CN102800642A - Multi-chip encapsulation structure with lead frame type contact finger - Google Patents
Multi-chip encapsulation structure with lead frame type contact finger Download PDFInfo
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- CN102800642A CN102800642A CN2011101367531A CN201110136753A CN102800642A CN 102800642 A CN102800642 A CN 102800642A CN 2011101367531 A CN2011101367531 A CN 2011101367531A CN 201110136753 A CN201110136753 A CN 201110136753A CN 102800642 A CN102800642 A CN 102800642A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention discloses a multi-chip encapsulation structure with a lead frame type contact finger. The structure comprises a lead frame, a non-conductive adhesive tape, a first chip, a second chip, multiple bonding wires, a sealing colloid and a metal plating layer, wherein the lead frame is provided with a chip seat and multiple first contact fingers; one side of the chip seat extends to be connected with at least one second contact finger; the second contact fingers are located among the first contact fingers and arranged in rows; the non-conductive adhesive tape is attached to the first contact fingers and the second contact fingers to connect in series and fix the first contact fingers and the second contact fingers; the first chip is arranged on the chip seat; the second chip is arranged on the first chip; the multiple bonding wires are electrically connected with multiple bonding pads of the first chip to the first contact fingers and the second contact fingers; the sealing colloid seals the chip seat, the first chip, the second chip and the non-conductive adhesive tape and is combined with the first contact fingers and the second contact fingers; and the metal plating layer is formed on the lower surfaces of the first contact fingers and the second contact fingers and exposed outside the sealing colloid.
Description
Technical field
The present invention is relevant for the multicore sheet encapsulation technology of semiconductor device, particularly relevant for a kind of multichip package structure with wire-frame type contact finger.
Background technology
At present, the encapsulation of multicore sheet is a kind of new encapsulation trend, allows a plurality of chips to be installed in same packaging structure, to reach more complete function and bigger capacity, for example memory card (memory card) or flash memory module (eMMC).The employed chip carrier of multichip package structure is a kind of for example the have printed circuit board (PCB) of glass core layer or substrate of flexible circuit board at present, and the adhesive body that utilizes the mould envelope to form is formed at the upper surface of substrate, with the sealing chip.Higher except packaging cost, the lower surface of substrate is because of can't be by the adhesive body seal protection, wears and tears impairedly easily, and the relatively poor problem of strippable substrate, warpage of packaging assembly and moisture resistance arranged also.So there is the people to propose to replace the multicore sheet encapsulation technology of substrate with lead frame.
The flash memory of I335656 number (being United States Patent (USP) 7,795,715 B2 numbers) wire-frame type of TaiWan, China patent; Disclose a kind of memory card multichip package structure that uses lead frame; Lead frame has chip carrier, lead-in wire and the contact mat in order to carries chips, yet contact mat is directly or with indivedual connecting rods to be connected to the outer metal framework of adhesive body, in encapsulation procedure, lacks enough fixing; In case rock or displacement, just can cause overflow glue or the coarse problem in pin position.The destruction of static discharge and peeling off of contact mat also can take place in grafting side easily that in addition, extend to memory card when the position of the lead frame that connects the convention contact mat.
Summary of the invention
In view of this, the technical problem that the present invention will solve is to provide a kind of multichip package structure with wire-frame type contact finger, can omit substrate with the reduction packaging cost, and can avoid convention to use lead frame to cause the generation of the excessive glue and the pin Bit Shift of contact mat.
Of the present invention time purpose is to provide a kind of multichip package structure with wire-frame type contact finger, effectively solves the contact mat easy shaking that is made up of lead frame and the problem of displacement.
For solving the problems of the technologies described above; Technical scheme of the present invention is achieved in that a kind of multichip package structure with wire-frame type contact finger; Comprise a lead frame; Have a chip carrier and a plurality of first contact finger, more extend at least one second contact finger of connection by one of this chip carrier side, this second contact finger also is in a row to arrange between those first contact fingers; One non-conductive adhesive tape is attached on those first contact fingers and this second contact finger, with fixing those first contact fingers and this second contact finger of contacting; One first chip is arranged on this chip carrier; One second chip is arranged on this first chip; A plurality of bonding wires electrically connect a plurality of weld pads to those first contact fingers and this second contact finger of this first chip; One adhesive body seals this chip carrier, this first chip, this second chip and this non-conductive adhesive tape and combines those first contact fingers and this second contact finger; And a coat of metal, be formed at the lower surface of those first contact fingers and this second contact finger and be emerging in outside this adhesive body.
Further, the size of this first chip is greater than the size of this second chip.
Further, it is characterized in that this first chip is a memory chip, this second chip is a controller chip.
Further, this adhesive body has the shape of a memory card.
Further; This adhesive body has a grafting side; This lead frame has a plurality of first connecting rods and a plurality of second connecting rod; Wherein those first connecting rods connect a plurality of non-grafting side of this chip carrier to this adhesive body, and those second connecting rods connect those non-grafting sides of both sides first contact finger to this adhesive body in those first contact fingers.
Further, an active surface of this first chip is formed with a reconfiguration line layer, to electrically connect this second chip to those first contact fingers and this second contact finger.
Further, other comprises at least one passive component, is arranged on this first chip and with this reconfiguration line layer to electrically connect.
Further, this coat of metal is a barrel plating nickel-gold layer.
Further, the width of this non-conductive adhesive tape is less than the finger length of those first contact fingers and this second contact finger, so that those first contact fingers remain with the routing zone that a plurality of confession bonding wires are connected with the upper surface of this second contact finger.
Further, the thickness of those first contact fingers and this second contact finger is greater than the thickness of this chip carrier, so that this adhesive body covers the lower surface of this chip carrier.
The technique effect that the present invention reaches is following:
1, can by lead frame have two kinds of contact fingers special construction and with the attaching of non-conductive adhesive tape relation as one of them technological means of the present invention; Effectively integrate the fixed effect that contact is instigated it to be formed in lead frame and promoted contact finger before the mould envelope; Can omit substrate with the reduction packaging cost, and can avoid known use lead frame to cause the generation of the excessive glue and the pin Bit Shift of contact finger.
2, can by lead frame have two kinds of contact fingers special construction and with the attaching of non-conductive adhesive tape relation as one of them technological means of the present invention, effectively solve the contact finger easy shaking that constitutes by lead frame and the problem of displacement.
3, for the various fixed mechanism of the contact finger of lead frame as one of them technological means of the present invention, make the connecting rod of lead frame not extend to the grafting side of adhesive body and can reduce the usage quantity of connecting rod, reach preferable moisture resistance and electrostatic discharge (ESD) protection.
4, the width of non-conductive adhesive tape and contact finger difference in length are as one of them technological means of the present invention; Can make those first contact fingers and the upper surface of this second contact finger remain with the routing zone that a plurality of confession bonding wires are connected and this non-conductive adhesive tape can be sealed by adhesive body fully, and not influence product appearance.
5, the thickness difference of the contact finger of lead frame and chip carrier is as one of them technological means of the present invention; Make the sealing physical efficiency cover the lower surface of chip carrier; Only there are the lower surface of contact finger and the cutting section of connecting rod not to be covered in the structure of lead frame, are specially adapted to low-cost memory card by adhesive body.
Description of drawings
Fig. 1 is a kind of schematic cross-section with multichip package structure of wire-frame type contact finger according to the specific embodiment of the invention;
Fig. 2 is the schematic top plan view of the multichip package structure perspective adhesive body of Fig. 1;
Fig. 3 A to 3G is a kind of schematic top plan view with multichip package structure each assembly in fabrication steps of wire-frame type contact finger according to the specific embodiment of the invention;
Fig. 4 is formed in the schematic top plan view of a lead frame for a plurality of encapsulation units district in the step that lead frame is provided among Fig. 3 A figure.
The sketch map that Fig. 5 is taken out by a wafer for first chip before the step that first chip is set among Fig. 3 B.
Fig. 6 forms the sketch map that adhesive body in the step of adhesive body covers a plurality of encapsulation units district continuously among Fig. 3 F.
Fig. 7 is the schematic bottom view of adhesive body after the singulation step of cutting among Fig. 3 G.
Fig. 8 is that roll extrusion forms the sketch map of the coat of metal in the bottom surface of adhesive body after the singulation step of cutting.
Embodiment
Below will cooperate appended diagram to specify embodiments of the invention; It should be noted that so those diagrams are the sketch map of simplification, only basic framework of the present invention or implementation method are described with illustrative method; So only show assembly and the syntagmatic relevant with the present invention; The assembly that is shown among the figure is not that number, shape, the size implemented with reality are done equal proportion and drawn, and some dimension scale and other relative dimensions ratio or exaggerated or simplify processing are to provide clearer description.Actual number, shape and the dimension scale of implementing is a kind of putting property of choosing, and detailed assembly layout maybe be more complicated.
According to a particular embodiment of the invention; A kind of multichip package structure 100 with wire-frame type contact finger is illustrated in the schematic top plan view of perspective adhesive body of schematic cross-section and Fig. 2 of Fig. 1, and look sketch map and can consult Fig. 8 at the end of this multichip package structure 100.This multichip package structure 100 comprises the non-conductive adhesive tape of a lead frame 110, one 120, one first chip 130, one second chip 140, a plurality of bonding wire 151, an adhesive body 160 and a coat of metal 170.
This lead frame 110 is a metal framework; Its metal material can be iron-nickel alloy or copper alloy; As the skeleton and the chassis of supporting chip, and have the gap that can supply the adhesive body coating to fill, be different from the non-conductive core of substrate and can not be coated lower surface by adhesive body.Like Fig. 1 and shown in Figure 2, this lead frame 110 has a chip carrier 111 and a plurality of first contact fingers 112, and this this chip carrier 111 of expression is identical material and is formed in same lead frame with those first contact fingers 112.So in complete product, those first contact fingers 112 are for separating.And, more extending at least one second contact finger 113 of connection by a side of this chip carrier 111, this second contact finger 113 also is in a row to arrange between those first contact fingers 112.Wherein the width of this second contact finger 113 can be suitable with the width of each first contact finger 112, but length can be slightly different, and for example: the length of this second contact finger 113 can be slightly larger than the average length (as shown in Figure 7) of those first contact fingers 112.The effect of this second contact finger 113 can be the connection of ground connection or power supply, and the main application of those first contact fingers 112 is the signal transmission.In the present embodiment, those first contact fingers 112 and this second contact finger 113 are as the external terminal golden finger of memory card.
And as shown in Figure 2, this non-conductive adhesive tape 120 is attached on those first contact fingers 112 and this second contact finger 113, with fixing those first contact fingers 112 and these second contact fingers 113 of contacting.In the present embodiment, this non-conductive adhesive tape 120 is a strip, and its configuration direction is vertical with the bearing of trend of this second contact finger 113, with can be than being adhered to those first contact fingers 112 under the short distance.As shown in Figure 1, the following of this non-conductive adhesive tape 120 can be formed with an adhesion layer 121, to be adhered to this second contact finger 113 and those first contact fingers 112 simultaneously.Therefore; Before mould seals in the multicore chip packaging process; This second contact finger 113 obtains the pin position and fixes because of one is connected in this chip carrier 111, and 112 of those first contact fingers can keep good fixed interval (FI) with this second contact finger 113 by sticking together of this non-conductive adhesive tape 120.
This first chip 130 is arranged on this chip carrier 111, for example can utilize glutinous brilliant glue 135 to stick together the upper surface of the back side of this first chip 130 to this chip carrier 111.In the present embodiment, the kenel of this glutinous brilliant glue 135 is a plurality of strips, and the back side of this first chip 130 also can be coated by this adhesive body 160.And this second chip 140 is arranged on this first chip 130.Preferably, the size of this first chip 130 can be greater than the size of this second chip 140, with the mother chip as this second chip 140 of carrying.In the present embodiment, this first chip 130 can be a memory chip, and this second chip 140 can be a controller chip.More specifically, the active surface of this first chip 130 can be formed with a reconfiguration line layer 180, to electrically connect this second chip 140 to those first contact finger 112 and this second contact finger 113.This reconfiguration line layer 180 is the line layer made from integrated circuit manufacture process at crystal circle grade, so can not increase chip stack thickness.Wherein, the active surface of this first chip 130 is that integrated circuit forms the surface, and in the present embodiment, this active surface is up and away from this chip carrier 111.
Those bonding wires 151 electrically connect a plurality of weld pads of this first chip 130 to those first contact finger 112 and this second contact finger 113, and wherein those weld pads are for reshuffling weld pad 131.In concrete structure; This first chip 130 can have a plurality of primary weld pads 132 and a plurality of switching pads 133 in addition, and this reconfiguration line layer 180 comprise at least those primary weld pads 132 of a plurality of connections to those switching pads 133 first circuit 181 and a plurality of connection those reshuffle second circuit 182 (shown in 3B schemes with 5) of weld pad 131 to those switching pads 133.This reconfiguration line layer 180 is arranged circuit again with signal, ground connection and the power supply of all chips, is provided with in position in order to those are reshuffled weld pad 131.So this first chip 130 is electrically connected to those first contact fingers 112 and this second contact finger 113 with the routing mode.140 of this second chips are to utilize routing mode or chip bonding mode to be electrically connected to this reconfiguration line layer 180; In the present embodiment, electrically connect a plurality of weld pads 141 and those switching pads 133 that are connected this reconfiguration line layer 180 of this second chip 140 with other a plurality of bonding wires 152.In addition; Be connected with the routing of this second contact finger 113 in order to carry out those first contact fingers 112; Preferably; The width of this non-conductive adhesive tape 120 can be less than the finger length of those first contact fingers 112 with this second contact finger 113; So that those first contact fingers 112 and the upper surface of this second contact finger 113 remain with the routing zone that those bonding wires 151 of a plurality of confessions are connected, can consult among Fig. 2 those first contact fingers 112 and this second contact finger 113 towards this chip carrier 111 and not by these non-conductive adhesive tape 120 region covered.And 130 of this non-conductive adhesive tape 120 and this first chips are on the same surface that is provided with of this lead frame 110, for sealing simultaneously.
These adhesive body 160 these chip carriers 111 of sealing, this first chip 130, this second chip 140 and this non-conductive adhesive tape 120 also combine those first contact fingers 112 and this second contact finger 113.Outstanding good ground, those first contact fingers 112 can so that this adhesive body 160 covers the lower surface of this chip carrier 111, promptly be provided with another surface of the upper surface of this first chip 130 greater than the thickness of this chip carrier 111 with the thickness of this second contact finger 113 with respect to confession.This adhesive body 160 is to form by shifting mould envelope or compression molding encapsulation method, this adhesive body 160 can be mould seal epoxy or compound (Epoxy Molding Compound, EMC).
In the present embodiment, this adhesive body 160 can have the profile (like Fig. 1,2, shown in 7 and 8) of a memory card, for example miniature flash memory (micro SD card).More specifically in the structure, this adhesive body 160 has a grafting side 161, is the side of these adhesive body 160 contiguous those first contact fingers 112 with this second contact finger 113, and promptly towards the grafting direction of internal memory, all the other sides of this adhesive body 160 then are non-grafting side 162.Preferably; This lead frame 110 has a plurality of first connecting rods 114 and a plurality of second connecting rods 115; Wherein those first connecting rods 114 can connect those non-grafting sides 162 of this chip carrier 111 to this adhesive body 160, and those second connecting rods 115 can connect the both sides first contact finger 112A in those first contact fingers 112 to those non-grafting sides 162 of this adhesive body 160.Because having used this non-conductive adhesive tape 120 pastes fixing those first contact fingers 112 and contacts with this second contact finger 113; Just can make those first contact fingers 112 obtain the fixedly support of this chip carrier 111; So those second connecting rods 115 do not need to connect individually those first contact fingers 112 to this grafting side 161, with the destruction of avoiding static discharge and the usage quantity that reduces connecting rod.And; This coat of metal 170 is formed at the lower surface of those first contact fingers 112 and this second contact finger 113 and is emerging in outside this adhesive body 160, also promotes the external concatenation ability of conducting electricity in order to prevent those first contact fingers 112 and the oxidation of this second contact finger 113.In the present embodiment, this coat of metal 170 can be a barrel plating nickel-gold layer.
In addition, this multichip package structure 100 can comprise at least one passive component 190 in addition, is arranged on this first chip 130 and with this reconfiguration line layer 180 to electrically connect.This passive component 190 is also by these adhesive body 160 sealings.In the present embodiment, this first chip 130 has a plurality of passive component connection pads 134 in addition, can be through be connected to those second circuits 182 (like Fig. 3 B and shown in Figure 5) of part by these reconfiguration line layer 180 a plurality of tertiary circuits 183.The electrode that utilizes scolder 191 those passive components 190 of welding is to those passive component connection pads 134, to reach the setting of this passive component 190 on this first chip 130.
About above-mentioned manufacturing approach with multichip package structure 100 of wire-frame type contact finger, Fig. 3 A to Fig. 3 G illustrates the schematic top plan view of each assembly in fabrication steps, and the explanation as after.
At first shown in Fig. 3 A and Fig. 4 figure, this lead frame 110 is provided, this lead frame 110 comprises the encapsulation unit district 110A of a plurality of corresponding multichip package structures, all is positioned at a metal framework 116.In each encapsulation unit district 110A, has this chip carrier 111 and those first contact fingers 112.Side one by this chip carrier 111 is extended this second contact finger 113.And stick fixing those first contact fingers 112 and these second contact fingers 113 with this non-conductive adhesive tape 120.This chip carrier 111 is connected to first connecting rod of this metal framework 116 or contiguous encapsulation unit district 110A with those first connecting rods 114.The both sides first contact finger 112A is connected to second connecting rod of this metal framework 116 or contiguous encapsulation unit district 110A with those second connecting rods 115.Whereby, before the mould envelope step in encapsulation procedure, first contact finger 112 of those separation obtains good pin position and fixes.
Afterwards, carry out the first time chip step is set.Shown in Fig. 3 B, this first chip 130 is arranged on this chip carrier 111.Please consult Fig. 5 again, this first chip 130 is taken from a wafer 30, and is formed on wafer stage at this first chip 130, and promptly this wafer 30 does not cut into before indivedual first chips 130 as yet.When this first chip 130 is arranged at 111 last times of this chip carrier, those reshuffle weld pad 131 near those first contact finger 112 and this second contact finger 113, to shorten wire length.In a preferred embodiment, shown in Fig. 3 C, at least one this passive component 190 is set on this first chip 130, the electrode alignment of this passive component 190 also is soldered to those passive component connection pads 134.
Afterwards, carry out the second time chip step is set.Shown in Fig. 3 D, this second chip 140 is arranged on this first chip 130.When being connected for routing between this second chip 140 and this reconfiguration line layer 180, this second chip 140 does not cover those switching pads 133.Then, carry out a routing step, shown in Fig. 3 E, form those bonding wires 151 and 152 with the routing mode, wherein those bonding wires 151 connect those and reshuffle weld pad 131 to those first contact finger 112 and this second contact finger 113; Those bonding wires 152 connect the weld pad of this second chip 140 to those switching pads 133.Therefore, this second chip 140 can be electrically connected to this first chip 130 and be electrically connected to those first contact fingers 112 and this second contact finger 113.
Afterwards, carry out mould envelope step.Shown in Fig. 3 F; Form this adhesive body 160; Sealing this first chip 130, this second chip 140, this passive component 190, those bonding wires 151,152 and this non-conductive adhesive tape 120, and combine this first contact finger 112 and this second contact finger 113 of this lead frame 110.As shown in Figure 6, the formation progressive die of this adhesive body 160 is enclosed in a plurality of encapsulation units district in this metal framework 116, to meet mass-produced requirement.
Afterwards, carry out a singulation cutting step.Adhesive body 160 shown in Fig. 3 F is cut into the face shaping shown in Fig. 3 G.Because during cutting; The side that is cut out nearly all is the material of adhesive body 160, can not switch to the whole side of known substrate, only can switch to those first connecting rods 114 and those second connecting rods 115; So can cut out comparatively complicated shape; And this singulation cutting step also can comprise the inferior step that moulding is ground in addition, does not have burr and the benefit that reduces cost to reach surfacing, can not cause peeling off or layering of known substrate.Preferably; The thickness of those first connecting rods 114 and those second connecting rods 115 is not more than the thickness of this chip carrier 111; Promptly less than the thickness of those first contact fingers 112 with this second contact finger 113; Make those first connecting rods 114 and the cutting section of those second connecting rods 115 can not abut the last lower edge of the cutting side of this adhesive body 160; Be those first connecting rods 114 and the periphery of the cutting section of those second connecting rods 115 is still coated by this adhesive body 160, can reduce the burr of those first connecting rods 114 and those second connecting rods 115 or loosening.As shown in Figure 7; After the singulation cutting; The bottom surface of this adhesive body 160 only appears the lower surface of those first contact fingers 112 and this second contact finger 113, and the lower surface of this chip carrier 111 and those first connecting rods 114 are still covered by this adhesive body 160 with the lower surface of those second connecting rods 115.At last, as shown in the figure, the lower surface of those first contact fingers 112 and this second contact finger 113 appears the position and forms this coat of metal 170 with the barrel plating mode in Fig. 7, to make this multichip package structure 100.
Therefore; The multichip package structure that the present invention has the wire-frame type contact finger can omit substrate to reduce packaging cost; And can avoid known use lead frame to cause the generation of the excessive glue and the pin Bit Shift of contact finger, and effectively solve the contact finger easy shaking that constitutes by lead frame and the problem of displacement.
In addition; Multichip package structure with wire-frame type contact finger of the present invention is not only limited to the application of flash memory; To change, the present invention also can be applicable to flash memory module (eMMC) by the circuit of the variation of the correspondingly-shaped of the position change of the contact finger of lead frame, non-conductive adhesive tape or quantity and reconfiguration line layer.
The above is merely preferred embodiment of the present invention, is not to be used to limit protection scope of the present invention.
Claims (10)
1. the multichip package structure with wire-frame type contact finger is characterized in that, comprises:
One lead frame has a chip carrier and a plurality of first contact finger, is more extended by one of this chip carrier side to connect at least one second contact finger, and this second contact finger also is in a row to arrange between those first contact fingers;
One non-conductive adhesive tape is attached on those first contact fingers and this second contact finger, with fixing those first contact fingers and this second contact finger of contacting;
One first chip is arranged on this chip carrier;
One second chip is arranged on this first chip;
A plurality of bonding wires electrically connect a plurality of weld pads to those first contact fingers and this second contact finger of this first chip;
One adhesive body seals this chip carrier, this first chip, this second chip and this non-conductive adhesive tape and combines those first contact fingers and this second contact finger; And
One coat of metal is formed at the lower surface of those first contact fingers and this second contact finger and is emerging in outside this adhesive body.
2. the multichip package structure with wire-frame type contact finger as claimed in claim 1 is characterized in that the size of this first chip is greater than the size of this second chip.
3. the multichip package structure with wire-frame type contact finger as claimed in claim 2 is characterized in that, this first chip is a memory chip, and this second chip is a controller chip.
4. the multichip package structure with wire-frame type contact finger as claimed in claim 3 is characterized in that this adhesive body has the shape of a memory card.
5. the multichip package structure with wire-frame type contact finger as claimed in claim 4; It is characterized in that; This adhesive body has a grafting side; This lead frame has a plurality of first connecting rods and a plurality of second connecting rod, and wherein those first connecting rods connect a plurality of non-grafting side of this chip carrier to this adhesive body, and those second connecting rods connect those non-grafting sides of both sides first contact finger to this adhesive body in those first contact fingers.
6. like claim 2,3,4 or 5 described multichip package structures with wire-frame type contact finger; It is characterized in that; One active surface of this first chip is formed with a reconfiguration line layer, to electrically connect this second chip to those first contact fingers and this second contact finger.
7. the multichip package structure with wire-frame type contact finger as claimed in claim 6 is characterized in that other comprises at least one passive component, is arranged on this first chip and with this reconfiguration line layer to electrically connect.
8. like claim 1,2,3,4 or 5 described multichip package structures, it is characterized in that this coat of metal is a barrel plating nickel-gold layer with wire-frame type contact finger.
9. like claim 1,2,3,4 or 5 described multichip package structures with wire-frame type contact finger; It is characterized in that; The width of this non-conductive adhesive tape is less than the finger length of those first contact fingers and this second contact finger, so that those first contact fingers remain with the routing zone that a plurality of confession bonding wires are connected with the upper surface of this second contact finger.
10. like claim 1,2,3,4 or 5 described multichip package structures with wire-frame type contact finger; It is characterized in that; The thickness of those first contact fingers and this second contact finger is greater than the thickness of this chip carrier, so that this adhesive body covers the lower surface of this chip carrier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2011101367531A CN102800642A (en) | 2011-05-25 | 2011-05-25 | Multi-chip encapsulation structure with lead frame type contact finger |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2011101367531A CN102800642A (en) | 2011-05-25 | 2011-05-25 | Multi-chip encapsulation structure with lead frame type contact finger |
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| CN102800642A true CN102800642A (en) | 2012-11-28 |
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| CN2011101367531A Pending CN102800642A (en) | 2011-05-25 | 2011-05-25 | Multi-chip encapsulation structure with lead frame type contact finger |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106486451A (en) * | 2015-08-28 | 2017-03-08 | 苏州普福斯信息科技有限公司 | The anti-hierarchy of TSOP package leadframe |
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| US5381037A (en) * | 1993-06-03 | 1995-01-10 | Advanced Micro Devices, Inc. | Lead frame with selected inner leads coupled to an inner frame member for an integrated circuit package assemblies |
| CN1466211A (en) * | 2002-06-28 | 2004-01-07 | ��Ʒ���ܹ�ҵ�ɷ�����˾ | Semiconductor package and mfg. method thereof |
| CN1481019A (en) * | 2002-08-06 | 2004-03-10 | �¹������ҵ��ʽ���� | Lead fram and its mfg. method |
| CN101103460A (en) * | 2005-01-20 | 2008-01-09 | 英飞凌科技股份公司 | Leadframe, semiconductor package and method for producing the same |
| CN101231990A (en) * | 2007-01-24 | 2008-07-30 | 南茂科技股份有限公司 | Tape coiling type packaging construction capable of inserting and electronic device using the construction |
| CN101499449A (en) * | 2008-02-02 | 2009-08-05 | 力成科技股份有限公司 | Semiconductor packaging construction on pin for wafer |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106486451A (en) * | 2015-08-28 | 2017-03-08 | 苏州普福斯信息科技有限公司 | The anti-hierarchy of TSOP package leadframe |
| CN106486451B (en) * | 2015-08-28 | 2019-04-16 | 苏州普福斯信息科技有限公司 | The anti-layered structure of TSOP package leadframe |
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