CN215864281U

CN215864281U - Small-sized quick icer

Info

Publication number: CN215864281U
Application number: CN202121591982.8U
Authority: CN
Inventors: 黄元雄
Original assignee: Guangdong Shunde District Gaoda Kefei Electrical Appliance Manufacturing Co ltd
Current assignee: Guangdong Shunde District Gaoda Kefei Electrical Appliance Manufacturing Co ltd
Priority date: 2021-07-13
Filing date: 2021-07-13
Publication date: 2022-02-18
Anticipated expiration: 2031-07-13

Abstract

The utility model discloses a small-sized quick icing machine, which comprises a refrigerating outer cup, a semiconductor refrigerating sheet and a radiator; the water is injected into the refrigeration outer cup, the cold end of the semiconductor refrigeration piece generates low temperature, so that the temperature of the radiator is reduced, the water in the refrigeration outer cup passes through the radiator, the temperature of the water is reduced, the water is sent back into the refrigeration outer cup again, circulating water is formed in the refrigeration outer cup and keeps the low temperature, objects needing to be iced are soaked in the circulating water, the water is used as a heat conduction medium, the heat exchange efficiency is guaranteed, the efficiency of the semiconductor refrigeration piece is kept, and the iced efficiency is greatly improved.

Description

Small-sized quick icer

Technical Field

The utility model relates to the technical field of household appliances, in particular to a small-sized quick icing machine.

Background

The market also has a small-sized icing machine adopting the semiconductor refrigeration sheet technology, which uses a conventional semiconductor refrigeration sheet device, wherein a radiating fin and a radiating fan are arranged at one end of the device package, and an object needing icing is directly placed on the surface of a metal device by pressing a heat-conducting metal device with a slightly larger area (or making the heat-conducting metal device into a cup shape) at the other end. When the semiconductor refrigerating sheet device works, the temperature of the metal device is reduced along with the semiconductor refrigerating sheet device, and meanwhile, the heat of an object needing to be iced is taken away, so that the temperature of the object is reduced, but the heat transfer efficiency between the metal device and the object is lower due to the contact area and the contact force of the object, so that the efficiency of the semiconductor refrigerating sheet device is reduced, and the icing effect is poor.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to solving at least one of the problems of the prior art. Therefore, the utility model provides a small-sized rapid icing machine, which comprises a refrigeration outer cup, a semiconductor refrigeration sheet and a radiator; a water outlet and a water inlet are formed in the refrigerating outer cup; the radiator is attached to the cold end of the semiconductor refrigeration piece, a water return opening and a cold water opening are formed in the radiator, the water return opening is communicated with the water outlet through a pipeline, and the cold water opening is communicated with the water inlet through a pipeline.

According to some embodiments of the utility model, the refrigerator further comprises a water pump, the water pump is arranged between the refrigeration outer cup and the radiator, a water inlet of the water pump is communicated with the water outlet through a pipeline, and a water outlet of the water pump is communicated with the water return port through a pipeline.

According to some embodiments of the utility model, a U-shaped groove is arranged in the radiator, and the ports of the U-shaped groove are the water return port and the cold water port respectively; the radiator adopts aluminum alloy.

According to some embodiments of the utility model, the outer refrigerated cup houses an inner refrigerated cup.

According to some embodiments of the present invention, a heat dissipation module is installed at the hot end of the semiconductor refrigeration sheet, and heat dissipation sheets are installed on the heat dissipation module, and the heat dissipation sheets are arranged at intervals.

According to some embodiments of the utility model, the water outlet is open at the bottom of the outer cooling cup and the water inlet is open at the side wall of the outer cooling cup.

The utility model has at least the following beneficial effects:

the water is injected into the refrigeration outer cup, the cold end of the semiconductor refrigeration piece generates low temperature, so that the temperature of the radiator is reduced, the water in the refrigeration outer cup passes through the radiator, the temperature of the water is reduced, the water is sent back into the refrigeration outer cup again, circulating water is formed in the refrigeration outer cup and keeps the low temperature, objects needing to be iced are soaked in the circulating water, the water is used as a heat conduction medium, the heat exchange efficiency is guaranteed, the efficiency of the semiconductor refrigeration piece is kept, and the iced efficiency is greatly improved.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the utility model.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is an overall schematic diagram of an embodiment of the present invention.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.

Referring to fig. 1, a small-sized rapid icing machine includes a refrigerating outer cup 100, a semiconductor refrigerating sheet 200, and a radiator 300; the refrigerating outer cup 100 is provided with a water outlet 110 and a water inlet 120; the radiator 300 is attached to the cold end of the semiconductor refrigeration sheet 200, the hot end of the semiconductor refrigeration sheet 200 is provided with a heat dissipation module 600, the heat dissipation module 600 is provided with heat dissipation fins 610, and the heat dissipation fins 610 are arranged at intervals; the radiator 300 is provided with a water return port 310 and a cold water port 320, the water return port 310 is communicated with the water outlet 110 through a pipeline, and the cold water port 320 is communicated with the water inlet 120 through a pipeline; the water is injected into the refrigeration outer cup 100, the cold end of the semiconductor refrigeration piece 200 generates low temperature, so that the temperature of the radiator 300 is reduced, the water in the refrigeration outer cup 100 passes through the radiator 300, the temperature of the water is reduced, the water is sent back into the refrigeration outer cup 100 again, circulating water is formed in the refrigeration outer cup 100 and is kept at the low temperature, objects needing to be iced are soaked in the circulating water, the water is used as a heat conduction medium, the heat exchange efficiency is guaranteed, the efficiency of the semiconductor refrigeration piece 200 is kept, and the iced efficiency is greatly improved.

The refrigerating inner cup 500 is arranged in the refrigerating outer cup 100, and the refrigerating inner cup 500 is used for containing drinks.

In order to improve the circulation effect, a water pump 400 is installed between the refrigerating outer cup 100 and the radiator 300, a water inlet 120 of the water pump 400 is communicated with a water outlet 110 through a pipeline, a water outlet 110 of the water pump 400 is communicated with a water return port 310 through a pipeline, and water in the refrigerating outer cup 100 is pumped towards the radiator 300 through the water pump 400.

A U-shaped groove 310 is arranged in the radiator 300, the ports of the U-shaped groove 310 are a water return port 310 and a cold water port 320, respectively, and the radiator 300 is made of aluminum alloy.

The water outlet 110 is arranged at the bottom of the refrigeration outer cup 100, and the water inlet 120 is arranged on the side wall of the refrigeration outer cup 100, so that cold water can fully cool objects needing to be iced.

The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.

Claims

1. A small rapid ice machine, comprising:

the refrigerator comprises a refrigeration outer cup (100), wherein a water outlet (110) and a water inlet (120) are formed in the refrigeration outer cup (100);

a semiconductor refrigeration plate (200);

a heat sink (300); radiator (300) paste in the cold junction of semiconductor refrigeration piece (200), be equipped with return water mouth (301), cold water mouth (302) on radiator (300), return water mouth (301) through the pipeline with delivery port (110) intercommunication, cold water mouth (302) through the pipeline with water inlet (120) intercommunication.

2. The small-sized rapid icing machine according to claim 1, further comprising a water pump (400), wherein the water pump (400) is installed between the refrigeration outer cup (100) and the radiator (300), a water inlet (120) of the water pump (400) is communicated with the water outlet (110) through a pipeline, and a water outlet (110) of the water pump (400) is communicated with the water return port (301) through a pipeline.

3. The small-sized rapid icing machine according to claim 1, wherein a U-shaped groove (310) is arranged in the radiator (300), and the ports of the U-shaped groove (310) are the water return port (301) and the cold water port (302), respectively; the radiator (300) is made of aluminum alloy.

4. A compact rapid-icing machine according to claim 1, characterised in that said external cooling cup (100) houses an internal cooling cup (500).

5. The small-sized rapid icing machine as claimed in claim 1, wherein a heat dissipation module (600) is mounted at the hot end of the semiconductor refrigeration plate (200), a heat dissipation plate (610) is arranged on the heat dissipation module (600), and the heat dissipation plate (610) is arranged in a plurality of pieces at intervals.

6. A small rapid cooling machine according to claim 1, characterized in that said water outlet (110) is opened at the bottom of said outer cooling cup (100) and said water inlet (120) is opened at the side wall of said outer cooling cup (100).