CN209840494U - Semiconductor refrigerator - Google Patents
Semiconductor refrigerator Download PDFInfo
- Publication number
- CN209840494U CN209840494U CN201920669677.2U CN201920669677U CN209840494U CN 209840494 U CN209840494 U CN 209840494U CN 201920669677 U CN201920669677 U CN 201920669677U CN 209840494 U CN209840494 U CN 209840494U
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- Prior art keywords
- refrigerator
- semiconductor
- box
- heat dissipation
- door
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- Expired - Fee Related
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Abstract
The utility model discloses a semiconductor refrigerator, the power distribution box comprises a box body, box one side is equipped with the refrigerator door, and the box upper end is equipped with the heat dissipation case, and the box top is equipped with the semiconductor refrigeration piece, and the refrigeration face of semiconductor refrigeration piece is down, and the cooling surface of semiconductor refrigeration piece is equipped with the vacuum layer up in the box. The utility model discloses refrigeration effect is good, sustainable work, and heat dispersion is good.
Description
Technical Field
The utility model relates to a refrigerator technical field, in particular to semiconductor refrigerator.
Background
The semiconductor refrigerator is also called as electronic refrigerator, is a product completely different from common refrigerator in refrigeration principle, and uses a semiconductor chip to implement refrigeration by means of high-effective ring double-layer heat pipe heat-radiation and conduction technology and automatic variable-pressure variable-flow control technology, and is known as the smallest compressor in the world. The semiconductor refrigerator has no mechanical transmission part, no abrasion, no noise and long service life; moreover, the efficiency is high and the power consumption is low. However, the cold end of the semiconductor refrigeration piece can generate a large amount of heat at the hot end of the semiconductor refrigeration piece while refrigerating, and the heat dissipation condition of a general semiconductor refrigerator is poor, so that the refrigeration effect of the semiconductor refrigerator is reduced.
In order to ensure that the semiconductor refrigerating sheet works reliably and continuously, the heat dissipation surface of the semiconductor refrigerating sheet needs to be dissipated in time.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to provide a semiconductor refrigerator carries out effectual heat dissipation, semiconductor refrigeration piece sustainable work to the cooling surface of semiconductor refrigeration piece.
In order to solve the technical problem, the utility model discloses a technical scheme does:
the utility model provides a semiconductor refrigerator, includes the box, box one side is equipped with the refrigerator door, and the box upper end is equipped with the heat dissipation case, and the box top is equipped with the semiconductor refrigeration piece, and the refrigeration face of semiconductor refrigeration piece is down, and the cooling surface of semiconductor refrigeration piece is equipped with the vacuum layer up in the box.
Preferably, the lower end of the refrigeration surface is provided with a fan I.
Preferably, the radiating surface is provided with a radiating cold head, one end of the radiating cold head is connected with the water inlet, the other end of the radiating cold head is connected with the water outlet, and the water inlet is provided with a water pump.
Preferably, the upper end of the box body is provided with a thawing box, one side of the thawing box is provided with a thawing box door, the heat dissipation surface of the semiconductor refrigeration sheet is provided with heat dissipation fins, and the heat dissipation fins are provided with fans II.
Preferably, a door handle I is arranged on the side surface of the refrigerator door.
Preferably, a door handle II is arranged on the side surface of the door of the defrosting box.
Preferably, a ventilating partition plate I is arranged in the box body.
Preferably, a ventilating partition plate II is arranged in the thawing box.
Adopt above-mentioned technical scheme, through set up the vacuum layer in the box, isolated heat gets into in the box, effectively dispels the heat to the cooling surface through the cold head that dispels the heat moreover, prevents effectively that a large amount of heats from piling up, and semiconductor refrigerator refrigeration effect promotes greatly.
Drawings
FIG. 1 is a schematic cross-sectional view of the first embodiment;
fig. 2 is a schematic overall cross-sectional structure diagram of the second embodiment.
In the figure, 1-box body, 11-ventilating partition plate I, 2-refrigerator door, 21-door handle I, 3-semiconductor refrigerating sheet, 31-refrigerating surface, 32-radiating surface, 4-radiating box, 5-vacuum layer, 6-fan I, 71-radiating cold head, 81-water inlet, 82-water outlet, 83-water pump, 9-unfreezing box, 91-unfreezing box door, 92-radiating fin, 93-fan II, 94-door handle II and 95-ventilating partition plate II.
Detailed Description
The following describes the present invention with reference to the accompanying drawings. It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. In addition, the technical features related to the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
In one embodiment, referring to fig. 1, the utility model provides a semiconductor refrigerator, which comprises a box body 1, wherein a refrigerator door 2 is arranged on one side of the box body 1, a heat dissipation box 4 is arranged at the upper end of the box body 1, the heat dissipation box 4 is used for dissipating heat of a heat dissipation surface 32 of a semiconductor refrigeration sheet 3, a semiconductor refrigeration sheet 3 is arranged at the top of the box body 1, a refrigeration surface 31 of the semiconductor refrigeration sheet 3 faces downwards, a fan I6 is arranged at the lower end of the refrigeration surface 31, the heat dissipation surface 32 of the semiconductor refrigeration sheet 3 faces upwards, a vacuum layer 5 is arranged in the box body 1, the vacuum layer 5 is used for separating the heat dissipation box 4 from the box body 1, the refrigeration effect of the refrigerator caused by heat exchange is avoided to be reduced, a heat dissipation cold head 71 is arranged on the heat dissipation surface 32, one end of the heat dissipation cold head 71 is connected with a water inlet 81, the other end is connected with, the air-permeable partition I11 prevents food in the refrigerator from coming into contact with the fan I6.
The working principle of the first embodiment is as follows: the semiconductor refrigerating sheet 3 is arranged at the upper end of the refrigerator body 1, the refrigerating surface 31 of the semiconductor refrigerating sheet 3 faces downwards, and cold air near the refrigerating surface 31 moves downwards through the rotation of the fan I6 to refrigerate food in the refrigerator; the vacuum layer 5 separates the heat dissipation box 4 from the box body 1, so that the heat of the heat dissipation box 4 and the box body 1 cannot be exchanged, and the refrigeration effect of the semiconductor refrigerator is effectively improved; through heat dissipation cold head 71 and the contact of cooling surface 32, heat dissipation cold head 71 carries out the heat conduction to cooling surface 32, and water pump 83 extracts the water of water inlet 81, and water flows to heat dissipation cold head 71 from water inlet 81, flows to delivery port 82 again and discharges, and the heat of cooling surface 32 is along with rivers discharge heat dissipation case 4, prevents effectively that a large amount of heats from piling up in heat dissipation case 4, and semiconductor refrigerator refrigeration effect promotes greatly.
In the second embodiment, referring to fig. 2, the utility model provides a semiconductor refrigerator, which comprises a box body 1, a refrigerator door 2 is arranged on one side of the box body 1, a thawing box 9 is arranged on the upper end of the box body 1, a semiconductor refrigeration sheet 3 is arranged on the top of the box body 1, a refrigeration surface 31 of the semiconductor refrigeration sheet 3 faces downwards, a fan I6 is arranged on the lower end of the refrigeration surface 31, a heat dissipation surface 32 of the semiconductor refrigeration sheet 3 faces upwards, a thawing box door 91 is arranged on one side of the thawing box 9, heat dissipation fins 92 are arranged on the heat dissipation surface 32 of the semiconductor refrigeration sheet 3, a fan II93 is arranged on the heat dissipation fins 92, a vacuum layer 5 is arranged in the box body 1, the vacuum layer 5 is used for separating the heat dissipation box 4 from the box body 1, the refrigeration effect of the refrigerator is prevented from being reduced due to heat exchange, a door handle I21 is arranged on the side of the refrigerator door 2, a door handle II 34 is arranged on, a ventilating partition plate II95 is arranged in the thawing box 9, and a ventilating partition plate II95 is used for fixing food to be thawed and preventing the food from contacting with the fan II 93.
Working principle of the second embodiment: the semiconductor refrigerating sheet 3 is arranged at the upper end of the refrigerator body 1, the refrigerating surface 31 of the semiconductor refrigerating sheet 3 faces downwards, and cold air near the refrigerating surface 31 moves downwards through the rotation of the fan I6 to refrigerate food in the refrigerator; the vacuum layer 5 separates the heat dissipation box 4 from the box body 1, so that the heat of the heat dissipation box 4 and the box body 1 cannot be exchanged, and the refrigeration effect of the semiconductor refrigerator is effectively improved; the fan II93 is arranged on the heat radiating surface 32 of the conductor refrigerating sheet 3, and the fan II93 blows the heat of the heat radiating surface 32 into the unfreezing box 9, so that the food to be unfrozen can be heated, and a large amount of heat of the semiconductor refrigerator is effectively utilized.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. It will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made in the embodiments without departing from the principles and spirit of the invention, and the scope of the invention is to be accorded the full scope of the claims.
Claims (8)
1. A semiconductor refrigerator comprises a refrigerator body (1), and is characterized in that: the refrigerator is characterized in that a refrigerator door (2) is arranged on one side of the refrigerator body (1), a heat dissipation box (4) is arranged at the upper end of the refrigerator body (1), a semiconductor refrigerating sheet (3) is arranged at the top of the refrigerator body (1), a refrigerating surface (31) of the semiconductor refrigerating sheet (3) faces downwards, a heat dissipation surface (32) of the semiconductor refrigerating sheet (3) faces upwards, and a vacuum layer (5) is arranged in the refrigerator body (1).
2. The semiconductor refrigerator of claim 1, wherein: the lower end of the refrigerating surface (31) is provided with a fan I (6).
3. The semiconductor refrigerator of claim 1, wherein: the radiating surface (32) is provided with a radiating cold head (71), one end of the radiating cold head (71) is connected with a water inlet (81), the other end of the radiating cold head is connected with a water outlet (82), and a water pump (83) is arranged at the water inlet (81).
4. The semiconductor refrigerator of claim 1, wherein: the semiconductor refrigerator is characterized in that a thawing box (9) is arranged at the upper end of the box body (1), a thawing box door (91) is arranged on one side of the thawing box (9), heat dissipation fins (92) are arranged on the heat dissipation surface (32) of the semiconductor refrigeration sheet (3), and a fan II (93) is arranged on the heat dissipation fins (92).
5. The semiconductor refrigerator of claim 1, wherein: and a door handle I (21) is arranged on the side surface of the refrigerator door (2).
6. The semiconductor refrigerator of claim 4, wherein: and a door handle II (94) is arranged on the side surface of the thawing box door (91).
7. The semiconductor refrigerator of claim 1, wherein: a ventilating partition plate I (11) is arranged in the box body (1).
8. The semiconductor refrigerator of claim 4, wherein: and a ventilating partition plate II (95) is arranged in the unfreezing box (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920669677.2U CN209840494U (en) | 2019-05-11 | 2019-05-11 | Semiconductor refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920669677.2U CN209840494U (en) | 2019-05-11 | 2019-05-11 | Semiconductor refrigerator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209840494U true CN209840494U (en) | 2019-12-24 |
Family
ID=68896954
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920669677.2U Expired - Fee Related CN209840494U (en) | 2019-05-11 | 2019-05-11 | Semiconductor refrigerator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209840494U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114777382A (en) * | 2022-04-29 | 2022-07-22 | 长虹美菱股份有限公司 | Wide temperature-changing refrigerator and control method thereof |
-
2019
- 2019-05-11 CN CN201920669677.2U patent/CN209840494U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114777382A (en) * | 2022-04-29 | 2022-07-22 | 长虹美菱股份有限公司 | Wide temperature-changing refrigerator and control method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191224 Termination date: 20200511 |