CN215668282U

CN215668282U - Cooling screen for simultaneously drawing multiple silicon cores by using crushed silicon materials

Info

Publication number: CN215668282U
Application number: CN202121548805.1U
Authority: CN
Inventors: 牛伟
Original assignee: Individual
Current assignee: Zhu Zhenye
Priority date: 2021-07-08
Filing date: 2021-07-08
Publication date: 2022-01-28
Anticipated expiration: 2031-07-08

Abstract

A cooling screen for simultaneously drawing a plurality of silicon cores by using a silicon chip material relates to the field of artificial crystal preparation, a plurality of drawing holes (10) are arranged on a cavity disc (8), then a cooling screen main body (4) is arranged on the cavity disc, a cooling medium passage is formed by a cavity on the cavity disc and a cavity on the cooling screen main body, a low-temperature zone is formed in the space above the bottom surface of the cavity disc by a cooling medium, namely, a temperature gradient with a high lower part and a low upper part is formed, the temperature of molten silicon liquid on the bottom surface of the cavity disc can be reduced, the viscosity of the silicon liquid is increased, the silicon liquid can be crystallized along with the silicon seed crystal, and the silicon core can be cooled, so that the drawing speed of the silicon core is increased, the simultaneous drawing of a plurality of silicon cores is realized, and the like when the cooling screen is used for a device for simultaneously drawing a plurality of silicon cores by using a silicon chip material, effectively avoiding the resource waste of the silicon scrap and the like.

Description

Cooling screen for simultaneously drawing multiple silicon cores by using crushed silicon materials

Technical Field

The utility model relates to the field of artificial crystal preparation, in particular to a cooling screen for simultaneously drawing a plurality of silicon cores, and particularly relates to a cooling screen for simultaneously drawing a plurality of silicon cores by using a silicon chip material.

Background

It is known that with the rapid development of information technology and photovoltaic industry and the interest of the related policies, the global demand for poly/single crystal silicon is growing rapidly and the market is short-lived. Under the influence, the price of poly/monocrystalline silicon used as a main raw material of the solar cell rapidly rises, and a plurality of domestic enterprises are expanding production.

In the whole production process of the multi/monocrystalline silicon, the consumption of silicon cores is very large, most of the existing silicon cores are prepared and obtained in a zone melting mode (the drawing process is mainly completed through a high-frequency coil and a seed chuck), and the working principle is as follows: when the high-frequency induction heating device works, high-frequency current is introduced into the high-frequency coil, the high-frequency coil generates current to generate magnetic force lines on the raw material rod, the upper end of the heated raw material rod forms a melting region, then the seed crystal is inserted into the melting region, when the end of the seed crystal is melted with the melting region of the raw material rod, the seed crystal is slowly lifted, melted raw material melt liquid rises along with the seed crystal to form a new cylindrical crystal, and the new cylindrical crystal is a finished product of the silicon core.

In the actual production process, the excess materials in the preparation process of the silicon core, the silicon core which is broken carelessly, the crushed materials generated by multi/single crystal silicon production enterprises in the process stages of reduction, cutting, grinding and polishing and the like are found to be very complicated to process, many enterprises directly discard or stack the crushed materials in a warehouse for saving trouble, and other enterprises recover the crushed materials, draw the crushed materials into a silicon rod through a straight pulling furnace, and then draw the silicon rod into the silicon core, so that the cost of drawing the silicon core is increased, the great resource waste is caused, and how to recycle the crushed silicon materials becomes the long-term technical appeal of technical personnel in the field.

The inventor finds that the utility model patent of china, patent No. 200910064106.7, filed on 2009, 1/20, entitled a crushed crystal silicon pulling core and a device for implementing the method, provides a device and a method for pulling a silicon core by using crushed crystal, and the patent discloses that although the silicon core can be pulled by using crushed silicon, the ovality of the pulled silicon core is slightly large, namely the yield is slightly low, and the like.

Disclosure of Invention

In order to overcome the defects in the background art, the utility model provides the cooling screen for simultaneously drawing the plurality of silicon cores by using the silicon scrap material.

In order to achieve the purpose, the utility model adopts the following technical scheme:

a cooling screen for simultaneously drawing a plurality of silicon cores by using a silicon chip material comprises a cooling screen main body, a cooling medium outlet pipe, a cavity disc and a cooling medium inlet pipe, wherein the cavity disc is arranged at the lower end of the cooling screen main body, a cavity on the cooling screen main body is communicated with a cavity on the cavity disc to form a cooling medium passage, the cooling medium passage is respectively connected with at least one group of cooling medium outlet pipe and at least one group of cooling medium inlet pipe, an observation hole or a drawing hole is arranged in the middle of the cavity disc, and at least one drawing hole is arranged on the periphery of the observation hole or the drawing hole to form the cooling screen for simultaneously drawing a plurality of silicon cores by using the silicon chip material.

The cooling screen is used for simultaneously drawing a plurality of silicon cores by using the silicon chip material, when a plurality of drawing holes are arranged, the plurality of drawing holes are arranged around the observation hole, or one drawing hole or the other drawing holes are arranged in the middle.

The cooling screen is used for simultaneously drawing a plurality of silicon cores by using silicon chip materials, the cavity plate comprises an upper plate, connecting columns and a lower plate, the upper plate is arranged above the lower plate, an observation hole penetrating through the upper surface of the upper plate to the lower surface of the lower plate is formed in the middle of the upper plate, an annular cavity structure is formed by the lower plate, the upper plate and the observation hole, a plurality of connecting columns are arranged in a cavity on the periphery of the observation hole, the upper end and the lower end of each connecting column are respectively connected with the upper plate and the lower plate, drawing holes are respectively formed in the middle of each connecting column, and at least one group of cooling medium lower inlet and cooling medium lower outlet penetrating through the cavity are respectively arranged on the upper plate.

The cooling screen for simultaneously drawing the plurality of silicon cores by using the silicon chip material comprises a cooling screen main body and a cooling screen outer layer plate, wherein the cooling screen outer layer plate and the cooling screen inner layer plate are arranged at intervals, an upper flange is arranged at the upper end of the cooling screen outer layer plate and the upper end of the cooling screen inner layer plate, and a cooling medium passage is formed in a gap between the cooling screen outer layer plate and the cooling screen inner layer plate.

The cooling screen is used for simultaneously drawing a plurality of silicon cores by using the silicon chips, and at least one air blowing opening is arranged on the inner edge surface of the lower part of each drawing hole and is externally connected with an air source.

The cooling screen is used for simultaneously drawing a plurality of silicon cores by using a silicon chip material, when the air blowing ports are arranged in one, the air blowing ports are connected with an air channel arranged on the lower plate, the air channel is connected with a lower air pipe through an air inlet hole B arranged on the lower plate, the lower air pipe is arranged on the outer side wall of the outer cooling screen plate or in a cavity between the outer cooling screen plate and the inner cooling screen plate, the upper end of the lower air pipe is communicated with an air inlet hole A arranged on the upper flange, the air inlet hole A is communicated with an upper air pipe, and the outer end of the upper air pipe is communicated with an air source.

The cooling screen is characterized in that the cooling screen is used for simultaneously drawing a plurality of silicon cores by using a silicon chip material, when a plurality of air blowing ports are arranged, a plurality of island columns are arranged on the lower board, drawing holes are respectively arranged on each island column, an annular air passage is arranged on the periphery of each drawing hole, a plurality of air blowing ports penetrating through the drawing holes are formed in the inner edge surface of each annular air passage, the outer edge surface of each annular air passage is communicated with an air passage arranged on each island column, the air passages are connected with a lower air pipe through air inlet holes B arranged on the lower board, the lower air pipe is arranged on the outer side wall of the outer cooling screen board or in a cavity between the outer cooling screen board and the inner cooling screen board, the upper end of the lower air pipe is communicated with an air inlet hole A arranged on the upper flange, the air inlet hole A is communicated with an upper air pipe, and the outer end of the upper air pipe is communicated with an air source.

The cooling screen is used for simultaneously drawing a plurality of silicon cores by using a silicon chip material, when the lower air pipe is arranged on the outer side wall of the outer cooling screen plate, the outer edge surface of the lower air pipe is coated with the gas cooling pipe, and at least one group of cooling medium through holes are formed in the outer side wall of the outer cooling screen plate, which is covered by the gas cooling pipe.

The cooling screen is used for simultaneously drawing a plurality of silicon cores by using the silicon scrap material, the outer end of the upper air pipe is connected with a pressure regulating valve, and the pressure regulating valve is connected with an air source through a pipeline.

The cooling screen is used for simultaneously drawing a plurality of silicon cores by using a silicon chip material, the outer end of the upper air pipe is respectively connected with an air inlet on the fixing ring, the air inlet is connected with a pressure regulating valve, and the pressure regulating valve is connected with an air source through a pipeline.

Due to the adoption of the technical scheme, the utility model has the following beneficial effects:

according to the utility model, the plurality of drawing holes are formed in the cavity disc, the cooling screen main body is arranged on the cavity disc, the cavity on the cavity disc and the cavity on the cooling screen main body form a cooling medium passage, a low-temperature region is formed in the space above the bottom surface of the cavity disc through the cooling medium, namely a temperature gradient with a high lower part and a low upper part is formed, meanwhile, the temperature of molten silicon on the bottom surface of the cavity disc can be reduced, the viscosity of the silicon is increased, the crystallization of the silicon along with seed crystals is facilitated, most importantly, the silicon core can be cooled, and further the drawing speed of the silicon core is increased.

Drawings

FIG. 1 is a schematic perspective view of the present invention;

FIG. 2 is a schematic view of a first configuration of the cooling shield body and cavity plate of the present invention;

FIG. 3 is a second structural schematic view of the cooling shield body and cavity plate of the present invention;

FIG. 4 is a schematic top cross-sectional structural view of FIG. 3;

FIG. 5 is a schematic view of a third construction of the cooling shield body and cavity plate of the present invention;

FIG. 6 is a schematic view of the retaining ring of the present invention;

FIG. 7 is a schematic top view of the structure of FIG. 1;

FIG. 8 is a schematic view of the construction of the cavity plate of the present invention;

FIG. 9 is a schematic view of another construction of the cavity plate of the present invention;

FIG. 10 is a schematic illustration of an application of the present invention;

in the figure: 1. a fixing ring; 2. an upper trachea; 3. an upper flange; 4. a cooling shield main body; 401. cooling the outer plate of the shield; 402. cooling the inner plate of the screen; 5. a cooling medium outlet pipe; 6. a lower trachea; 7. an air inlet; 8. a cavity plate; 801. an upper plate; 802. connecting columns; 803. a lower plate; 9. an observation hole; 10. drawing holes; 11. a cooling medium inlet pipe; 12. an upper inlet for cooling medium; 13. an air inlet A; 14. a cooling medium lower inlet; 15. an air inlet hole B; 16. a gas channel; 17. a lower outlet for the cooling medium; 18. a dovetail groove; 19. an island column; 20. an annular air passage; 21. an air blowing port; 22. lifting the pull head; 23. a silicon core; 24. a furnace chamber; 25. melting a silicon material; 26. a crucible; 27. supporting a crucible; 28. a heater; 29. an upper outlet for the cooling medium; 30. a gas cooling tube; 31. and a cooling medium through hole.

Detailed Description

The present invention will be explained in more detail by the following examples, which are intended to disclose all changes and modifications within the scope of the present invention, and the present invention is not limited to the following examples;

in the description of the present invention, it is to be understood that the terms "central," "lateral," "length," "width," "height," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "side," and the like, as used herein, are used in the orientation or positional relationship indicated in FIG. 1, merely to facilitate the description of the utility model and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the present invention.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The cooling screen for simultaneously drawing a plurality of silicon cores by using the crushed silicon material comprises a cooling screen main body 4, a cooling medium outlet pipe 5, a cavity disc 8 and a cooling medium inlet pipe 11, a cavity plate 8 is arranged at the lower end of the cooling screen main body 4, the cavity of the cooling screen main body 4 is communicated with the cavity of the cavity plate 8 to form a cooling medium passage, the cooling medium passages are respectively connected with at least one group of cooling medium outlet pipe 5 and cooling medium inlet pipe 11, the middle part of the cavity disc 8 is provided with an observation hole 9 or a drawing hole 10, the periphery of the observation hole 9 or the drawing hole 10 is provided with at least one drawing hole 10, when in specific implementation, when the drawing holes 10 are provided in plural, as shown in fig. 5, the plural drawing holes 10 are provided around the observation hole 9, or one drawing hole 10 is arranged in the middle, and the other drawing holes are arranged around to form the cooling screen for simultaneously drawing a plurality of silicon cores by using the silicon scrap.

Further, as shown in fig. 2, 3, 4, 5, and 8, the cavity plate 8 includes an upper plate 801, a connecting column 802, and a lower plate 803, the upper plate 801 is disposed above the lower plate 803, an observation hole 9 penetrating to the lower surface of the lower plate 803 is disposed in the middle of the upper surface of the upper plate 801, an annular cavity structure is formed by the lower plate 803, the upper plate 801, and the observation hole 9, a plurality of connecting columns 802 are disposed in a cavity around the observation hole 9, the upper end and the lower end of each connecting column 802 are respectively connected to the upper plate 801 and the lower plate 803, a drawing hole 10 is disposed in the middle of each connecting column 802, and at least one set of a lower inlet 14 and a lower outlet 17 for a cooling medium penetrating to the cavity are disposed on the upper plate 801. In particular, a baffle may be provided in the cavity for routing the cooling medium in the cavity.

Further, as shown in fig. 2, 3, 5, and 9, in order to improve the yield of the silicon core during the silicon core drawing, that is, to realize that the ovality, the isodiametric degree, and the like of the drawn silicon core meet the requirements of high standards, at least one air blowing port 21 may be provided on the inner edge surface of the lower portion of each drawing hole 10, and the air blowing port 21 is externally connected with an air source. When the silicon core drawing device is implemented, the air blowing is carried out on the crystallization area, so that the silicon core drawing speed is improved, the ovality of the silicon core is reduced, and the isodiametric degree of simultaneously drawing a plurality of silicon cores is improved.

In practice, when the air blowing ports 21 are arranged in one, as shown in fig. 2, 3, 4 and 5, the air blowing ports 21 are connected with the air channel 16 arranged on the lower plate 803, the air channel 16 is connected with the lower air pipe 6 through the air inlet holes B15 arranged on the lower plate 803, the lower air pipe 6 is arranged on the outer side wall of the cooling screen outer plate 401 or in a cavity between the cooling screen outer plate 401 and the cooling screen inner plate 402, the upper end of the lower air pipe 6 is communicated with the air inlet hole a13 arranged on the upper flange 3, the air inlet hole a13 is communicated with the upper air pipe 2, and the outer end of the upper air pipe 2 is communicated with an air source. That is, the lower air pipe 6 may be disposed on the outer side wall of the outer cooling shield plate 401, or may be disposed in a cavity between the outer cooling shield plate 401 and the inner cooling shield plate 402, so as to cool the air in the lower air pipe 6.

Further, when a plurality of air blowing ports 21 are provided, as shown in fig. 2, 3, 4, 5, and 9, a plurality of islands 19 are provided on the lower plate 803, drawing holes 10 are provided on each island 19, an annular air passage 20 is provided at the periphery of the drawing holes 10, a plurality of air blowing ports 21 penetrating to the drawing holes 10 are provided on the inner edge surface of the annular air passage 20, the outer edge surface of the annular air passage 20 is communicated with the air passage 16 provided on the island 19, the air passage 16 is connected to the lower air pipe 6 through an air inlet B15 provided on the lower plate 803, the lower air pipe 6 is provided on the outer side wall of the cooling shield outer plate 401 or in the cavity between the cooling shield outer plate 401 and the cooling shield inner plate 402, the upper end of the lower air pipe 6 is communicated with an air inlet a13 provided on the upper flange 3, the air inlet a13 is communicated with the upper air pipe 2, and the outer end of the upper air pipe 2 is communicated with an air source.

Further, as shown in fig. 3 and 4, when the lower gas pipe 6 is provided on the outer side wall of the cooling panel outer plate 401, the gas cooling pipe 30 is covered on the outer edge surface of the lower gas pipe 6, and at least one set of coolant through holes 31 for cooling the gas in the lower gas pipe 6 is provided on the outer side wall of the cooling panel outer plate 401 which is covered with the gas cooling pipe 30.

Further, the outer end of the upper air pipe 2 is connected with a pressure regulating valve for regulating air pressure, and the pressure regulating valve is connected with an air source through a pipeline. The purpose of the pressure regulating valve is to achieve the blowing amount of each drawing hole 10.

Further, the outer end of the upper air pipe 2 is respectively connected with an air inlet 7 on the fixing ring 1, the air inlet 7 is connected with a pressure regulating valve, and the pressure regulating valve is connected with an air source through a pipeline.

Further, as shown in fig. 10, a dovetail groove 18 is provided on the fixing ring 1, a sealing ring is provided in the dovetail groove 18, and a cooling water channel is provided below the fixing ring 1, and the cooling water channel is connected to a water inlet and a water outlet respectively.

Further, as shown in fig. 2, the cooling shield main body 4 includes an upper flange 3, a cooling shield outer plate 401 and a cooling shield inner plate 402, the cooling shield outer plate 401 and the cooling shield inner plate 402 are arranged at an interval, the upper flange 3 is arranged at the upper ends of the cooling shield outer plate 401 and the cooling shield inner plate 402, a gap between the cooling shield outer plate 401 and the cooling shield inner plate 402 forms a cooling medium passage, in a specific implementation, a plurality of welding columns may be arranged between the cooling shield outer plate 401 and the cooling shield inner plate 402, so that concentricity of the cooling shield outer plate 401 and the cooling shield inner plate 402 may be ensured, a cooling medium entering between the cooling shield outer plate 401 and the cooling shield inner plate 402 is uniform, and a uniform temperature gradient is realized; in order to make the cooling medium uniform, a cooling medium guide plate may be disposed between the outer cooling panel plate 401 and the inner cooling panel plate 402 to make the cooling medium flow according to a specified route, the upper flange 3 disposed at the upper end of the cooling panel main body 4 is provided with an upper cooling medium inlet 12 and an upper cooling medium outlet 29, in practice, the upper cooling medium inlet 12 and the upper cooling medium outlet 29 may also be disposed on the outer cooling panel plate 401 or the inner cooling panel plate 402, and the upper cooling medium inlet 12 and the upper cooling medium outlet 29 are respectively connected to the cooling medium outlet pipe 5 and the cooling medium inlet pipe 11.

Further, the cooling medium is cooling water or cooling gas such as liquid nitrogen or the like.

In the specific application of the utility model, as shown in fig. 10, the utility model is arranged above a crucible 26 in a furnace chamber 24, the lower part of a cavity plate 8 in the utility model is close to but can not contact with a silicon material melt 25 in the crucible 26, when the utility model works, firstly, a broken silicon material is put into the crucible 26, a heater 28 is started to heat the crucible 26 on a crucible support 27, after the broken silicon material in the crucible 26 is melted into the silicon material melt 25, a pull head 22 is lifted up to drive a seed crystal to descend, when the seed crystal passes through a drawing hole 10 on the cavity plate 8 to be contacted with the silicon material melt 25, the seed crystal is stopped to descend, when the lower end head of the seed crystal is melted, the seed crystal is slowly lifted, at the moment, because a cooling medium is introduced into the utility model, the temperature at the bottom surface of the cavity plate 8 forms a temperature gradient from top to bottom, at the moment, the silicon material melt 25 ascends along with the seed crystal, when the silicon material melt 25 is close to the drawing hole 10 on the cavity plate 8, because the temperature at the position is lower than the temperature of the crucible 26, the silicon material melt 25 is gradually crystallized, when the crystallized silicon material melt 25 enters the cooling screen main body 4 through the drawing hole 10, the temperature is gradually reduced, and then the required silicon core 23 is formed, when the silicon material melt is applied, the air blowing port 21 in the utility model can forcibly cool the silicon core 23 which is just crystallized, and simultaneously, the ovality of the silicon core and the isodiametric degree of the drawn silicon core can be adjusted by adjusting the air blowing amount, so that the yield and the drawing efficiency of the silicon core 23 are greatly improved.

In the specific implementation of the utility model, all the related cooling medium inlets and outlets can be arranged into a plurality of groups.

The silicon scraps involved in the utility model not only comprise excess materials in the preparation process of the silicon core, carelessly broken silicon cores, crushed materials generated by multi/single crystal silicon production enterprises in the process stages of reduction, cutting, grinding and polishing and the like, but also comprise silicon materials with other shapes (such as cauliflower materials, silicon rods with smaller lengths and the like), or directly purchase new silicon materials and directly draw the silicon core by using the utility model.

In practical application, the utility model not only can be used for drawing the silicon core, but also can realize the drawing of other crystal materials.

The details of the above are not described in detail since they are prior art.

The embodiments selected for the purpose of disclosing the utility model are presently considered to be suitable, however, it should be understood that the utility model is intended to cover all variations and modifications of the embodiments falling within the spirit and scope of the present inventive concept.

Claims

1. The utility model provides a cooling screen for using garrulous silicon material to draw many silicon cores simultaneously, includes cooling screen main part (4), cooling medium exit tube (5), cavity dish (8) and cooling medium go into pipe (11), characterized by: the cooling screen is characterized in that a cavity disc (8) is arranged at the lower end of the cooling screen main body (4), a cavity on the cooling screen main body (4) is communicated with a cavity on the cavity disc (8) to form a cooling medium passage, the cooling medium passage is respectively connected with at least one group of cooling medium outlet pipes (5) and cooling medium inlet pipes (11), an observation hole (9) or a drawing hole (10) is formed in the middle of the cavity disc (8), and at least one drawing hole (10) is formed in the periphery of the observation hole (9) or the drawing hole (10) to form the cooling screen for simultaneously drawing a plurality of silicon cores by using a silicon chip material.

2. The cooling screen as set forth in claim 1, wherein the cooling screen is adapted to simultaneously draw a plurality of silicon cores from a crushed silicon material, and further comprises: when a plurality of drawing holes (10) are arranged, the plurality of drawing holes (10) are arranged around the observation hole (9), or one drawing hole (10) is arranged in the middle, and the other drawing holes are arranged around the observation hole.

3. The cooling screen as set forth in claim 1, wherein the cooling screen is adapted to simultaneously draw a plurality of silicon cores from a crushed silicon material, and further comprises: the cavity plate (8) comprises an upper plate (801), connecting columns (802) and a lower plate (803), wherein the upper plate (801) is arranged above the lower plate (803), an observation hole (9) penetrating to the lower surface of the lower plate (803) is formed in the middle of the upper surface of the upper plate (801), the lower plate (803), the upper plate (801) and the observation hole (9) form an annular cavity structure, a plurality of connecting columns (802) are arranged in a cavity on the periphery of the observation hole (9), the upper end and the lower end of each connecting column (802) are respectively connected with the upper plate (801) and the lower plate (803), a drawing hole (10) is respectively arranged in the middle of each connecting column (802), and at least one group of a cooling medium lower inlet (14) and a cooling medium lower outlet (17) penetrating to the cavity are respectively arranged on the upper plate (801).

4. The cooling screen as set forth in claim 1, wherein the cooling screen is adapted to simultaneously draw a plurality of silicon cores from a crushed silicon material, and further comprises: the cooling screen main body (4) comprises an upper flange (3), a cooling screen outer plate (401) and a cooling screen inner plate (402), the cooling screen outer plate (401) and the cooling screen inner plate (402) are arranged at intervals, the upper flange (3) is arranged at the upper ends of the cooling screen outer plate (401) and the cooling screen inner plate (402), and a cooling medium passage is formed in a gap between the cooling screen outer plate (401) and the cooling screen inner plate (402).

5. The cooling screen as set forth in claim 1, wherein the cooling screen is adapted to simultaneously draw a plurality of silicon cores from a crushed silicon material, and further comprises: at least one air blowing opening (21) is arranged on the inner edge surface of the lower part of each drawing hole (10), and the air blowing opening (21) is externally connected with an air source.

6. The cooling screen as set forth in claim 5, wherein the cooling screen is adapted to simultaneously draw a plurality of silicon cores from a crushed silicon material, and further comprises: when gas blow mouth (21) set up to one, gas channel (16) of setting on hypoplastron (803) are connected to gas blow mouth (21), and trachea (6) under gas channel (16) are connected through inlet port B (15) that sets up on hypoplastron (803), trachea (6) set up down in the cavity between the lateral wall of cooling screen outer plywood (401) or cooling screen outer plywood (401) and cooling screen inner plating (402), and the last end intercommunication of trachea (6) sets up inlet port A (13) on upper flange (3) down, inlet port A (13) intercommunication upper air pipe (2), the outer end intercommunication air supply of upper air pipe (2).

7. The cooling screen as set forth in claim 5, wherein the cooling screen is adapted to simultaneously draw a plurality of silicon cores from a crushed silicon material, and further comprises: when the air blowing openings (21) are arranged in a plurality, a plurality of island columns (19) are arranged on the lower plate (803), drawing holes (10) are respectively arranged on each island column (19), an annular air passage (20) is arranged on the periphery of each drawing hole (10), a plurality of air blowing openings (21) penetrating through the drawing holes (10) are arranged on the inner edge surface of each annular air passage (20), the outer edge surface of each annular air passage (20) is communicated with an air passage (16) arranged on each island column (19), the air passages (16) are connected with the lower air pipe (6) through air inlet holes B (15) arranged on the lower plate (803), the lower air pipe (6) is arranged on the outer side wall of the outer cooling screen plate (401) or in a cavity between the outer cooling screen plate (401) and the inner cooling screen plate (402), the upper end heads of the lower air pipe (6) are communicated with air inlet holes A (13) arranged on the upper flange (3), and the air inlet holes A (13) are communicated with the upper air pipe (2), the outer end of the upper air pipe (2) is communicated with an air source.

8. A cooling screen according to any one of claims 6 or 7 for simultaneously drawing a plurality of silicon cores from a crushed silicon mass, wherein: when the lower air pipe (6) is arranged on the outer side wall of the outer cooling screen plate (401), the outer edge surface of the lower air pipe (6) is coated with the gas cooling pipe (30), and at least one group of cooling medium through holes (31) are formed in the outer side wall of the outer cooling screen plate (401) covered by the gas cooling pipe (30).

9. A cooling screen according to any one of claims 6 or 7 for simultaneously drawing a plurality of silicon cores from a crushed silicon mass, wherein: the outer end of the upper air pipe (2) is connected with a pressure regulating valve, and the pressure regulating valve is connected with an air source through a pipeline.

10. A cooling screen according to any one of claims 6 or 7 for simultaneously drawing a plurality of silicon cores from a crushed silicon mass, wherein: the outer end of the upper air pipe (2) is connected with an air inlet (7) on the fixing ring (1) respectively, the air inlet (7) is connected with a pressure regulating valve, and the pressure regulating valve is connected with an air source through a pipeline.