CN205428891U - Semiconductor carrier tool - Google Patents
Semiconductor carrier tool Download PDFInfo
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- CN205428891U CN205428891U CN201521086164.7U CN201521086164U CN205428891U CN 205428891 U CN205428891 U CN 205428891U CN 201521086164 U CN201521086164 U CN 201521086164U CN 205428891 U CN205428891 U CN 205428891U
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- semiconductor carrier
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- glue
- carrier tool
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Abstract
The utility model discloses a semiconductor carrier tool, glue glutinous layer including base and the at least one deck that covers the base upper surface, glue a glutinous layer upper surface and can glue glutinous entertaining and carry a semiconductor carrier. The utility model provides a semiconductor carrier tool simple structure, cost are lower, can carry the partly of semiconductor carrier as entertaining simultaneously temporarily, uninstall behind the plastic envelope together, reduce off -the -shelf quality risk. The semiconductor carrier size that can carry with entertaining because of semiconductor carrier tool's size in addition is unanimous, and backward flow and cleaning equipment's restriction in quantity is few, has improved the output of product. Because be the bonding of whole faces, what the product can be complete is fixed, the effectual warpage of improving the product.
Description
Technical field
This utility model relates to technical field of semiconductors, particularly relates to a kind of semiconductor carrier tool, disposes and unloading jig particularly to quasiconductor middle frame/substrate.
Background technology
At present in semiconductor packaging process, first semiconductor carrier such as framework/substrate is prevented on metal fixture base, cover on framework/substrate with pressing plate again, pressing plate passes through magnet absorption between metal fixture base, with fixed frame/substrate, the operation of subsequent handling for convenience, the size of tool is typically larger than the size of framework/substrate.But above-mentioned tool has a disadvantage in that
Needing to customize special tool, tool price is high.
The metal lid of magnetic and base, need special equipment to dispose and unloading, have enough to meet the need between multiple operation, increase the quality risk of product.
In order to ensure the fixing of product, the width ratio product width of tool has certain increase, and due to tool width, in backflow and cleaning equipment, single allows the tool limited amount system passed through, and have impact on the output of product.
Because being frame fixed frame/substrate, product be fixed with limitation, the warpage of product is improved effect limited.
Utility model content
In view of drawbacks described above of the prior art or deficiency, it is provided that a kind of semiconductor carrier tool, including: base and the viscous glutinous layer of at least one of which, described viscous glutinous layer can glue glutinous semiconductor carrier to be lifted to cover on the upper surface of described base.
The semiconductor carrier jig structure that this utility model provides is simple, cost is relatively low, can unload together temporarily as a part for semiconductor carrier to be lifted simultaneously, reduce the quality risk of finished product after plastic packaging.Additionally can reflux and the quantity of cleaning equipment limits few with semiconductor carrier consistent size to be lifted, improve the output of product because of the size of semiconductor carrier tool.Because being the bonding in whole face, what product can be complete is fixing, effectively improves the warpage of product.
Accompanying drawing explanation
By reading the detailed description being made non-limiting example made with reference to the following drawings, other features, purpose and advantage will become more apparent upon:
The semiconductor carrier jig structure schematic diagram that Fig. 1 provides for this utility model embodiment；
Description of reference numerals:
1-base；The viscous glutinous layer of 2-；3-articulamentum；4-framework/substrate
Detailed description of the invention
With embodiment, the application is described in further detail below in conjunction with the accompanying drawings.It is understood that specific embodiment described herein is used only for explaining relevant utility model, rather than the restriction to this utility model.It also should be noted that, for the ease of describing, accompanying drawing illustrate only the part relevant to utility model.
It should be noted that in the case of not conflicting, the embodiment in the application and the feature in embodiment can be mutually combined.Describe the application below with reference to the accompanying drawings and in conjunction with the embodiments in detail.
As it is shown in figure 1, the semiconductor carrier tool that the present embodiment provides, including the viscous glutinous layer 2 of base 1 and at least one of which, viscous glutinous layer 2 can glue glutinous semiconductor carrier to be lifted such as framework/substrate 4 to cover on the upper surface of base 1.
The semiconductor carrier jig structure that this utility model provides is simple, and cost is relatively low.Can unload after plastic packaging together temporarily as a part for semiconductor carrier to be lifted simultaneously, reduce the quality risk of finished product.Additionally can reflux and the quantity of cleaning equipment limits few with the consistent size of semiconductor carrier to be lifted, improve the output of product because of the size of semiconductor carrier tool.Because being the bonding in whole face, what product can be complete is fixing, effectively improves the warpage of product.
As it is shown in figure 1, further, the semiconductor carrier tool that the present embodiment provides also includes that at least one of which articulamentum 3, articulamentum 3 are arranged on the upper surface of base 1, for viscous glutinous layer 2 is connected to base 1.Under viscous glutinous layer, arrange articulamentum to make viscous glutinous layer and treat that viscous glutinous semiconductor carrier laminating is tightr, smooth.
As it is shown in figure 1, further, the articulamentum 3 that the present embodiment provides is two-sided tape, and viscous glutinous layer 2 is one-faced tapes, and that glues glutinous layer 2 can glue glutinous semiconductor carrier to be lifted containing glue surface, and such as framework/substrate, viscous glutinous the non-of layer 2 is connected with articulamentum 3 containing glue surface.Two-sided tape has stronger cohesive force in the present embodiment, and one-faced tapes can be attached to framework/substrate back at room temperature, will not produce colloid residual after one side glue is thrown off.Simple in construction, cost is relatively low, and easily install and facilitate follow-up by semiconductor carrier to be lifted as framework/substrate is removed from tool.
As it is shown in figure 1, further, gluing of the present embodiment offer sticks layer 2, articulamentum 3 is consistent with base 1 shape and is completely superposed.Can preferably fix semiconductor carrier to be lifted.
As it is shown in figure 1, further, the base 1 upper surface shape that the present embodiment provides is identical with semiconductor carrier shape to be lifted.Because of susceptor surface shape with shape with semiconductor carrier shape to be lifted consistent, namely each size such as length, width are consistent, and the quantity when subsequent handling such as backflow and cleaning equipment limits few, improves the output of product.Simultaneously as be the bonding in whole face, what product can be complete is fixing, the effective warpage improving semiconductor carrier to be lifted such as framework/substrate.
As it is shown in figure 1, further, base 1 upper surface that the present embodiment provides is rectangle.With the shape of actual most of semiconductor carriers to be lifted such as framework/substrate is consistent, adaptability is good.
Utilize the using method of the semiconductor carrier tool that the present embodiment provides:
First hard base front being pasted two-sided tape in advance, two-sided tape has stronger cohesive force；Secondly by one side glue on double faced adhesive tape, then by framework/substrate sticking on one side glue.
Or first hard base front being pasted two-sided tape in advance, two-sided tape has stronger cohesive force；Secondly framework/the substrate posting one side glue is sticked on the hard base with two-sided tape.
After completing the plastic packaging of framework/substrate, first being removed by framework/substrate, then removed by one-faced tapes, the remaining hard tool with two-sided tape recycles.
Above description is only the preferred embodiment of the application and the explanation to institute's application technology principle.Skilled artisan would appreciate that, utility model scope involved in the application, it is not limited to the technical scheme of the particular combination of above-mentioned technical characteristic, also should contain in the case of conceiving without departing from described utility model, other technical scheme being carried out combination in any by above-mentioned technical characteristic or its equivalent feature and being formed simultaneously.Such as features described above and (but not limited to) disclosed herein have the technical characteristic of similar functions and replace mutually and the technical scheme that formed.
Claims (6)
1. a semiconductor carrier tool, it is characterised in that including: base and the viscous glutinous layer of at least one of which, described viscous glutinous layer can glue glutinous semiconductor carrier to be lifted to cover on the upper surface of described base.
Semiconductor carrier tool the most according to claim 1, it is characterised in that also include that at least one of which articulamentum, described articulamentum are arranged on the upper surface of described base, for being connected to described base by described viscous glutinous layer.
Semiconductor carrier tool the most according to claim 2, it is characterized in that, described articulamentum is two-sided tape, and described viscous glutinous layer is one-faced tapes, described viscous glutinous layer can glue glutinous semiconductor carrier to be lifted containing glue surface, described viscous glutinous the non-of layer is connected with described articulamentum containing glue surface.
Semiconductor carrier tool the most according to claim 2, it is characterised in that described viscous glutinous layer, described articulamentum is consistent with described base shape and is completely superposed.
Semiconductor carrier tool the most according to claim 4, it is characterised in that described base upper surface shape is identical with semiconductor carrier shape to be lifted.
Semiconductor carrier tool the most according to claim 5, it is characterised in that described base upper surface is rectangle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521086164.7U CN205428891U (en) | 2015-12-23 | 2015-12-23 | Semiconductor carrier tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521086164.7U CN205428891U (en) | 2015-12-23 | 2015-12-23 | Semiconductor carrier tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205428891U true CN205428891U (en) | 2016-08-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521086164.7U Active CN205428891U (en) | 2015-12-23 | 2015-12-23 | Semiconductor carrier tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205428891U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113135011A (en) * | 2021-04-12 | 2021-07-20 | 睿惢思工业科技（苏州）有限公司 | Semiconductor chip high-temperature bearing jig and processing technology thereof |
| CN114293164A (en) * | 2021-12-29 | 2022-04-08 | 立芯科技(昆山)有限公司 | Preparation method of electromagnetic shielding layer of semiconductor product and semiconductor product |
-
2015
- 2015-12-23 CN CN201521086164.7U patent/CN205428891U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113135011A (en) * | 2021-04-12 | 2021-07-20 | 睿惢思工业科技（苏州）有限公司 | Semiconductor chip high-temperature bearing jig and processing technology thereof |
| CN114293164A (en) * | 2021-12-29 | 2022-04-08 | 立芯科技(昆山)有限公司 | Preparation method of electromagnetic shielding layer of semiconductor product and semiconductor product |
| CN114293164B (en) * | 2021-12-29 | 2024-04-12 | 立芯科技(昆山)有限公司 | Preparation method of electromagnetic shielding layer of semiconductor product and semiconductor product |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 226006 Jiangsu Province, Nantong City Chongchuan District Chongchuan Road No. 288 Patentee after: Tongfu Microelectronics Co., Ltd. Address before: 226006 Jiangsu Province, Nantong City Chongchuan District Chongchuan Road No. 288 Patentee before: Fujitsu Microelectronics Co., Ltd., Nantong |