CN215647576U - Heat radiation structure and integrated circuit board card - Google Patents
Heat radiation structure and integrated circuit board card Download PDFInfo
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- CN215647576U CN215647576U CN202122340334.1U CN202122340334U CN215647576U CN 215647576 U CN215647576 U CN 215647576U CN 202122340334 U CN202122340334 U CN 202122340334U CN 215647576 U CN215647576 U CN 215647576U
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- 230000005855 radiation Effects 0.000 title claims description 11
- 230000017525 heat dissipation Effects 0.000 claims abstract description 148
- 238000009434 installation Methods 0.000 claims abstract description 11
- 230000000694 effects Effects 0.000 description 10
- 239000002826 coolant Substances 0.000 description 7
- 238000005192 partition Methods 0.000 description 7
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000008094 contradictory effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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Abstract
The utility model provides a heat dissipation structure and an integrated circuit board card, relates to the technical field of chip heat dissipation equipment, and aims to solve the problem that the existing heat dissipation structure cannot adapt to the heat source distribution characteristics of the integrated circuit board card to a certain extent. The heat dissipation structure provided by the utility model is used for an integrated circuit board card, a mounting area is formed on the heat dissipation structure, a connecting part is formed in the mounting area, and the integrated circuit board card is connected with the connecting part; a heat dissipation convex part is formed in the mounting area, and when the integrated circuit board card is connected with the heat dissipation structure, the heat dissipation convex part is contacted with a chip on the integrated circuit board card; a heat dissipation cavity is formed in the heat dissipation structure, an inlet portion and an outlet portion which are communicated with the heat dissipation cavity are formed in the heat dissipation structure, and the heat dissipation cavity can dissipate heat of the installation area.
Description
Technical Field
The utility model relates to the technical field of chip heat dissipation equipment, in particular to a heat dissipation structure and an integrated circuit board card.
Background
Compared with a common heat source, the integrated circuit board card has poor self heat conduction capability and uneven heat source distribution, most areas are PCB boards which do not generate heat, the heat consumption of a chip embedded on the integrated circuit board card is high, the area is small, the internal flow channels of the traditional cold plate are uniformly distributed, the heat source characteristics of the integrated circuit board card cannot be adapted to the chip, most surface areas of the cold plate are wasted, and the heat exchange capability of the part in contact with the chip is insufficient.
Therefore, it is desirable to provide a heat dissipation structure and an integrated circuit board card to solve the problems in the prior art to a certain extent.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a heat dissipation structure and an integrated circuit board card, and aims to solve the problem that the existing heat dissipation structure cannot adapt to the heat source distribution characteristics of the integrated circuit board card to a certain extent.
The utility model provides a heat dissipation structure for an integrated circuit board card, wherein a mounting area is formed on the heat dissipation structure, a connecting part is formed in the mounting area, and the integrated circuit board card is connected with the connecting part; a heat dissipation convex part is formed in the mounting area, and when the integrated circuit board card is connected with the heat dissipation structure, the heat dissipation convex part is contacted with a chip on the integrated circuit board card; the heat dissipation structure is internally provided with a heat dissipation cavity, the heat dissipation structure is provided with an inlet part and an outlet part which are communicated with the heat dissipation cavity, and the heat dissipation cavity can dissipate heat of the installation area.
The heat dissipation convex parts are multiple and are arranged in one-to-one correspondence with the chips on the integrated circuit board card.
Specifically, the heat dissipation cavity comprises an inflow cavity and an outflow cavity, the inlet part is communicated with the inflow cavity, the outflow cavity is connected with the outlet part, and a jet hole communicated with the inflow cavity and the outflow cavity is formed between the inflow cavity and the outflow cavity.
Further, the jet holes are multiple, and the positions of the multiple jet holes correspond to the positions of the multiple heat dissipation protrusions.
More closely, the thickness of the outflow cavity is H, the diameter of the jet hole is D, and the range of H/D is kept between 3 and 10; the depth of the jet hole is L, and the range of L/D is kept between 2 and 5; the maximum current-carrying capacity of the heat dissipation structure is Q, the number of the jet holes is n, and Q/(D) is2N) is kept in the range of 1.5-5.
The mounting area is a mounting groove formed by extending the horizontal end face of one side of the heat dissipation structure to the horizontal end face of the other side along the thickness direction of the heat dissipation structure, and the depth of the mounting groove corresponds to the thickness of the integrated circuit board card.
Specifically, the connecting portion includes a first connecting protrusion and a second connecting protrusion, and the first connecting protrusion and the second connecting protrusion extend in a first direction and are respectively located at two sides of the mounting groove.
Furthermore, the first connecting convex part and the second connecting convex part are both provided with positioning holes and/or positioning grooves.
More closely, a first mounting convex part and a second mounting convex part are respectively formed on two sides of the heat dissipation structure along the first direction.
Compared with the prior art, the heat dissipation structure provided by the utility model has the following advantages:
the heat dissipation structure provided by the utility model is used for an integrated circuit board card, a mounting area is formed on the heat dissipation structure, a connecting part is formed in the mounting area, and the integrated circuit board card is connected with the connecting part; a heat dissipation convex part is formed in the mounting area, and when the integrated circuit board card is connected with the heat dissipation structure, the heat dissipation convex part is contacted with a chip on the integrated circuit board card; a heat dissipation cavity is formed in the heat dissipation structure, an inlet portion and an outlet portion which are communicated with the heat dissipation cavity are formed in the heat dissipation structure, and the heat dissipation cavity can dissipate heat of the installation area.
From this analysis, it can be known that the integrated circuit board card can be connected to the heat dissipation structure by the mounting region formed on the heat dissipation structure and the connecting portion formed in the mounting region.
And because the chip on the integrated circuit board card generates higher heat during working, but the integrated circuit board card has poorer heat conductivity, the temperature of most areas of the integrated circuit board card except the chip is lower. Therefore, this application passes through the heat dissipation convex part that forms in the installing zone, and when integrated circuit board is connected with heat radiation structure, the heat dissipation convex part can contact with the chip on the integrated circuit board, and the radiating effect to the chip can be strengthened to a certain extent to the heat dissipation cavity that is formed with in the rethread heat radiation structure.
Moreover, the heat dissipation cavity in the application can still dissipate heat of the mounting area, so that the heat dissipation structure provided by the heat dissipation structure can not only strengthen the heat dissipation capacity of the chip, but also ensure the heat dissipation effect of other positions of the integrated circuit board card.
In addition, the utility model also provides an integrated circuit board card, which applies the heat dissipation structure; the integrated circuit board is embedded with a plurality of chips and connected with the heat dissipation structure through the connecting part.
Through adopting the integrated circuit board of heat radiation structure that this application provided, can promote the radiating effect to the chip to a certain extent to can dispel the heat to the integrated circuit board better, and then promote the wholeness ability of integrated circuit board.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic overall structure diagram of a heat dissipation structure according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a first view angle of a heat dissipation structure according to an embodiment of the present invention.
In the figure: 1-a heat dissipation structure; 101-a mounting area; 1011-heat dissipation convex part; 1012-first connection projection; 1013-a second connecting boss; 102-an inflow lumen; 103-jet hole; 104-an outflow lumen; 105-a first mounting boss; 106-a second mounting boss; 2-an inlet section; 3-an outlet part;
s1 — first direction.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present application without making any creative effort, shall fall within the protection scope of the present application.
In the description of the embodiments of the present application, it should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the present invention are usually placed in when used, and are only used for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the devices or elements indicated must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or pendant, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the embodiments of the present application, it should also be noted that, unless otherwise explicitly stated or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As used herein, the term "and/or" includes any one of the associated listed items and any combination of any two or more of the items.
For ease of description, spatial relationship terms such as "above … …," "upper," "below … …," and "lower" may be used herein to describe one element's relationship to another element as illustrated in the figures. Such spatial relationship terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures.
The terminology used herein is for the purpose of describing various examples only and is not intended to be limiting of the disclosure. The singular forms also are intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises," "comprising," and "having" specify the presence of stated features, quantities, operations, elements, components, and/or combinations thereof, but do not preclude the presence or addition of one or more other features, quantities, operations, components, elements, and/or combinations thereof.
Variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, may be expected. Thus, the examples described herein are not limited to the particular shapes shown in the drawings, but include changes in shape that occur during manufacturing.
The features of the examples described herein may be combined in various ways that will be apparent after understanding the disclosure of the present application. Further, while the examples described herein have a variety of configurations, other configurations are possible, as will be apparent after understanding the disclosure of the present application. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present application.
As shown in fig. 1, the present invention provides a heat dissipation structure 1, which is used for an integrated circuit board, wherein a mounting area 101 is formed on the heat dissipation structure 1, a connection portion is formed in the mounting area 101, and the integrated circuit board is connected to the connection portion; a heat dissipation convex part 1011 is formed in the mounting area 101, and when the integrated circuit board card is connected with the heat dissipation structure 1, the heat dissipation convex part 1011 is in contact with a chip on the integrated circuit board card; a heat dissipation cavity is formed in the heat dissipation structure 1, and an inlet portion 2 and an outlet portion 3 communicated with the heat dissipation cavity are arranged on the heat dissipation structure 1, and the heat dissipation cavity can dissipate heat of the installation area 101.
Compared with the prior art, the heat dissipation structure 1 provided by the utility model has the following advantages:
according to the heat dissipation structure 1 provided by the utility model, the integrated circuit board card can be connected with the heat dissipation structure 1 through the installation area 101 formed on the heat dissipation structure 1, and the connecting part is formed in the installation area 101.
And because the chip on the integrated circuit board card generates higher heat during working, but the integrated circuit board card has poorer heat conductivity, the temperature of most areas of the integrated circuit board card except the chip is lower. Therefore, this application passes through the heat dissipation convex part 1011 that forms in the installing zone 101, and when integrated circuit board and heat radiation structure 1 were connected, heat dissipation convex part 1011 can contact with the chip on the integrated circuit board, and the radiating effect to the chip can be strengthened to a certain extent to the heat dissipation cavity that is formed with in rethread heat radiation structure 1.
Moreover, since the heat dissipation cavity in the present application can still dissipate heat from the mounting area 101, the heat dissipation structure 1 provided by itself can not only enhance the heat dissipation capability of the chip, but also ensure the heat dissipation effect of other positions of the integrated circuit board card.
It should be noted that, in the present application, the heat dissipation structure 1 is used for an integrated circuit board, and the integrated circuit board can be applied to a computer, which can be a large-scale super computer or a home computer or other types of computers with integrated circuit board and chip structures.
Preferably, as shown in fig. 1, the number of the heat dissipation convex portions 1011 in the present application is multiple, and the multiple heat dissipation convex portions 1011 are disposed in one-to-one correspondence with the chips on the integrated circuit board.
As shown in fig. 1, in the heat dissipation structure 1, the number of the heat dissipation protrusions 1011 is six, the six heat dissipation protrusions 1011 are uniformly distributed in the mounting region 101, and the shapes and the sizes of the six heat dissipation protrusions 1011 are the same. However, the above-mentioned method is only a method for matching one of the integrated circuit boards and the arrangement of the chips on the integrated circuit board. Because the sizes of the chips on different integrated circuit boards and the positions of the chips on the integrated circuit boards are different, the specific number of the heat dissipation convex parts 1011 and the distribution mode on the mounting area 101 are not specifically limited in the application, and the heat dissipation convex parts can be correspondingly formed according to requirements.
It should be added that, as shown in fig. 1, the mounting area 101 in the present application is a mounting groove formed by extending a horizontal end surface of one side of the heat dissipation structure 1 to a horizontal end surface of the other side along a thickness direction of the heat dissipation structure 1, and a depth of the mounting groove corresponds to a thickness of the integrated circuit board card.
As shown in fig. 1, the cross section of the mounting groove in the present application is rectangular, so that the integrated circuit board can be better matched, and the mounting of the integrated circuit board is more stable. Moreover, the installation groove is formed by the horizontal end face of one side of the heat dissipation structure 1 to the horizontal end face of the other side, so that the installation of the integrated circuit board card and the heat dissipation structure 1 is smoother.
Specifically, as shown in fig. 1 in conjunction with fig. 2, the coupling part in the present application includes a first coupling protrusion 1012 and a second coupling protrusion 1013, and the first coupling protrusion 1012 and the second coupling protrusion 1013 extend in the first direction S1 and are respectively located at both sides of the mounting groove.
Preferably, as shown in fig. 1 and fig. 2, the connection portion in the present application includes a first connection protrusion 1012 and a second connection protrusion 1013, and the first connection protrusion 1012 and the second connection protrusion 1013 extend along the first direction S1 and are oppositely disposed on two opposite side walls of the mounting groove, so that the integrated circuit board can be more stably connected to the heat dissipation structure 1.
Preferably, in the present application, the first connecting protrusion 1012 and the second connecting protrusion 1013 are formed with positioning holes and/or positioning grooves, and the connection between the integrated circuit board and the heat dissipation structure 1 can be more stable through the formed positioning holes and/or positioning grooves. After the integrated circuit board is connected to the heat dissipation structure 1 through the first connecting protrusion 1012 and the second connecting protrusion 1013, the integrated circuit board card can be detachably connected to the heat dissipation structure 1 by inserting positioning members such as bolts into the positioning holes and/or the positioning grooves.
Specifically, as shown in fig. 2, the heat dissipation cavity in the present application includes an inflow chamber 102 and an outflow chamber 104, the inlet portion 2 communicates with the inflow chamber 102, the outflow chamber 104 communicates with the outlet portion 3, and a jet hole 103 communicating the inflow chamber 102 and the outflow chamber 104 is formed between the inflow chamber 102 and the outflow chamber 104.
Preferably, the outflow cavity 104 corresponds to the installation area 101, and since the jet hole 103 is formed between the inflow cavity 102 and the outflow cavity 104, the cooling medium flowing into the cavity 102 enters the outflow cavity 104 through the jet hole 103 to generate a strong jet, so that heat on the installation area 101 can be better taken away.
Further preferably, as shown in fig. 2, the number of the jet holes 103 in the present application is multiple, and the positions of the multiple jet holes 103 correspond to the positions of the multiple heat dissipation protrusions 1011, and by making the positions of the jet holes 103 correspond to the positions of the heat dissipation protrusions 1011, the cooling medium entering the outflow cavity 104 through the jet holes 103 can first contact the inner wall surface corresponding to the heat dissipation bosses, so that forced convection can be generated, and the heat dissipation effect on the positions of the heat dissipation protrusions 1011 can be improved.
It should be added that, in the present application, a partition is formed between the inflow cavity 102 and the outflow cavity 104 along the horizontal direction, and the partition is a structure that the inflow cavity 102 and the outflow cavity 104 are separated from each other in the heat dissipation cavity, the jet holes 103 are formed on the partition, and the number and the positions of the jet holes 103 correspond to the number and the positions of the heat dissipation convex portions 1011, so that heat dissipation can be performed on the chip corresponding to the heat dissipation convex portions 1011, and the heat dissipation effect on the integrated circuit board card is improved.
More closely, the thickness that flows out the chamber 104 in this application is H, and the diameter of jet hole 103 is D, and when the ratio of the thickness that flows out the chamber 104 and the diameter of jet hole 103 was less, easily make the flow resistance increase, and when the ratio was great, easily made the efflux effect weaken, consequently, the ratio scope of the thickness that flows out the chamber 104 in this application and the diameter of jet hole 103 keeps between 3-10.
The degree of depth of jet hole 103 is L in this application, because jet hole 103 communicates inflow chamber 102 and outflow chamber 104, and jet hole 103 is formed on the partition portion, consequently, the degree of depth of jet hole 103 is unanimous with the thickness of partition portion, if the diameter of jet hole 103 is unchangeable, the partition portion is thinner, and the degree of depth of jet hole 103 is less, and the ratio of the degree of depth and diameter is less to influence efflux intensity. The greater the depth of the jet hole 103, the thicker the partition means, the more space is wasted and the weight of the entire structure is increased. Therefore, it is preferable that the depth to diameter ratio of the jet hole 103 in the present application is maintained in a range of 2 to 5.
The maximum current carrying capacity of the heat dissipation structure 1 in this application is Q, and the maximum current carrying capacity is the amount of the cooling medium entering the heat dissipation structure 1, and the flow of the heat dissipation structure 1 is usually kept constant. Therefore, as the number n of the jet holes 103 is larger, Q/(D)2N) is smaller, thereby causing insufficient jet strength and affecting the heat dissipation effect. And when the number of the jet holes 103 is smaller, Q/(D) is given2N) is larger, thereby increasing flow resistance, also affecting heat dissipation. Therefore, it is preferable in the present application that the ratio of the flow to the number and diameter of the jet holes 103 be maintained in a range of 1.5 to 5.
It should be added that, in the present application, the heat dissipation structure 1 is mainly applied to a computer, and therefore, as shown in fig. 1 and fig. 2, the first mounting convex portion 105 and the second mounting convex portion 106 are respectively formed on both sides of the heat dissipation structure 1 along the first direction S1, and the heat dissipation structure 1 can be directly connected to the chassis of the computer by the first mounting convex portion 105 and the second mounting convex portion 106 on both sides.
In addition, the utility model also provides an integrated circuit board card, which applies the heat radiation structure 1; the integrated circuit board is embedded with a plurality of chips and is connected with the heat dissipation structure 1 through the connecting part.
Through adopting the integrated circuit board of heat radiation structure 1 that this application provided, can promote the radiating effect to the chip to a certain extent to can dispel the heat to the integrated circuit board better, and then promote the wholeness ability of integrated circuit board.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (10)
1. A heat radiation structure is used for an integrated circuit board card, and is characterized in that a mounting area is formed on the heat radiation structure, a connecting part is formed in the mounting area, and the integrated circuit board card is connected with the connecting part;
a heat dissipation convex part is formed in the mounting area, and when the integrated circuit board card is connected with the heat dissipation structure, the heat dissipation convex part is contacted with a chip on the integrated circuit board card;
the heat dissipation structure is internally provided with a heat dissipation cavity, the heat dissipation structure is provided with an inlet part and an outlet part which are communicated with the heat dissipation cavity, and the heat dissipation cavity can dissipate heat of the installation area.
2. The heat dissipation structure of claim 1, wherein the heat dissipation protrusions are multiple, and the multiple heat dissipation protrusions are arranged in one-to-one correspondence with chips on the integrated circuit board.
3. The heat dissipation structure according to claim 2, wherein the heat dissipation cavity includes an inflow chamber and an outflow chamber, the inlet portion communicates with the inflow chamber, the outflow chamber communicates with the outlet portion, and a jet hole communicating the inflow chamber and the outflow chamber is formed between the inflow chamber and the outflow chamber.
4. The heat dissipation structure according to claim 3, wherein the jet hole is plural, and a position of the plural jet holes corresponds to a position of the plural heat dissipation protrusions.
5. The heat dissipation structure of claim 4, wherein the outflow cavity has a thickness H, the jet hole has a diameter D, and the range of H/D is maintained between 3 and 10;
the depth of the jet hole is L, and the range of L/D is kept between 2 and 5;
the maximum current-carrying capacity of the heat dissipation structure is Q, the number of the jet holes is n, and Q/(D) is2N) is kept in the range of 1.5-5.
6. The heat dissipating structure of claim 1, wherein the mounting area is a mounting groove formed by extending a horizontal end surface of one side of the heat dissipating structure to a horizontal end surface of the other side along a thickness direction of the heat dissipating structure, and a depth of the mounting groove corresponds to a thickness of the integrated circuit board.
7. The heat dissipating structure of claim 6, wherein the connecting portion comprises a first connecting protrusion and a second connecting protrusion, the first connecting protrusion and the second connecting protrusion extending in a first direction and being located at both sides of the mounting groove, respectively.
8. The heat dissipating structure of claim 7, wherein the first connecting protrusion and the second connecting protrusion each have a positioning hole and/or a positioning groove formed thereon.
9. The heat dissipation structure of claim 8, wherein first and second mounting protrusions are formed on both sides of the heat dissipation structure in the first direction, respectively.
10. An integrated circuit board, characterized in that the heat dissipation structure of any of the preceding claims 1-9 is applied;
the integrated circuit board is embedded with a plurality of chips and connected with the heat dissipation structure through the connecting part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122340334.1U CN215647576U (en) | 2021-09-26 | 2021-09-26 | Heat radiation structure and integrated circuit board card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122340334.1U CN215647576U (en) | 2021-09-26 | 2021-09-26 | Heat radiation structure and integrated circuit board card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215647576U true CN215647576U (en) | 2022-01-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122340334.1U Active CN215647576U (en) | 2021-09-26 | 2021-09-26 | Heat radiation structure and integrated circuit board card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215647576U (en) |
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2021
- 2021-09-26 CN CN202122340334.1U patent/CN215647576U/en active Active
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Effective date of registration: 20240509 Address after: 050200, No.3 Industrial Park, Shangzhuang Town, Luquan District, Shijiazhuang City, Hebei Province Patentee after: Hebei Microenthalpy New Material Technology Co.,Ltd. Country or region after: China Address before: 100082 5-18, floor 5, building 10, courtyard 10, northwest Wangdong Road, Haidian District, Beijing Patentee before: BEIJING WEIHAN TECHNOLOGY CO.,LTD. Country or region before: China Patentee before: CHANGZHOU WEIHAN THERMAL CONTROL TECHNOLOGY Co.,Ltd. |