CN211628001U

CN211628001U - Chip front-channel stacked gluing developing machine

Info

Publication number: CN211628001U
Application number: CN202020622396.4U
Authority: CN
Inventors: 郭勇; 钱咏梅; 柳直
Original assignee: Suzhou Gounbot Technology Co ltd
Current assignee: Suzhou Gounbot Technology Co ltd
Priority date: 2020-04-23
Filing date: 2020-04-23
Publication date: 2020-10-02
Anticipated expiration: 2030-04-23

Abstract

The utility model provides a heap rubber coating developing machine in chip front, relate to semiconductor equipment technical field, be equipped with the conveying unit in the technology room of technology box, dust removal unit and from the top down pile up the development unit and the rubber coating unit that set up, every rubber coating unit top is equipped with a development unit at least, the conveying unit is used for the circulation of wafer between different technologies, the dust removal unit includes the wind channel, wind channel one end is equipped with the air intake, the other end is equipped with the air outlet, it adjusts the intake size to be equipped with the air adjusting plate in the wind channel at air intake rear portion, be equipped with the dust pocket in the wind channel between air adjusting plate and the air outlet. The utility model increases the dust removal unit in the process chamber, so as to remove the dust generated in the gluing process and improve the wafer quality; the structure of the stack type is adopted, the gluing unit and the developing unit are arranged up and down, and the size of the equipment is reduced, so that more equipment can be placed under the same floor area, the space utilization rate is effectively improved, and the production efficiency is improved.

Description

Chip front-channel stacked gluing developing machine

Technical Field

The utility model relates to a semiconductor process equipment technical field especially relates to a heap rubber coating developing machine of chip front track.

Background

In semiconductor manufacturing, a Track (Track) is a common apparatus for manufacturing semiconductors, and is generally used for processes such as photoresist coating and developing. In the whole process engineering, the gluing process and the developing process are respectively finished by a gluing unit and a developing unit of a gluing developing machine, and the two process units are carried out in different process spaces.

The glue coating process is to coat the photoresist on the wafer according to the requirement, because the wafer is placed on the bearing table rotating at high speed when the photoresist is coated, the photoresist dust on the surface of the wafer and in the glue coating unit can be lifted under the action of centrifugal force and is filled in the glue coating process space, and the environment of the process space is polluted. After the coating is finished, the wafer needs to enter the developing process space, at the moment, the bearing table stops rotating, photoresist dust in the coating process space can fall on the surface of the wafer, on one hand, defects are caused on the surface of the wafer, the yield of products is reduced, and the later-stage production process is influenced.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem that will solve is: in order to overcome among the prior art photoresist produces the not enough that the dust influences the wafer quality, the utility model provides a heap rubber coating developing machine of chip front track.

The utility model provides a technical scheme that its technical problem will adopt is: a chip front-passage stacking type glue spreading developing machine comprises a process box body, wherein a wafer box chamber and a process chamber are arranged in the process box body, a mechanical arm for moving the wafer from the wafer box chamber to the process chamber is arranged between the wafer box chamber and the process chamber, the technical room is internally provided with a conveying unit, a dust removing unit, a plurality of developing units and a plurality of gluing units which are stacked from top to bottom, at least one developing unit is arranged above each gluing unit, the conveying unit is used for the circulation of the wafers among different processes, the dust removal unit is arranged close to the gluing unit and comprises an air duct, one end of the air duct is provided with an air inlet, the other end of the air duct is provided with an air outlet, the air inlet is positioned in the technical room, the air duct at the rear part of the air inlet is internally provided with an air adjusting plate, the air adjusting plate can adjust the air inlet volume of the air inlet, and a dust removing bag is arranged in an air channel between the air adjusting plate and the air outlet.

On one hand, the dust removal unit is additionally arranged in the process chamber, so that dust generated in the gluing process is removed, and the quality of the wafer is improved; on the other hand, in order to meet the requirements of large-scale integrated circuit production, a stacked structure is adopted, and the gluing unit and the developing unit are arranged up and down, so that the volume of equipment is reduced, more equipment can be placed under the same floor area, the space utilization rate is effectively improved, and the production efficiency is improved.

Furthermore, in order to adjust the performance of the dust removal unit according to the amount of generated dust, the air adjusting plate comprises a fixing plate and a rotating plate which are stacked and coaxially arranged, the rotating plate can rotate relative to the fixing plate, first air vents are formed in the fixing plate and are radially arranged into a plurality of air vents, a plurality of groups of second air vents are formed in the rotating plate, each first air vent corresponds to one group of second air vents, each group of second air vents is composed of at least one second air vent which is radially arranged, the aperture of the second air vents in the same strip is equal in the same group, and the aperture of the second air vents in different strips is unequal.

Specifically, each group of second ventilation holes forms a sector area on the rotating plate, and the second ventilation holes in different sector areas are arranged in the same manner.

Further, in order to realize uniform gluing and gluing of wafers with different outer diameters and different thicknesses, the gluing unit comprises a multi-head clamp, a vertical movement mechanism and a horizontal movement mechanism, wherein the multi-head clamp can simultaneously accommodate a plurality of photoresists, and the horizontal movement mechanism is connected to the vertical movement mechanism through an L-shaped connecting plate and moves up and down synchronously along with the vertical movement mechanism. The extending length of the multi-head clamp can be adjusted by adjusting the horizontal movement mechanism, so that the glue spreading machine is suitable for the glue spreading of wafers with different sizes; the height of the multi-head clamp can be adjusted through the vertical movement mechanism so as to adapt to rubber cylinders and needles with different sizes and the thickness of a wafer. The utility model discloses well horizontal motion adopts telescopic cylinder to realize, and vertical motion adopts linear guide and motor to realize, including but not limited to above-mentioned embodiment.

Preferably, the number of the developing units and the number of the gluing units are two, and the developing units are located above the gluing units in a one-to-one correspondence manner.

Specifically, the multi-head clamp on each gluing unit can accommodate four kinds of photoresist. Different photoresist requirements can be realized.

Further, for the convenience of adjusting the stability of sucking disc subassembly when the rubber coating, rubber coating unit below is equipped with telescopic bracket, telescopic bracket includes the crossbeam and sets up the expansion plate on the crossbeam, expansion plate one end is equipped with waist circular shape and adjusts the slot hole, adjusts the slot hole through waist circular shape and fixes on the crossbeam, is convenient for adjust the output position of expansion plate, and the other end transversely extends the crossbeam outward, one side of expansion plate is equipped with the detection sensor. The device is used for detecting whether the sucker component is in place or not, and the detection sensor can adopt a photoelectric sensor, an optical fiber sensor and the like.

Further, in order to realize the circulation of the wafer among different processes, the conveying unit comprises a lifting mechanism, a rotating mechanism and a sucker assembly, the sucker assembly is arranged on the rotating mechanism and can synchronously rotate along with the rotating mechanism, and the rotating mechanism is connected with the lifting mechanism and can move up and down along with the lifting mechanism.

Furthermore, a plurality of heat treatment units are arranged on the side wall of the process chamber. The number of the heat treatment units is not more than 16, and the heat treatment units are used for realizing the rapid setting and drying of the photoresist.

The utility model discloses well development unit's structure is not main improvement point, adopts prior art can realize, consequently, and here is no longer repeated.

The utility model has the advantages that: the utility model provides a chip front-end stack type gluing developing machine, which increases the dust removal unit to realize the cleaning of the photoresist dust, and reduces the reject ratio of the product; the stacked glue spreading and developing unit can reduce the volume of equipment and the occupied space, and is more suitable for large-scale integrated circuit production.

Drawings

The present invention will be further explained with reference to the drawings and examples.

Fig. 1 is a schematic structural diagram of a front view of the present invention.

Fig. 2 is a top view of the structure of fig. 1.

Fig. 3 is a schematic structural view of the dust removing unit.

Fig. 4 is a schematic structural view of a first embodiment of the air register plate.

Fig. 5 is a schematic view of a first embodiment of the damper in use.

Fig. 6 is a schematic structural view of a second embodiment of the air register plate.

Fig. 7 is a schematic structural view of a first embodiment of the air register plate.

Fig. 8 is a schematic structural view of the glue application device.

Figure 9 is a schematic view of the construction of the chuck assembly.

In the figure: 100. the device comprises a process box body, 1, a film box chamber, 2, a process chamber, 3, a mechanical arm, 4, a developing unit, 5, a gluing unit, 51, a multi-head clamp, 52, a vertical movement mechanism, 53, a horizontal movement mechanism, 54, photoresist, 55, an L-shaped connecting plate, 6, a dust removal unit, 61, an air duct, 62, an air inlet, 63, an air outlet, 64, an air adjusting plate, 641, a fixing plate, 642, a rotating plate, 643, a first air vent, 644, a second air vent, 645, an axle hole, 65, a dust removal bag, 7, a heat treatment unit, 8, a sucker assembly, 81, a sucker, 82, an air hole, 83, a rotating shaft, 9, a telescopic bracket, 91, a beam, 92, a telescopic plate, 93 and a detection sensor.

Detailed Description

The present invention will now be described in further detail with reference to the accompanying drawings. The drawings are simplified schematic drawings, which illustrate the basic structure of the invention only in a schematic way, and thus show only the components that are relevant to the invention, and the directions and references (e.g., upper, lower, left, right, etc.) may be used only to help describe the features in the drawings. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the claimed subject matter is defined only by the appended claims and equivalents thereof.

As shown in fig. 1 and 2, the utility model discloses a heap rubber coating developing machine before chip, including technology box 100, technology box 100 adopts the metal sheet welding to form, and every technology position correspondence on technology box 100 is equipped with the chamber door that can open. A wafer box room 1 and a process room 2 are arranged in the process box body 100, a mechanical arm 3 for moving wafers from the wafer box room 1 to the process room 2 is arranged between the wafer box room 1 and the process room 2, and the mechanical arm 3 is used for feeding and blanking the wafers. The process chamber 2 is mainly used for coating and developing the photoresist 54, and is internally provided with a conveying unit, a dust removing unit 6, a plurality of developing units 4 and a plurality of gluing units 5 which are stacked from top to bottom, wherein at least one developing unit 4 is arranged above each gluing unit 5, in the embodiment, the number of the developing units 4 and the number of the gluing units 5 are two, and the developing units 4 are correspondingly arranged above the gluing units 5. The conveying unit is used for circulating the wafers among different processes, and the dust removal unit 6 is arranged close to the gluing unit 5, preferably around the side wall of the process room 2. A plurality of heat treatment units 7 are provided on the sidewall of the process chamber 2. The number of the heat treatment units 7 does not exceed 16, and the heat treatment units 7 are used for realizing rapid setting and drying of the photoresist 54.

As shown in fig. 3, the dust removing unit 6 includes an air duct 61, one end of the air duct 61 is provided with an air inlet 62, the air inlet 62 is located inside the process chamber 2, and adopts a circular arc structure, which is beneficial to guiding in air and can avoid dust accumulation at edges and corners; the other end of the air duct 61 is provided with an air outlet 63 for circularly guiding out the processed air. An air adjusting plate 64 is arranged in the air duct 61 at the rear part of the air inlet 62, the air adjusting plate 64 can adjust the air inlet amount of the air inlet 62, and a dust removing bag 65 is arranged in the air duct 61 between the air adjusting plate 64 and the air outlet 63. The arrows in the figure indicate the direction of the air flow.

The structure of the register plate 64 has various implementations, and three specific structures are given below.

The first implementation mode comprises the following steps:

as shown in fig. 4 and 5, the air adjusting plate 64 includes a fixed plate 641 and a rotating plate 642 which are stacked and coaxially disposed, and the rotating plate 642 can rotate relative to the fixed plate 641 through a rotating shaft disposed in a shaft hole 645, the fixed plate 641 and the rotating plate 642 have completely the same structure, the fixed plate 641 is provided with a first vent hole 643, the rotating plate 642 is provided with a second vent hole 644, the first vent hole 643 and the second vent hole 644 are six and radially arranged, each vent hole has a circular shape with an equal size, and when the rotating plate 642 is rotated, the overlapping position of the first vent hole 643 and the second vent hole 644 changes, so as to change the size of the air volume. Each set of the second ventilation holes 644 forms a sector on the rotating plate 642, and the second ventilation holes 644 in different sectors are arranged in the same manner. In fig. 5, the rotating plate 642 is located at the front side, the fixing plate 641 is located at the rear side, the rotating plate 642 is rotated at an angle, and the second vent hole 644 at the front side partially overlaps the first vent hole 643 at the rear side.

The second embodiment:

as shown in fig. 6, the present embodiment is different from the first embodiment in that the shape of the second vent hole 644 in the rotating plate 642 is different, and in the present embodiment, the shape of the second vent hole 644 is a waist-shaped through hole distributed in the circumferential direction, and the width of the waist-shaped through hole is smaller than the diameter of the first vent hole 643.

The third embodiment is as follows:

as shown in fig. 7, the present embodiment is different from the first embodiment in that the arrangement of the second vent holes 644 on the rotating plate 642 is different, in the present embodiment, the rotating plate 642 is divided into six fan-shaped areas, each fan-shaped area corresponds to one first vent hole 643, each fan-shaped area is provided with a group of second vent holes 644, each group of second vent holes 644 includes three second vent holes 644 radially arranged, in the same group, the second vent holes 644 in the same strip have the same aperture, and the apertures of the second vent holes 644 in different strips gradually decrease along the clockwise direction. The second ventilation holes 644 with different apertures divide the rotating plate 642 into three levels, and the fixed air volume can be set by adjusting the positions of the fixed plate 641 and the rotating plate 642.

As shown in fig. 9, the glue spreading unit 5 includes a multi-head jig 51, a vertical moving mechanism 52, and a horizontal moving mechanism 53, the multi-head jig 51 being capable of accommodating a plurality of photoresists 54 at the same time, and the horizontal moving mechanism 53 being connected to the vertical moving mechanism 52 through an L-shaped connecting plate 55 and moving up and down in synchronization with the vertical moving mechanism 52. The extension length of the multi-head clamp 51 can be adjusted by adjusting the horizontal movement mechanism 53, so that the glue spreading device is suitable for the glue spreading of wafers with different sizes; the height of the multi-head fixture 51 can be adjusted by the vertical movement mechanism 52 to accommodate different sizes of glue cartridges and needles, and wafer thickness. The utility model discloses well horizontal motion 53 adopts telescopic cylinder to realize, and vertical motion 52 adopts linear guide and motor to realize, including but not limited to above-mentioned embodiment. The multi-head jig 51 on each of the gumming units 5 can accommodate four kinds of photoresists 54. Different photoresist 54 requirements may be achieved.

In order to facilitate the adjustment of the stability of the sucker assembly 8 during gluing, a telescopic support 9 is arranged below the gluing unit 5, the telescopic support 9 comprises a cross beam 91 and a telescopic plate 92 arranged on the cross beam 91, a waist-shaped adjusting long hole is formed in one end of the telescopic plate 92, the telescopic plate 92 is fixed on the cross beam 91 through the waist-shaped adjusting long hole, the output position of the telescopic plate 92 is convenient to adjust, the other end of the telescopic plate outwards and transversely extends out of the cross beam 91, and a detection sensor 93 is arranged on one side of the telescopic plate 92. The detection sensor 93 can be a photoelectric sensor, an optical fiber sensor, etc. for detecting whether the sucker assembly 8 is in place.

Further, in order to realize the circulation of the wafer among different processes, the conveying unit (not shown in the figure) comprises a lifting mechanism, a rotating mechanism and a sucker assembly 8, wherein the sucker assembly 8 is arranged on the rotating mechanism and can synchronously rotate along with the rotating mechanism, and the rotating mechanism is connected with the lifting mechanism and can move up and down along with the lifting mechanism. As shown in fig. 8, the suction cup assembly 8 includes a suction cup 81, a plurality of air holes 82 are formed in the suction cup 81, the air holes 82 are communicated with a vacuum system, and a rotating shaft 83 is arranged below the suction cup 81 and can drive the suction cup 81 to rotate.

In light of the foregoing, it will be apparent to those skilled in the art from this disclosure that various changes and modifications can be made without departing from the scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.

Claims

1. The utility model provides a chip front-end heap rubber coating developing machine which characterized in that: including the technology box, be equipped with between the spool box and the technology in the technology box, be equipped with between the spool box and the technology and remove the wafer from the spool box between the robotic arm between the technology, be equipped with conveying unit, dust removal unit and from the top down and pile up a plurality of development units and a plurality of rubber coating unit that set up in the technology, every rubber coating unit top is equipped with a development unit at least, conveying unit is used for the circulation of wafer between different technologies, the dust removal unit is close to the rubber coating unit and sets up, including the wind channel, wind channel one end is equipped with the air intake, and the other end is equipped with the air outlet, just the air intake is located inside the technology room, be equipped with the air regulating plate in the wind channel at air intake rear portion, the air inlet size of air intake can be adjusted to the air regulating plate, be equipped with.

2. The pre-chip stack paste dispenser according to claim 1, wherein: the air adjusting plate comprises a fixing plate and a rotating plate which are stacked and coaxially arranged, the rotating plate can rotate relative to the fixing plate, first air vents are formed in the fixing plate and are radially arranged into a plurality of air vents, a plurality of groups of second air vents are formed in the rotating plate, each first air vent corresponds to one group of second air vents, each group of second air vents is composed of a plurality of radially arranged second air vents, the aperture of each second air vent in the same group is equal to that of each other, the aperture of each second air vent in different groups is unequal, and the aperture of each second air vent is not larger than that of each first air vent.

3. The pre-chip stack paste dispenser according to claim 2, wherein: each group of second ventilation holes form a sector area on the rotating plate, and the second ventilation holes in different sector areas are arranged the same.

4. The pre-chip stack paste dispenser according to claim 2, wherein: the gluing unit comprises a multi-head clamp, a vertical movement mechanism and a horizontal movement mechanism, wherein the multi-head clamp can simultaneously accommodate a plurality of photoresists, and the horizontal movement mechanism is connected to the vertical movement mechanism through an L-shaped connecting plate and moves up and down synchronously along with the vertical movement mechanism.

5. The pre-chip stack paste dispenser according to claim 4, wherein: the developing units and the gluing units are two, and the developing units are located above the gluing units in a one-to-one correspondence mode.

6. The pre-chip stack paste dispenser according to claim 4, wherein: the multi-head clamp can accommodate four kinds of photoresist.

7. The pre-chip stack paste dispenser according to claim 4, wherein: the rubber coating unit below is equipped with telescopic bracket, telescopic bracket includes the crossbeam and sets up the expansion plate on the crossbeam, expansion plate one end is equipped with waist circular shape and adjusts the slot hole, adjusts the slot hole through waist circular shape and fixes on the crossbeam, and the outside transverse extension of the other end goes out the crossbeam, one side of expansion plate is equipped with detection sensor.

8. The pre-chip stack paste dispenser according to claim 4, wherein: the conveying unit comprises a lifting mechanism, a rotating mechanism and a sucker assembly, the sucker assembly is arranged on the rotating mechanism and can synchronously rotate along with the rotating mechanism, and the rotating mechanism is connected with the lifting mechanism and can move up and down along with the lifting mechanism.

9. The pre-chip stack paste dispenser according to any one of claims 1-8, wherein: and a plurality of heat treatment units are arranged on the side wall of the process chamber.