CN216249126U

CN216249126U - Novel computer without fan heat radiation structure

Info

Publication number: CN216249126U
Application number: CN202122524531.9U
Authority: CN
Inventors: 杨威
Original assignee: Individual
Current assignee: Individual
Priority date: 2021-10-20
Filing date: 2021-10-20
Publication date: 2022-04-08
Anticipated expiration: 2031-10-20

Abstract

The utility model provides a computer with a novel fanless heat dissipation structure, which comprises a computer body with a fanless heat dissipation structure, the computer body with the fanless heat dissipation structure comprises a main board, an external heat dissipation structure I, a heat conduction plate and an external heat dissipation structure II, the surface of the main board is provided with a cross joint screw, the middle of the main board is provided with a CPU chip, the bottom end of the CPU wafer is connected with a CPU heat conduction structure I which is arranged in the middle of the heat conduction plate, cross countersunk screws are arranged at four corners of the heat conducting plate, a first external heat dissipation structure is arranged at the bottom end of the heat conducting plate, an external heat dissipation top cover is arranged inside the first external heat dissipation structure, the computer with the novel fanless heat dissipation structure has the advantages of easy processing, reduced cost, less limitation, reduced product weight, the heat dissipation condition of the mainboard can be met by only changing the processing thickness of the section bar under the condition of changing the CPU power consumption of the mainboard.

Description

Novel computer without fan heat radiation structure

Technical Field

The utility model relates to the technical field of heat dissipation structures, in particular to a novel computer without a fan heat dissipation structure.

Background

The traditional industrial computer without the fan is generally of a transverse die structure, namely, the die opening surface is parallel to the IO port surface of the main board, the structure has certain limitation in die processing, and the die cannot be processed or the defect rate is high during processing when the structure is complex, and the die is easy to damage.

On the other hand, in the application of the industrial computer mainboard, the sizes of the mainboards are made according to international standards, different versions have different mainboard sizes, but the sizes of all the mainboards of the same version are fixed. For example, 3.5 inch motherboard, 170 x 170 motherboard, etc. all have international standards for standard motherboard sizes. Although the type size of the same type of mainboard is fixed, each type of mainboard has different power consumptions, different CPUs can be replaced on the same mainboard according to different performance requirements or the mainboard with the same size has different product power consumptions, and therefore additional cost can be increased in the prior art.

SUMMERY OF THE UTILITY MODEL

Aiming at the defects in the prior art, the utility model aims to provide a novel computer with a fanless heat dissipation structure to solve the problems in the background art, the novel computer with the fanless heat dissipation structure is easy to process, reduces the cost, has small limitation and lightens the product weight, and can meet the heat dissipation condition of a mainboard by only changing the processing thickness of a section bar under the condition of changing the power consumption of a CPU (central processing unit) of the mainboard.

In order to achieve the purpose, the utility model is realized by the following technical scheme: the utility model provides a novel computer of no fan heat radiation structure, includes no fan heat radiation structure computer body, no fan heat radiation structure computer body includes mainboard, outside heat radiation structure one, heat-conducting plate and outside heat radiation structure two, the surface mounting of mainboard has the cross joint screw, the CPU wafer is installed to the centre of mainboard, the bottom and the CPU heat conduction structure one of CPU wafer are connected, the centre at the heat-conducting plate is installed to CPU heat conduction structure one, the cross countersunk screw is installed in the four corners of heat-conducting plate, outside heat radiation structure one is installed to the bottom of heat-conducting plate, the inside of outside heat radiation structure one is provided with the outside heat dissipation top cap, IO panel and mainboard expansion port are installed to the side of mainboard, expansion port panel is installed to the opposite side of mainboard, bottom plate one is installed to the bottom of expansion port panel.

As a preferred embodiment of the present invention, a second CPU heat conducting structure is installed at the bottom end of the main board, a second external heat dissipating structure is installed at the bottom end of the second CPU heat conducting structure, a top cover of a product is installed at the bottom end of the second external heat dissipating structure, a middle frame of the product is installed at a side edge of the top cover of the product, a fixing plate is installed on the surface of the second external heat dissipating structure, a hexagonal stud is installed on the surface of the main board, and a second bottom plate is installed at the top end of the main board.

In a preferred embodiment of the present invention, four hexagonal studs are provided and are respectively mounted at four corners of the main board.

As a preferred embodiment of the utility model, the side edges of the middle frame of the product are provided with strip-shaped heat dissipation holes.

In a preferred embodiment of the present invention, the external heat-dissipating top cover is attached to the surface of the heat-conducting plate.

In a preferred embodiment of the present invention, the CPU heat conducting structure is fixedly mounted on the external heat dissipating top cover by a cross countersunk head screw.

The utility model has the beneficial effects that: the utility model discloses a novel computer with a fan-free heat dissipation structure, which comprises a computer body with a fan-free heat dissipation structure, wherein the computer body with the fan-free heat dissipation structure comprises a mainboard, a CPU wafer, a first external heat dissipation structure, a first CPU heat conduction structure, a top external heat dissipation cover, a cross countersunk head screw, a heat conduction plate, a cross joint screw, a mainboard expansion port, an IO panel, an expansion port panel, a first bottom plate, a second CPU heat conduction structure, a second external heat dissipation structure, a top product cover, a middle product frame, a fixing plate, a hexagonal stud and a second bottom plate.

1. The novel computer with the fan-free heat dissipation structure mainly can meet the requirement of more diversified design forms and is convenient for die machining. In the first embodiment of the present invention, the heat dissipation condition of the motherboard can be satisfied by changing the processing thickness of the profile only when the power consumption of the CPU of the motherboard is changed. The industrial computer can meet more diversified design forms and meet the heat dissipation condition of the main board by changing the processing thickness of the section bar, and mainly meets the requirements of high-power-consumption products.

2. In the second embodiment of the figure, the computer with the novel fanless heat dissipation structure mainly embodies that under the condition that the power consumption of a CPU is changed on a mainboard, a profile die (the same profile product) is not changed by an external heat dissipation structure, the heat dissipation area is increased only by changing the thickness of a profile, or the volume of the profile die meets the heat dissipation requirements of different power consumption products, and meanwhile, the requirement that the product weight is reduced on the premise that the power consumption of the product is met by aiming at low-power consumption products is also met.

3. This novel fanless heat radiation structure's computer adopts the degree of difficulty of the section bar cross-section die sinking that the product direction that changes product fanless complete machine heat radiation structure reduces like this to easily process, can satisfy the industrial control computer of pluralism design form, and the cost is practiced thrift with slight difference's heat dissipation demand. Such as: some customers of the same CPU power consumption product need to use the full power consumption without reducing the frequency, and some customers can receive 80 percent of reduced frequency for use, so that the customization requirements of the customers are met, and the cost of finished product materials is saved

4. This novel no fan heat radiation structure's computer for the radiating mode that generally adopts among the current no fan industrial control computer, promptly with mainboard IO face parallel section bar cross-section fin or with the mode of mainboard IO face vertical section bar cross-section fin, this patent structure has solved the weight that the low-power consumption product has also alleviateed the product when satisfying the heat dissipation demand.

Drawings

FIG. 1 is a top view of a motherboard of a first example of a novel fanless heat dissipation structure of the present invention;

FIG. 2 is a side view of a computer with a novel fanless heat dissipation structure according to an exemplary embodiment of the present invention;

FIG. 3 is a sectional view of an external heat dissipating top cover portion of a computer with a novel fanless heat dissipating structure according to the present invention;

FIG. 4 is an exploded view of a first example of a computer with a novel fanless heat dissipation structure according to the present invention;

FIG. 5 is a top view of a second example of a computer with a novel fanless heat dissipation structure according to the present invention;

FIG. 6 is a side view of a second example of a computer with a novel fanless heat dissipation structure according to the present invention;

FIG. 7 is an exploded view of a second example of a computer with a novel fanless heat dissipation structure according to the present invention;

in the figure: 1. a main board; 2. a CPU chip; 3. an external heat dissipation structure I; 4. a first CPU heat conducting structure; 5. an external heat dissipating top cover; 6. a cross countersunk head screw; 7. a heat conducting plate; 8. a cross joint screw; 9. a motherboard expansion port; 10. an IO panel; 11. an expansion port panel; 12. A first bottom plate; 13. a second CPU heat conducting structure; 14. a second external heat dissipation structure; 15. a product top cover; 16. a product middle frame; 17. a fixing plate; 18. a hexagonal stud; 19. and a second bottom plate.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the utility model easy to understand, the utility model is further described with the specific embodiments.

Referring to fig. 1 to 7, the present invention provides a technical solution: a novel computer with a fanless heat dissipation structure comprises a computer body with a fanless heat dissipation structure, wherein the computer body with the fanless heat dissipation structure comprises a main board 1, a first external heat dissipation structure 3, a heat conduction plate 7 and a second external heat dissipation structure 14, cross joint screws 8 are mounted on the surface of the main board 1, a CPU wafer 2 is mounted in the middle of the main board 1, the bottom end of the CPU wafer 2 is connected with the first CPU heat conduction structure 4, the first CPU heat conduction structure 4 is mounted in the middle of the heat conduction plate 7, cross countersunk head screws 6 are mounted at four corners of the heat conduction plate 7, the first external heat dissipation structure 3 is mounted at the bottom end of the heat conduction plate 7, an external heat dissipation top cover 5 is arranged inside the first external heat dissipation structure 3, an IO panel 10 and a main board expansion port 9 are mounted at the side edge of the main board 1, and an expansion port panel 11 is mounted at the other side of the main board 1, the bottom end of the expansion port panel 11 is provided with a first bottom plate 12, and the structure is used as the installation of the first example, and mainly embodies that the heat dissipation condition of the main board 1 can be met by only changing the processing thickness of the section bar under the condition of changing the power consumption of the CPU chip 2.

As a preferred embodiment of the present invention, a second CPU heat conducting structure 13 is installed at the bottom end of the main board 1, a second external heat dissipating structure 14 is installed at the bottom end of the second CPU heat conducting structure 13, a top cover 15 of a product is installed at the bottom end of the second external heat dissipating structure 14, a middle frame 16 of the product is installed at a side edge of the top cover 15 of the product, a fixing plate 17 is installed on the surface of the second external heat dissipating structure 14, a hexagon stud 18 is installed on the surface of the main board 1, and a second bottom plate 19 is installed at the top end of the main board 1.

In a preferred embodiment of the present invention, four hexagonal studs 18 are provided and are respectively mounted at four corners of the main plate 1, and the main plate 1 is partially supported and lifted by the hexagonal studs 18.

As a preferred embodiment of the present invention, the side edges of the middle frame 16 of the product are all provided with strip-shaped heat dissipation holes, so as to perform auxiliary heat dissipation and improve the heat dissipation effect.

In a preferred embodiment of the present invention, the external heat-dissipating top cover 5 is bonded to the surface of the heat-conducting plate 7 so as to correspond to each other, and the external heat-dissipating top cover 5 performs a heat-dissipating function.

In a preferred embodiment of the present invention, the first CPU heat conducting structure 4 is fixedly mounted on the external heat dissipating top cover 5 by a cross countersunk head screw 6, and the two are attached to each other to realize heat transfer.

The working principle is as follows: this novel fanless heat radiation structure's computer provides the electric energy for this device through power cord switch-on external power source, and the lower picture has contained the application example of two these novel structures, wherein in example one, scribble heat conduction silica gel in the middle of heat-conducting plate 7 and CPU heat conduction structure 4, and this contact surface need closely laminate, then fix with cross countersunk screw 6, heat-conducting plate 7 and CPU heat conduction structure 4 that will assemble are fixed to fix on outside heat dissipation top cap 5 with cross countersunk screw 6, make it closely laminate. According to different forms of the structure of the external heat dissipation top cover 5, the heat conduction structure of the CPU and the external heat dissipation top cover 5 can be directly and tightly attached to enhance the heat dissipation effect in a form of opening holes on the heat conduction plate 7. IO panel 10 is screwed to external heat dissipating cap 5. The chip 2 with the CPU is coated with heat-conducting silica gel and then fixed on the assembled heat-conducting plate 7 by screws. The expansion port of the main board 1 is mounted on the expansion port panel 11, the assembled expansion port panel 11 is fixed to the external heat dissipation top cover 5, and the IO panel 10 and the expansion port panel 11 are fixed by screws. And fixing the first base plate 12 on the panel by using screws to complete the assembly of the whole machine. The effect of this kind of structure lies in under the condition that mainboard 1 changes the CPU consumption, and outside heat radiation structure does not change the section bar mould and only increases heat radiating area through the thickness that changes the section bar to satisfy the heat dissipation demand of different consumption products. In the second example, the second product external heat dissipation structure 14 and the fixing plate 17 are fixed by the cross countersunk head screw 6. And fixing the assembled second external heat dissipation structure 14 on the top cover 15 of the product by using screws. Assembling the product middle frame 16 and the assembled product top cover 15, coating heat-conducting silica gel on the CPU, assembling the CPU into the product middle frame 16, and fixing the CPU by using the hexagonal stud 18. And fixing the second bottom plate 19 on the hexagonal stud 18 by using the cross countersunk head screw 6 to complete the whole assembly. The effect of this kind of structure lies in not only having satisfied the heat dissipation demand of product but also having saved the material and having alleviateed the weight of product when the product consumption is less, also can increase heat radiating area and satisfy the heat dissipation demand of consumption according to the thickness that CPU consumption is different only through changing the section bar to can satisfy more diversified design forms and can satisfy the industrial computer of mainboard heat dissipation condition through the processing thickness that changes the section bar.

While there have been shown and described what are at present considered the fundamental principles and essential features of the utility model and its advantages, it will be apparent to those skilled in the art that the utility model is not limited to the details of the foregoing exemplary embodiments, but is capable of other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. The utility model provides a novel computer of no fan heat radiation structure, includes no fan heat radiation structure computer body, its characterized in that: the computer body with the fanless heat dissipation structure comprises a mainboard (1), a first external heat dissipation structure (3), a heat conduction plate (7) and a second external heat dissipation structure (14), wherein a cross joint screw (8) is mounted on the surface of the mainboard (1), a CPU wafer (2) is mounted in the middle of the mainboard (1), the bottom end of the CPU wafer (2) is connected with the first CPU heat dissipation structure (4), the first CPU heat dissipation structure (4) is mounted in the middle of the heat conduction plate (7), cross countersunk head screws (6) are mounted at four corners of the heat conduction plate (7), the first external heat dissipation structure (3) is mounted at the bottom end of the heat conduction plate (7), an external heat dissipation top cover (5) is arranged inside the first external heat dissipation structure (3), an IO panel (10) and a mainboard expansion port (9) are mounted at the side edge of the mainboard (1), an expansion port panel (11) is mounted at the other side of the mainboard (1), and a first bottom plate (12) is arranged at the bottom end of the expansion port panel (11).

2. The computer with novel fanless heat dissipation structure as claimed in claim 1, wherein: two (13) of CPU heat conduction structure are installed to the bottom of mainboard (1), two (14) of outside heat radiation structure are installed to the bottom of two (13) of CPU heat conduction structure, product top cap (15) are installed to the bottom of two (14) of outside heat radiation structure, product center (16) are installed to the side of product top cap (15), the surface mounting of two (14) of outside heat radiation structure has fixed plate (17), the surface mounting of mainboard (1) has hex bolts (18), two (19) of bottom plates are installed on the top of mainboard (1).

3. The computer with novel fanless heat dissipation structure as claimed in claim 2, wherein: the number of the hexagonal studs (18) is four, and the four hexagonal studs are respectively arranged at four corners of the main board (1).

4. The computer with novel fanless heat dissipation structure as claimed in claim 2, wherein: the side of the product middle frame (16) is provided with strip-shaped heat dissipation holes.

5. The computer with novel fanless heat dissipation structure as claimed in claim 1, wherein: the external heat-radiating top cover (5) is attached to the surface of the heat-conducting plate (7).

6. The computer with novel fanless heat dissipation structure as claimed in claim 1, wherein: the CPU heat conducting structure I (4) is fixedly arranged on the external heat dissipation top cover (5) through a cross countersunk head screw (6).