CN215933589U - Surface mount rectifier bridge - Google Patents
Surface mount rectifier bridge Download PDFInfo
- Publication number
- CN215933589U CN215933589U CN202122302817.2U CN202122302817U CN215933589U CN 215933589 U CN215933589 U CN 215933589U CN 202122302817 U CN202122302817 U CN 202122302817U CN 215933589 U CN215933589 U CN 215933589U
- Authority
- CN
- China
- Prior art keywords
- chip
- area
- supporting
- rectifier bridge
- chip substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Rectifiers (AREA)
Abstract
The utility model discloses a surface mount type rectifier bridge, which comprises: first chip substrate, second chip substrate and one end of cladding in the epoxy packaging body are from first pin, the second pin that stretches out in the epoxy packaging body, first chip substrate is including being used for the first supporting area of being connected with at least two chips and the first lead wire district of the first supporting area one end of perpendicular to, second chip substrate includes the second supporting area that sets up with first supporting area parallel interval and perpendicular to second supporting area one end and lies in the first supporting area and keeps away from the second lead wire district in first lead wire district one end outside, the area of supporting part is less than the area and every of chip lower surface the supporting part is located under corresponding chip central zone. The utility model can reduce the position offset and rotation of the chip in the high-temperature welding process, improve the position precision of chip welding, improve the connection strength between epoxy and the chip and improve the stability of the product.
Description
Technical Field
The utility model relates to the technical field of semiconductor packaging, in particular to a surface mount type rectifier bridge.
Background
In recent years, the trend of miniaturization and light weight development of power supply products is more and more remarkable, and higher requirements are also put forward on the power density of patch type rectifier bridge products. The existing packaging structure is limited by the inner space of a product, a chip with a larger size is difficult to package, and the improvement of the power density of a rectifier bridge product is limited. The existing packaging structure mainly has the following defects: when packaging large-size chips, the chip spacing is not sufficient, and there is a risk that the chips collide together to cause product failure.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a chip type rectifier bridge which can reduce the position offset and rotation of a chip in the high-temperature welding process, improve the position precision of chip welding, improve the connection strength between epoxy and the chip and improve the stability of a product.
In order to achieve the purpose, the utility model adopts the technical scheme that: a surface mount rectifier bridge, comprising: the first chip substrate, the second chip substrate and the first pin and the second pin extend out of the epoxy package body at one end, the first chip substrate comprises a first supporting area and a first lead area, the first supporting area is used for being connected with at least two chips, the first lead area is perpendicular to one end of the first supporting area, the second chip substrate comprises a second supporting area and a second lead area, the second supporting area is parallel to the first supporting area and arranged at intervals, the second lead area is perpendicular to one end of the second supporting area and located on the outer side of one end, far away from the first lead area, of the first supporting area, one end, close to the second supporting area, of the second lead area is provided with a downward first bending portion, an upper horizontal portion and a lower horizontal portion are formed on two sides of the first bending portion, and the upper surface, located on the outer side of the first supporting area, of the lower horizontal portion is lower than the lower surface of the first supporting area in the vertical direction;
the chip comprises a first chip substrate and a second chip substrate, wherein the first chip substrate and the second chip substrate are respectively provided with a supporting part in the region for being connected with a chip, the area of each supporting part is smaller than that of the lower surface of the chip, and each supporting part is positioned under the central region of the corresponding chip.
The further improved scheme in the technical scheme is as follows:
1. in the above scheme, the first bending portion is located at a joint of the second lead region and the second support region, so that the upper horizontal portion and the second support region partially overlap.
2. In the above scheme, one end of the lower horizontal part, which is far away from the upper horizontal part, extends outwards from the interior of the epoxy packaging body.
3. In the above scheme, the side surface at the edge of the support part is a slope.
4. In the above scheme, the upper and lower surfaces of the supporting portion are respectively connected to the chip, the first chip substrate or the second chip substrate through solder.
Due to the application of the technical scheme, compared with the prior art, the utility model has the following advantages and effects:
1. according to the surface mount rectifier bridge, the two chip substrates which are close to each other in the horizontal direction are separated in the vertical direction through the arrangement of the first bending part on the second lead area, so that the chips can be arranged at the edge of the chip substrates and extend outwards from the edge of the chip substrates, the distance between multiple chips on the same chip substrate is increased without increasing the product structure, the problem of product failure caused by collision between adjacent chips and between the chips and other chip substrates due to insufficient distance is avoided, and the overall processing yield and the product stability are improved.
2. According to the surface mount type rectifier bridge, the areas, used for being connected with the chips, of the first chip substrate and the second chip substrate are respectively provided with the supporting parts, the areas of the supporting parts are smaller than the area of the lower surfaces of the chips, and each supporting part is located right below the central area of the corresponding chip, so that the position deviation and rotation of the chips in the high-temperature welding process can be reduced, the position accuracy of chip welding is improved, the connection strength between epoxy and the chips can be improved, and the stability of products is improved.
Drawings
FIG. 1 is a schematic structural diagram of a surface mount rectifier bridge according to the present invention;
FIG. 2 is a schematic view of a partial structure of a surface mount rectifier bridge according to the present invention;
fig. 3 is a sectional view taken along line a-a in fig. 1.
In the above drawings: 1. an epoxy package; 2. a first chip substrate; 21. a first support region; 22. a first lead region; 3. a second chip substrate; 31. a second support region; 32. a second lead section; 4. a first pin; 5. a second pin; 6. a chip; 61. a first chip; 62. a second chip; 63. a third chip; 64. a fourth chip; 7. connecting sheets; 8. a first bending portion; 91. an upper horizontal portion; 92. a lower horizontal portion; 10. a second bending portion; 11. a support portion.
Detailed Description
The utility model is further described with reference to the following figures and examples:
example 1: a surface mount rectifier bridge, comprising: a first chip substrate 2, a second chip substrate 3, and first and second pins 4 and 5, one end of which extends from the epoxy package 1, the first chip substrate 2 includes a first support region 21 for connecting with at least two chips 6 and a first lead region 22 perpendicular to one end of the first support region 21, the second chip substrate 3 includes a second support region 31 parallel to the first support region 21 and spaced apart from the first support region 21, and a second lead region 32 perpendicular to one end of the second support region 31 and located outside the first support region 21 and far from the first lead region 22, one end of the second lead region 32 close to the second support region 31 has a downward first bending portion 8, so that an upper horizontal portion 91 and a lower horizontal portion 92 are formed on both sides of the first bending portion 8, and an upper surface of the lower horizontal portion 92 located outside the first support region 21 is lower than a lower surface of the first support region 21 in a vertical direction, the height difference between the upper horizontal part and the lower horizontal part is 0.1 cm;
the first chip substrate 2 and the second chip substrate 3 are respectively provided with a supporting part 11 in the region for connecting with the chip 6, the area of the supporting part 11 is smaller than the area of the lower surface of the chip 6, and each supporting part 11 is located right below the central region of the corresponding chip 6.
The first bending portion 8 is located at the connection point of the second lead region 32 and the second support region 31, so that the upper horizontal portion 91 is partially overlapped with the second support region 31; one end of the lower horizontal portion 92 away from the upper horizontal portion 91 extends outward from the interior of the epoxy package 1;
the first chip 61 and the second chip 62 are disposed on the upper surface of the second chip substrate 3 at an interval, the positive electrodes of the first chip 61 and the second chip 62 are electrically conducted with the first chip substrate 2, the negative electrodes of the third chip 63 and the fourth chip 64 are disposed on the upper surface of the first chip substrate 2 at an interval, the negative electrodes of the first chip 61 and the positive electrodes of the third chip 63 are electrically conducted with the second chip substrate 3, the negative electrodes of the third chip 63 and the positive electrodes of the fourth chip 63 are electrically connected with one end of the first pins 4 in the epoxy package 1 through a connecting sheet 7, and the negative electrodes of the second chip 62 and the positive electrodes of the fourth chip 64 are electrically connected with one end of the second pins 5 in the epoxy package 1 through another connecting sheet 7.
Example 2: a surface mount rectifier bridge, comprising: a first chip substrate 2, a second chip substrate 3, and first and second pins 4 and 5, one end of which extends from the epoxy package 1, the first chip substrate 2 includes a first support region 21 for connecting with at least two chips 6 and a first lead region 22 perpendicular to one end of the first support region 21, the second chip substrate 3 includes a second support region 31 parallel to the first support region 21 and spaced apart from the first support region 21, and a second lead region 32 perpendicular to one end of the second support region 31 and located outside the first support region 21 and far from the first lead region 22, one end of the second lead region 32 close to the second support region 31 has a downward first bending portion 8, so that an upper horizontal portion 91 and a lower horizontal portion 92 are formed on both sides of the first bending portion 8, and an upper surface of the lower horizontal portion 92 located outside the first support region 21 is lower than a lower surface of the first support region 21 in a vertical direction, the height difference between the upper horizontal part and the lower horizontal part is 0.1 cm;
the first chip substrate 2 and the second chip substrate 3 are respectively provided with a supporting part 11 in the region for connecting with the chip 6, the area of the supporting part 11 is smaller than the area of the lower surface of the chip 6, and each supporting part 11 is located right below the central region of the corresponding chip 6.
The side surface at the edge of the supporting part 11 is a slope; the upper and lower surfaces of the support portion 11 are connected to the chip 6, the first chip substrate 2, or the second chip substrate 3 by solder, respectively; the first chip substrate 2 and the second chip substrate 3 are copper substrates.
When the chip type rectifier bridge is adopted, the two chip substrates which are close to each other in the horizontal direction are spatially separated in the vertical direction through the arrangement of the first bending part on the second lead area, so that the chips can be arranged at the edge of the chip substrates and extend outwards from the edge of the chip substrates, the space between the multiple chips on the same chip substrate is increased while the product structure is not increased, the product failure problem caused by collision between the adjacent chips and between the chips and other chip substrates due to insufficient space is avoided, and the integral processing yield and the product stability are improved;
in addition, a supporting part is arranged in the region of the first chip substrate and the region of the second chip substrate, which are respectively used for being connected with the chip, the area of the supporting part is smaller than that of the lower surface of the chip, and each supporting part is positioned right below the central region of the corresponding chip. The chip welding device can reduce the position offset and rotation of the chip in the high-temperature welding process, improve the position precision of chip welding, improve the connection strength between epoxy and the chip and improve the stability of a product.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.
Claims (5)
1. A surface mount rectifier bridge, comprising: first chip base plate (2), second chip base plate (3) and one end of cladding in epoxy packaging body (1) are from first pin (4), second pin (5) that stretch out in epoxy packaging body (1), its characterized in that: the first chip substrate (2) comprises a first support area (21) for connecting with at least two chips (6) and a first lead area (22) vertical to one end of the first support area (21), the second chip substrate (3) comprises a second supporting area (31) which is arranged in parallel with the first supporting area (21) at an interval and a second lead area (32) which is vertical to one end of the second supporting area (31) and is positioned outside one end of the first supporting area (21) far away from the first lead area (22), one end of the second lead area (32) close to the second support area (31) is provided with a downward first bending part (8), thereby forming an upper horizontal part (91) and a lower horizontal part (92) at both sides of the first bending part (8), and the upper surface of the lower horizontal portion (92) located outside the first support zone (21) is lower than the lower surface of the first support zone (21) in the vertical direction;
the region that is used for being connected with chip (6) on first chip base plate (2), the second chip base plate (3) separately is provided with a supporting part (11), the area of supporting part (11) is less than the area and every of chip (6) lower surface supporting part (11) are located and correspond chip (6) central zone under.
2. The surface mount rectifier bridge of claim 1, wherein: the first bending part (8) is positioned at the joint of the second lead area (32) and the second support area (31) so that the upper horizontal part (91) is partially overlapped with the second support area (31).
3. The surface mount rectifier bridge of claim 1, wherein: one end of the lower horizontal part (92) far away from the upper horizontal part (91) extends outwards from the interior of the epoxy packaging body (1).
4. The surface mount rectifier bridge of claim 1, wherein: the side surface at the edge of the supporting part (11) is a slope surface.
5. The surface mount rectifier bridge of claim 1, wherein: the upper surface and the lower surface of the supporting part (11) are respectively connected with the chip (6), the first chip substrate (2) or the second chip substrate (3) through soldering tin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122302817.2U CN215933589U (en) | 2021-09-23 | 2021-09-23 | Surface mount rectifier bridge |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122302817.2U CN215933589U (en) | 2021-09-23 | 2021-09-23 | Surface mount rectifier bridge |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215933589U true CN215933589U (en) | 2022-03-01 |
Family
ID=80414144
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122302817.2U Active CN215933589U (en) | 2021-09-23 | 2021-09-23 | Surface mount rectifier bridge |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215933589U (en) |
-
2021
- 2021-09-23 CN CN202122302817.2U patent/CN215933589U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW201327944A (en) | LED light bar and manufacturing method of the same | |
| CN215933589U (en) | Surface mount rectifier bridge | |
| CN201937955U (en) | Circuit board and module | |
| CN107293530B (en) | High-precision high-yield rectifier device | |
| CN215933588U (en) | Full-bridge semiconductor device | |
| CN215933592U (en) | Semiconductor power device | |
| CN215933591U (en) | High power density semiconductor device | |
| CN202084544U (en) | Diamond bridge rectifier | |
| CN217544605U (en) | D2PAK lead frame | |
| CN215933590U (en) | Semiconductor rectifier bridge for communication | |
| CN216214007U (en) | Circulator with PCB | |
| CN115910976A (en) | Semiconductor rectifier bridge | |
| CN210628297U (en) | High-density IDF type lead frame | |
| CN215578513U (en) | High power semiconductor device | |
| CN210778574U (en) | DBC structure suitable for high-voltage power device module packaging | |
| CN210866147U (en) | Heating block unit and heating device | |
| CN207098955U (en) | A kind of three phase rectifier bridge module with the electrode for being easy to welding | |
| CN213635978U (en) | High-reliability diode device | |
| CN215578512U (en) | High-yield high-power device | |
| CN114551367A (en) | Semiconductor device of parallel structure | |
| CN215578510U (en) | Power device of multilayer chip | |
| CN108598178B (en) | Rectifying chip for microelectronic device | |
| CN213635960U (en) | High-efficiency protection device | |
| CN219716860U (en) | Chip packaging structure | |
| CN216311783U (en) | Mini/Micro-LED display module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |