CN215600358U - GBU packaged lead frame structure and GBU packaging structure - Google Patents
GBU packaged lead frame structure and GBU packaging structure Download PDFInfo
- Publication number
- CN215600358U CN215600358U CN202121950110.6U CN202121950110U CN215600358U CN 215600358 U CN215600358 U CN 215600358U CN 202121950110 U CN202121950110 U CN 202121950110U CN 215600358 U CN215600358 U CN 215600358U
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- frame body
- gbu
- jumper
- base island
- frame
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
Abstract
The utility model relates to the technical field of semiconductor manufacturing, and particularly discloses a lead frame structure of a GBU (GBU package), which comprises: the frame comprises a first frame body, a second frame body, a third frame body and a fourth frame body, wherein the second frame body and the first frame body are arranged in parallel at intervals, at least the corner adjacent to the first frame body on the second frame body and the corner adjacent to the first frame body on the third frame body are at right angles, the fourth frame body and the third frame body are arranged in parallel at intervals, and at least the corner adjacent to the third frame body on the fourth frame body is at right angles. The utility model also discloses a GBU packaging structure. The GBU encapsulated lead frame structure provided by the utility model solves the problem that the size of a silicon wafer is limited due to the area of a base island in the prior art.
Description
Technical Field
The utility model relates to the technical field of semiconductor manufacturing, in particular to a GBU (ground lead Unit) packaging lead frame structure and a GBU packaging structure.
Background
The standard GBU (glass passivated Bridge rectifier Unit) packaging type lead frame is characterized in that the lead frame is four base islands, the middle of the lead frame is connected with a silicon wafer and an outer pin through clips (jumpers), the process flow is that tin paste is dotted on a PAD (base island), the silicon wafer is placed on the tin paste, the tin paste is dotted on the silicon wafer again, the jumpers are welded, and the lead frame is connected with the silicon wafer through four clips (jumpers).
As shown in fig. 1, the existing GBU packaging frame mainly has the following disadvantages: the area of a foot rest PAD is smaller; the maximum size of silicon wafers that can be mounted is limited (currently only the maximum size of silicon wafers that can be mounted is 140 mils, mils being the unit of length, 1mil =0.0254 mm); the existing jumper wire is not bent, and the difference of the heights of the connecting positions of the jumper wire can be met only by using the convex points on the foot rest, so that the thickness of the screen plate needs to be increased by more than one convex point, and the manufacturing difficulty of the screen plate is increased.
In view of the above disadvantages of the GBU encapsulation framework in the prior art, how to provide a new GBU encapsulation framework becomes a technical problem to be solved by those skilled in the art.
Disclosure of Invention
The utility model provides a GBU packaging lead frame structure and a GBU packaging structure, which solve the problem of defects of GBU packaging frames in the related technology.
As a first aspect of the present invention, there is provided a lead frame structure of a GBU package, including: the frame comprises a first frame body, a second frame body, a third frame body and a fourth frame body, wherein the first frame body, the second frame body, the third frame body and the fourth frame body are connected with pins, the first frame body and the fourth frame body are positioned at two sides, the second frame body and the third frame body are positioned in the middle, the corners of the second frame body adjacent to the first frame body and the corners of the third frame body adjacent to the first frame body are both right-angled, the corners of the fourth frame body adjacent to the third frame body are parallel to and spaced from each other, and the corners of the fourth frame body adjacent to the third frame body are right-angled, the second frame body, the third frame body and the fourth frame body are all provided with a base island, the base islands are used for mounting silicon wafers, the silicon wafers mounted on the base islands of the second frame body and the silicon wafers mounted on the base islands of the third frame body are connected with the first frame body through jumper wires, and the silicon wafers mounted on the base islands of the fourth frame body are respectively connected with the second frame body and the third frame body through jumper wires.
Furthermore, a first base island is arranged at a position, close to the first frame body, of the second frame body, a second base island is arranged at a position, close to the first frame body, of the third frame body, a third base island and a fourth base island are arranged on the fourth frame body at intervals, the first base island, the second base island, the third base island and the fourth base island are used for mounting silicon wafers, the silicon wafers mounted on the first base island are connected with the first frame body through first jumper wires, the silicon wafers mounted on the second base island are connected with the first frame body through second jumper wires, the silicon wafers mounted on the third base island are connected with the second frame body through third jumper wires, the silicon wafers mounted on the fourth base island are connected with the third frame body through fourth jumper wires, and the first jumper wires, the second jumper wires and the third jumper wires are connected, The third jumper wire and the fourth jumper wire are identical in shape and structure.
Furthermore, the first jumper wire, the second jumper wire, the third jumper wire and the fourth jumper wire all comprise inverted V-shaped jumper wires with two bent sides of the middle bulge.
Furthermore, the first frame body, the second frame body and the fourth frame body are all provided with positioning holes.
Further, a plurality of cutting grooves are formed in the connecting edges of the first frame body, the second frame body, the third frame body and the fourth frame body and the pins.
Further, the number of the cutting grooves is 8.
As another aspect of the present invention, a GBU package structure is provided, which includes a package housing and the lead frame structure of the GBU package described above located in the package housing.
According to the GBU packaged lead frame structure, each frame body and the adjacent frame body are arranged in parallel at intervals, and the corner positions of the adjacent frame bodies are right angles, so that compared with the arc shape in the prior art, the area of the base island arranged on the frame bodies is increased, the size of a silicon wafer welded on the base island is increased, and the problem that the size of the silicon wafer is limited due to the area of the base island in the prior art is solved. In addition, the overall dimension of the lead frame structure of the GBU package is not changed, and the area of the base island is increased by changing the shape of the frame body as in the previous overall dimension.
Drawings
The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the principles of the utility model and not to limit the utility model.
Fig. 1 is a schematic diagram of a lead frame structure in the prior art.
Fig. 2 is a schematic structural diagram of a lead frame structure of a GBU package according to the present invention.
Fig. 3 is a schematic diagram of a jumper structure provided in the present invention.
Fig. 4 is a schematic view of the grooving structure provided by the present invention.
Fig. 5 is an enlarged view of the cutting groove shown in fig. 4.
Fig. 6 is a schematic view of an overall structure of the GBU package structure provided in the present invention.
Detailed Description
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
In order to make those skilled in the art better understand the technical solution of the present invention, the technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged under appropriate circumstances in order to facilitate the description of the embodiments of the utility model herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
In this embodiment, a lead frame structure of a GBU package is provided, and fig. 2 is a schematic structural diagram of the lead frame structure of the GBU package according to an embodiment of the present invention, as shown in fig. 2 and fig. 3, including: a first frame body 110, a second frame body 120, a third frame body 130 and a fourth frame body 140, wherein the first frame body 110, the second frame body 120, the third frame body 130 and the fourth frame body 140 are all connected with a pin 500, the first frame body 110 and the fourth frame body 140 are located at two sides, the second frame body 120 and the third frame body 130 are located in the middle, the corners of the second frame body 120 adjacent to the first frame body 110 and the corners of the third frame body 130 adjacent to the first frame body 110 are both in a right angle, the corners of the fourth frame body 140 and the third frame body 130 are both in a parallel and spaced arrangement, the fourth frame body 140 is at least perpendicular to the corner adjacent to the third frame body 130, the second frame body 120, the third frame body 130 and the fourth frame body 140 are all provided with a base island 200, the base island 200 is used for mounting a silicon wafer, the silicon wafer mounted on the base island 200 of the second frame body 120 and the silicon wafer mounted on the base island 200 of the third frame body 130 are both connected with the first frame body 110 through a jumper 300, and the silicon wafer mounted on the base island 200 of the fourth frame body 140 is respectively connected with the second frame body and the third frame body 130 through a jumper 300.
According to the GBU packaged lead frame structure provided by the embodiment of the utility model, each frame body and the adjacent frame body are arranged in parallel at intervals, and the corner positions of the adjacent frame bodies are right angles, so that compared with the arc shape in the prior art, the area of the base island arranged on the frame bodies is increased, the size of a silicon wafer welded on the base island is increased, and the problem that the size of the silicon wafer is limited due to the area of the base island in the prior art is solved. In addition, the overall dimension of the lead frame structure of the GBU package is not changed, and the area of the base island is increased by changing the shape of the frame body as in the previous overall dimension.
It should be understood that the base island 200 is used for mounting a silicon wafer, and when mounting a silicon wafer, a layer of solder paste with a thickness of about 20 μm is printed on the base island, and the silicon wafer is pressed on the solder paste, and after baking at a high temperature, the silicon wafer is cured on the base island.
Specifically, as shown in fig. 2 and 3, a first base island 210 is disposed at a position of the second frame body 120 close to the first frame body 110, a second base island 220 is disposed at a position of the third frame body 130 close to the first frame body 110, a third base island 230 and a fourth base island 240 are disposed at intervals on the fourth frame body 140, the first base island 210, the second base island 220, the third base island 230 and the fourth base island 240 are all used for mounting silicon wafers, the silicon wafer mounted on the first base island 210 is connected with the first frame body 110 through a first jumper 310, the silicon wafer mounted on the second base island 220 is connected with the first frame body 110 through a second jumper 320, the silicon wafer mounted on the third base island 230 is connected with the second frame body 120 through a third jumper 330, and the silicon wafer mounted on the fourth base island 240 is connected with the third frame body 130 through a fourth jumper 340, the first jumper 310, the second jumper 320, the third jumper 330 and the fourth jumper 340 are all the same in shape and structure.
It should be noted that, since the fourth jumper wire 340 is connected to the silicon wafers mounted on the third frame body 130 and the fourth base island 240, the distance is long, and thus the length of the fourth jumper wire 340 is longer than the lengths of the other three jumper wires, but the structure and the shape of the fourth jumper wire are the same as those of the other three jumper wires.
Preferably, as shown in fig. 3, the first jumper wire 310, the second jumper wire 320, the third jumper wire 330 and the fourth jumper wire 340 each include a zigzag jumper wire having a central protrusion bent at both sides.
It should be understood that by arranging the jumper wire into the shape as shown in fig. 3, the arrangement of the convex points on the frame body can be omitted, and the thickness of the mesh plate does not need to be increased by the height of the convex points, so that the difficulty of manufacturing the mesh plate is reduced.
In order to facilitate the positioning of the subsequent processes in the plastic packaging work, as shown in fig. 2, the first frame body 110, the second frame body 120, and the fourth frame body 140 are all provided with positioning holes 160.
It should be noted that, in order to increase the bonding force between the frame body and the plastic-encapsulated epoxy resin and reduce delamination, so as to increase the water resistance and the air tightness of the finished product, as shown in fig. 4 and 5, a plurality of notches 400 are disposed at the connecting edges of the first frame body 110, the second frame body 120, the third frame body 130, and the fourth frame body 140 and the leads 500.
Preferably, the number of the cutting slots 400 is 8.
As another embodiment of the present invention, a GBU package structure is provided, wherein, as shown in fig. 6, the GBU package structure includes a package housing 10 and the aforementioned lead frame structure of the GBU package inside the package housing.
It should be noted that, in the GBU package structure provided in the embodiment of the present invention, by using the foregoing lead frame structure of the GBU package, the problem of the limited size of the silicon wafer caused by the limited area of the island in the prior art is overcome, and the adopted jumper wire has a bent structure, so that the bumps can be omitted, thereby reducing the difficulty in manufacturing the screen plate.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the utility model, and these modifications and improvements are also considered to be within the scope of the utility model.
Claims (7)
1. A lead frame structure for a GBU package, comprising: the frame comprises a first frame body, a second frame body, a third frame body and a fourth frame body, wherein the first frame body, the second frame body, the third frame body and the fourth frame body are connected with pins, the first frame body and the fourth frame body are positioned at two sides, the second frame body and the third frame body are positioned in the middle, the corners of the second frame body adjacent to the first frame body and the corners of the third frame body adjacent to the first frame body are both right-angled, the corners of the fourth frame body adjacent to the third frame body are parallel to and spaced from each other, and the corners of the fourth frame body adjacent to the third frame body are right-angled, the second frame body, the third frame body and the fourth frame body are all provided with a base island, the base islands are used for mounting silicon wafers, the silicon wafers mounted on the base islands of the second frame body and the silicon wafers mounted on the base islands of the third frame body are connected with the first frame body through jumper wires, and the silicon wafers mounted on the base islands of the fourth frame body are respectively connected with the second frame body and the third frame body through jumper wires.
2. The GBU packaged lead frame structure of claim 1, wherein the second frame body is disposed with a first base island near the first frame body, the third frame body is disposed with a second base island near the first frame body, the fourth frame body is disposed with a third base island and a fourth base island at intervals, the first base island, the second base island, the third base island and the fourth base island are used for mounting silicon wafers, the silicon wafer mounted on the first base island is connected with the first frame body through a first jumper, the silicon wafer mounted on the second base island is connected with the first frame body through a second jumper, the silicon wafer mounted on the third base island is connected with the second frame body through a third jumper, and the silicon wafer mounted on the fourth base island is connected with the third frame body through a fourth jumper, the first jumper wire, the second jumper wire, the third jumper wire and the fourth jumper wire are identical in shape and structure.
3. The lead frame structure of a GBU package according to claim 2, wherein the first jumper, the second jumper, the third jumper, and the fourth jumper each include a zigzag jumper having a central protrusion bent at both sides.
4. The lead frame structure of a GBU package according to claim 1, wherein said first frame body, said second frame body and said fourth frame body are each provided with a positioning hole.
5. The lead frame structure of a GBU package according to claim 1, wherein a plurality of slits are provided at connecting edges of the first, second, third and fourth frame bodies and the pins.
6. The lead frame structure of a GBU package of claim 5, wherein said number of said slits is 8.
7. A GBU package comprising a package housing and a lead frame structure of a GBU package according to any one of claims 1 to 6 located within said package housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121950110.6U CN215600358U (en) | 2021-08-19 | 2021-08-19 | GBU packaged lead frame structure and GBU packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121950110.6U CN215600358U (en) | 2021-08-19 | 2021-08-19 | GBU packaged lead frame structure and GBU packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215600358U true CN215600358U (en) | 2022-01-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121950110.6U Active CN215600358U (en) | 2021-08-19 | 2021-08-19 | GBU packaged lead frame structure and GBU packaging structure |
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| Country | Link |
|---|---|
| CN (1) | CN215600358U (en) |
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2021
- 2021-08-19 CN CN202121950110.6U patent/CN215600358U/en active Active
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