CN216491224U

CN216491224U - Anticreep high heat conduction printed circuit board

Info

Publication number: CN216491224U
Application number: CN202122888924.8U
Authority: CN
Inventors: 张宗超; 彭磊
Original assignee: Shenzhen Chaofeng Keyu Technology Co ltd
Current assignee: Shenzhen Chaofeng Keyu Technology Co ltd
Priority date: 2021-11-19
Filing date: 2021-11-19
Publication date: 2022-05-10
Anticipated expiration: 2031-11-19

Abstract

The utility model discloses an anti-creeping high-heat-conductivity printed circuit board which comprises a base, wherein a group of connecting bolts are arranged on the left part of the lower end and the right part of the lower end of the base, the two groups of connecting bolts are distributed in a bilateral symmetry manner, each group is provided with two, nuts are arranged on the upper parts of the outer surfaces of the two groups of connecting bolts, a heat dissipation assembly is arranged in the middle of the upper end of the base, a main body plate is arranged at the upper end of the heat dissipation assembly, and an insulation assembly is arranged on the upper end face of the main body plate. According to the anti-creeping high-heat-conductivity printed circuit board, the heat dissipation equipment, the heat dissipation assembly and the insulation assembly are arranged, the fan drives the rotating column and the fan blades, wind power is conveyed into the mounting frame, heat in the mounting frame is discharged from the ventilation groove, accordingly, the heat dissipation efficiency of the circuit board is improved, meanwhile, the heat conduction efficiency of the circuit board is improved, and the insulation effect of the main body board can be improved under the condition that the main body board is wrapped by the first insulation layer and the second insulation layer.

Description

Anticreep high heat conduction printed circuit board

Technical Field

The utility model relates to the technical field of printed circuit boards, in particular to an anti-creeping high-thermal-conductivity printed circuit board.

Background

Printed Circuit Boards (PCBs) are one of the important components of the electronics industry. The PCB can provide mechanical support for fixing and assembling the electronic elements, and can realize electrical connection among the electronic elements. Almost every electronic device, as small as electronic watches, calculators, as large as computers, communication electronics, military weaponry systems, requires the use of printed circuit boards for electrical interconnection between electronic components such as integrated circuits. In the prior art: 1. the existing equipment is poor in heat dissipation effect, so that the heat conduction effect of the circuit board is reduced, the circuit board is easy to damage due to high temperature, 2, the existing equipment is poor in insulation effect, the circuit board is easy to leak electricity, the use efficiency is reduced, and the limitation of the use of the anti-electricity-leakage high-heat-conductivity printed circuit board is caused.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims to provide an anti-creeping high-thermal-conductivity printed circuit board which can effectively solve the problems in the background art.

In order to achieve the purpose, the utility model adopts the technical scheme that:

the utility model provides a high heat conduction printed circuit board of anticreep, includes the base, base lower extreme left part and lower extreme right part all are provided with a set of connecting bolt, and are two sets of connecting bolt is bilateral symmetry and distributes and every group sets up to two, and is two sets of connecting bolt surface upper portion all is provided with the nut, base upper end middle part is provided with radiator unit, the radiator unit upper end is provided with the main part board, main part board up end is provided with insulating assembly, base upper end left part and upper end right part all are provided with the heat dissipation equipment, two the heat dissipation equipment all connects at radiator unit left end and right-hand member.

Preferably, the heat dissipation equipment includes the link, the ventilation hole of break-over about a plurality of is all seted up in the inside left side of link, the inside right side of link is provided with the fan, the fan output is provided with rotates the post, it is provided with the flabellum to rotate the post right-hand member, the link is connected at base upper end left part and upper end right part and is connected with radiator unit.

Preferably, the fan blades are not in contact with the inner wall of the connecting frame, and the plurality of the ventilation holes are distributed at equal intervals.

Preferably, the radiating assembly comprises a mounting rack, a fixing frame is arranged on the upper side inside the mounting rack, a plurality of air inlet holes are formed in the left end and the right end of the mounting rack, a plurality of ventilation grooves are formed in the middle of the upper end of the base, a group of connecting grooves are formed in the left portion and the right portion of the upper end of the base, and the mounting rack is connected to the middle of the upper end of the base.

Preferably, the plurality of ventilation grooves are distributed at equal intervals, and the plurality of air inlet holes are distributed at equal intervals.

Preferably, the insulation assembly comprises a second insulation layer, a waterproof layer is arranged at the upper end of the second insulation layer, a first insulation layer is arranged at the lower end of the main body plate, and the second insulation layer is connected to the upper end of the main body plate.

Compared with the prior art, the utility model has the following beneficial effects:

1. according to the utility model, by arranging the heat dissipation equipment and the heat dissipation assembly on the whole device, when the device is used, the mounting frame is connected to the middle part of the upper end of the base, the fixing frame is arranged in the mounting frame, the left end and the right end of the mounting frame are both provided with a plurality of air inlet holes, the middle part of the upper end of the base is provided with a plurality of air permeable grooves, the connecting frame is connected to the left part and the right part of the upper end of the base, the connecting frame is connected to the left end and the right end of the mounting frame, the fan is connected in the connecting frame, the rotating column is connected to the output end of the fan, the fan blade is connected to the right end of the rotating column, the rotating column is driven by the fan, and then the fan blade is driven by the rotating column, so that the heat dissipation effect of the circuit board is improved, and the use efficiency is improved;

2. according to the utility model, through the arrangement of the insulation assembly, when the insulation assembly is used, the first insulation layer is connected to the lower end face of the main body plate, the second insulation layer is connected to the upper end face of the main body plate, the waterproof layer is connected to the upper end of the second insulation layer, and the main body plate is wrapped by the first insulation layer and the second insulation layer, so that the insulation efficiency of the circuit board can be improved, the electric leakage condition of the circuit board is avoided, and the use efficiency is improved.

Drawings

FIG. 1 is a schematic view of an overall structure of an anti-creeping high thermal conductive printed circuit board according to the present invention;

FIG. 2 is a schematic view of the overall structure of a heat dissipation device of an anti-creeping high thermal conductivity printed circuit board according to the present invention;

FIG. 3 is a schematic diagram of an overall structure of a heat dissipation assembly of an anti-creeping high thermal conductivity printed circuit board according to the present invention;

fig. 4 is a schematic view of an overall structure of an insulation assembly of an anti-creeping high thermal conductive printed circuit board according to the present invention.

In the figure: 1. a base; 2. a connecting bolt; 3. a nut; 4. a heat dissipating device; 5. a heat dissipating component; 6. a main body plate; 7. an insulating assembly; 41. a connecting frame; 42. a vent hole; 43. a fan; 44. rotating the column; 45. a fan blade; 51. a mounting frame; 52. a fixed mount; 53. an air inlet hole; 54. a ventilation groove; 55. connecting grooves; 71. an insulating layer I; 72. a waterproof layer; 73. and a second insulating layer.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the utility model easy to understand, the utility model is further described with the specific embodiments.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, such as "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in fig. 1-4, an anticreep high heat conduction printed circuit board, including base 1, base 1 lower extreme left part and lower extreme right part all are provided with a set of connecting bolt 2, two sets of connecting bolts 2 are bilateral symmetry and distribute and every group sets up to two, 2 surface upper portions of two sets of connecting bolts all are provided with nut 3, base 1 upper end middle part is provided with radiator unit 5, radiator unit 5 upper end is provided with main body board 6, main body board 6 up end is provided with insulating assembly 7, base 1 upper end left part and upper end right part all are provided with heat abstractor 4, two heat abstractor 4 all connect at radiator unit 5 left end and right-hand member.

The heat dissipation device 4 comprises a connecting frame 41, a plurality of ventilation holes 42 penetrating from left to right are formed in the left side inside the connecting frame 41, a fan 43 is arranged on the right side inside the connecting frame 41, the output end of the fan 43 is provided with a rotating column 44, the right end of the rotating column 44 is provided with fan blades 45, and the connecting frame 41 is connected to the left end and the right end of the upper end of the base 1 and connected with the heat dissipation assembly 5.

The fan blades 45 are not in contact with the inner wall of the connecting frame 41, and the plurality of ventilation holes 42 are distributed at equal intervals.

Radiator unit 5 includes mounting bracket 51, and the inside upside of mounting bracket 51 is provided with mount 52, and a plurality of inlet air holes 53 have all been seted up to mounting bracket 51 left end and right-hand member, and a plurality of ventilative grooves 54 have been seted up at base 1 upper end middle part, and a set of spread groove 55 has all been seted up to base 1 upper end left part and upper end right part, and mounting bracket 51 is connected at base 1 upper end middle part.

The plurality of ventilation grooves 54 are equidistantly distributed, and the plurality of air inlet holes 53 are equidistantly distributed.

The insulation assembly 7 comprises a second insulation layer 73, a waterproof layer 72 is arranged at the upper end of the second insulation layer 73, a first insulation layer 71 is arranged at the lower end of the main body plate 6, and the second insulation layer 73 is connected to the upper end of the main body plate 6.

The utility model is to be noted that, by arranging the heat dissipation device 4 and the heat dissipation assembly 5, when in use, the mounting rack 51 is connected to the middle part of the upper end of the base 1, the fixing rack 52 is arranged inside the mounting rack 51, the left end and the right end of the mounting rack 51 are both provided with a plurality of air inlet holes 53, the middle part of the upper end of the base 1 is provided with a plurality of ventilation grooves 54, the connecting rack 41 is connected to the left part and the right part of the upper end of the base 1, the connecting rack 41 is connected to the left end and the right end of the mounting rack 51, the fan 43 is connected inside the connecting rack 41, the rotating column 44 is connected to the output end of the fan 43, the fan blade 45 is connected to the right end of the rotating column 44, the rotating column 44 is driven by the fan 43, and the fan blade 45 is driven by the rotating column 44, so that the heat dissipation effect of the circuit board is improved, and the use efficiency is improved; through setting up insulating assembly 7, when using, connect terminal surface under main part board 6 with an insulating layer 71 to connect No. two insulating layers 73 at main part board 6 up end, connect No. two insulating layers 73 upper ends with waterproof layer 72, under the parcel to main part board 6 through an insulating layer 71 and No. two insulating layers 73, can improve the insulating efficiency of circuit board, thereby avoid the circuit board electric leakage condition to appear, thereby improve the availability factor.

The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a high heat conduction printed circuit board of anticreep, includes base (1), its characterized in that: base (1) lower extreme left part and lower extreme right part all are provided with a set of connection bolt (2), and are two sets of connection bolt (2) are bilateral symmetry and distribute and every group sets up to two, and are two sets of connection bolt (2) surface upper portion all is provided with nut (3), base (1) upper end middle part is provided with radiator unit (5), radiator unit (5) upper end is provided with main part board (6), main part board (6) up end is provided with insulating assembly (7), base (1) upper end left part and upper end right part all are provided with radiator unit (4), two radiator unit (4) all are connected at radiator unit (5) left end and right-hand member.

2. The printed circuit board of claim 1, wherein: the heat dissipation device (4) comprises a connecting frame (41), a plurality of ventilation holes (42) penetrating from left to right are formed in the left side inside the connecting frame (41), a fan (43) is arranged on the right side inside the connecting frame (41), a rotation column (44) is arranged at the output end of the fan (43), fan blades (45) are arranged at the right end of the rotation column (44), and the connecting frame (41) is connected to the left end and the right end of the base (1) and connected with the heat dissipation assembly (5).

3. The printed circuit board of claim 2, wherein: flabellum (45) and link (41) inner wall contactless are a plurality of ventilation hole (42) are the equidistance and distribute.

4. The printed circuit board of claim 3, wherein: the heat dissipation assembly (5) comprises a mounting rack (51), a fixing frame (52) is arranged on the upper side inside the mounting rack (51), a plurality of air inlet holes (53) are formed in the left end and the right end of the mounting rack (51), a plurality of ventilation grooves (54) are formed in the middle of the upper end of the base (1), a group of connecting grooves (55) are formed in the left end and the right end of the upper end of the base (1), and the mounting rack (51) is connected to the middle of the upper end of the base (1).

5. The printed circuit board of claim 4, wherein: the plurality of air-permeable grooves (54) are distributed at equal intervals, and the plurality of air inlet holes (53) are distributed at equal intervals.

6. The printed circuit board of claim 5, wherein: insulating assembly (7) are including No. two insulating layer (73), No. two insulating layer (73) upper end is provided with waterproof layer (72), main part board (6) lower extreme is provided with insulating layer (71), No. two insulating layer (73) are connected in main part board (6) upper end.