CN110350068A - A kind of CSP LED and its processing method with circular luminous face - Google Patents
A kind of CSP LED and its processing method with circular luminous face Download PDFInfo
- Publication number
- CN110350068A CN110350068A CN201910538801.6A CN201910538801A CN110350068A CN 110350068 A CN110350068 A CN 110350068A CN 201910538801 A CN201910538801 A CN 201910538801A CN 110350068 A CN110350068 A CN 110350068A
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- led
- led chip
- csp
- fluorescent film
- light
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- 238000003672 processing method Methods 0.000 title claims abstract description 14
- 239000003292 glue Substances 0.000 claims description 13
- 239000012790 adhesive layer Substances 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 238000004513 sizing Methods 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 238000012536 packaging technology Methods 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000009826 distribution Methods 0.000 abstract description 5
- 230000001795 light effect Effects 0.000 abstract description 3
- 230000000007 visual effect Effects 0.000 abstract description 3
- 230000003760 hair shine Effects 0.000 abstract description 2
- 238000005538 encapsulation Methods 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 241001465382 Physalis alkekengi Species 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a kind of CSP LED and its processing method with circular luminous face, LED chip is positioned by carrier film, single fluorescent film is placed in one by one in LED chip and is adhesively fixed, it is rectangular CSP LED light-emitting surface packaging technology directed downwardly that middle light-emitting surface, which is different from the prior art, the face-up packaging technology that shines is used to realize light-emitting surface as the batch automatic production of circular CSP LED, it is rectangular CSP LED compared to light-emitting surface, light-emitting surface is circular CSP LED, good visual effect, facilitate light distribution, the present invention has filled up this technological gap of circular luminous face CSP LED, product itself is good at light effect, have a wide range of application, processing method novel and unique, high production efficiency, yields is high, have very big industrial value and economic value, The present invention is suitable for CSP LED and its packaging technology.
Description
Technical field
The present invention relates to CSP LED and its packaging technology field, in particular to a kind of CSP LED with circular luminous face
And its processing method.
Background technique
LED is also referred to as light emitting diode, is a kind of semiconductor devices that can convert electrical energy into visible light, LED conduct
A kind of new type light source, due to energy-efficient, environmentally protective, the service life is long, starting speed is fast, without the conventional light sources such as stroboscopic height without
Analogous advantage achieves fast development, is related to the daily household electrical appliances such as mobile phone, lamps and lanterns, household electrical appliances and machinery production with field
Aspect, wherein being mainly packaged using CSP encapsulation technology to light-emitting component.CSP full name Chip Scale Package, refers to
It is the fully functional packaging that the ratio between package dimension and chip size are not more than 1.2 times, thus using the LED of CSP encapsulation
With small size, high current, highly reliable.
CSP LED light-emitting surface in the prior art be mostly it is rectangular, using on fluorescent film bond LED chip dispensing after cut
The light-emitting surface packaging technology directed downwardly for cutting separation, is easy to batch automatic production.Circular luminous face compared to rectangular light-emitting surface, depending on
Feel that effect is good, and facilitates light distribution, therefore light-emitting surface is that circular CSP LED has great market value, due to light-emitting surface shape
Caused LED internal structure difference can not use above-mentioned packaging technology to mass-produce light-emitting surface as circular CSP LED, be somebody's turn to do
Technological gap is urgently filled up.
Summary of the invention
In order to overcome the above-mentioned deficiencies of the prior art, the present invention provides a kind of CSP LED with circular luminous face and
Its processing method.
In order to achieve the above objectives, the technical solution adopted by the present invention to solve the technical problems is: one kind having round hair
The CSP LED of smooth surface, including live apart up and down, the fluorescent film that is adhesively fixed and LED chip, the fluorescent film is rounded, the LED
Chip lower wall is equipped with a pair of electrodes, and adhesive layer is folded between the LED chip and fluorescent film, and the LED chip upper wall covering is glimmering
Light film lower wall, the LED chip surrounding and fluorescent film surrounding, which are wrapped up in, is cased with white wall glue, is integrally formed one with fluorescent film upper wall institute
It is top surface, using plane where LED chip lower wall as the cuboid of bottom surface in plane.
Based on a kind of above-mentioned CSP LED with circular luminous face, the present invention still further developed a kind of processing method, including
Following steps:
A., one carrier film is set, and in one layer of silica adhesive of coating in carrier film；
B. several LED chips are spaced apart from each other and rectangular array is distributed in carrier film, LED chip lower wall and carrier film
It is adhesively fixed；
C. adhesive layer is coated in LED chip upper wall, single fluorescent film is placed in one by one in LED chip and is adhesively fixed, is made
Fluorescent film lower wall, baking sizing is completely covered in LED chip upper wall；
D. white wall glue is clicked and entered on a carrier film, so that white wall glue is filled up between LED chip the everywhere gap between fluorescent film, and white
Wall glue upper surface maintains an equal level in fluorescent film upper wall, baking sizing；
E. it cuts along LED chip transverse and longitudinal gap, is cut off simultaneously together with carrier film vertically, remove carrier film after separation blanking and obtain
To several CSP LED with circular luminous face.
Preferably, the carrier film is made of PET material.
Preferably, the carrier film thickness is 0.2mm, surface viscosity 3-6g/cm2。
Due to the application of the above technical scheme, the present invention have compared with prior art it is following the utility model has the advantages that
LED chip is positioned by carrier film, single fluorescent film is placed in one by one in LED chip and is adhesively fixed, is distinguished
In light-emitting surface in the prior art be rectangular CSP LED light-emitting surface packaging technology directed downwardly, using the encapsulation work for shining face-up
Skill realizes the batch automatic production that light-emitting surface is circular CSP LED, is rectangular CSP LED, hair compared to light-emitting surface
Smooth surface is circular CSP LED, and good visual effect facilitates light distribution.
The present invention has filled up this technological gap of circular luminous face CSP LED, and product itself is good at light effect, application range
Extensively, processing method novel and unique, high production efficiency, yields is high, has very big industrial value and economic value.
Detailed description of the invention
Fig. 1 is a kind of top view of the CSP LED with circular luminous face in the present embodiment.
Fig. 2 is a kind of cross-sectional view of the CSP LED with circular luminous face in the present embodiment.
Fig. 3 is a kind of process flow chart of the CSP LED processing method with circular luminous face in the present embodiment.
In figure: 1, fluorescent film；2, LED chip；3, electrode；4, adhesive layer；5, white wall glue；6, carrier film.
Specific embodiment
Combined with specific embodiments below, the contents of the present invention are described in further detail:
The present embodiment is a kind of CSP LED with circular luminous face combined with Figure 1 and Figure 2, including separation is upper and lower, bonding
Fixed fluorescent film 1 and LED chip 2, fluorescent film 1 is rounded, and 2 lower wall of LED chip is equipped with a pair of electrodes 3, LED chip 2 and glimmering
Adhesive layer 4 is folded between light film 1,2 upper wall of LED chip covers 1 lower wall of fluorescent film, and 2 surrounding of LED chip and 1 surrounding of fluorescent film are equal
Wrap up in and be cased with white wall glue 5, be integrally formed one using plane where fluorescent film 1 upper wall as top surface, with plane where 2 lower wall of LED chip
For the cuboid of bottom surface.
The present embodiment is the CSP LED that single side goes out light, goes out light color and is determined by 2 color of LED chip and 1 color of fluorescent film
It is fixed, for example, the present embodiment issues white light when fluorescent film 1 is yellow fluorescence film 1 and LED chip 2 is blue LED die 2.
As shown in figure 3, a kind of above-mentioned CSP LED processing method with circular luminous face, comprising the following steps:
A., one carrier film 6 is set, and in one layer of silica adhesive of coating in carrier film 6；
B. several LED chips 2 are spaced apart from each other and rectangular array is distributed in carrier film 6,2 lower wall of LED chip and load
Body film 6 is adhesively fixed；
C. adhesive layer 4 is coated in 2 upper wall of LED chip, single fluorescent film 1 is placed in one by one in LED chip 2 and is bonded admittedly
It is fixed, make 2 upper wall of LED chip that 1 lower wall of fluorescent film, baking sizing be completely covered；
D. white wall glue 5 is clicked and entered in carrier film 6, fills up white wall glue 5 between LED chip 2 between fluorescent film 1 between everywhere
Gap, and white 5 upper surface of wall glue maintains an equal level in 1 upper wall of fluorescent film, baking sizing；
E. it cuts along 2 transverse and longitudinal gap of LED chip, is cut off simultaneously together with carrier film 6 vertically, remove carrier film after separating blanking
6 obtain several CSP LED with circular luminous face.
Wherein, 1 lower wall of fluorescent film is completely covered in 2 upper wall of LED chip, ensure that the complete of circular luminous face；Carrier film 6 by
PET material is constituted；Carrier film 6 is with a thickness of 0.2mm, surface viscosity 3-6g/cm2, it is processed that carrier film 6 is used only as CSP LED
The positioning of LED chip 2 in journey, CSP LED finished product remove carrier film 6 when applying；The distribution of LED chip 2 and putting for fluorescent film 1
It sets and is all made of corresponding automation equipment and is realized by dedicated fixture.
Innovation of the invention is: positioning LED chip 2 by carrier film 6, single fluorescent film 1 is placed in one by one
It is adhesively fixed in LED chip 2, it is rectangular CSP LED light-emitting surface packaging technology directed downwardly that middle light-emitting surface, which is different from the prior art,
The face-up packaging technology that shines is used to realize light-emitting surface for the batch automatic production of circular CSP LED, compared to hair
Smooth surface is rectangular CSP LED, and light-emitting surface is circular CSP LED, and good visual effect facilitates light distribution.
The present invention has filled up this technological gap of circular luminous face CSP LED, and product itself is good at light effect, application range
Extensively, processing method novel and unique, high production efficiency, yields is high, has very big industrial value and economic value.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art
Scholar can understand the contents of the present invention and be implemented, and it is not intended to limit the scope of the present invention, it is all according to the present invention
Equivalent change or modification made by Spirit Essence, should be covered by the scope of protection of the present invention.
Claims (4)
1. a kind of CSP LED with circular luminous face, it is characterised in that: including fluorescent film (1) that is upper and lower, being adhesively fixed of living apart
With LED chip (2), the fluorescent film (1) is rounded, and LED chip (2) lower wall is equipped with a pair of electrodes (3), the LED core
It is folded between piece (2) and fluorescent film (1) adhesive layer (4), LED chip (2) upper wall covers fluorescent film (1) lower wall, the LED
Chip (2) surrounding and fluorescent film (1) surrounding, which are wrapped up in, is cased with white wall glue (5), is integrally formed one with flat where fluorescent film (1) upper wall
Face is top surface, using plane where LED chip (2) lower wall as the cuboid of bottom surface.
2. a kind of CSP LED processing method with circular luminous face, which comprises the following steps:
A., one carrier film (6) is set, and in one layer of silica adhesive of coating on carrier film (6)；
B. several LED chips (2) are spaced apart from each other and rectangular array are distributed on carrier film (6), LED chip (2) lower wall and
Carrier film (6) is adhesively fixed；
C. adhesive layer (4) are coated in LED chip (2) upper wall, single fluorescent film (1) is placed in one by one on LED chip (2) and is bonded
It is fixed, make LED chip (2) upper wall that fluorescent film (1) lower wall, baking sizing be completely covered；
D. white wall glue (5) is clicked and entered on carrier film (6), fills up white wall glue (5) each between fluorescent film (1) between LED chip (2)
Locate gap, and white wall glue (5) upper surface maintains an equal level in fluorescent film (1) upper wall, baking sizing；
E. it cuts along LED chip (2) transverse and longitudinal gap, is cut off simultaneously together with carrier film (6) vertically, remove carrier film after separating blanking
(6) several CSP LED with circular luminous face are obtained.
3. a kind of CSP LED processing method with circular luminous face according to claim 2, it is characterised in that: described
Carrier film (6) is made of PET material.
4. a kind of CSP LED processing method with circular luminous face according to claim 2, it is characterised in that: described
Carrier film (6) is with a thickness of 0.2mm, surface viscosity 3-6g/cm2。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910538801.6A CN110350068A (en) | 2019-06-20 | 2019-06-20 | A kind of CSP LED and its processing method with circular luminous face |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910538801.6A CN110350068A (en) | 2019-06-20 | 2019-06-20 | A kind of CSP LED and its processing method with circular luminous face |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110350068A true CN110350068A (en) | 2019-10-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910538801.6A Pending CN110350068A (en) | 2019-06-20 | 2019-06-20 | A kind of CSP LED and its processing method with circular luminous face |
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| Country | Link |
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| CN (1) | CN110350068A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110880497A (en) * | 2019-11-21 | 2020-03-13 | 东莞市中麒光电技术有限公司 | Small-spacing display screen and manufacturing method thereof |
| CN110911391A (en) * | 2019-11-21 | 2020-03-24 | 东莞市中麒光电技术有限公司 | Small-space display screen module and manufacturing method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206040708U (en) * | 2016-08-30 | 2017-03-22 | 江苏稳润光电有限公司 | CSP chip scale package structure |
| CN108666307A (en) * | 2017-03-28 | 2018-10-16 | 江苏博睿光电有限公司 | CSP light source and preparation method thereof |
-
2019
- 2019-06-20 CN CN201910538801.6A patent/CN110350068A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206040708U (en) * | 2016-08-30 | 2017-03-22 | 江苏稳润光电有限公司 | CSP chip scale package structure |
| CN108666307A (en) * | 2017-03-28 | 2018-10-16 | 江苏博睿光电有限公司 | CSP light source and preparation method thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110880497A (en) * | 2019-11-21 | 2020-03-13 | 东莞市中麒光电技术有限公司 | Small-spacing display screen and manufacturing method thereof |
| CN110911391A (en) * | 2019-11-21 | 2020-03-24 | 东莞市中麒光电技术有限公司 | Small-space display screen module and manufacturing method thereof |
| CN110911391B (en) * | 2019-11-21 | 2020-11-06 | 东莞市中麒光电技术有限公司 | Small-space display screen module and manufacturing method thereof |
| CN110880497B (en) * | 2019-11-21 | 2024-01-26 | 东莞市中麒光电技术有限公司 | Small-spacing display screen and manufacturing method thereof |
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Application publication date: 20191018 |