CN215578557U

CN215578557U - UVC LED encapsulation lamp pearl of special plastic support material

Info

Publication number: CN215578557U
Application number: CN202121285663.4U
Authority: CN
Inventors: 唐勇; 林启程; 曾剑峰; 余海清; 邱国梁; 谭琪琪; 刘辉煌
Original assignee: Yonglin Electronics Co Ltd
Current assignee: Yonglin Electronics Co Ltd
Priority date: 2021-06-09
Filing date: 2021-06-09
Publication date: 2022-01-18
Anticipated expiration: 2031-06-09

Abstract

The utility model discloses a UVC LED packaging lamp bead made of a special plastic support material, which has the technical scheme that: the support comprises a support main body, a chip bonding pad, a UVC chip and a UVA chip, wherein the chip bonding pad is fixedly arranged on the support main body, a cover plate is fixedly arranged at the upper end of a chip placing groove, the UVC chip and the UVA chip are fixedly arranged in the chip placing groove, the UVC chip, the UVA chip and the chip bonding pad are connected in parallel to form a zener tube, a through hole is formed in the chip bonding pad in a penetrating manner, conductive metal is fixedly arranged in the through hole, electrode bonding pads are fixedly arranged on the lower surfaces of the chip bonding pads, support electrode pins are fixedly arranged in the front and the back of the support main body, and a support notch is formed in the support main body; the utility model solves the problems that the cost occupation ratio of a product support is high, and the effect is poor because a UVC product chip and the support are combined by adopting a solder paste reflow soldering curing process; the radiating effect of UVC LED encapsulation lamp pearl needs the problem that promotes.

Description

UVC LED encapsulation lamp pearl of special plastic support material

Technical Field

The utility model relates to a UVC LED packaging lamp bead made of a special plastic support material.

Background

The sterilization effect of UVC on bacteria and viruses is generally completed within a few seconds, the UVC almost instantaneously takes place, the sterilization and disinfection capacity is 600-3000 times greater than that of chlorine, and almost all the bacteria and viruses can be killed efficiently. Therefore, the application prospect of the UVC in the sterilization and disinfection market is bright.

According to the current chinese patent with publication number CN212723198U, a UVCLED packaged lamp bead test structure is disclosed, which comprises a test box, wherein a placement groove is provided at the top of both sides of the test box, an insertion plate is provided at the bottom of the placement groove, a slot is provided on the insertion plate, a fixing slot is provided inside the insertion plate, the fixing slot is located at both sides of the slot, a clamping slot is provided at one side of the slot, the clamping slot is communicated with the fixing slot, a hemispherical fixture block is slidably connected between the top and the bottom of the inner wall of the fixing slot, and a spring is fixedly connected between one side of the hemispherical fixture block and one side of the inner wall of the fixing slot. The utility model can test and detect a plurality of packaged lamp beads at one time through the insertion plate, greatly improves the test efficiency, can extrude and fix the packaged lamp beads through the hemispherical fixture blocks and the springs, prevents poor contact caused by insertion errors of the packaged lamp beads, can ensure that the packaged lamp beads cannot be damaged in the detection process, and can ensure the integrity of products.

However, the UVC LED package lamp bead made of the bracket material still has some disadvantages, such as: the cost occupation ratio of the product support is high, and the UVC product chip and the support are combined by adopting a solder paste over-reflow soldering curing process, so that the effect is poor; the radiating effect of UVC LED encapsulation lamp pearl needs promote.

SUMMERY OF THE UTILITY MODEL

Aiming at the problems in the background art, the utility model aims to provide a UVC LED packaging lamp bead made of a special plastic support material, so as to solve the problems that the cost occupation ratio of a product support is high, and the effect is poor due to the fact that a UVC product chip and the support are combined by a solder paste reflow soldering curing process; the radiating effect of UVC LED encapsulation lamp pearl needs the problem that promotes.

The technical purpose of the utility model is realized by the following technical scheme:

the utility model provides a UVC LED encapsulates lamp pearl of special plastic support material, which comprises a bracket main body, the chip pad, the UVC chip, the UVA chip is constituteed, the fixed chip pad that is provided with in the support main body, the fixed chip standing groove that is provided with in middle part of the chip pad, the fixed apron that is provided with in upper end of chip standing groove, the fixed UVC chip that is provided with in inside of chip standing groove, the UVA chip, the UVC chip, the UVA chip is parallelly connected with the chip pad and is provided with the flush nanotube, run through on the chip pad and seted up the through-hole, the fixed conducting metal that is provided with in the through-hole, the lower fixed electrode pad that is provided with of chip pad, conducting metal and electrode pad fixed connection, the fixed support electrode pin that is provided with in the front and the back of support main body, the support breach has been seted up in the support main body.

Furthermore, the cover plate is made of quartz glass.

By adopting the technical scheme, the expansion coefficient of the quartz glass is small, the packaging structure is not more stable, the quartz glass is very low in moisture permeability and oxygen permeability, and the electrostatic breakdown of UVC chips and UVA chips in the chip placing groove 5 is prevented.

Furthermore, the electrode pad is composed of a positive electrode guide sheet, a negative electrode guide sheet and a heat dissipation guide sheet, the heat dissipation guide sheet is fixedly arranged between the positive electrode guide sheet and the negative electrode guide sheet, and the positive electrode guide sheet, the negative electrode guide sheet and the heat dissipation guide sheet are isolated by insulating materials.

By adopting the technical scheme, the heat dissipation guide sheet can realize conductive heat dissipation, and the positive electrode guide sheet and the negative electrode guide sheet are convenient for connection and conduction of a circuit.

Furthermore, the electrode pad is electrically connected with the electrode pin of the bracket.

Through adopting above-mentioned technical scheme, the convenience is connected the external circuit to UVC LED encapsulation lamp pearl, makes facilitate the use.

Furthermore, a blocking belt is fixedly arranged between the cover plate and the chip placing groove.

Through adopting above-mentioned technical scheme, thermal stress problem is avoided to barrier zone 1 for the structure is more stable, and external environment influences the normal use of UVC chip, UVA chip.

Furthermore, the chip bonding pad is made of pure copper, and an anti-oxidation coating is fixedly arranged on the surface of the chip bonding pad.

Through adopting above-mentioned technical scheme, the oxidation resistant coating prevents that the oxidation of chip pad promotes the life-span that UVC LED encapsulates lamp pearl used, and pure copper material promotes the radiating effect of UVC LED encapsulates lamp pearl, prevents that the high temperature chip from becoming invalid.

In conclusion, the utility model mainly has the following beneficial effects:

1. the utility model discloses a, through the production technology of moulding plastics of support main part, reduction in production cost, what the scaling powder combination was adopted to UVC chip, UVA chip and support main part through the scaling powder is the eutectic technology of scaling powder excess vacuum furnace, can let the chip fully combine to make new product luminance promote than former product luminance with the support, and reliability and ageing effect all have obvious promotion.

2. The utility model discloses a, through placing UVC chip, UVA chip in the chip standing groove, through the setting of apron and separate zone, avoid the thermal stress problem for the structure is more stable, makes the normal use of UVC chip, UVA chip, through the material of heat dissipation guide vane, support breach, chip bonding pad on the electrode bonding pad, promotes the radiating effect of UVC LED encapsulated lamp pearl.

Drawings

The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the principles of the utility model and not to limit the utility model. In the drawings:

FIG. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic structural view of an electrode pad.

In the figure: 1. a stent body; 2. a chip bonding pad; 3. a UVC chip; 4. a UVA chip; 5. a placement groove; 6. a zener tube; 7. a conductive metal; 8. an electrode pad; 801. a positive electrode lead; 802. a negative electrode lead; 803. a heat dissipation guide sheet; 9. a support electrode pin; 10. a bracket notch; 11. a cover plate; 12. a barrier band.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention clear and fully described, embodiments of the present invention are further described in detail below with reference to the accompanying drawings.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "inner", "outer", "top", "bottom", "side", "vertical", "horizontal", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," "fourth," "fifth," and "sixth" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example 1

Referring to fig. 1-2, a UVC LED package lamp bead made of a special plastic bracket material includes a bracket main body 1, a chip pad 2, a UVC chip 3, and a UVA chip 4, the bracket main body 1 of a new UVC product has a very low cost, the cost of the whole lamp is greatly reduced, the price advantage is large, the new UVC product can be operated by using a conventional SMD stripper, manual stripping of small batches of personnel can be completed, the process requirement is low, the bracket main body 1 is fixedly provided with the chip pad 2, the middle part of the chip pad 2 is fixedly provided with a chip placement groove 5, the placement groove 5 is made of aluminum oxide, the upper end of the chip placement groove 5 is fixedly provided with a cover plate 11, the inner part of the chip placement groove 5 is fixedly provided with the UVC chip 3 and the UVA chip 4, the UVC chip 3 and the UVA chip 4 are fixed by epoxy resin, the UVC chip 3 and the UVA chip 4 are combined with the bracket main body 1 by using a eutectic process of a flux passing through a vacuum furnace, the process can ensure that the UVC chip 3 and the UVA chip 4 are fully combined with the support to ensure that the brightness of a new product is improved by about 5 percent compared with the brightness of an original product, the reliability and the aging effect are obviously improved, the UVC chip 3, the UVA chip 4 and the chip bonding pad 2 are connected in parallel and provided with the zener tube 6, the chip bonding pad 2 is provided with a through hole in a penetrating way, a conductive metal 7 is fixedly arranged in the through hole, the lower surface of the chip bonding pad 2 is fixedly provided with an electrode bonding pad 8, the conductive metal 7 is fixedly connected with the electrode bonding pad 8, the front and the back of the support main body 1 are fixedly provided with support electrode pins 9, the support main body 1 is provided with a support notch 10, and good heat dissipation is carried out.

Referring to fig. 1, the cover plate 11 is made of quartz glass, the expansion coefficient of the quartz glass is small, the package structure is not stable, and the quartz glass is very low in moisture permeability and oxygen permeability, so that electrostatic breakdown of the UVC chip 3 and the UVA chip 4 in the chip placement groove 5 is prevented.

Referring to fig. 1 and 2, the electrode pad 8 is composed of a positive electrode lead 801, a negative electrode lead 802, and a heat dissipation lead 803, the heat dissipation lead 803 is fixedly disposed between the positive electrode lead 801 and the negative electrode lead 802, the positive electrode lead 801, the negative electrode lead 802, and the heat dissipation lead 803 are isolated from each other by an insulating material, and the electrode pad 8 can realize conductive heat dissipation and facilitate connection and conduction of a circuit.

Referring to fig. 1, an electrode pad 8 is electrically connected to a support electrode pin 9, so that the UVC LED package lamp bead is conveniently connected with an external circuit, and the use is convenient.

Referring to fig. 1 and 2, a barrier band 12 is fixedly disposed between the cover plate 11 and the chip placement groove 5, so as to avoid a thermal stress problem, make the structure more stable, and prevent an external environment from affecting normal use of the UVC chip 3 and the UVA chip 4.

Referring to fig. 1, the chip bonding pad 2 is made of pure copper, and the surface of the chip bonding pad 2 is fixedly provided with an antioxidant coating, so that the oxidation of the chip bonding pad 2 is prevented, the service life of the UVC LED packaging lamp bead is prolonged, the heat dissipation effect of the UVC LED packaging lamp bead is improved, and the failure of a chip with overhigh temperature is prevented.

When the lamp holder is used, the production cost is reduced through the injection molding production process of the holder main body 1, the eutectic process of the soldering flux over a vacuum furnace is adopted by combining the UVC chip 3, the UVA chip 4 and the holder main body 1 through the soldering flux, the chips and the holder can be fully combined to improve the brightness of a new product compared with the brightness of an original product, the reliability and the aging effect are obviously improved, the UVC chip 3 and the UVA chip 4 are placed in the chip placing grooves, the thermal stress problem is avoided through the arrangement of the cover plate 11 and the barrier belt 12, the structure is more stable, the UVC chip 3 and the UVA chip 4 can be normally used, and the heat dissipation effect of the UVC LED packaging lamp bead is improved through the heat dissipation guide sheets 803 on the electrode pad 8, the holder notch 10 and the material of the chip pad 2.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that various changes, modifications and substitutions can be made without departing from the spirit and scope of the utility model as defined by the appended claims. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a UVC LED encapsulates lamp pearl of special plastic support material, includes support main part (1), chip pad (2), UVC chip (3), UVA chip (4) and constitutes its characterized in that: the support comprises a support main body (1), a chip bonding pad (2) is fixedly arranged on the support main body (1), a chip placing groove (5) is fixedly arranged in the middle of the chip bonding pad (2), a cover plate (11) is fixedly arranged at the upper end of the chip placing groove (5), the UVC chip (3) and the UVA chip (4) are fixedly arranged in the chip placing groove (5), the UVC chip (3) and the UVA chip (4) are connected with the chip bonding pad (2) in parallel and provided with an accommodating tube (6), a through hole is formed in the chip bonding pad (2) in a penetrating manner, a conductive metal (7) is fixedly arranged in the through hole, an electrode bonding pad (8) is fixedly arranged on the lower surface of the chip bonding pad (2), the conductive metal (7) is fixedly connected with the electrode bonding pad (8), and support electrode pins (9) are fixedly arranged in front and at the back of the support main body (1), the bracket main body (1) is provided with a bracket notch (10).

2. The UVC LED packaged lamp bead with special plastic bracket material of claim 1, wherein: the cover plate (11) is made of quartz glass.

3. The UVC LED packaged lamp bead with special plastic bracket material of claim 1, wherein: the electrode pad (8) is composed of a positive electrode guide sheet (801), a negative electrode guide sheet (802) and a heat dissipation guide sheet (803), the heat dissipation guide sheet (803) is fixedly arranged between the positive electrode guide sheet (801) and the negative electrode guide sheet (802), and the positive electrode guide sheet (801), the negative electrode guide sheet (802) and the heat dissipation guide sheet (803) are isolated through insulating materials.

4. The UVC LED packaged lamp bead with special plastic bracket material as claimed in claim 3, wherein: the electrode pad (8) is electrically connected with the support electrode pin (9).

5. The UVC LED packaged lamp bead with special plastic bracket material of claim 1, wherein: a blocking belt (12) is fixedly arranged between the cover plate (11) and the chip placing groove (5).

6. The UVC LED packaged lamp bead with special plastic bracket material of claim 1, wherein: the chip bonding pad (2) is made of pure copper, and an anti-oxidation coating is fixedly arranged on the surface of the chip bonding pad (2).