CN106486451A - The anti-hierarchy of TSOP package leadframe - Google Patents
The anti-hierarchy of TSOP package leadframe Download PDFInfo
- Publication number
- CN106486451A CN106486451A CN201510536508.8A CN201510536508A CN106486451A CN 106486451 A CN106486451 A CN 106486451A CN 201510536508 A CN201510536508 A CN 201510536508A CN 106486451 A CN106486451 A CN 106486451A
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- Prior art keywords
- lead frame
- wafer
- larger areas
- adhesive tape
- copper
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Abstract
The present invention relates to the anti-hierarchy of TSOP package leadframe, including wafer IC, adhesive tape, lead frame and suspension area, lead frame is provided with larger areas of copper region, cover strip shape adhesive tape in position under wafer IC, suspension area are located between adhesive tape, and lead frame is located at adhesive tape bottom surface, the larger areas of copper region of lead frame wafer IC position is provided with square copper sheet, the remaining larger areas of copper region in larger areas of copper region is provided with hollow out, and which passes through resin and is molded in hollow-out parts, and resin is formed with wafer through lead frame and combined；Technical solution of the present invention designs vacuum cup structure on lead frame, and in the case of sucking disc area is ensured, remaining larger areas of copper region increases punching area, reduces the presence of large area copper sheet.
Description
Technical field
The present invention discloses the anti-hierarchy of TSOP package leadframe.
Background technology
TSOP packing forms are to apply a kind of packing forms widely in current IC package, and lead frame used is copper, copper
Piece constitutes the lead frame structure required for IC package through punching press or etching, for importing and exporting for IC signal, lead frame
Due to being that the copper sheet of full wafer is punched into hollow out form, overall resistance to stress is less able, yielding, can stick adhesive tape guarantor on framework
Its Stability Analysis of Structures is held, as this layer of adhesive tape would generally be made separate strip by cost reason, except anchor leg outer frame is also for putting
Wafer IC is put, wafer IC is attached on framework fixation adhesive tape during encapsulation；As framework is fixed between lead frame and wafer IC
The interval of adhesive tape can cause wafer IC lower part hanging, as bonding wire craft is very high to the requirement of work materials fixed precision, then brilliant
Below circle IC, frame part answers wafer IC bob when sucked by the vacuum plate sucking of bonding equipment to reduce operation as much as possible,
So may require that lead frame retains the non-blanking area of large area as far as possible and adsorbs for suction disc, and large-area copper sheet area is easily
When causing to be molded, itself independent area and resin between is excessive, because the larger convergent force of the different generations of the shrinkage factor of unlike material is poor, easily
Layering causes product reliability problem.
Content of the invention
The present invention is in order to solve problem of the prior art, there is provided design vacuum cup structure on lead frame, is ensureing sucker face
In the case of product, remaining larger areas of copper region increases punching area, reduces anti-point of the TSOP package leadframe that large area copper sheet is present
Rotating fields.
The concrete scheme of the present invention is：The anti-hierarchy of TSOP package leadframe, including wafer, adhesive tape, lead frame and suspension area,
The lead frame is provided with larger areas of copper region, masking tape on the lead frame under the wafer IC position, and the suspension area is located at
Between adhesive tape, the lead frame is located at adhesive tape bottom surface, and the larger areas of copper region that the lead frame is provided with is provided with square copper sheet,
The remaining larger areas of copper region in the larger areas of copper region is provided with hollow out, and which passes through resin and is molded in hollow-out parts, and resin is passed through and drawn
Wire frame is formed with wafer and is combined.
It is below the attached technical scheme of the present invention：
Preferably, the size of the square copper sheet is 0.8 × 0.8mm.
Preferably, on the lead frame for arrange the position of square copper sheet be provided with multiple.
The Advantageous Effects of the present invention：The anti-hierarchy of the TSOP package leadframe of the present invention, designs vacuum on lead frame
Sucker structure, in the case of sucking disc area is ensured, remaining larger areas of copper region increases punching area, reduces depositing for large area copper sheet
, it is ensured that the vacuum of bonding wire craft is fixed, the possibility being layered after reducing injection again.
Description of the drawings
Fig. 1 is the top view of the existing design of the anti-hierarchy of embodiment of the present invention TSOP package leadframe.
Fig. 2 is the upward view of the existing design of the anti-hierarchy of embodiment of the present invention TSOP package leadframe.
Fig. 3 is the side view of the anti-hierarchy of embodiment of the present invention TSOP package leadframe.
Fig. 4 is the top view of the anti-hierarchy of embodiment of the present invention TSOP package leadframe.
In figure：Wafer IC1, larger areas of copper region 2, adhesive tape 3, lead frame 4, suspension area 5, resin 7, square copper sheet 8,
Hollow-out parts 9.
Specific embodiment
As depicted in figs. 1 and 2, the anti-hierarchy of the TSOP packing forms lead frame of the present invention is right with existing hierarchy
Than being：The larger areas of copper panel region (as shown in Figure 1) of existing hierarchy, which can be adsorbed by bonding equipment suction disc well, but
Can cause to be molded the problem of layering, after injection, between resin face, UNICOM is less, big with lead frame faying face Area comparison, causes
Two separate components produce larger stress difference because of different shrinkage factors, so as to cause to be layered (as shown in Figure 2).
As shown in Figure 3 and Figure 4, the anti-hierarchy of the TSOP package leadframe of the present invention, including wafer IC1, adhesive tape 3, draws
Wire frame 4 and suspension area 5, are provided with larger areas of copper region 2, the wafer IC1 on the lead frame below the wafer IC1 position
Lower masking tape 3, the suspension area 4 are located between adhesive tape 3, and the lead frame 4 is located at 3 bottom surface of adhesive tape, the wafer IC1
The larger areas of copper region 2 that lead frame below position is provided with is provided with square copper sheet 8, the size of the square copper sheet 8
For 0.8 × 0.8mm, the remaining larger areas of copper region in the larger areas of copper region 2 is provided with hollow-out parts 9, and which passes through resin 7 and is molded
To in hollow-out parts 9, resin 7 is formed with wafer 1 through lead frame 4 and is combined.
Further, the anti-hierarchy of the TSOP package leadframe of the present invention, retains the side of 0.8x0.8mm on large area copper sheet
Shape copper sheet area adsorbs for bonding equipment evacuated panel, the hollow-out parts of remaining larger areas of copper, passes through for resin during injection, and resin is passed through and drawn
Wire frame is combined with wafer, is played preferably and is combined effect, faying face is spread out, receive between resin and lead frame each other
Also because dispersion diminishes, resin and lead frame interaction are combined stress under compression difference, so reduce the risk being layered between resin and lead frame.
As shown in figure 4, the position for being available for arranging on the lead frame 4 vacuum cup 8 is provided with multiple, square copper sheet size
Design 0.8x0.8mm, position and quantity can be set according to the lead frame of multi-form, if wafer is larger, and on lead frame
The position for being available for arranging sucker is more, and can set several quality, especially wafer currents as ensureing bonding wire craft becomes more and more more
Thin, the number of plies is more and more, and during bonding wire, the fixing of material requires to be even more substantially, and the setting of sucker is even more important.
The anti-hierarchy of the TSOP package leadframe of the present invention, designs vacuum cup structure on lead frame, is ensureing sucker face
In the case of product, remaining larger areas of copper region increases punching area, reduces the presence of large area copper sheet, it is ensured that bonding wire craft
Vacuum fixes the possibility being layered after reducing injection again.It is pointed out that above-mentioned preferred embodiment skill only to illustrate the invention
Art design and feature, its object is to allow person skilled in the art will appreciate that present disclosure and implement according to this, not
Can be limited the scope of the invention with this.All equivalence changes that is made according to spirit of the invention or modification, should all cover
Within protection scope of the present invention.
Claims (3)
- The anti-hierarchy of 1.TSOP package leadframe, including wafer IC, adhesive tape, lead frame and suspension area, wafer on the lead frame IC position is provided with larger areas of copper region, masking tape on the wafer IC position lead below frame, and the suspension area is located at adhesive tape Between, the lead frame is located at adhesive tape bottom surface, it is characterised in that：It is provided with the larger areas of copper region being provided with lead frame Square copper sheet, the remaining larger areas of copper region in the larger areas of copper region are provided with hollow out, and which passes through resin and is molded in hollow-out parts, Resin is formed with wafer through lead frame and is combined.
- 2. the anti-hierarchy of TSOP package leadframe as claimed in claim 1, it is characterised in that：The area of the square copper sheet is big Little is 0.8 × 0.8mm.
- 3. the anti-hierarchy of TSOP package leadframe as claimed in claim 1, it is characterised in that：Setting side is supplied on the lead frame The position of shape copper sheet is provided with multiple.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510536508.8A CN106486451B (en) | 2015-08-28 | 2015-08-28 | The anti-layered structure of TSOP package leadframe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510536508.8A CN106486451B (en) | 2015-08-28 | 2015-08-28 | The anti-layered structure of TSOP package leadframe |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106486451A true CN106486451A (en) | 2017-03-08 |
| CN106486451B CN106486451B (en) | 2019-04-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201510536508.8A Active CN106486451B (en) | 2015-08-28 | 2015-08-28 | The anti-layered structure of TSOP package leadframe |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040145038A1 (en) * | 2002-07-31 | 2004-07-29 | Koji Numazaki | Composite integrated circuit device |
| CN102347305A (en) * | 2011-10-24 | 2012-02-08 | 上海凯虹科技电子有限公司 | Array structure of lead frame |
| CN102800642A (en) * | 2011-05-25 | 2012-11-28 | 力成科技股份有限公司 | Multi-chip encapsulation structure with lead frame type contact finger |
| CN104465596A (en) * | 2014-12-05 | 2015-03-25 | 苏州日月新半导体有限公司 | Lead frame, semiconductor packaging body and manufacturing method thereof |
| CN104485323A (en) * | 2014-12-23 | 2015-04-01 | 日月光封装测试(上海)有限公司 | Lead frame and semiconductor packaging body |
| CN104659008A (en) * | 2013-11-19 | 2015-05-27 | 西安永电电气有限责任公司 | Plastic-encapsulated type IPM (Intelligent Power Module) lead frame structure |
-
2015
- 2015-08-28 CN CN201510536508.8A patent/CN106486451B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040145038A1 (en) * | 2002-07-31 | 2004-07-29 | Koji Numazaki | Composite integrated circuit device |
| CN102800642A (en) * | 2011-05-25 | 2012-11-28 | 力成科技股份有限公司 | Multi-chip encapsulation structure with lead frame type contact finger |
| CN102347305A (en) * | 2011-10-24 | 2012-02-08 | 上海凯虹科技电子有限公司 | Array structure of lead frame |
| CN104659008A (en) * | 2013-11-19 | 2015-05-27 | 西安永电电气有限责任公司 | Plastic-encapsulated type IPM (Intelligent Power Module) lead frame structure |
| CN104465596A (en) * | 2014-12-05 | 2015-03-25 | 苏州日月新半导体有限公司 | Lead frame, semiconductor packaging body and manufacturing method thereof |
| CN104485323A (en) * | 2014-12-23 | 2015-04-01 | 日月光封装测试(上海)有限公司 | Lead frame and semiconductor packaging body |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106486451B (en) | 2019-04-16 |
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