CN216413036U

CN216413036U - Bernoulli sucker and silicon wafer transfer device

Info

Publication number: CN216413036U
Application number: CN202122574012.3U
Authority: CN
Inventors: 龚志清; 查俊; 刘刚
Original assignee: Suzhou Maxwell Technologies Co Ltd
Current assignee: Suzhou Maxwell Technologies Co Ltd
Priority date: 2021-10-25
Filing date: 2021-10-25
Publication date: 2022-04-29
Anticipated expiration: 2031-10-25

Abstract

The utility model relates to the technical field of suckers, and provides a Bernoulli sucker and a silicon wafer transfer device. A bernoulli chuck comprising a first chuck body comprising a first housing and a first chuck core disposed within the first housing; the first shell is square, the bottom surface of the first shell comprises a middle area and an edge area, and a plurality of gaskets are distributed in the middle area and the edge area; airflow channels are formed at four corners of the bottom of the first shell, and at least one airflow channel is formed between every two adjacent corners. This application can improve the frictional force between work piece and the sucking disc, improves the adsorption efficiency, reduces or avoids the damage of work piece in handling.

Description

Bernoulli sucker and silicon wafer transfer device

Technical Field

The utility model relates to the technical field of suckers, in particular to a Bernoulli sucker and a silicon wafer transfer device.

Background

At present, with the development of economy and the progress of society, the photovoltaic industry is fierce in China. Therefore, the demand of the equipment for producing the silicon wafers is increased, and the daily capacity of the equipment is also required to be higher. In recent years, enterprises related to silicon wafer production equipment are developing in the direction of saving cost, being convenient to use, improving productivity and the like. In the process links of texturing, etching, PECVD, printing and the like of the silicon wafer, the adsorption and transportation of the silicon wafer are the basic requirements of a plurality of working procedures.

A bernoulli chuck is a chuck suitable for handling thin, extremely delicate and fragile workpieces such as silicon wafers. Generally, the bernoulli chuck sets up the air inlet on the sucking disc, insert high compressed air, blow to the sucking disc lower surface, the sucking disc working face produces even and thin strong air current, the work piece is greater than the gas flow rate of its lower part like the gas flow rate of silicon chip upper surface this moment, utilize the fluid speed the faster the less principle of pressure, the upper and lower both sides of silicon chip can produce the pressure differential, thereby can form ascending support power in the bottom of silicon chip, and then make the silicon chip adsorb the bottom at the sucking disc body, also utilize atmospheric pressure difference to adsorb the silicon chip.

Although the conventional Bernoulli chuck can quickly suck up the silicon wafer, the friction force applied to the silicon wafer after the silicon wafer is sucked up is relatively small, so that the silicon wafer and the chuck are displaced and slide in the carrying process, and the silicon wafer is easily thrown away when the silicon wafer is serious. In addition, when the existing Bernoulli chuck adsorbs a large-size silicon wafer, the periphery of four corners of the silicon wafer bends downwards when the silicon wafer is adsorbed due to the small adsorption area of the chuck, so that the silicon wafer is easy to crush in the process of carrying the silicon wafer, and the silicon wafer is easy to damage; or when the corner of the silicon chip on the table top is broken, the conventional sucker cannot adsorb or blow off fragments, so that the subsequent processes are influenced.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned problems, the present invention is directed to solving, at least to some extent, one of the technical problems in the related art. Therefore, the utility model provides the Bernoulli chuck and the silicon wafer transfer device, which can improve the friction force between a workpiece and the chuck, improve the adsorption effect and reduce or avoid the damage of the workpiece in the conveying process.

In order to solve the technical problems, the utility model adopts the following technical scheme:

according to one aspect of the present application, there is provided a bernoulli chuck comprising a first chuck body comprising a first housing and a first chuck core disposed within the first housing;

the first shell is square, the bottom surface of the first shell comprises a middle area and an edge area, and a plurality of gaskets are distributed in the middle area and the edge area;

airflow channels are formed at four corners of the bottom of the first shell, and at least one airflow channel is formed between every two adjacent corners.

In some embodiments, the square shape is a rectangle, at least two airflow channels are arranged along the length direction of the first housing, and at least one airflow channel is arranged along the width direction of the first housing.

In some of these embodiments, further comprising a second suction cup body, the first suction cup body for use alongside the second suction cup body;

the second sucker main body comprises a second shell and a second sucker core body arranged in the second shell;

the second casing is the rectangle, four corners in the bottom of second casing all are formed with airflow channel, along the length direction of second casing is equipped with at least two airflow channel, along the width direction of second casing is equipped with at least one airflow channel, just airflow channel on the length direction of second casing with airflow channel staggered arrangement on the length direction of first casing.

In some embodiments, a plurality of the spacers are distributed at intervals in the middle area, and a plurality of the spacers are distributed at intervals in the edge area, and a groove is arranged between the middle area and the edge area;

the gasket is polygonal; and/or

The gaskets are all made of sponge.

In some of these embodiments, the polygon comprises a square.

In some embodiments, a mounting bracket is connected to the upper end of the first housing, and the mounting bracket is connected to the first housing by an adjusting bolt.

In some embodiments, a bernoulli joint and a vacuum breaking joint are connected to the upper end face of the first housing, and an interface of the bernoulli joint and an interface of the vacuum breaking joint are arranged oppositely.

In some embodiments, a first air inlet channel and a second air inlet channel are disposed in the first chuck core, a first air inlet hole is disposed in the bernoulli joint, a second air inlet hole is disposed in the vacuum breaking joint, the first air inlet hole is communicated with the first air inlet channel, and the second air inlet hole is communicated with the second air inlet channel.

In some embodiments, the sidewall of the first suction cup core is provided with a plurality of air outlet holes, one end of each air outlet hole is communicated with the first air inlet channel and the second air inlet channel, and the other end of each air outlet hole is communicated with the air flow channel.

In some of these embodiments, the first suction cup core is rectangular, has a width of 30mm to 45mm, and has a length of 125mm to 150 mm.

According to another aspect of the present application, there is also provided a wafer transfer device comprising a bernoulli chuck as described above.

The implementation of the scheme of the utility model has at least the following beneficial effects:

the first sucker main body in the Bernoulli sucker comprises a first shell and a first sucker core body arranged in the first shell, wherein the first shell is square, the bottom surface of the first shell comprises a middle area and an edge area, and a plurality of gaskets are distributed in the middle area and the edge area; from this, be square setting through making first casing, can make the regional square bernoulli region of changing into of current circular bernoulli, increase bernoulli's region, and the middle zone and the marginal zone of first casing bottom surface all have laid a plurality of gaskets, increased the region of distribution gasket, be covered with the sucking disc in the sucking disc bottom as far as possible, thereby can improve lateral friction and the rotational friction between work piece and the sucking disc, improve the suction of sucking disc promptly, reinforcing adsorption effect, prevent that the sucking disc from adsorbing the work piece like the silicon chip after, when high-speed linear motion or high-speed rotation, throw away the silicon chip, reinforcing sucking disc job stabilization nature. Meanwhile, airflow channels are formed at four corners of the bottom of the first shell of the Bernoulli chuck, and at least one airflow channel is formed between two adjacent corners; like this, when the peripheral downwarping in four corners of silicon chip behind the absorption silicon chip, can utilize the airflow channel of four corners to adsorb the four corners of silicon chip edge collapsing, prevent that the silicon chip from being adsorbed the back because the periphery does not have suction, the silicon chip is fallen downwards under the effect of gravity to can reduce or avoid the silicon chip to be bumped garrulous risk in handling. In addition, the fragments on the table top can be blown away by utilizing the airflow channels, so that the fragments on the table top are prevented from influencing the etching precision of the next silicon wafer.

The wafer transfer device provided by the present application includes the aforementioned bernoulli chuck, and thus has at least all of the features and advantages of the aforementioned bernoulli chuck, which are not described herein again.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the utility model.

Drawings

FIG. 1 is a first perspective structural schematic view of a Bernoulli chuck according to some embodiments of the present invention;

FIG. 2 is a schematic view of a Bernoulli chuck according to some embodiments of the present invention from a second perspective;

FIG. 3 is a schematic diagram of a second chuck body in a Bernoulli chuck according to some embodiments of the present invention;

FIG. 4 is a schematic view of the distribution of airflow channels of a Bernoulli chuck according to some embodiments of the present invention.

(in FIGS. 2 and 4, the arrows indicate the distribution of the air flow after it exits the suction cup core.)

In the figure: 1-a first chuck body; 10-a first housing; 11-a first suction cup core; 101-middle area; 102-an edge region; 103-a groove;

2-a second suction cup body; 20-a second housing; 21-a second suction cup core body;

3-a gasket; 4-an airflow channel; 5, mounting a bracket; 6-adjusting the bolt; a 7-Bernoulli linker; 8-breaking the vacuum joint.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.

It should be noted that the term "and/or"/"used herein is only one kind of association relationship describing associated objects, and means that there may be three relationships, for example, a and/or B, and may mean: a exists alone, A and B exist simultaneously, and B exists alone.

In the present invention, unless specified to the contrary, use of the terms of orientation such as "upper, lower, top, bottom" or the like, generally refer to the orientation as shown in the drawings, or to the component itself in a vertical, perpendicular, or gravitational orientation; similarly, for ease of understanding and description, the definitions of "inner and outer" are consistent with the usual definitions of inner and outer, such as "inner and outer" referring to the inner and outer contours of the respective components themselves, but the above directional words are not intended to limit the utility model.

Those skilled in the art will appreciate that, as is known in the art, more or less, the prior art bernoulli chuck constructions suffer from certain drawbacks. For example, after the silicon wafer is quickly sucked up by the existing sucker, the transverse friction and the rotary friction of the silicon wafer are relatively small, and the normal linear motion carrying can normally work, but if the silicon wafer rotates, the silicon wafer is easily thrown away due to the small friction of the rotation. Or when the sucker is used for sucking a larger-size silicon wafer, the periphery of four corners of the silicon wafer bends downwards when the silicon wafer is sucked due to the small sucking area of the sucker, so that the silicon wafer is easy to crush in the carrying process; in addition, when the corners of the silicon wafer on the table top are broken, the conventional sucker cannot adsorb or blow off fragments, and subsequent processes are affected. Therefore, there is a need for improvement of bernoulli chuck structure to improve the suction force of the chuck, enhance the adsorption effect, reduce or avoid damage to the adsorbed workpiece, and ensure the quality of the product. See below for a description of specific embodiments.

FIG. 1 is a first perspective structural schematic view of a Bernoulli chuck according to some embodiments of the present invention; FIG. 2 is a schematic view of a Bernoulli chuck according to some embodiments of the present invention from a second perspective; FIG. 3 is a schematic diagram of a second chuck body in a Bernoulli chuck according to some embodiments of the present invention; FIG. 4 is a schematic view of the distribution of airflow channels of a Bernoulli chuck according to some embodiments of the present invention. It should be noted that the arrows in fig. 2 and 4 show the distribution of the air flow after exiting from the suction cup core.

Referring to fig. 1 to 4, in some embodiments of the present application, there is provided a bernoulli chuck comprising a first chuck body 1, the first chuck body 1 comprising a first housing 10 and a first chuck core 11 disposed within the first housing 10; wherein, the first casing 10 is square, the first sucker core 11 is square, and the first sucker main body 1 can be generally square on the whole; the bottom surface of the first casing 10 includes a middle area 101 and an edge area 102, and a plurality of gaskets 3 are distributed on both the middle area 101 and the edge area 102; airflow channels 4 are formed at four corners of the bottom of the first casing 10, and at least one airflow channel 4 is also formed between two adjacent corners.

The Bernoulli chuck of the embodiment of the application designs the existing round Bernoulli area into the square Bernoulli area so as to achieve the purpose of increasing the Bernoulli area, and increases the area of the distribution gasket 3, thereby improving the transverse friction force and the rotation friction force between the silicon wafer and the chuck. And four airflow channels 4 are designed at four corners of the chuck main body, namely the airflow channels 4 for gas exhaust, so that four Bernoulli areas can be formed in the four airflow channels 4 at the corners, and the risk of crashing the silicon wafers in the process of carrying is reduced. The bernoulli chuck in some preferred embodiments of the present application, further comprising a second chuck body 2, the general structure of the second chuck body 2 and the first chuck body 1 can be the same or similar, differing by the distribution of the airflow channels 4 of the two; through the air flow channel 4 that the length direction that makes first sucking disc main part 1 distributes along the air flow channel 4 asymmetric structural design (dislocation design) that the length direction distributes along second sucking disc main part 2, can prevent that first sucking disc main part 1 and second sucking disc main part 2 from disturbing each other to the air current offset when using side by side, influence the sucking disc and adsorb silicon chip effect.

The Bernoulli chuck of the embodiment of the application can be used for adsorbing a silicon wafer, namely the Bernoulli chuck can be applied to the related field of preparation of the silicon wafer. In addition, in other embodiments, other workpieces similar to silicon wafers or workpieces with improved requirements for adhesion force, adhesion structure, etc. may be used with the bernoulli chucks provided herein, i.e., the bernoulli chucks of the embodiments of the present application include, but are not limited to, those used for adhering silicon wafers.

In some embodiments, the square shape may be a rectangle or a square shape, the first housing 10 may be substantially a rectangle or a square shape, and the first chuck core 11 may be substantially a rectangle or a square shape. Preferably, in order to increase the suction area and improve the suction force, the first housing 10 is substantially rectangular, and the first suction pad core 11 is substantially rectangular. The substantially rectangular shape means that, for example, the first casing 10 is approximately rectangular, and a small protrusion or a small groove may be provided in a partial region of the casing, but this does not affect the adsorption area, i.e., the overall structure and adsorption effect.

According to the embodiment of the application, the first sucker body 1 can be a half sucker body, the second sucker body 2 can be a half sucker body, the first sucker body 1 can be used alone, and can also be used side by side with the second sucker body 2, and the whole sucker body is formed. The general structure of the second suction cup body 2 of the first suction cup body 1 and the first suction cup body 1 may be the same or similar, differing in the distribution of the air flow passages 4 of both, in particular the distribution of the air flow passages 4 in the length direction. Therefore, the embodiment of the present application mainly takes the first suction cup body 1 as an example for detailed description, and the structural parts of the second suction cup body 2 that are the same as those of the first suction cup body 1 can refer to the description of the first suction cup body 1, and will not be described in detail herein.

In some embodiments, the square shape is a rectangle, that is, the first casing 10 is a rectangle, the airflow channels 4 are formed at four corners of the bottom of the first casing 10, and the airflow channels 4 are also formed between two adjacent corners, for example, at least two airflow channels 4 are provided along the length direction of the first casing 10, and at least one airflow channel 4 is provided along the width direction of the first casing 10.

The bernoulli chuck of the embodiment of the present application not only forms four air flow channels 4 at four corners, but also forms the air flow channels 4 between the corners, that is, the air flow channels 4 are formed in both the length direction and the width direction, for example, at least two (for example, two, three, four, five or more) air flow channels may be arranged at intervals in the length direction, and at least one (for example, one, two, or three, etc.) air flow channel may be arranged in the width direction. The length direction may include two long sides disposed oppositely, and the width direction may include two wide sides disposed oppositely. Like this, also set up airflow channel through in length and width direction, can further strengthen the adsorption affinity, improve the adsorption effect, also can guarantee that the sucking disc atress is even, improves the job stabilization nature of sucking disc.

In some embodiments, the bernoulli chuck comprises a first chuck body 1 and a second chuck body 2, said first chuck body 1 being used side by side with said second chuck body 2; the second suction cup main body 2 includes a second housing 20 and a second suction cup core 21 provided in the second housing 20, the bottom surface of the second housing 20 includes a middle region 101 and a peripheral region 102, and the middle region 101 and the peripheral region 102 are evenly distributed with a plurality of spacers 3. As described above, the structure of the second suction cup body 2 is substantially the same as or similar to that of the first suction cup body 1, except for the distribution of the air flow passages 4 of the two, particularly the distribution of the air flow passages 4 in the longitudinal direction. Specifically, the second casing 20 is rectangular, airflow channels 4 are formed at four corners of the bottom of the second casing 20, at least one airflow channel 4 is also formed between two adjacent corners, for example, at least two airflow channels 4 are arranged along the length direction of the second casing 20, at least one airflow channel 4 is arranged along the width direction of the second casing 20, and the airflow channels 4 in the length direction of the second casing 20 and the airflow channels 4 in the length direction of the first casing 10 are arranged in a staggered manner.

According to the embodiment of the present application, at least two airflow channels 4 are provided in the length direction of the first housing 10, at least two airflow channels 4 are provided in the length direction of the second housing 20, and the arrangement of the airflow channels 4 in the length direction of the first housing 10 is different from the arrangement of the airflow channels 4 in the length direction of the second housing 20, so that when the two housings are used side by side, the airflow channels 4 are asymmetric, that is, are arranged in a staggered manner. Therefore, the mutual interference of the air currents of the two sucker main bodies can be prevented, and the influence of the sucker on the adsorption of the silicon wafer is avoided.

In some embodiments, a plurality of the spacers 3 are distributed at intervals in the middle area 101, and a plurality of the spacers 3 are distributed at intervals in the edge area 102, a groove 103 is provided between the middle area 101 and the edge area 102, and the middle area 101 is separated from the edge area 102 by the groove 103. The shim 3 has a square or polygonal shape, which may be, for example, a pentagon, a hexagon, or the like, or may be a quadrilateral-like shape, such as a quadrilateral with a notch. The gasket 3 is made of sponge, that is, the gasket 3 may be a sponge gasket, and further, may be made of EVA sponge material. The embodiment of the application does not limit the specific number of the gaskets, and the bottom of the sucker is as full as possible of the gaskets. Because ordinary sucking disc bottom adopts the silica gel gasket, this kind of gasket is heated and takes place to warp easily, and it is inhomogeneous to make sucking disc bottom and work piece contact after warping, and then leads to the work piece to take place phenomena such as drop, displacement easily, and adopts sponge material for example EVA sponge material then to have better heat-resisting wearability, non-deformable to can make first sucking disc main part 1 more effectual snatch the work piece.

According to this application embodiment, no matter be first sucking disc main part or second sucking disc main part, through rectangular design, increased 3 regional areas of gasket, can make the sucking disc bottom be covered with the sponge gasket as far as, all can arrange the sponge gasket like the region except recess 103. Among the plurality of sponge pads of the edge area 102, the air flow passage 4 may be formed between adjacent two sponge pads. Therefore, the friction force between the silicon wafer and the sucker, particularly the transverse friction force and the rotating friction force can be improved, so that the suction force of the sucker is improved, and the silicon wafer is prevented from being thrown away after being adsorbed.

In some embodiments, a mounting bracket 5 is connected to the upper end of the first housing 10, and the mounting bracket 5 is connected to the first housing 10 by an adjusting bolt 6. Further, four threaded mounting holes may be formed in the upper end of the first housing 10, and the mounting bracket 5 is fixedly connected to the corresponding four threaded mounting holes through four adjusting bolts 6; several locking threads may also be attached to each adjusting bolt 6 to provide a more secure attachment of the first housing 10 to the mounting bracket 5. The mounting bracket 5 can be used for being connected with a manipulator, and when the mounting bracket is used, the mounting bracket can be adjusted according to the position of the manipulator where the Bernoulli chuck is installed and the screwing-in depth of the height adjusting bolt 6, and then the whole first chuck main body 1 and the mounting bracket 5 are installed on the manipulator.

In some embodiments, a bernoulli joint 7 and a vacuum breaking joint 8 are connected to the upper end face of the first housing 10, and an interface of the bernoulli joint 7 and an interface of the vacuum breaking joint 8 are arranged oppositely. The interface of the Bernoulli joint 7 and the interface of the vacuum breaking joint 8 are arranged in a back manner, so that the Bernoulli joint 7 and the vacuum breaking joint 8 can be connected with an external air source respectively, mutual interference is prevented, and arrangement of a pipeline or an air circuit is facilitated.

According to the embodiment of the application, the Bernoulli joint 7 can be connected with an external air source through the arrangement of the Bernoulli joint 7, so that the sucker has the capacity of adsorbing a workpiece; when vacuum breaking is needed, the vacuum breaking joint 8 is connected with an external positive pressure gas source, positive pressure gas enters the sucker core body through the vacuum breaking joint 8 to blow off a workpiece adsorbed at the bottom of the sucker, and the purpose of vacuum breaking is achieved, so that adsorption can be removed more efficiently and conveniently. Therefore, the provided Bernoulli chuck not only has the capacity of adsorbing the workpiece, but also has the capacity of breaking vacuum, and can conveniently interrupt the adsorption action on the workpiece.

In the embodiment of the present application, the specific structure or connection manner of the first suction cup core 11 is not limited. For example, the arrangement of the air inlet structure and the air outlet structure of the first suction cup core 11, or the connection manner of the first suction cup core 11 and the first housing 10, can be referred to the prior art, and the structures and connection manners known to those skilled in the art can be adopted. For example, a mounting hole is formed in the first shell, and the first sucker core body is fixedly mounted in the mounting hole through a fixing bolt.

For example, in some embodiments, a first air inlet channel and a second air inlet channel are formed in the first chuck core 11, a first air inlet hole is formed in the bernoulli joint 7, a second air inlet hole is formed in the vacuum breaking joint 8, the first air inlet hole is communicated with the first air inlet channel, and the second air inlet hole is communicated with the second air inlet channel.

In some embodiments, the side wall of the first suction cup core 11 is provided with a plurality of air outlet holes, one end of each air outlet hole is communicated with the first air inlet channel and the second air inlet channel, and the other end of each air outlet hole is communicated with the air flow channel 4.

Through the scheme, the Bernoulli joint 7 is communicated with the external compressed air, when the compressed air is guided into the first air inlet channel through the first air inlet hole of the Bernoulli joint 7, the compressed air can be uniformly ejected from the air outlet hole through the air flow and flows out through the air flow channel 4, and the air flow speed passing through the upper surface of the workpiece is higher than that of the lower part of the workpiece. According to the Bernoulli principle, the larger the gas flow velocity, the smaller the pressure, and at the moment, the lifting force is generated below the workpiece, and the workpiece is adsorbed at the bottom of the sucker body. When vacuum breaking is needed, the vacuum breaking joint 8 is connected with an external positive pressure gas source, and positive pressure gas can flow out outwards and blow off a workpiece adsorbed at the bottom of the sucker after being introduced into the second air inlet channel through the second air inlet hole of the vacuum breaking joint 8, so that the purpose of vacuum breaking is achieved, and the adsorption effect can be relieved more conveniently.

In some embodiments, the first absorbent core 11 has a rectangular shape with a width of 30mm to 45mm and a length of 125mm to 150 mm. In some embodiments, the first suction cup core 11 is rectangular, has a width of 32mm to 40mm and a length of 130mm to 140 mm. In some embodiments, the first absorbent core 11 has a rectangular shape with a width of 34mm to 38mm and a length of 134mm to 138 mm. In some embodiments, the first absorbent core 11 has a rectangular shape, and can have a width of, for example, 32mm, 34mm, 35mm, 36mm, 38mm, 40mm, 42mm, 44mm, 45mm, etc., and a length of, for example, 125mm, 126mm, 128mm, 130mm, 132mm, 134mm, 135mm, 136mm, 138mm, 140mm, 146mm, 148mm, 150mm, etc. Preferably, the first suction cup core 11 has a width of 34mm and a length of 134 mm.

Most of the existing sucker core bodies are of circular structures, the diameter of the existing sucker core bodies is generally 35mm, and the area of a Bernoulli area is 961mm²(ii) a Whereas the first suction cup core of the present application is rectangular, having a width of, for example, 34mm, a length of, for example, 134mm, and a bernoulli zone area of 4556mm². Compared with the existing Bernoulli chuck, the Bernoulli chuck greatly increases the Bernoulli area, enhances the adsorption force and improves the adsorption effect.

It can be known from above synthesizing, the bernoulli chuck that this application embodiment provided can make current circular bernoulli regional change become square bernoulli regional, greatly increased the area of sucking disc core, increased bernoulli's region, increased the region that distributes gasket 3, can fill up gasket 3 in sucking disc bottom as far as possible to can improve horizontal frictional force and the rotational friction between work piece and the sucking disc, improve the suction of sucking disc promptly, reinforcing adsorption effect prevents that the sucking disc from adsorbing the back with the work piece like the silicon chip, when high-speed linear motion or high-speed rotation, throw away the silicon chip, reinforcing sucking disc job stabilization nature. Meanwhile, airflow channels 4 are formed at four corners of the bottom of the first shell 10 of the bernoulli chuck, and at least one airflow channel 4 is formed between two adjacent corners; like this, when the peripheral downwarping in four corners of silicon chip behind the absorption silicon chip, can utilize the airflow channel 4 of four corners to adsorb the four corners of silicon chip edge collapsing, prevent that the silicon chip from being adsorbed the back because the periphery does not have suction, the silicon chip is fallen downwards under the effect of gravity to can reduce or avoid the silicon chip to be collided garrulous risk in handling. In addition, the plurality of air flow channels 4 can be used for processing fragments on the working table surface, the fragments on the working table surface are blown away, and the fragments on the working table surface are prevented from influencing the etching precision of the next silicon wafer.

In some embodiments, there is also provided a wafer transfer device comprising a bernoulli chuck as described above. The silicon wafer transfer device in the embodiment of the present application may be used for carrying silicon wafers, and certainly, the technical solution in the embodiment of the present application does not exclude that the silicon wafer transfer device has a function of loading and/or unloading at the same time, and is not limited herein.

The core of the silicon wafer transfer device is that the device comprises the bernoulli chuck provided by the embodiment of the application, and in addition, other mechanisms such as a motor, an air source mechanism and the like can be driven, and the specific structures and connections of the other mechanisms can refer to the prior art, which belongs to the technology known by the person skilled in the art, and the utility model is not limited thereto, and will not be described in detail herein.

The utility model has not been described in detail and is in part known to those of skill in the art.

Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims

1. A Bernoulli chuck comprising a first chuck body comprising a first housing and a first chuck core disposed within the first housing;

2. The Bernoulli chuck of claim 1, wherein said square shape is rectangular, at least two of said airflow channels are provided along a length of said first housing, and at least one of said airflow channels is provided along a width of said first housing.

3. The Bernoulli chuck of claim 2, further comprising a second chuck body, the first chuck body for use side-by-side with the second chuck body;

4. The bernoulli chuck of claim 1, wherein a plurality of said spacers are spaced apart in said middle region and a plurality of said spacers are spaced apart in said edge region, a groove being provided between said middle region and said edge region;

the gasket is polygonal; and/or

The gaskets are all made of sponge.

5. The Bernoulli chuck of claim 4, wherein the polygon comprises a square.

6. The Bernoulli chuck of claim 1, wherein a mounting bracket is connected to an upper end of the first housing, the mounting bracket being connected to the first housing by an adjustment bolt.

7. A Bernoulli chuck according to any one of claims 1 to 6, wherein a Bernoulli joint and a vacuum break joint are connected to the upper end face of the first housing, and wherein the interface of the Bernoulli joint and the interface of the vacuum break joint are disposed facing away.

8. The Bernoulli chuck of claim 7, wherein the first chuck core has a first air inlet channel and a second air inlet channel therein, the Bernoulli joint has a first air inlet hole therein, the vacuum breaking joint has a second air inlet hole therein, the first air inlet hole communicates with the first air inlet channel, and the second air inlet hole communicates with the second air inlet channel.

9. The Bernoulli chuck of claim 8, wherein the sidewall of the first chuck core is provided with a plurality of air outlet holes, one end of each air outlet hole communicates with the first air inlet channel and the second air inlet channel, and the other end of each air outlet hole communicates with the air flow channel.

10. A Bernoulli chuck according to any one of claims 1 to 6, wherein the first chuck core is rectangular, has a width of 30mm to 45mm and a length of 125mm to 150 mm.

11. A wafer transfer device comprising the bernoulli chuck according to any one of claims 1 to 10.