CN215869452U - LED glue injection packaging structure - Google Patents
LED glue injection packaging structure Download PDFInfo
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- CN215869452U CN215869452U CN202120948997.9U CN202120948997U CN215869452U CN 215869452 U CN215869452 U CN 215869452U CN 202120948997 U CN202120948997 U CN 202120948997U CN 215869452 U CN215869452 U CN 215869452U
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- inner bowl
- glue injection
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Abstract
The utility model discloses an LED glue injection packaging structure, which comprises: the LED chip fixing structure comprises a support, wherein an inner bowl cup is arranged in the support, a step is arranged on the upper edge of the inner bowl cup along the support, and the LED chip is fixed in the support through die bonding glue. The steps are changed through the support, glue is injected into the inner bowl cup, the using amount of the glue is saved by 40% -50%, the cost is saved, the glue injection speed can be increased, the productivity is improved, and the sealing performance and the bonding performance of the lamp beads are improved. In addition, the positive and negative electrodes of the chip are respectively connected with the support through the M bonding wires, so that stress generated by expansion and contraction of the colloid can be effectively released, and the service life of the lamp bead is prolonged.
Description
Technical Field
The utility model relates to the technical field of LED packaging, in particular to an LED glue injection packaging structure.
Background
At present, the LED is used as a novel light source, and has the advantages of low energy consumption, long service life, small volume, flexible and convenient use and the like, thereby being widely applied to the fields of illumination and display. The traditional SMD paster LED packaging is that a plane or a slightly concave colloid is formed in a bowl cup through glue injection, and the colloid mainly plays a role in protecting bonding wires from being damaged.
Most SMD patches on the market have more than 1/3 colloid above the bonding wire, which cannot play a main role and causes certain cost loss.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims to provide an LED glue injection packaging structure which not only can save cost and improve efficiency, but also can improve the overall performance of a lamp bead.
In order to achieve the above object, the present invention provides an LED glue injection package structure, including: the LED chip fixing structure comprises a support, wherein an inner bowl cup is arranged in the support, a step is arranged on the upper edge of the inner bowl cup along the support, and the LED chip is fixed in the support through die bonding glue.
The LED glue injection packaging structure further comprises bonding wires, and the bonding wires are used for connecting the positive electrode and the negative electrode of the LED chip with the support respectively.
And the bonding wire connects the positive electrode and the negative electrode of the LED chip with the bracket respectively through an M-shaped wire arc model.
Wherein, the bracket fixed with the LED chip is baked for 120 minutes at 165 +/-5 ℃.
The LED glue injection packaging structure further comprises glue, and the glue is filled in the inner bowl cup of the support.
Wherein the viscosity of the colloid before baking is 6000-8000 mPa.s.
Wherein the colloid comprises two-stage baking at 85 ℃ for 60 minutes in the first stage and 150 ℃ for 240 minutes in the second stage.
The utility model has the beneficial effects that: the LED glue injection packaging structure has the advantages that the steps are changed through the support, glue is injected into the inner bowl cup, the using amount of the glue is saved by 40% -50%, the cost is saved, the glue injection speed can be increased, the productivity is improved, and the sealing performance and the bonding performance of the lamp beads are improved. In addition, the positive and negative electrodes of the chip are respectively connected with the support through the M bonding wires, so that stress generated by expansion and contraction of the colloid can be effectively released, and the service life of the lamp bead is prolonged.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic diagram of a packaging process flow of the LED glue injection packaging structure of the present invention;
fig. 2 is a schematic diagram of an LED glue injection package structure according to the present invention.
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings. Drawings
| Code | Name (R) | Code | Name (R) |
| 1 | |
3 | Colloid |
| 2 | |
4 | Chip and method for manufacturing the same |
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 2, the present invention provides an LED glue injection package structure, including: the LED lamp holder comprises a support, wherein an inner bowl cup is arranged in the support, a step 1 is arranged on the upper edge of the inner bowl cup along the support, and an LED chip 4 is fixed in the support through die bonding glue. Therefore, the steps 1 are changed through the support, glue is injected into the inner bowl cup, the using amount of the glue is saved and reaches 40% -50%, the cost is saved, the glue injection speed can be increased, the productivity is improved, and the sealing performance and the bonding performance of the lamp beads are improved. Wherein, the bracket fixed with the LED chip 4 is baked for 120 minutes at 165 +/-5 ℃.
Further, the LED glue injection packaging structure further comprises bonding wires, and the bonding wires are used for connecting the positive electrode and the negative electrode of the LED chip 4 with the support respectively.
And the bonding wire connects the positive electrode and the negative electrode of the LED chip 4 with the bracket respectively through an M-shaped wire arc model.
From this, adopt M bonding wire 2 with the positive negative pole of chip 4 respectively with the leg joint, can effectual release colloid 3 stress that the expansion and contraction produced, improve the life of lamp pearl.
Further, the LED glue injection packaging structure further comprises glue 3, and the glue 3 is filled in the inner bowl cup of the support. Specifically, when filling is performed, the AB glue mixed in a certain proportion may be vacuumized and defoamed, and then dispensed into the inner bowl of the bracket through the dispenser, as shown in fig. 2. The glue amount of the whole bowl after being fully dispensed is 820 (machine dispensing amount) and is changed into glue amount of 420 (machine dispensing amount) after being dispensed by 48.7 percent.
After the dispensing is finished, the bracket is placed in a material box with the front face facing downwards and is placed in a constant-temperature oven to be baked at two stages of temperatures, wherein the first stage is baked at 85 ℃ for 60 minutes, and the second stage is baked at 150 ℃ for 240 minutes. In order to prevent the glue from flowing to the step 1 of the bracket, the viscosity of the mixed glue is controlled to be 6000-8000 mPa.s.
Compared with the prior art, the LED glue injection packaging structure has the advantages that the sealing performance and the bonding performance of the lamp beads are improved by changing the step 1 of the support; the glue consumption is saved by 40-50% by the way of injecting glue into the inner bowl and the inner cup; the service life of the lamp bead in an extreme environment is prolonged through the M-shaped arc; the viscosity of the glue is controlled within the range of 6000-plus-8000 mPa.s, the glue is solidified by inverse baking, the glue injection speed can be increased, the productivity can be improved, and the sealing property and the bonding property of the lamp beads can be improved.
The LED glue injection packaging process flow of the present invention is further described in detail with reference to fig. 1 and fig. 2, and mainly includes the following steps:
the first step is crystal solidification: and fixing the chip 4 at a designated position in the inner bowl with the step 1 bracket through die bonding glue.
The second step is crystal fixing and baking: the support with the chip 4 fixed thereon is placed into a constant temperature oven and baked for 120 minutes at 165 +/-5 ℃.
The third step is a solid crystal thrust test: and (4) carrying out thrust test on the baked die bonding material by using a die bonding thrust tester, and checking whether the thrust of the die bonding material meets the requirement of operation.
Fourth step, wire welding: the positive and negative electrodes of the chip 4 are connected with the support through the M bonding wires 2 respectively, and the M wire arc model is adopted for connection, so that stress generated by expansion and contraction of the colloid 3 can be effectively released, and the service life of the lamp bead is prolonged.
Fifthly, dehumidifying the dispensing support: baking the mixture for 120 minutes in a constant temperature oven at 150 ℃.
Sixth step dispensing: and after the AB glue mixed according to a certain proportion is vacuumized and defoamed, the AB glue is dispensed into an inner bowl cup of the bracket through a dispenser to form a colloid 3. The glue amount of the whole bowl after being fully dispensed is 820 (machine dispensing amount) and is changed into glue amount of 420 (machine dispensing amount) after being dispensed by 48.7 percent.
The seventh step of inverted baking: placing the bracket with the front face facing downwards in a material box, placing the material box in a constant-temperature oven for baking at two temperatures, wherein the first section is baked at 85 ℃ for 60 minutes, and the second section is baked at 150 ℃ for 240 minutes. In order to prevent the glue from flowing to the step 1 of the bracket, the viscosity of the mixed glue is controlled to be 6000-8000 mPa.s.
Eighth step appearance inspection: and (4) sorting out defective products in the finished product through manual visual inspection.
Ninth step stripping: and stripping the finished lamp beads and the bracket die by a stripping machine.
A tenth step of light splitting: and dividing parameters such as voltage, color area, brightness and the like of the finished lamp beads through a wind-light machine, and blocking defective products such as dead lamps, electric leakage and the like.
Eleventh step taping: and (4) braiding the finished lamp beads in a uniform direction through a braiding machine and winding the braided lamp beads by a reel.
And a twelfth step of packaging: and (5) carrying out vacuum packaging on the reel, and attaching labels with corresponding parameters.
The utility model has the beneficial effects that: the LED glue injection packaging structure has the advantages that the steps 1 are changed through the support, glue is injected into the inner bowl cup, the using amount of the glue is saved by 40% -50%, the cost is saved, the glue injection speed can be increased, the productivity is improved, and the sealing performance and the bonding performance of lamp beads are improved. In addition, the positive and negative electrodes of the chip 4 are respectively connected with the support by the M bonding wires 2, so that stress generated by expansion and contraction of the colloid 3 can be effectively released, and the service life of the lamp bead is prolonged.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (1)
1. The utility model provides a LED injecting glue packaging structure which characterized in that includes: the LED chip fixing structure comprises a support, wherein an inner bowl cup is arranged in the support, a step is arranged on the support along the upper edge of the inner bowl cup, and the LED chip is fixed in the support through die bonding glue;
the LED glue injection packaging structure further comprises bonding wires, and the bonding wires are used for respectively connecting the positive electrode and the negative electrode of the LED chip with the bracket;
the bonding wire connects the positive and negative electrodes of the LED chip with the bracket respectively through an M-shaped wire arc model;
the LED glue injection packaging structure further comprises glue, and the glue is filled in the inner bowl cup of the support.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120948997.9U CN215869452U (en) | 2021-05-06 | 2021-05-06 | LED glue injection packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120948997.9U CN215869452U (en) | 2021-05-06 | 2021-05-06 | LED glue injection packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215869452U true CN215869452U (en) | 2022-02-18 |
Family
ID=80316019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120948997.9U Active CN215869452U (en) | 2021-05-06 | 2021-05-06 | LED glue injection packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215869452U (en) |
-
2021
- 2021-05-06 CN CN202120948997.9U patent/CN215869452U/en active Active
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Address after: 518000 floor 5, building B and floor 6, building B, No. 1 new plant, No. 3 industrial zone, Luozu community, Shiyan street, Bao'an District, Shenzhen, Guangdong Patentee after: Shenzhen Liangan Technology Co.,Ltd. Address before: 518000 6 / F, block a and 6 / F, block B, No. 1 new plant, No. 3 industrial zone, Luozu community, Shiyan street, Bao'an District, Shenzhen, Guangdong Patentee before: SHENZHEN LIANGAN PHOTOELECTRICITY TECHNOLOGY CO.,LTD. |