CN215668281U - Cooling device for simultaneously drawing multiple silicon cores by using crushed silicon materials - Google Patents
Cooling device for simultaneously drawing multiple silicon cores by using crushed silicon materials Download PDFInfo
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- CN215668281U CN215668281U CN202121548804.7U CN202121548804U CN215668281U CN 215668281 U CN215668281 U CN 215668281U CN 202121548804 U CN202121548804 U CN 202121548804U CN 215668281 U CN215668281 U CN 215668281U
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Abstract
A cooling device for simultaneously drawing a plurality of silicon cores by using crushed silicon materials relates to the field of artificial crystal preparation, and the utility model forms a cooling medium passage by connecting a cooling medium outlet pipe (1) and a cooling medium inlet pipe (2) with a cooling block (7), forms a low-temperature region in the space above the bottom surface of the cooling block by using a cooling medium, namely forms a temperature gradient with a high lower part and a low upper part, can also reduce the temperature of molten silicon liquid at the bottom surface of the cooling block, increases the viscosity of the silicon liquid, is beneficial to the crystallization of the silicon liquid along with seed crystals, and most importantly, can also cool the silicon cores so as to improve the drawing speed of the silicon cores, further, can realize the simultaneous drawing of a plurality of silicon cores and the like by arranging a plurality of cooling blocks and respectively arranging drawing holes on each cooling block, when the cooling device is used for simultaneously drawing a plurality of silicon cores by using crushed silicon materials, the waste of resources of the crushed silicon materials is effectively avoided, is suitable for wide popularization and application.
Description
Technical Field
The utility model relates to the field of artificial crystal preparation, in particular to a cooling device for simultaneously drawing a plurality of silicon cores, and specifically relates to a cooling device for simultaneously drawing a plurality of silicon cores by using a silicon chip material.
Background
It is known that with the rapid development of information technology and photovoltaic industry and the interest of the related policies, the global demand for poly/single crystal silicon is growing rapidly and the market is short-lived. Under the influence, the price of poly/monocrystalline silicon used as a main raw material of the solar cell rapidly rises, and a plurality of domestic enterprises are expanding production.
In the whole production process of the multi/monocrystalline silicon, the consumption of silicon cores is very large, most of the existing silicon cores are prepared and obtained in a zone melting mode (the drawing process is mainly completed through a high-frequency coil and a seed chuck), and the working principle is as follows: when the high-frequency induction heating device works, high-frequency current is introduced into the high-frequency coil, the high-frequency coil generates current to generate magnetic force lines on the raw material rod, the upper end of the heated raw material rod forms a melting region, then the seed crystal is inserted into the melting region, when the end of the seed crystal is melted with the melting region of the raw material rod, the seed crystal is slowly lifted, melted raw material melt liquid rises along with the seed crystal to form a new cylindrical crystal, and the new cylindrical crystal is a finished product of the silicon core.
In the actual production process, the excess materials in the preparation process of the silicon core, the silicon core which is broken carelessly, the crushed materials generated by multi/single crystal silicon production enterprises in the process stages of reduction, cutting, grinding and polishing and the like are found to be very complicated to process, many enterprises directly discard or stack the crushed materials in a warehouse for saving trouble, and other enterprises recover the crushed materials, draw the crushed materials into a silicon rod through a straight pulling furnace, and then draw the silicon rod into the silicon core, so that the cost of drawing the silicon core is increased, the great resource waste is caused, and how to recycle the crushed silicon materials becomes the long-term technical appeal of technical personnel in the field.
The inventor finds that the utility model patent of china, patent No. 200910064106.7, filed on 2009, 1/20, entitled a crushed crystal silicon pulling core and a device for implementing the method, provides a device and a method for pulling a silicon core by using crushed crystal, and the patent discloses that although the silicon core can be pulled by using crushed silicon, the ovality of the pulled silicon core is slightly large, namely the yield is slightly low, and the like.
Disclosure of Invention
In order to overcome the defects in the background art, the utility model provides a cooling device for simultaneously drawing a plurality of silicon cores by using a silicon scrap material.
In order to achieve the purpose, the utility model adopts the following technical scheme:
a cooling device for simultaneously drawing a plurality of silicon cores by using a crushed silicon material comprises a cooling medium outlet pipe, a cooling medium inlet pipe and a cooling block, wherein at least one group of cooling medium outlet pipe and cooling medium inlet pipe is arranged, the lower end head of each group of cooling medium outlet pipe and cooling medium inlet pipe is respectively connected with the cooling block, a drawing hole penetrating to the lower surface of the cooling block is formed in the upper surface of the cooling block, a closed medium channel is arranged on the cooling block on the periphery of the drawing hole, and the inlet and the outlet of the medium channel are respectively connected with the cooling medium inlet pipe and the cooling medium outlet pipe to form the cooling device for simultaneously drawing a plurality of silicon cores by using the crushed silicon material.
The cooling device for simultaneously drawing the plurality of silicon cores by using the silicon scrap material is characterized in that when the plurality of cooling blocks are arranged, the plurality of cooling blocks are arranged in a circular shape.
The cooling device for simultaneously drawing a plurality of silicon cores by using silicon chip materials is characterized in that a positioning ring is arranged above the cooling block, a plurality of groups of pipeline through holes and a plurality of guide holes are formed in the positioning ring, each group of pipeline through holes is respectively sleeved on the outer edge surfaces of the corresponding cooling medium outlet pipe and the corresponding cooling medium inlet pipe, each guide hole respectively corresponds to a drawing hole in the cooling block, and the guide holes and the drawing holes are concentrically arranged.
The cooling device for simultaneously drawing the plurality of silicon cores by using the silicon chip material is characterized in that at least one air blowing opening is arranged on the inner edge surface of the lower part of each drawing hole, and the air blowing opening is externally connected with an air source.
The cooling device is used for simultaneously drawing a plurality of silicon cores by using the silicon chip material, when one air blowing opening is arranged, the air blowing opening is connected with an air channel arranged at the lower part of the cooling block, and the air channel is communicated with an air source through an air blowing pipe arranged on the outer side wall of the cooling block.
The cooling device for simultaneously drawing the plurality of silicon cores by using the silicon chip material is characterized in that when the plurality of air blowing openings are formed, air passages are formed in the periphery of the drawing hole in the lower portion of the cooling block, a plurality of air blowing openings penetrating through the drawing hole are formed in the inner edge surface of each air passage, the outer edge surface of each air passage is communicated with an air passage in the lower portion of the cooling block, and the air passages are communicated with an air source through air blowing pipes arranged on the outer side wall of the cooling block.
The cooling device for simultaneously drawing the plurality of silicon cores by using the silicon chip material is characterized in that the air blowing pipe is arranged on the inner edge surface of the cooling medium outlet pipe or the cooling medium inlet pipe, the outer end head of the air blowing pipe is communicated with an air source, the lower end head of the air blowing pipe sequentially penetrates through the through hole of the air blowing pipe on the cooling block and the medium channel and then is communicated with the air channel, and at least one air blowing opening penetrating through the drawing hole is formed in the inner edge surface of the air channel.
The cooling device is used for simultaneously drawing a plurality of silicon cores by using the silicon chips, the outer end head of the air blowing pipe is connected with a pressure regulating valve, and the pressure regulating valve is connected with an air source through a pipeline.
The cooling device is used for simultaneously drawing a plurality of silicon cores by using a silicon chip material, the outer end head of the air blowing pipe is respectively connected with an air inlet on the fixing ring, the air inlet is connected with a pressure regulating valve, and the pressure regulating valve is connected with an air source through a pipeline.
The cooling device for simultaneously drawing a plurality of silicon cores by using the silicon chip material is characterized in that the outer end heads of the cooling medium outlet pipe and the cooling medium inlet pipe are respectively and fixedly connected with a cooling medium outlet and a cooling medium inlet on the fixing ring, and the cooling medium outlet and the cooling medium inlet are externally connected with an air source.
Due to the adoption of the technical scheme, the utility model has the following beneficial effects:
the cooling medium outlet pipe and the cooling medium inlet pipe are connected with the cooling block to form a cooling medium passage, a low-temperature region is formed in a space above the bottom surface of the cooling block through the cooling medium, namely a temperature gradient with a high lower part and a low upper part is formed, meanwhile, the temperature of molten silicon at the bottom surface of the cooling block can be reduced, the viscosity of the molten silicon is increased, the crystallization of the molten silicon along with seed crystals is facilitated, most importantly, the silicon core can be cooled, the drawing speed of the silicon core is improved, further, when the plurality of cooling blocks are arranged, drawing holes are respectively formed in each cooling block, the simultaneous drawing of a plurality of silicon cores can be realized, and the like.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic front view of the structure of FIG. 1;
FIG. 3 is a schematic sectional view of a cooling block according to the present invention;
FIG. 4 is a schematic perspective view of an embodiment of the present invention with an air intake duct;
FIG. 5 is a cross-sectional structural schematic view of the front view of FIG. 4;
FIG. 6 is a schematic view of the partial cross-sectional structure of FIG. 4;
FIG. 7 is a schematic cross-sectional view of B-B of FIG. 5;
in the figure: 1. a cooling medium outlet pipe; 2. a cooling medium inlet pipe; 3. a fixing ring; 4. a positioning ring; 5. a guide hole; 6. drawing holes; 7. cooling the block; 8. a cooling medium outlet; 9. a cooling medium inlet; 10. a dovetail groove; 11. a media channel; 12. an air blowing pipe; 13. an air blowing port; 14. an airway; 15. perforating an air blow pipe; 16. a gas channel.
Detailed Description
The present invention will be explained in more detail by the following examples, which are intended to disclose all changes and modifications within the scope of the present invention, and the present invention is not limited to the following examples;
in the description of the present invention, it is to be understood that the terms "central," "lateral," "length," "width," "height," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "side," and the like, as used herein, are used in the orientation or positional relationship indicated in FIG. 1, merely to facilitate the description of the utility model and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the present invention.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The cooling device for simultaneously drawing a plurality of silicon cores by using silicon chips comprises a cooling medium outlet pipe 1, a cooling medium inlet pipe 2 and a cooling block 7, wherein at least one group of cooling medium outlets 8 and cooling medium inlets 9 are arranged on the outer edge surface of a fixing ring 3 at intervals, each cooling medium outlet 8 and cooling medium inlet 9 are respectively connected with the cooling medium outlet pipe 1 and the cooling medium inlet pipe 2, the outer ends of the cooling medium outlets 8 and the cooling medium inlets 9 are respectively connected with an air source, the lower end heads of the cooling medium outlet pipe 1 and the cooling medium inlet pipe 2 are respectively connected with the cooling block 7, a drawing hole 6 penetrating to the lower surface of the cooling block 7 is arranged on the cooling block 7 at the periphery of the drawing hole 6, a closed medium channel 11 is arranged on the cooling block 7 at the periphery of the drawing hole 6, and the inlet and outlet of the medium channel 11 are respectively connected with the cooling medium inlet pipe 2 and the cooling medium outlet pipe 1, in specific implementation, when the number of the cooling blocks 7 is multiple, the cooling blocks 7 are arranged in a circular shape to form the cooling device for simultaneously drawing the plurality of silicon cores by using the silicon scrap.
Further, as shown in fig. 1 and 3, in order to improve the stability of silicon core drawing and ensure that the cooling block 7 does not shake, a positioning ring 4 is arranged above the cooling block 7, a plurality of sets of pipe perforations and a plurality of guide holes 5 are arranged on the positioning ring 4, each set of pipe perforations is respectively sleeved on the outer edge surfaces of the corresponding cooling medium outlet pipe 1 and the corresponding cooling medium inlet pipe 2, each guide hole 5 respectively corresponds to a drawing hole 6 on the cooling block 7, and the guide holes 5 and the drawing holes 6 are concentrically arranged.
Further, in order to further increase the speed of drawing the silicon core, reduce the ovality of the silicon core, and ensure the equal diameter of the silicon core being drawn at the same time, as shown in fig. 2, 5, and 7, at least one air blowing port 13 is provided on the outer edge surface of the lower portion of each drawing hole 6, and the air blowing port 13 is externally connected with an air source. The gas blowing port 13 can accelerate the crystallization speed of the silicon melt contacted with the seed crystal.
Further, in practice, when the number of the air blowing openings 13 is one, as shown in fig. 2 and 5, the air blowing openings 13 are connected with an air channel 16 arranged at the lower part of the cooling block 7, and the air channel 16 is communicated with an air source through an air blowing pipe 12 arranged on the outer side wall of the cooling block 7.
Further, in implementation, when a plurality of air blowing ports 13 are provided, as shown in fig. 2 and 7, an air passage 14 is provided at the periphery of the drawing hole 6 at the lower part of the cooling block 7, a plurality of air blowing ports 13 penetrating through the drawing hole 6 are provided on the inner edge surface of the air passage 14, the outer edge surface of the air passage 14 is communicated with an air passage 16 provided at the lower part of the cooling block 7, and the air passage 16 is communicated with an air source through an air blowing pipe 12 provided on the outer side wall of the cooling block 7.
Further, in implementation, as shown in fig. 4, 5, 6, and 7, the blowpipe 12 is disposed on an inner edge surface of the cooling medium outlet pipe 1 or the cooling medium inlet pipe 2, an outer end of the blowpipe 12 is communicated with an air source, a lower end of the blowpipe 12 sequentially passes through a blowpipe through hole 15 and a medium channel 11 on the cooling block 7 and then is communicated with an air passage 14 (the specific structure is shown in fig. 5 and 6), and at least one blowhole 13 penetrating through the drawing hole 6 is disposed on an inner edge surface of the air passage 14.
Further, in implementation, the outer end of the blowing pipe 12 is connected with a pressure regulating valve for regulating air inflow, and the pressure regulating valve is connected with an air source through a pipeline.
Further, in implementation, the outer end of the blowing pipe 12 is connected to the air inlets of the fixing rings 3, the air inlets are connected to a pressure regulating valve, and the pressure regulating valve is connected to an air source through a pipeline.
Further, in implementation, as shown in fig. 2 and 5, a dovetail groove 10 is arranged on the fixing ring 3, a sealing ring is arranged in the dovetail groove 10, and a cooling water channel for cooling is arranged below the fixing ring 3 and is respectively connected with a water inlet and a water outlet.
Further, the cooling medium is cooling water or cooling gas such as liquid nitrogen or the like.
When the utility model is applied specifically, the utility model is arranged above a crucible positioned in a furnace chamber, the lower part of a cooling block 7 in the utility model is close to a silicon material molten liquid in the crucible but can not be contacted, when the utility model works, firstly, a broken silicon material is put into the crucible, a heater is started to heat the crucible positioned on a crucible support, after the broken silicon material in the crucible is melted into the silicon material molten liquid, a pull head is lifted up to drive a seed crystal to descend, when the seed crystal passes through a drawing hole 6 on the cooling block 7 to be contacted with the silicon material molten liquid, the seed crystal descends, after the lower end head of the seed crystal is melted, the seed crystal is lifted slowly, at the moment, because a cooling medium is introduced into the utility model, the temperature of the bottom surface of the cooling block 7 forms a temperature gradient with a higher temperature and a lower temperature, at the moment, the silicon material molten liquid ascends along with the seed crystal, when the silicon material molten liquid is close to the drawing hole 6 on the cooling block 7, because the temperature at the position is lower than the temperature of the crucible, the silicon material molten liquid is crystallized gradually, and when the crystallized silicon material molten liquid enters from a plurality of cooling medium outlet pipes 1 and the cooling medium inlet 6 When the silicon core forming device is applied, the air blowing port 13 in the silicon core forming device can forcibly cool the silicon core which is just crystallized, and can adjust the ovality, the isodiametric degree and the like of the silicon core by adjusting the air blowing amount, so that the yield and the drawing efficiency of the silicon core are greatly improved.
The silicon scraps involved in the utility model not only comprise excess materials in the preparation process of the silicon core, carelessly broken silicon cores, crushed materials generated by multi/single crystal silicon production enterprises in the process stages of reduction, cutting, grinding and polishing and the like, but also comprise silicon materials with other shapes (such as cauliflower materials, silicon rods with smaller lengths and the like), or directly purchase new silicon materials and directly draw the silicon core by using the utility model.
In practical application, the utility model not only can be used for drawing the silicon core, but also can realize the drawing of other crystal materials.
The details of the above are not described in detail since they are prior art.
The embodiments selected for the purpose of disclosing the utility model are presently considered to be suitable, however, it should be understood that the utility model is intended to cover all variations and modifications of the embodiments falling within the spirit and scope of the present inventive concept.
Claims (10)
1. A cooling device for simultaneously drawing a plurality of silicon cores by using crushed silicon materials comprises a cooling medium outlet pipe (1), a cooling medium inlet pipe (2) and a cooling block (7), and is characterized in that: the cooling device is characterized in that at least one group of cooling medium outlet pipe (1) and one group of cooling medium inlet pipe (2) are arranged, the lower end head of each group of cooling medium outlet pipe (1) and the lower end head of each group of cooling medium inlet pipe (2) are respectively connected with a cooling block (7), a drawing hole (6) penetrating below the cooling block (7) is formed in the upper surface of the cooling block (7), a closed medium channel (11) is arranged on the cooling block (7) on the periphery of the drawing hole (6), and the inlet and the outlet of the medium channel (11) are respectively connected with the cooling medium inlet pipe (2) and the cooling medium outlet pipe (1) to form the cooling device for simultaneously drawing a plurality of silicon cores by using a silicon chip material.
2. The cooling apparatus as set forth in claim 1, wherein the cooling apparatus comprises: when the cooling blocks (7) are arranged in a plurality of numbers, the cooling blocks (7) are arranged in a circular shape.
3. The cooling apparatus as set forth in claim 1, wherein the cooling apparatus comprises: the top of cooling block (7) is equipped with holding ring (4), be equipped with plural group's pipeline perforation and a plurality of guiding hole (5) on holding ring (4), every group pipeline perforation cup joints respectively on the outer fringe face of cooling medium exit tube (1) and the cooling medium income pipe (2) that correspond, and every guiding hole (5) correspond drawing hole (6) on cooling block (7) respectively, guiding hole (5) set up with drawing hole (6) are concentric.
4. The cooling apparatus as set forth in claim 1, wherein the cooling apparatus comprises: at least one air blowing opening (13) is formed in the inner edge surface of the lower portion of each drawing hole (6), and the air blowing openings (13) are externally connected with an air source.
5. The cooling apparatus as set forth in claim 4, wherein the cooling apparatus comprises: when the number of the air blowing openings (13) is one, the air blowing openings (13) are connected with an air channel (16) arranged at the lower part of the cooling block (7), and the air channel (16) is communicated with an air source through an air blowing pipe (12) arranged on the outer side wall of the cooling block (7).
6. The cooling apparatus as set forth in claim 4, wherein the cooling apparatus comprises: when the air blowing ports (13) are arranged in a plurality of manners, air passages (14) are arranged on the periphery of the drawing hole (6) in the lower portion of the cooling block (7), a plurality of air blowing ports (13) penetrating through the drawing hole (6) are formed in the inner edge surface of each air passage (14), the outer edge surface of each air passage (14) is communicated with an air passage (16) in the lower portion of the cooling block (7), and the air passages (16) are communicated with an air source through air blowing pipes (12) arranged on the outer side wall of the cooling block (7).
7. The cooling device for simultaneously drawing a plurality of silicon cores from a crushed silicon material as claimed in any one of claims 5 or 6, wherein: the air blowing pipe (12) is arranged on the inner edge surface of the cooling medium outlet pipe (1) or the cooling medium inlet pipe (2), the outer end of the air blowing pipe (12) is communicated with an air source, the lower end of the air blowing pipe (12) sequentially penetrates through an air blowing pipe through hole (15) in the cooling block (7) and the medium channel (11) and then is communicated with an air passage (14), and at least one air blowing port (13) penetrating through the drawing hole (6) is formed in the inner edge surface of the air passage (14).
8. The cooling device for simultaneously drawing a plurality of silicon cores from a crushed silicon material as claimed in any one of claims 5 or 6, wherein: the outer end of the air blowing pipe (12) is connected with a pressure regulating valve, and the pressure regulating valve is connected with an air source through a pipeline.
9. The cooling device for simultaneously drawing a plurality of silicon cores from a crushed silicon material as claimed in any one of claims 5 or 6, wherein: the outer end of the air blowing pipe (12) is connected with an air inlet on the fixing ring (3) respectively, the air inlet is connected with a pressure regulating valve, and the pressure regulating valve is connected with an air source through a pipeline.
10. The cooling apparatus as set forth in claim 1, wherein the cooling apparatus comprises: the outer end heads of the cooling medium outlet pipe (1) and the cooling medium inlet pipe (2) are fixedly connected with a cooling medium outlet (8) and a cooling medium inlet (9) on the fixing ring (3) respectively, and the cooling medium outlet (8) and the cooling medium inlet (9) are externally connected with an air source.
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| CN202121548804.7U CN215668281U (en) | 2021-07-08 | 2021-07-08 | Cooling device for simultaneously drawing multiple silicon cores by using crushed silicon materials |
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| CN202121548804.7U CN215668281U (en) | 2021-07-08 | 2021-07-08 | Cooling device for simultaneously drawing multiple silicon cores by using crushed silicon materials |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113481589A (en) * | 2021-07-08 | 2021-10-08 | 牛伟 | Cooling device for simultaneously drawing multiple silicon cores by using crushed silicon materials |
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2021
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113481589A (en) * | 2021-07-08 | 2021-10-08 | 牛伟 | Cooling device for simultaneously drawing multiple silicon cores by using crushed silicon materials |
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Effective date of registration: 20220920 Address after: 5-2-802, Zhonghong Central Plaza, Jiudu West Road, Jianxi District, Luoyang City, Henan Province, 471000 Patentee after: Zhu Zhenye Address before: 471000 room 2501, gate 1, building 1, yard 16, Shangyang Road, Xigong District, Luoyang City, Henan Province Patentee before: Niu Wei |
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Effective date of registration: 20230310 Address after: Room 1017, Huizhi Building, Yanguang Road, Chuangye Road Street, High-tech Zone, Luoyang, Henan Province, 471000 Patentee after: Luoyang Changying New Energy Technology Co.,Ltd. Address before: 5-2-802, Zhonghong Central Plaza, Jiudu West Road, Jianxi District, Luoyang City, Henan Province, 471000 Patentee before: Zhu Zhenye |
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