CN219260264U - Crystal cooling device used in crystal pulling - Google Patents

Abstract

The utility model relates to a crystal cooling device used for crystal drawing, which is characterized in that the surface of a crystal cooling mechanism is insulated by an insulation board, so that the phenomenon that volatile matters adhere to the lower surface and the side wall of the crystal cooling mechanism due to condensation is effectively avoided.

Description

Crystal cooling device used in crystal pulling

Technical Field

The utility model relates to the technical field of artificial crystal preparation, in particular to a crystal cooling device, and particularly relates to a crystal cooling device used for crystal drawing.

Background

As known, in terms of improving the crystal pulling efficiency, how to improve the pulling speed of crystals is one of the key technologies, taking multi/single crystal silicon preparation as an example, the usage amount of columnar silicon rods with the diameter of 8 mm-12 mm is very large in the whole production process of multi/single crystal silicon, in the actual production process, surplus materials occurring in the preparation process of columnar silicon rods are found, the handling of broken materials and the like generated in the process stages of cutting, breaking and the like of multi/single crystal silicon production enterprises is very complicated, many enterprises are in order to save trouble, the broken materials are directly discarded or stacked in a warehouse for a long time, some enterprises recycle the broken materials, and then a multi-wire saw is used for cutting Cheng Fushu pieces of columnar silicon rods with the size of 8 mm-8 mm or 10 mm-10 mm into columnar silicon rods, so that the production cost of the columnar silicon rods is increased, the impurity introduction is increased in the cutting process, and the large resource waste and the like are caused, so that the long-term technology of workers in the field is required to recycle the broken silicon materials is realized.

The inventor finds that the technology of drawing a silicon rod by adopting a Czochralski method is very mature and is widely applied to the field of artificial crystal preparation, but the traditional Czochralski method can only draw a silicon rod at the center of a crucible when drawing the silicon rod, such as Chinese patent, patent number 201320678696.4, application date of 10 months and 30 days in 2013, bulletin number CN203639604U, and the patent name of a flexible shaft pulling type single crystal furnace; the utility model patent of China is 202011063763.2, the application date is 9 months and 30 days in 2020, the bulletin number is CN112176400A, and the patent name is a Czochralski single crystal furnace and a melt temperature gradient control method thereof. The technical schemes disclosed in the two patents are all technical schemes for drawing silicon rods by adopting a Czochralski method, but the two technical schemes can only realize simultaneous drawing of one silicon rod and cannot realize simultaneous drawing of a plurality of silicon rods.

In order to achieve simultaneous drawing of a plurality of crystals, the present inventors filed a patent application named a crystal cooling device for an artificial crystal furnace to the national intellectual property agency at 2022, 3 and 21, with the patent application number 202220616165.1, which found the following problems in crystal drawing:

1. because the cooling medium is introduced into the lower flange or the cooling disc close to the molten liquid in the crucible, the temperature of the outer surface of the lower flange or the cooling disc is lower than the temperature of the area where the lower flange or the cooling disc is positioned, after the silicon material in the crucible is molten into the silicon liquid, the silicon material in the silicon liquid and impurities in the furnace chamber are volatilized and then float to the lower bottom surface or the side wall of the lower flange or the cooling disc, the temperature of the lower flange or the cooling disc is relatively lower because the cooling medium is introduced into the lower flange or the cooling disc, at the moment, the volatile material is condensed and adhered to the bottom surface or the side wall of the lower flange or the cooling disc, after the volatile material is accumulated to a certain thickness, the volatile material drops to the upper surface of the molten liquid due to the air current disturbance and the thermal expansion and contraction effect, the volatile material is not fused and cannot be gasified, and can continuously exist on the upper surface of the molten liquid, and because the crucible is always rotated, the volatile material in the crucible is not static at a certain position on the upper surface of the silicon liquid, but is not fixed, the position is floating, once the floating silicon core is adhered to the position, the silicon core is adhered to the crystal core, the crystal is deformed, the diameter is also can not be deformed, and the silicon core is deformed when the silicon is finally, and the silicon is deformed when the silicon is finally, and the silicon is deformed.

2. Because the lower surface of the lower flange or the cooling disc is a plane, the cooling effect of the cooling medium on each crystal drawing hole on the lower flange or the cooling disc is the same, at the moment, the temperature of the crucible is from the inner edge of the crucible to the center of the crucible sequentially from high to low due to the non-uniform temperature of the melt in the crucible, when the crystal at the outer ring of the lower flange or the cooling disc is drawn, the crystallization speed of the crystal at the outer ring of the lower flange or the cooling disc is lower than that of the crystal at the inner ring of the lower flange or the cooling disc due to the fact that the temperature of the outer ring is higher than that of the inner ring of the lower flange or the cooling disc during drawing (the crystallization speed is lower than that of the crystal at the center of the crucible, the crystal at the outer ring of the lower flange or the cooling disc is smaller than that at the same drawing speed, and the crystal diameters at the same time are not uniform.

3. The lower surface of the lower flange or the cooling disc is close to but not contacted with the upper surface of the molten liquid in the crucible, and at the moment, the low temperature of the surface of the lower flange or the cooling disc can absorb part of heat above the crucible, so that unnecessary heat loss is caused, a certain electricity consumption loss is caused, and the like.

In summary, how to overcome the above technical problems is an urgent need to be solved.

Disclosure of Invention

In order to overcome the defects in the background technology, the utility model provides a crystal cooling device for crystal drawing, which is characterized in that a cooling medium channel is arranged at the periphery of a crystal cooling transistor, a low-temperature area is formed in a space above a crucible through the cooling medium, namely, a temperature gradient with a lower height and a lower height is formed, the temperature of molten silicon above the crucible is reduced, the viscosity of the silicon is increased, the silicon is beneficial to crystallization of the silicon along with seed crystals, then an insulation board is arranged below a lower flange or a cooling disc, so that volatile matters are effectively prevented from adhering to the surface of the lower flange or the cooling disc due to condensation, and meanwhile, the insulation board can also adjust the temperature of the inner ring and the outer ring on the lower flange or the cooling disc, thereby achieving the purpose of realizing the equal diameter and the like.

In order to achieve the aim of the utility model, the utility model adopts the following technical scheme:

the crystal cooling device comprises an upper flange, a lower flange, crystal cooling transistors, a cooling medium channel and an insulation board, wherein a plurality of crystal cooling transistors are arranged between the upper flange and the lower flange, the periphery of the crystal cooling transistors is provided with the cooling medium channel, an inlet of the cooling medium channel is connected with a cooling source through a pipeline, an outlet of the cooling medium channel is connected with a cooling medium recovery mechanism through a pipeline, and the insulation board is arranged below the lower flange; or a cooling plate is arranged below the lower flange, and an insulation board is arranged below the cooling plate to form the crystal cooling device used for crystal drawing.

The crystal cooling device for crystal drawing is characterized in that a cavity is formed in the middle of the cooling disc, a plurality of fixing columns are arranged in the cavity, crystal lifting holes are respectively formed in each fixing column, the cavity is respectively communicated with a water outlet pipe and a water inlet pipe, and the water outlet pipe and the water inlet pipe are communicated with a cooling medium channel.

The lower flange or the lower surface of the cooling disc is provided with at least one stage of upward concave steps from outside to inside to form a stepped surface, and each stage of stepped surface is provided with a circle of crystal lower through holes or crystal lifting holes.

The crystal cooling device for crystal drawing is characterized in that the heat-insulating plate is of a flat plate structure, a plurality of through holes are formed in the heat-insulating plate, each through hole corresponds to a crystal lower through hole on the lower flange or a crystal lifting hole on the cooling plate, and the external dimension of the heat-insulating plate is larger than or equal to that of the lower flange or the cooling plate.

When the heat-insulating plate is of a flat plate structure, at least one step of step which is raised upwards is arranged on the heat-insulating plate from outside to inside, and the step is correspondingly matched with a step surface below the lower flange or the cooling plate.

The crystal cooling device for crystal drawing is characterized in that the heat preservation plate is in a barrel-shaped structure formed by arranging a concave groove at the middle part of the heat preservation plate, a plurality of through holes are arranged on the heat preservation plate, each through hole corresponds to a crystal lower through hole on a lower flange or a crystal lifting hole on a cooling disc respectively, and the inner edge surface of the groove is in clearance fit or interference fit with the outer edge surface of the lower flange or the cooling disc.

In the crystal cooling device used for crystal drawing, when the outer edge surface of the lower flange or the cooling disc is in clearance fit with the inner edge surface of the groove, heat-insulating filler is arranged at the clearance.

When the heat-insulating plate is in a barrel-shaped structure, at least one step of step which is upwards raised is arranged on the heat-insulating plate from outside to inside, and the step is correspondingly matched with the step surface below the lower flange or the cooling plate.

The first structure of the cooling medium channel is that a connecting cylinder is arranged between an upper flange and a lower flange, a plurality of crystal cooling transistors are arranged in the connecting cylinder, the upper end of each crystal cooling transistor is respectively connected with a crystal upper perforation arranged on the upper flange, the lower end of each crystal cooling transistor is respectively connected with a crystal lower perforation arranged on the lower flange, a cooling medium channel is formed by the inner edge surface of the connecting cylinder, the lower end surface of the upper flange and a cavity between the upper end surface of the lower flange, a water outlet and a water inlet are respectively arranged on the upper flange, and the water outlet and the water inlet respectively form an inlet and an outlet of the cooling medium channel.

The second structure of the cooling medium channel is that the periphery of each crystal cooling tube is respectively sleeved with a sleeve, the upper end of each sleeve is respectively communicated with a water inlet cavity arranged in the middle of an upper flange, the lower end of each sleeve is respectively communicated with a water collecting cavity arranged in the middle of a lower flange, a cooling cavity, a water inlet cavity and a water collecting cavity between the inner edge surface of each sleeve and the outer edge surface of the crystal cooling tube form a cooling medium channel, the water inlet cavity is communicated with a water inlet, the water collecting cavity is connected with a water outlet through a water return pipe, and the water outlet and the water inlet form an inlet and an outlet of the cooling medium channel respectively.

The third structure of the cooling medium channel is that a sleeve is sleeved on the periphery of each crystal cooling tube, a semicircular step which is sunken downwards is arranged at the upper end of each sleeve, the upper end of each sleeve is respectively communicated with a water inlet cavity arranged on the upper part of the upper flange, the upper end of each semicircular step is respectively communicated with a water return cavity arranged on the lower part of the upper flange, the lower end of each sleeve is respectively communicated with a water collecting cavity arranged on the upper part of the lower flange, a cooling cavity, a water inlet cavity, a water return cavity and a water collecting cavity between the inner edge surface of each sleeve and the outer edge surface of the crystal cooling tube form a cooling medium channel, the water inlet cavity is communicated with a water inlet, the water outlet cavity is connected with a water outlet through a connecting pipe, and the water outlet and the water inlet form an inlet and an outlet of the cooling medium channel respectively.

The fourth structure of the cooling medium channel is that the periphery of each crystal cooling tube is respectively sleeved with a sleeve, the upper end of each sleeve is respectively provided with a semicircular step which is sunken downwards, the upper end of each sleeve is respectively communicated with a water inlet cavity arranged on the upper part of the upper flange, the upper end of each semicircular step is respectively communicated with a water return cavity arranged on the lower part of the upper flange, the lower end of each sleeve is respectively connected with the lower flange, a cooling cavity, a water inlet cavity and a water return cavity between the inner edge surface of each sleeve and the outer edge surface of the crystal cooling tube form a cooling medium channel, the water inlet cavity is communicated with a water inlet, the water return cavity is connected with a water outlet through a connecting pipe, and the water outlet and the water inlet form an inlet and an outlet of the cooling medium channel respectively.

And a baffle is arranged in a cooling cavity between the crystal cooling transistor and the sleeve.

The first structure of the upper flange is that the upper flange is of a solid structure, and a plurality of crystal upper perforations, water outlets and water inlets which penetrate through the lower surface of the upper flange are respectively arranged on the upper surface of the upper flange; or the middle part above the upper flange is provided with a gas perforation, and the upper flange at the periphery of the gas perforation is provided with a plurality of crystal upper perforation, a water outlet and a water inlet which are communicated with the lower part of the upper flange.

The second structure of the upper flange is that an upward concave groove is arranged below the upper flange, a lower cover plate is arranged at the opening end of the groove, a cavity formed by the lower cover plate and the groove is a water inlet cavity, a plurality of crystal cooling transistor through holes, water outlets and water inlets penetrating through the upper surface of the upper flange are respectively arranged at the bottom of the groove, and a plurality of sleeve through holes and water return pipe through holes are arranged on the lower cover plate.

The third structure of the upper flange is that an upper groove and a lower groove are respectively arranged on the upper surface and the lower surface of the upper flange, a water inlet cavity cover plate and a water return cavity cover plate are respectively arranged at the opening ends of the upper groove and the lower groove, a cavity formed by the water inlet cavity cover plate and the upper groove is a water inlet cavity, a cavity formed by the water return cavity cover plate and the lower groove is a water return cavity, a plurality of crystal cooling tube perforations, water outlets and water inlets which are communicated with the bottom of the lower groove are respectively arranged on the water inlet cavity cover plate, a plurality of sleeve perforation and water return tube perforations are arranged on the water return cavity cover plate, a semicircular water inlet hole which is communicated with the bottom of the lower groove is arranged at the bottom of the upper groove, and the water return cavity is communicated with the water outlet through a connecting pipe.

The first structure of the lower flange is that the lower flange is of a solid structure, and a plurality of crystal lower through holes penetrating to the lower surface of the lower flange are arranged on the lower flange.

The second structure of the lower flange is that a concave groove is arranged on the lower flange, an upper cover plate is arranged at the opening end of the groove, a plurality of through holes for the transistor cooling tube are arranged at the bottom of the groove and penetrate through to the lower surface of the lower flange, and a plurality of sleeve through holes are arranged on the upper cover plate.

The crystal cooling device used for crystal drawing is characterized in that a plurality of crystal cooling transistors are arranged in a mode that one crystal cooling transistor is arranged in the middle, a plurality of groups of crystal cooling transistors are radially arranged on the periphery of the middle crystal cooling transistor, and each group of crystal cooling transistors comprises at least two crystal cooling transistors; or a second arrangement of a plurality of transistor-cooling transistors is provided in such a way that a plurality of groups of transistor-cooling transistors are arranged radially around the periphery of the gas-perforated hole in the upper flange, each group of transistor-cooling transistors comprising at least two transistor-cooling transistors.

Due to the adoption of the technical scheme, the utility model has the following beneficial effects:

According to the utility model, the plurality of crystal cooling pipes are arranged between the upper flange and the lower flange, the cooling medium channels are arranged at the periphery of the crystal cooling pipes, a low-temperature area is formed in the space above the crucible by the cooling medium, namely, a temperature gradient with a lower height and a lower height is formed, meanwhile, the temperature of molten silicon above the crucible can be reduced, the viscosity of the silicon is increased, the silicon is beneficial to crystallization of the silicon along with a seed crystal, and the silicon core can be cooled, so that the drawing speed of the silicon core is improved, then, the heat preservation plate is arranged below the lower flange or the cooling disc, the surface of the crystal cooling mechanism is preserved by the heat preservation plate, the phenomenon that volatile matters adhere to the lower surface and the side wall of the crystal cooling mechanism due to condensation is effectively avoided, meanwhile, the temperature reduction of the corresponding crucible area due to the low temperature below the crystal cooling mechanism is avoided, the fact that the crystal cooling mechanism takes away excessive temperature is prevented, the effect of reducing heating energy consumption is achieved, meanwhile, the purpose of fully drawing the crystal cooling medium in the crystal cooling mechanism is realized, the cooling effect of the crystal cooling mechanism is improved, the crystal is promoted, the purpose of fully drawing the crystal is achieved, the cooling effect is improved, the cooling effect is promoted, and the crystal cooling speed is further is suitable.

Drawings

FIG. 1 is a schematic perspective view of the present utility model;

FIG. 2 is a partial perspective view of the present utility model;

FIG. 3 is a schematic view of the structure of the upper flange of the present utility model;

FIG. 4 is a schematic view of the structure of the lower flange of the present utility model;

FIG. 5 is a second schematic view of the cooling medium passage of the present utility model;

FIG. 6 is a schematic view of a third configuration of the cooling medium passage in the present utility model;

FIG. 7 is a fourth schematic view of the cooling medium passage of the present utility model;

FIG. 8 is a schematic view of the structure of the sleeve of the present utility model;

FIG. 9 is a first schematic view of the cooling plate arrangement of the present utility model;

FIG. 10 is a second schematic view of the cooling plate arrangement of the present utility model;

FIG. 11 is a schematic view of a third construction of the cooling plate arrangement of the present utility model;

FIG. 12 is a schematic view of the structure of the separator of the present utility model;

FIG. 13 is a schematic view of a first construction of an insulation board according to the present utility model;

FIG. 14 is a second schematic view of the thermal insulation board of the present utility model;

FIG. 15 is a schematic view of a third construction of an insulation board according to the present utility model;

FIG. 16 is a schematic view of a fourth construction of an insulation board according to the present utility model;

In the figure: 1. perforating the crystal; 2. a water outlet; 3. an upper flange; 4. a connecting cylinder; 5. a lower flange; 6. a water inlet; 7. a transistor cooling; 8. a lower annular positioning step; 9. perforating under the crystal; 10. an upper annular positioning step; 11. a water inlet cavity; 12. a cooling chamber; 13. a sleeve; 14. a water return pipe; 15. an upper cover plate; 16. a water collecting cavity; 17. a lower cover plate; 18. a water inlet cavity cover plate; 19. a connecting pipe; 20. a water return cavity; 21. a backwater cavity cover plate; 22. a semicircular step; 23. a water outlet pipe; 24. a cavity; 25. a cooling plate; 26. fixing the column; 27. a crystal pulling hole; 28. a water inlet pipe; 29. a partition plate; 30. a thermal insulation board; 3001. perforating; 3002. a central bore; 3003. a step; 31. gas perforation; 32. and (5) insulating the filler.

Detailed Description

The present utility model will be explained in more detail by the following examples, and the purpose of the present utility model is to protect all changes and modifications within the scope of the present utility model, but the present utility model is not limited to the following examples;

in the description of the present utility model, it should be understood that the terms "center", "side", "length", "width", "height", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "side", etc. indicate orientations or positional relationships based on the orientation or positional relationships shown in fig. 1 are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

In the description of the present utility model, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

The crystal cooling device for crystal pulling comprises an upper flange 3, a lower flange 5, crystal cooling transistors 7, a cooling medium channel and a heat insulation plate 30, wherein a plurality of crystal cooling transistors 7 are arranged between the upper flange 3 and the lower flange 5; or a second arrangement of a plurality of transistor cooling transistors is that a plurality of groups of transistor cooling transistors are radially arranged on the periphery of the gas through hole 31 on the upper flange 3, each group of transistor cooling transistors comprises at least two transistor cooling transistors, and the arrangement number of the transistor cooling transistors 7 is specifically selected according to the number of pulled crystals; a cooling medium channel is arranged at the periphery of the transistor cooling transistor 7, cooling medium for cooling is introduced into the cooling medium channel, an inlet of the cooling medium channel is connected with a cooling source through a pipeline, an outlet of the cooling medium channel is connected with a cooling medium recovery mechanism through a pipeline, and a heat insulation plate 30 is arranged below the lower flange 5; or be equipped with cooling plate 25 in the below of lower flange 5, cooling plate 25's middle part is equipped with cavity 24 be equipped with a plurality of fixed columns 26 in cavity 24, be equipped with respectively on every fixed column 26 and carry the draw hole 27, cavity 24 communicates outlet pipe 23 and inlet tube 28 respectively, outlet pipe 23 and inlet tube 28 communicate the cooling medium passageway, are equipped with heated board 30 below cooling plate 25 and form the crystal cooling device that is used for the crystal to draw.

In practical application, the heat insulation board 30 is arranged, so that the following effects can be achieved:

1. by arranging the heat-insulating plate 30, the surface temperature of the lower flange 5 or the cooling disk 25 is lower than the temperature in the furnace chamber due to the cooling medium, and further the condensation and adhesion of volatile matters in the melt to the outer surface of the lower flange 5 or the cooling disk 25 can be reduced or avoided.

2. Through the arrangement of the heat insulation plate 30, the uniformity of the temperature of each crystal lower perforation (9) or crystal lifting hole (27) on the lower flange 5 or the cooling disc 25 can be better ensured (namely, the temperature of the inner ring crystal lower perforation (9) and the outer ring crystal lower perforation (9) on the lower flange 5 or the temperature of the inner ring crystal lifting hole (27) and the outer ring crystal lifting hole (27) on the cooling disc 25 can be adjusted, so that the temperature of the inner ring crystal lower perforation (9) and the outer ring crystal lifting hole (27) tends to be isothermal, and the temperature distribution range of the crucible is higher than the central temperature, and the cooling range of the lower flange 5 or the cooling disc 25 is also changed when the crystals are pulled, so that the uniformity of the inner ring crystal and the outer ring crystal crystals is ensured.

3. Through the setting of heated board 30, can also make the temperature in the crucible crystallization region tend to be even, play the cooling of cooling medium in lower flange 5 or cooling disk 25 to the crystallization region in the crucible (lower flange 5 or cooling disk 25 surface temperature is low, can take away a part of heat, after the heat loss, and then lead to the reduction of temperature), can avoid in order to guarantee that the temperature in the crucible crystallization region is not reduced, guarantee the step that the temperature in the crucible crystallization region is not reduced through the method of increasing heating power, and then realize reducing energy consumption's effect (namely through the setting of heated board 30, can reduce or adjust the absorption of lower flange 5 or cooling disk 25 to crucible interior melt liquid level temperature, thereby avoid unnecessary heat loss, avoid causing the increase of electricity consumption etc.), like this can also realize the temperature in crucible crystallization region evenly.

Further, as shown in fig. 15 and 16, a step surface is formed by arranging at least one step of upward concave step from outside to inside under the lower flange 5 or the cooling plate 25, in order to realize the drawing of more crystal rods at the same time, a plurality of circles of crystal lower through holes 9 or crystal lifting holes 27 are sequentially arranged on the lower flange 5 or the cooling plate 25 from the outer edge to inside at intervals, at this time, in order to ensure the uniformity of the diameters of crystals drawn by each circle of crystal lower through holes 9 or crystal lifting holes 27, the technical problem to be avoided is mainly to overcome the problem of uneven temperature of the melt in the crucible, so that at least one step of upward concave step is arranged from outside to inside under the lower flange 5 or the cooling plate 25 to form a step surface, and a circle of crystal lower through holes 9 or crystal lifting holes 27 are respectively arranged on each step surface, and the shape of the step surface is consistent with the step 3003 on the heat insulation plate 30. In implementation, the step steps can better ensure the uniformity of the temperature of the crystal perforation or the crystal pulling hole 27 on the lower flange 5 or the cooling disc 25, and the cooling range of the lower flange 5 or the cooling disc 25 is changed when the crystal is pulled because the temperature distribution range of the crucible is that the peripheral temperature is higher than the central temperature, so that the uniformity of the crystallization of the inner ring crystal and the outer ring crystal is ensured.

Further, as shown in fig. 14, the heat-insulating plate 30 has a flat plate structure, a plurality of through holes 3001 are provided on the heat-insulating plate 30, each through hole 3001 corresponds to a crystal lower through hole 9 on the lower flange 5 or a crystal lifting hole 27 on the cooling plate 25, and when the external dimension of the heat-insulating plate 30 is greater than or equal to the external dimension of the lower flange 5 or the cooling plate 25, a central hole 3003 may be provided in the middle of the heat-insulating plate 30, and a plurality of groups of through holes 3001 are radially provided on the periphery of the central hole 3003, and the through holes 3001 correspond to the crystal lower through holes 9 or the crystal lifting holes 27 on the lower flange 5 or the cooling plate 25, respectively.

Further, as shown in fig. 14 and 16, when the heat-insulating plate 30 has a flat plate structure, at least one step 3003 protruding upwards is provided on the upper surface of the heat-insulating plate 30 from outside to inside, and the step 3003 is correspondingly matched with the step surface below the lower flange 5 or the cooling plate 25.

Further, as shown in fig. 13 and 15, the heat-insulating plate 30 has an alternative structure in which a concave groove is formed in the middle of the heat-insulating plate 30, a plurality of through holes 3001 are formed in the heat-insulating plate 30, each through hole 3001 corresponds to the crystal lower through hole 9 on the lower flange 5 or the crystal lifting hole 27 on the cooling plate 25, and an inner edge surface of the groove is in clearance fit or interference fit with an outer edge surface of the lower flange 5 or the cooling plate 25.

Further, as shown in fig. 15, when the outer edge surface of the lower flange 5 or the cooling plate 25 is in clearance fit with the inner edge surface of the groove, a heat-insulating filler 32 is provided in the clearance.

Further, as shown in fig. 15, when the heat-insulating plate 30 is configured in a barrel structure, at least one step 3003 protruding upwards is provided on the upper surface of the heat-insulating plate 30 from outside to inside, and the step 3003 is correspondingly matched with the step surface below the lower flange 5 or the cooling plate 25. In the implementation process, the temperature uniformity of the lower through holes 9 or the crystal lifting holes 27 on the lower flange 5 or the cooling disc 25 can be better ensured by arranging the step steps, and the cooling range of the lower flange 5 or the cooling disc 25 is changed when the crystal is pulled because the temperature distribution range of the crucible is that the peripheral temperature is higher than the central temperature, so that the crystallization consistency of the inner and outer ring crystals is ensured.

In practice, the outer dimension of the insulation board 30 is larger than that of the lower flange 5 or the cooling plate 25, as shown in fig. 14, the outer edge of the insulation board 30 extends outwards, so that the adhesion of volatile matters to the outer edge of the lower flange 5 or the cooling plate 25 can be reduced or avoided, and meanwhile, the insulation board can also act as a tray to drop the volatile matters on the upper surface extending out of the insulation board 30. When the external dimension of the thermal insulation board 30 is equal to that of the lower flange 5 or the cooling plate 25, as shown in fig. 16, the thermal insulation board 30 and the lower flange 5 or the cooling plate 25 can be connected in an adhesive manner, or can be connected in a pin or screw fixing manner, or can be hung below the lower flange 5 or the cooling plate 25 through a connecting rod, and the thermal insulation board 30 can be made of graphite felt, graphite board, carbon-carbon composite board, or the like.

Further, as shown in fig. 13 and 15, the heat insulation board 30 has an alternative structure in which a concave groove is formed in the middle of the heat insulation board 30 to form a barrel structure, and an inner edge surface of the concave groove is connected with an outer edge surface of the lower flange 5 or the cooling disc 25 in a clearance fit or interference fit manner. In practice, when the outer edge surface of the lower flange 5 or the cooling disk 25 is in clearance fit with the inner edge surface of the groove, a heat-insulating filler 32 is arranged at the clearance. The heat preservation filler 32 is any one of quartz felt, graphite felt or zirconium felt. The heat preservation plate 30 with the barrel-shaped structure can prevent volatile matters from being adhered to and accumulated on the side wall of the lower flange 5 or the cooling disc 25, can also play a role in adjusting the heat preservation effect of the side wall of the lower flange 5 or the cooling disc 25, and can adjust the temperature of the crystal lower through holes 9 or the crystal lifting holes 27 on the outer ring of the lower flange 5 or the cooling disc 25 by adjusting the heat preservation effect of the side wall of the lower flange 5 or the cooling disc 25, so as to adjust the diameter of the drawn cylindrical crystal, and the heat preservation filler 32 is arranged to adjust the heat preservation temperature by adjusting the thickness of the added heat preservation filler 32 while playing a heat preservation role, thereby finally realizing the adjustment of the temperature of the crystal lower through holes 9 or the crystal lifting holes 27 on the outer ring of the lower flange 5 or the cooling disc 25, and the like.

In implementation, an insulation board can be further arranged on the upper panel of the lower flange 5 or the cooling plate 25, namely, the outer surface of the lower flange 5 or the cooling plate 25 is entirely coated with a layer of insulation material.

In practice, a central hole 3002 consistent with the central hole of the cooling plate 25 may be disposed in the middle of the heat insulation plate 30, a plurality of holes 3001 corresponding to the crystal lifting holes 27 on the cooling plate 25 are disposed on the periphery of the central hole 3002, when the lower flange 5 or the lower surface of the cooling plate 25 is provided with at least one step of step recessed upwards from outside to inside to form a step surface, the heat insulation plate 30 is provided with at least one step of step 3003 protruding upwards from outside to inside, and the step 3003 is matched with the step surface on the lower flange 5 or the cooling plate 25, and the specific structure is shown in fig. 15 and 16.

The cooling medium in the utility model is cooling water or cooling oil or cooling gas, such as liquid nitrogen.

Further, as shown in fig. 9, 10 and 11, a cooling disc 25 is arranged below the lower flange 5, a cavity 24 is arranged in the middle of the cooling disc 25, a plurality of fixing columns 26 are arranged in the cavity 24, crystal lifting holes 27 are respectively arranged on each fixing column 26, the cavity 24 is respectively communicated with a water outlet pipe 23 and a water inlet pipe 28, the water outlet pipe 23 and the water inlet pipe 28 are communicated with a cooling medium channel, and in the implementation, as shown in fig. 9, the upper end of the water inlet pipe 28 is connected with a water inlet 6 on the upper flange 3, and the upper end of the water outlet pipe 23 is communicated with a water collecting cavity 16 on the lower flange 5; or as shown in fig. 10, the upper end of the water inlet pipe 28 is connected with the water inlet 6 on the upper flange 3, and the upper end of the water outlet pipe 23 is communicated with the water return cavity 20 on the upper flange 3; or as shown in fig. 11, a cooling disc 25 is arranged below the lower flange 5, a cavity 24 is arranged in the middle of the cooling disc 25, a plurality of fixing columns 26 are arranged in the cavity 24, crystal lifting holes 27 are respectively arranged on each fixing column 26, the cavity 24 is respectively communicated with a water outlet pipe 23 and a water inlet pipe 28, the water outlet pipe 23 and the water inlet pipe 28 respectively penetrate through the lower flange 5 and are respectively communicated with a cooling medium channel formed by the lower flange 5, a connecting cylinder 4 and an upper flange 3, and when the cooling device is implemented, the upper ends of the water outlet pipe 23 and the water inlet pipe 28 can also penetrate through the lower flange 5 and are directly communicated with a water outlet 2 and a water inlet 6 arranged on the upper flange 3, namely, the cooling disc 25 and the crystal cooling pipe 7 can be respectively cooled through the plurality of water outlets 2 and the water inlets 6, so that the cooling disc 25 and the crystal cooling pipe 7 can be independently arranged; or the upper end of the water outlet pipe 23 or the water inlet pipe 28 is communicated with the water outlet 2 or the water inlet 6, and the water inlet pipe 28 or the upper end of the water outlet pipe 23 is communicated with a cooling medium channel consisting of the lower flange 5, the connecting cylinder 4 and the upper flange 3, namely, the mode of realizing independent inlet and outlet or realizing independent inlet and outlet is realized; that is, the specific connection of the water outlet pipe 23 and the water inlet pipe 28 with which part depends on the structural form of the cooling medium channel, when in implementation, the cooling disc 25 is arranged below the lower flange 5, the inner hole of each crystal cooling tube 7 on the lower flange 5 corresponds to each crystal lifting hole 27 on the cooling disc 25 and is arranged concentrically, so that the crystal rod can be ensured to smoothly pass through the crystal lifting holes 27 and the crystal cooling tubes 7, meanwhile, an operator can observe the drawing condition of the crystal through the gap between the lower flange 5 and the cooling disc 25, when in use, after the seed crystal drives the melt to enter the crystal lifting holes 27 on the cooling disc 25, the new crystal rod is formed along with the crystallization of the seed crystal along with the temperature reduction, the crystal cooling transistor 7 cools the crystal bar again to form a required crystal bar, at this time, an operator can observe the drawing condition of the crystal bar through a gap between the lower flange 5 and the cooling disc 25, the crystal cooling transistor 7 can cool the crystal bar (a temperature gradient area required by crystal growth is formed by cooling the crystal cooling transistor 7 through cooling medium in a cooling medium channel), meanwhile, the crystal cooling transistor 7 can also play a role of guiding the crystal bar, namely, the lower end of the crystal bar is guaranteed not to shake (it is required to be explained that when the crystal bar is drawn to a certain length, if the upper end is slightly shaken, the shaking amplitude is doubled or increased by tens of times, so that the drawing of the crystal bar is affected, and the drawing length of the crystal bar is generally about 2m to 3m at present).

As shown in fig. 1, 2, 3 and 4, the first structure of the cooling medium channel is that a connecting tube 4 is arranged between an upper flange 3 and a lower flange 5, when in implementation, a lower annular positioning step 8 is arranged below the upper flange 3, an upper annular positioning step 10 is arranged above the lower flange 5, then the upper end and the lower end of the connecting tube 4 are respectively sleeved on the lower annular positioning step 8 and the upper annular positioning step 10, then the connecting tube 4 is welded on the upper flange 3 and the lower flange 5 in a welding mode, a plurality of crystal cooling tubes 7 are arranged in the connecting tube 4, the upper end of each crystal cooling tube 7 is respectively connected with a crystal upper through hole 1 arranged on the upper flange 3, the lower end of each crystal cooling tube 7 is respectively connected with a crystal lower through hole 9 arranged on the lower flange 5, a cooling medium channel is formed by a cavity between the inner edge surface of the connecting tube 4 and the lower end surface of the upper flange 3 and the upper end surface of the lower flange 5, a water outlet 2 and a water inlet 6 are respectively arranged on the upper flange 3, and the water outlet 2 and the water inlet 6 respectively form an inlet and an outlet of the cooling medium channel. In implementation, the arrangement form of the plurality of transistor cooling transistors 7 is that one transistor cooling transistor 7 is arranged in the middle, then a plurality of groups of transistor cooling transistors 7 are radially arranged on the periphery of the middle transistor cooling transistor 7, each group of transistor cooling transistors 7 comprises at least two transistor cooling transistors 7, and the arrangement quantity of the transistor cooling transistors 7 is specifically selected according to the quantity of pulled crystals; the structure of the upper flange 3 is that the upper flange 3 is of a solid structure, and a plurality of crystal upper through holes 1, a water outlet 2 and a water inlet 6 which are communicated with the lower surface of the upper flange 3 are respectively arranged on the upper surface of the upper flange 3. The structure of the lower flange 5 is that the lower flange 5 is of a solid structure, a plurality of crystal lower through holes 9 penetrating to the lower surface of the lower flange 5 are formed in the upper surface of the lower flange 5, when the crystal cooling device is used, a cooling medium enters a cooling medium channel formed by the upper flange 3, the connecting cylinder 4 and the lower flange 5 through the water inlet 6, after the whole cooling medium channel is filled with the cooling medium, the cooling medium flows out from the water outlet 2, the purpose of cooling crystal bars in each crystal cooling tube 7 is achieved, and when the crystal cooling device is implemented, the cooling medium preferably cools pure water, and other cooling gases can be selected. During implementation, a cooling disc 25 can be arranged below the lower flange 5, a cavity 24 is formed in the middle of the cooling disc 25, a plurality of fixing columns 26 are arranged in the cavity 24, crystal lifting holes 27 are respectively formed in each fixing column 26, the cavity 24 is respectively communicated with a water outlet pipe 23 and a water inlet pipe 28, and the water outlet pipe 23 and the water inlet pipe 28 are communicated with a water inlet and a water outlet which are arranged on the lower flange 5.

Further, as shown in fig. 5, the second structure of the cooling medium channel is that the periphery of each crystal cooling tube 7 is respectively sleeved with a sleeve 13, the upper end of each sleeve 13 is respectively communicated with a water inlet cavity 11 arranged in the middle of the upper flange 3, the lower end of each sleeve 13 is respectively communicated with a water collecting cavity 16 arranged in the middle of the lower flange 5, a cooling cavity 12, a water inlet cavity 11 and a water collecting cavity 16 between the inner edge surface of each sleeve 13 and the outer edge surface of the crystal cooling tube 7 form a cooling medium channel, the water inlet cavity 11 is communicated with the water inlet 6, the water collecting cavity 16 is connected with the water outlet 2 through a water return pipe 14, and the water outlet 2 and the water inlet 6 respectively form an inlet and an outlet of the cooling medium channel. In implementation, the structure of the upper flange 3 is that an upward concave groove is arranged below the upper flange 3, a lower cover plate 17 is arranged at the opening end of the groove, a cavity formed by the lower cover plate 17 and the groove is a water inlet cavity 11, a plurality of through holes of a transistor cooling tube, a water outlet 2 and a water inlet 6 which penetrate through the upper surface of the upper flange 3 are respectively arranged at the bottom of the groove, and a plurality of through holes of a sleeve tube and through holes of a water return tube are arranged on the lower cover plate 17. The lower flange 5 is structured in such a way that a concave groove is arranged on the lower flange 5, an upper cover plate 15 is arranged at the opening end of the groove, a plurality of transistor cooling tube perforations penetrating to the lower surface of the lower flange 5 are arranged at the bottom of the groove, and a plurality of sleeve tube perforations are arranged on the upper cover plate 15. When in use, the cooling medium enters the water inlet cavity 11 through the water inlet 6, then the cooling medium is shunted into each cooling cavity 12 through the water inlet cavity 11, the cooling medium flows through the cooling cavities 12 and then enters the water collecting cavity 16, the cooling medium enters the water return pipe 14 through the water collecting cavity 16, and the cooling medium enters the water outlet 2 through the water return pipe 14.

Further, as shown in fig. 6 and 8, the third structure of the cooling medium channel is that a sleeve 13 is sleeved on the periphery of each crystal cooling tube 7, a semicircular step 22 recessed downwards is arranged at the upper end of each sleeve 13, the upper end of each sleeve 13 is respectively communicated with a water inlet cavity 11 arranged at the upper part of the upper flange 3, the upper end of each semicircular step 22 is respectively communicated with a water return cavity 20 arranged at the lower part of the upper flange 3, the lower end of each sleeve 13 is respectively communicated with a water collecting cavity 16 arranged at the upper part of the lower flange 5, a cooling medium channel is formed by a cooling cavity 12, a water inlet cavity 11 and a water return cavity 20 between the inner edge surface of each sleeve 13 and the outer edge surface of the crystal cooling tube 7, the water inlet cavity 11 is communicated with the water inlet 6, the water return cavity 20 is connected with the water outlet 2 through a connecting pipe 19, and the water outlet 2 and the water inlet 6 respectively form an inlet and an outlet of the cooling medium channel. In implementation, the upper flange 3 is configured such that an upper groove and a lower groove are respectively disposed on the upper and lower surfaces of the upper flange 3, a water inlet cavity cover plate 18 and a water return cavity cover plate 21 are respectively disposed at the open ends of the upper groove and the lower groove, a cavity formed by the water inlet cavity cover plate 18 and the upper groove is a water inlet cavity 11, a cavity formed by the water return cavity cover plate 21 and the lower groove is a water return cavity 20, a plurality of crystal cooling tube perforations penetrating to the bottom of the lower groove, a water outlet 2 and a water inlet 6 are respectively disposed on the water inlet cavity cover plate 18, a plurality of sleeve perforations and water return tube perforations are disposed on the water return cavity cover plate 21, a semicircular water inlet penetrating to the bottom of the lower groove is disposed at the bottom of the upper groove, and the water return cavity 20 is communicated with the water outlet 2 through a connecting pipe 19. The lower flange 5 is structured in such a way that a concave groove is arranged on the lower flange 5, an upper cover plate 15 is arranged at the opening end of the groove, a plurality of transistor cooling tube perforations penetrating to the lower surface of the lower flange 5 are arranged at the bottom of the groove, and a plurality of sleeve tube perforations are arranged on the upper cover plate 15. In order to improve the cooling effect, a partition 29 may be disposed in the cooling cavity 12 between the crystal cooling transistor 7 and the sleeve 13, as shown in fig. 12, the cooling cavity 12 is divided into a water inlet cavity and a water outlet cavity by the partition 29, that is, the cooling medium is led to the lower end of the crystal cooling transistor 7, when in use, the cooling medium enters the water inlet cavity 11 through the water inlet 6, then flows into the water inlet cavity of each cooling cavity 12 through the water inlet cavity 11, flows into the water collecting cavity 16 after flowing through the water inlet cavity of the cooling cavity 12, flows into the water outlet cavity of each cooling cavity 12 through the water collecting cavity 16, then flows into the water return cavity 20 through the water outlet cavity, and the cooling medium in the water return cavity 20 flows into the water outlet 2 through the connecting pipe 19.

Further, as shown in fig. 7 and 8, the fourth structure of the cooling medium channel is that the periphery of each crystal cooling tube 7 is respectively sleeved with a sleeve 13, the upper end of each sleeve 13 is respectively provided with a semicircular step 22 recessed downwards, the upper end of each sleeve 13 is respectively communicated with a water inlet cavity 11 arranged at the upper part of the upper flange 3, the upper end of each semicircular step 22 is respectively communicated with a water return cavity 20 arranged at the lower part of the upper flange 3, the lower end of each sleeve 13 is respectively connected with the lower flange 5, a cooling cavity 12, a water inlet cavity 11 and a water return cavity 20 between the inner edge surface of each sleeve 13 and the outer edge surface of the crystal cooling tube 7 form a cooling medium channel, the water inlet cavity 11 is communicated with a water inlet 6, the water return cavity 20 is connected with a water outlet 2 through a connecting pipe 19, and the water outlet 2 and the water inlet 6 respectively form an inlet and an outlet of the cooling medium channel. In implementation, the third structure of the upper flange 3 is that an upper groove and a lower groove are respectively arranged on the upper surface and the lower surface of the upper flange 3, a water inlet cavity cover plate 18 and a water return cavity cover plate 21 are respectively arranged at the opening ends of the upper groove and the lower groove, a cavity formed by the water inlet cavity cover plate 18 and the upper groove is a water inlet cavity 11, a cavity formed by the water return cavity cover plate 21 and the lower groove is a water return cavity 20, a plurality of crystal cooling tube perforations penetrating through the bottom of the lower groove, a water outlet 2 and a water inlet 6 are respectively arranged on the water inlet cavity cover plate 18, a plurality of sleeve perforation and a water return tube perforation are arranged on the water return cavity cover plate 21, a semicircular water inlet penetrating through the bottom of the lower groove is arranged at the bottom of the upper groove, and the water return cavity 20 is communicated with the water outlet 2 through a connecting pipe 19. The lower flange 5 is in a solid structure, and a plurality of crystal lower through holes 9 penetrating to the lower surface of the lower flange 5 are arranged on the upper surface of the lower flange 5. In order to improve the cooling effect, a partition 29 may be disposed in the cooling cavity 12 between the transistor 7 and the sleeve 13, as shown in fig. 12, the cooling cavity 12 is divided into a water inlet cavity and a water outlet cavity by the partition 29, the lower ends of the water inlet cavity and the water outlet cavity are communicated to form a circulating channel, when in use, a cooling medium enters the water inlet cavity 11 through the water inlet 6, then flows into the water inlet cavity in each cooling cavity 12 through the water inlet cavity 11, flows through the water inlet cavity of the cooling cavity 12, then enters the water outlet cavity in the cooling cavity 12, then enters the water return cavity 20 through the water outlet cavity, and the cooling medium in the water return cavity 20 enters the water outlet 2 through the connecting pipe 19.

In the implementation of the present utility model, the water inlet 6 provided on the upper flange 3 may be provided in one or more, and when the water inlet is provided in one, the upper flange 3 may be provided in a structure as shown in fig. 5 when the cooling medium needs to be provided to the cooling disc 25 and the cooling medium channel, respectively, so that the cooling medium may be split into the cooling disc 25 and the cooling medium channel through the water inlet chamber 11.

When the utility model is applied, the lower flange 5 or the cooling disc 25 is arranged above the crucible in the furnace body, the lower surface of the lower flange 5 or the cooling disc 25 is close to the molten liquid in the crucible but cannot be contacted, when the utility model works, firstly, raw materials are put into the crucible, a heater is started to heat the crucible on the lower shaft, after the raw materials of the crucible are melted into the molten liquid, the upper lifting mechanism drives the seed crystal to descend, when the seed crystal passes through the crystal lower through hole 9 or the crystal lower through hole 9 and the crystal lifting hole 27 and is contacted with the molten liquid after 3001, the seed crystal descends, after the lower end of the seed crystal is melted, the seed crystal is slowly lifted, and as the cooling medium is introduced into the lower flange 5 or the cooling disc 25, the molten liquid rises along with the seed crystal, when the molten liquid is close to the lower surface of the lower flange 5 or the cooling disc 25, and as the temperature of the molten liquid is lower than the temperature of the crucible, the molten liquid is gradually crystallized, and when the crystallized molten liquid enters the crystal lower through hole 9 or the crystal lower through hole 27, the temperature of the crystal lower through hole 9 is gradually reduced, the required cylindrical crystal is formed, when the seed crystal is used, the seed crystal is penetrated through the crystal lower through hole 9 or the crystal lower through hole 27, the cooling medium in the lower flange 5 or the crystal lifting hole 27 is arranged, the crystal lifting hole 9 or the cylindrical crystal lifting hole is further, the diameter is adjusted, the diameter of the cylindrical crystal is adjusted, and the diameter of the cylindrical crystal is further, the cylindrical crystal is kept warm, and the diameter is kept constant, and the diameter is adjusted, and the diameter of the crystal is 30 is kept by the crystal is kept warm, and the heat is cooled, and the temperature is kept by the heat, and the heat is cooled, and is cooled by the heat is cooled.

In practice, the stepped steps 3003 provided on the thermal insulation board 30 may be provided in a circular shape or a quincuncial shape formed by providing an inwardly concave circular arc between each two through holes 3001 or providing an outwardly protruding circular arc or various abnormal shapes between each two through holes 3001.

In the implementation of the utility model, all the related cooling medium inlets and outlets can be arranged into a plurality of groups.

The broken silicon materials related in the utility model not only comprise the surplus materials which appear in the preparation process of the silicon core and the silicon core which is broken carelessly, and crushed materials which are produced by multi/monocrystalline silicon production enterprises in the process stages of reduction, cutting, grinding and polishing, and the like, but also comprise the silicon materials with other shapes (such as flowering materials, silicon rods with smaller length, and the like), or directly purchase new silicon materials to directly draw the silicon core.

When the utility model is practically applied, the utility model can be used for drawing silicon core and drawing other crystal materials.

The above is not described in detail in the prior art.

The embodiments selected herein for the purposes of disclosing the present utility model are presently considered to be suitable, however, it is to be understood that the present utility model is intended to include all such variations and modifications as fall within the spirit and scope of the present utility model.

Claims (19)

1. The crystal cooling device for crystal drawing comprises an upper flange (3), a lower flange (5), a crystal cooling tube (7), a cooling medium channel and an insulation board (30), and is characterized in that: a plurality of crystal cooling transistors (7) are arranged between the upper flange (3) and the lower flange (5), cooling medium channels are arranged on the periphery of the crystal cooling transistors (7), an inlet of each cooling medium channel is connected with a cooling source through a pipeline, an outlet of each cooling medium channel is connected with a cooling medium recovery mechanism through a pipeline, and an insulation board (30) is arranged below the lower flange (5); or a cooling plate (25) is arranged below the lower flange (5), and an insulation board (30) is arranged below the cooling plate (25) to form the crystal cooling device used for crystal drawing.

2. The crystal cooling apparatus for crystal pulling according to claim 1, wherein: the middle part of cooling disk (25) is equipped with cavity (24) be equipped with a plurality of fixed columns (26) in cavity (24), be equipped with crystal on every fixed column (26) respectively and carry draw hole (27), cavity (24) communicate outlet pipe (23) and inlet tube (28) respectively, outlet pipe (23) and inlet tube (28) communicate the cooling medium passageway.

3. The crystal cooling apparatus for crystal pulling according to claim 1, wherein: the lower flange (5) or the cooling disc (25) is provided with at least one stage of upward concave steps from outside to inside to form a step surface, and each stage of step surface is provided with a circle of crystal lower through holes (9) or crystal lifting holes (27) respectively.

4. The crystal cooling apparatus for crystal pulling according to claim 1, wherein: the heat preservation board (30) is of a flat plate structure, a plurality of through holes (3001) are formed in the heat preservation board (30), each through hole (3001) corresponds to a crystal lower through hole (9) in the lower flange (5) or a crystal lifting hole (27) in the cooling disc (25) respectively, and the outline dimension of the heat preservation board (30) is larger than or equal to that of the lower flange (5) or the cooling disc (25).

5. The crystal cooling apparatus for crystal pulling according to claim 1, wherein: when the heat-insulating plate (30) is of a flat plate structure, at least one stage of step (3003) protruding upwards is arranged on the heat-insulating plate (30) from outside to inside, and the step (3003) is correspondingly matched with the step surface below the lower flange (5) or the cooling plate (25).

6. The crystal cooling apparatus for crystal pulling according to claim 1, wherein: the replacement structural form of heated board (30) is that the middle part of heated board (30) sets up the recess that undercut forms barrel structure, is equipped with a plurality of perforation (3001) on heated board (30), and each perforation (3001) corresponds crystal under perforation (9) on lower flange (5) or crystal on cooling plate (25) respectively and carries draw hole (27), the inner edge face of recess and the outer edge face of lower flange (5) or cooling plate (25) are clearance fit or interference fit.

7. The crystal cooling apparatus for crystal pulling according to claim 6, wherein: when the outer edge surface of the lower flange (5) or the cooling disc (25) is in clearance fit with the inner edge surface of the groove, a heat-insulating filler (32) is arranged at the clearance.

8. The crystal cooling apparatus for crystal pulling according to claim 6, wherein: when the heat-insulating plate (30) is in a barrel-shaped structure, at least one stage of step (3003) protruding upwards is arranged on the heat-insulating plate (30) from outside to inside, and the step (3003) is correspondingly matched with the step surface below the lower flange (5) or the cooling disc (25).

9. The crystal cooling apparatus for crystal pulling according to claim 1, wherein: the first structure that the cooling medium passageway set up is set up connecting tube (4) between last flange (3) and lower flange (5) be equipped with a plurality of crystal cooling tube (7) in connecting tube (4), the upper end of every crystal cooling tube (7) is connected respectively and is set up perforation (1) on the crystal on last flange (3), perforation (9) under the crystal that sets up on lower flange (5) are connected respectively to the lower extreme of every crystal cooling tube (7), form the cooling medium passageway by the cavity between the interior marginal face of connecting tube (4) and terminal surface under last flange (3), lower flange (5) up end, be equipped with delivery port (2) and water inlet (6) on last flange (3) respectively, delivery port (2) and water inlet (6) form cooling medium passageway's import and export respectively.

10. The crystal cooling apparatus for crystal pulling according to claim 1, wherein: the second structure that the cooling medium passageway set up is cup jointed sleeve pipe (13) respectively in the periphery of every crystal cooling tube (7), and the upper end of every sleeve pipe (13) communicates water inlet chamber (11) at last flange (3) middle part respectively, and the lower end of every sleeve pipe (13) communicates water collecting chamber (16) at lower flange (5) middle part respectively, forms the cooling medium passageway by cooling chamber (12), water inlet chamber (11) and water collecting chamber (16) between the interior marginal face of sleeve pipe (13) and crystal cooling tube (7), water inlet chamber (11) intercommunication water inlet (6), water outlet (2) are connected through wet return (14) in water collecting chamber (16), water outlet (2) and water inlet (6) form the import and the export of cooling medium passageway respectively.

11. The crystal cooling apparatus for crystal pulling according to claim 1, wherein: the third structure that cooling medium passageway set up is cup jointed sleeve pipe (13) respectively in the periphery of every crystal cooling tube (7), be equipped with semicircle step (22) of undercut respectively at the upper end of every sleeve pipe (13), the upper end of every sleeve pipe (13) communicates water inlet (11) of setting on flange (3) upper portion respectively, the upper end of every semicircle step (22) communicates water return chamber (20) of setting on flange (3) lower part respectively, the lower end of every sleeve pipe (13) communicates water collecting chamber (16) of setting on flange (5) upper portion respectively, cooling chamber (12), water inlet (11), return water chamber (20) and water collecting chamber (16) between the outer fringe face of crystal cooling tube (7) by the interior edge face of sleeve pipe (13), water inlet (11), return chamber (20), water inlet (11) intercommunication water inlet (6), return chamber (20) are connected delivery port (2) through connecting pipe (19), delivery port (2) and water inlet (6) form cooling medium passageway's import and export respectively.

12. The crystal cooling apparatus for crystal pulling according to claim 1, wherein: the fourth structure that the cooling medium passageway set up is cup jointed sleeve pipe (13) respectively in the periphery of every crystal cooling tube (7), be equipped with semicircle step (22) of undercut respectively at the upper end of every sleeve pipe (13), the upper end of every sleeve pipe (13) communicates water inlet (11) of setting on flange (3) upper portion respectively, the upper end of every semicircle step (22) communicates water return cavity (20) of setting on flange (3) lower part respectively, lower flange (5) are connected respectively to the lower end of every sleeve pipe (13), form the cooling medium passageway by cooling chamber (12) between the inner edge face of sleeve pipe (13) and the outer fringe face of crystal cooling tube (7), water inlet (11) and return water chamber (20), water inlet (11) intercommunication water inlet (6), water outlet (2) are connected through connecting pipe (19) to delivery port (20), delivery port (2) and water inlet (6) form cooling medium passageway's import and export respectively.

13. A crystal cooling apparatus for crystal pulling according to any one of claims 11 or 12, wherein: a partition plate (29) is arranged in the cooling cavity (12) between the transistor cooling transistor (7) and the sleeve (13).

14. The crystal cooling apparatus for crystal pulling according to claim 1, wherein: the first structure of the upper flange (3) is that the upper flange (3) is of a solid structure, and a plurality of crystal upper through holes (1), water outlets (2) and water inlets (6) penetrating through the lower surface of the upper flange (3) are respectively arranged on the upper surface of the upper flange (3); or the middle part above the upper flange is provided with a gas perforation (31), and a plurality of crystal upper perforation, water outlet and water inlet which penetrate through the lower part of the upper flange are arranged above the upper flange at the periphery of the gas perforation (31).

15. The crystal cooling apparatus for crystal pulling according to claim 1, wherein: the second structure of the upper flange (3) is that an upward concave groove is arranged below the upper flange (3), a lower cover plate (17) is arranged at the opening end of the groove, a cavity formed by the lower cover plate (17) and the groove is a water inlet cavity (11), a plurality of through holes of the transistor cooling tube, a water outlet (2) and a water inlet (6) which penetrate through the upper surface of the upper flange (3) are respectively arranged at the bottom of the groove, and a plurality of through holes of the sleeve and through holes of the water return tube are arranged on the lower cover plate (17).

16. The crystal cooling apparatus for crystal pulling according to claim 1, wherein: the third structure of upper flange (3) is equipped with upper groove and lower groove respectively for upper and lower both sides of upper flange (3), be equipped with inlet chamber apron (18) and return water chamber apron (21) respectively at the open end of upper groove and lower groove, the cavity that inlet chamber apron (18) and upper groove formed is inlet chamber (11), return water chamber apron (21) and lower groove formed's cavity is return water chamber (20), be equipped with a plurality of transistor perforation, delivery port (2) and water inlet (6) that link up to the lower groove tank bottom respectively on inlet chamber apron (18), be equipped with a plurality of sleeve pipe perforation and return water pipe perforation on return water chamber apron (21), be equipped with the semicircular water inlet hole that link up to the lower groove tank bottom in the tank bottom of upper groove, return water chamber (20) are delivery port (2) through connecting pipe (19).

17. The crystal cooling apparatus for crystal pulling according to claim 1, wherein: the first structure of the lower flange (5) is that the lower flange (5) is of a solid structure, and a plurality of crystal lower through holes (9) penetrating to the lower surface of the lower flange (5) are arranged on the upper surface of the lower flange (5).

18. The crystal cooling apparatus for crystal pulling according to claim 1, wherein: the second structure of the lower flange (5) is that a concave groove is arranged on the lower flange (5), an upper cover plate (15) is arranged at the opening end of the groove, a plurality of through transistor cooling tube perforations which penetrate to the lower surface of the lower flange (5) are arranged at the bottom of the groove, and a plurality of sleeve tube perforations are arranged on the upper cover plate (15).

19. The crystal cooling apparatus for crystal pulling according to claim 1, wherein: the arrangement mode of the plurality of transistor cooling transistors (7) is that one transistor cooling transistor (7) is arranged in the middle, a plurality of groups of transistor cooling transistors (7) are radially arranged on the periphery of the middle transistor cooling transistor (7), and each group of transistor cooling transistors (7) comprises at least two transistor cooling transistors (7); or a second arrangement of a plurality of transistor cooling transistors is provided in such a way that a plurality of groups of transistor cooling transistors are arranged radially on the periphery of the gas through hole (31) in the upper flange (3), each group of transistor cooling transistors comprising at least two transistor cooling transistors.

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