CN214848670U - LED module and LED lamp - Google Patents

Abstract

The utility model discloses a LED module and LED lamps and lanterns, including casing, LED chip and support, the LED chip links firmly with the support, and housing face is provided with the conducting layer, and the both ends of conducting layer communicate with LED chip, support electricity respectively, between casing and the support to and it has the encapsulation to glue to be packaged with between casing and the LED chip. The utility model discloses in, realize the electric conductance between LED chip and the support through the conducting layer and lead to, replace the mode of current wire lug connection LED chip and support, because the conducting layer is installed on the casing to all be packaged with the encapsulation between casing and LED chip, the support and glue, the deformation of conducting layer is limited, even the LED module wets, the conducting layer is less in the deformation under the expend with heat and contract with cold effect, avoids the conducting layer fracture, thereby has improved the life and the stability of LED module and LED lamps and lanterns.

Description

LED module and LED lamp

Technical Field

The utility model relates to the field of lighting technology, especially, relate to a LED module and LED lamps and lanterns.

Background

The LED has the characteristics of high energy conservation and long service life, can be frequently opened and closed, adopts a fixed packaging mode, and is convenient to transport and install. In traditional LED packaging technology, the LED chip and the support are welded together through a wire, when an LED is affected by tide, the temperature rises rapidly at the moment of electrifying work, and the wire is broken due to expansion with heat and contraction with cold, so that the LED lamp is dead, and the service life of the LED is seriously influenced.

Disclosure of Invention

The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the utility model provides a LED module can reduce because LED wets the wire fracture risk that leads to improve LED's life.

The utility model discloses still provide a LED lamps and lanterns that have above-mentioned LED module.

According to the utility model discloses a LED module of first aspect embodiment, include:

the LED chip is fixedly connected with the bracket;

the surface of the shell is provided with a conducting layer, and two ends of the conducting layer are respectively electrically communicated with the LED chip and the bracket;

and packaging glue is packaged between the shell and the support and between the shell and the LED chip.

According to the utility model discloses LED module has following beneficial effect at least:

the utility model provides a LED module sets up the conducting layer on the casing, realize the electric conduction between LED chip and the support through the conducting layer, replace the mode of current wire lug connection LED chip and support, because the conducting layer is installed on the casing, and all be packaged with the encapsulation between casing and LED chip, the support and glue, the deformation of conducting layer is limited, even the LED module wets, the conducting layer is less under expend with heat and contract with cold effect, avoid the conducting layer fracture, thereby the life and the stability of LED module have been improved.

According to some embodiments of the invention, the housing has a recess, the conductive layer is embedded in the recess.

According to some embodiments of the invention, the conductive layer is lower than a surface of the housing.

According to some embodiments of the present invention, the housing and the surface of the LED chip are all encapsulated with an encapsulation adhesive.

According to some embodiments of the present invention, the center of the housing is recessed, and the housing is disposed over the LED chip.

According to some embodiments of the utility model, the conducting layer is provided with two, two the conducting layer branch is located the both sides of casing.

According to some embodiments of the invention, the conductive layer is bent or linear.

According to some embodiments of the invention, the end of the conducting layer is provided with a connection contact for connection with the LED chip or the bracket weld.

According to some embodiments of the invention, the support has a pin, the pin being welded with the connection contact.

According to the utility model discloses a LED lamps and lanterns of second aspect embodiment, including foretell LED module.

According to the utility model discloses LED lamps and lanterns has following beneficial effect at least:

the utility model provides a LED lamps and lanterns have improved the life and the stability of LED lamps and lanterns through using the LED module.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The invention will be further described with reference to the following drawings and examples, in which:

fig. 1 is a schematic structural diagram of an embodiment of an LED module according to the present invention;

fig. 2 is an exploded view of the LED module shown in fig. 1.

Reference numerals: a housing 100, a recess 110; a conductive layer 200, a connection contact 210; a support 300, pins 310; the LED chip 400.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it should be understood that the orientation or positional relationship indicated with respect to the orientation description, such as up, down, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, a plurality of means is one or more, a plurality of means is two or more, and the terms greater than, less than, exceeding, etc. are understood as not including the number, and the terms greater than, less than, within, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present invention, unless there is an explicit limitation, the words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in combination with the specific contents of the technical solution.

In the description of the present invention, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Referring to fig. 1 and 2, an embodiment of the present invention provides a LED module, which changes the connection mode between the traditional LED chip and the bracket through wires, and reduces the risk of wire breakage caused by thermal expansion and contraction, thereby improving the service life of the LED. The LED module comprises a shell 100, wherein a conducting layer 200 is arranged on the surface of the shell 100, an LED chip 400 and a support 300 are arranged on the surface of the shell 100, the LED chip 400 is fixed on the support 300, two ends of the conducting layer 200 are respectively electrically communicated with the LED chip 400 and the support 300, and packaging glue is packaged between the LED chip 400 and the shell 100 and between the shell 100 and the support 300, so that the outer surface of the LED chip 400 is sealed, and the connection between the LED chip 400 and the shell 100 is strengthened through packaging.

Therefore, the utility model provides a LED module, set up conducting layer 200 on casing 100, realize the electric conductance between LED chip 400 and the support 300 through conducting layer 200 and lead to, replace current wire lug connection LED chip 400 and support 300's mode, because conducting layer 200 is installed on casing 100, and casing 100 and LED chip 400, all be packaged with the encapsulation between the support 300 and glue, conducting layer 200's deformation is limited, even the LED module wets, conducting layer 200 is less in the deformation under the expend with heat and contract with cold effect, avoid conducting layer 200 fracture, thereby the life and the stability of LED module have been improved.

It should be noted that, the outer surface of the casing 100 is also coated with the packaging adhesive, the packaging adhesive is coated on the casing 100 and the LED chip 400 in a spot coating manner, the packaging adhesive can be epoxy packaging adhesive, silicone packaging adhesive, polyurethane packaging adhesive, ultraviolet light curing packaging adhesive and the like, the packaging adhesive is coated on the LED chip 400 in a spot coating manner, so that the packaging adhesive fills gaps between the casing 100 and the support 300 and between the casing 100 and the LED chip 400, the packaging adhesive protects the LED chip 400, plays a role in water resistance, moisture resistance and sealing, and strengthens the connection between the casing 100 and the support 300 and between the casing 100 and the LED chip 400. After the coating of the encapsulation adhesive is completed, the encapsulation adhesive is cured, for example, by heating, baking and ultraviolet irradiation, so that the encapsulation adhesive is converted into a solid state to stably connect the housing 100, the LED chip 400 and the support 300.

The conductive layer 200 may be stably connected to the LED chip 400 and the support 300 by soldering to form electrical conduction, and the LED chip 400 may be adhered to the support 300 by silver paste to fix the LED chip 400 and the support 300. The support 300 is used for conducting and supporting the LED chip 400, and may be made of metal, ceramic, or the like, and the support 300 may be a simple mounting board or a circuit board integrated with a circuit.

The shell 100 is provided with the groove 110, the groove 110 can be formed on the surface of the shell 100 through an etching mode or a mechanical processing mode such as punching, groove milling and the like, the conductive layer 200 can be formed in the groove 110 through an electroplating or physical vapor deposition mode, the conductive layer 200 can be made of metal or alloy materials, the conductive layer 200 is embedded in the groove 110, the conductive layer 200 is limited by the inner wall of the groove 110, deformation of the conductive layer 200 can be further reduced, and effective connection of the conductive layer 200, the LED chip 400 and the support 300 is guaranteed. After the conductive layer 200 is formed, the housing 100 may be polished to completely embed the conductive layer 200 in the groove 110, and the upper plane of the conductive layer 200 does not exceed the surface of the housing 100. Through polishing, make the surface of casing 100 more clean and tidy on the one hand, on the other hand, because conducting layer 200 imbeds recess 110 completely, its deformation is completely limited by the inner wall of recess 110, can effectively ensure conducting layer 200 and LED electricity core, support 300's electricity and be connected.

The housing 100 is made of a transparent material to ensure the light-emitting rate of the LED chip 400. In one embodiment, the center of the housing 100 is concave, the housing 100 is spanned over the LED chip 400, the LED chip 400 is mounted on the top of the bracket 300, and the LED chip 400 is located right in the concave of the housing 100, so as to improve the compactness of the connection between the housing 100 and the LED chip 400; the conductive layer 200 extends from the recess of the housing 100 to the bottom end of the housing 100, the bottom end of the housing 100 is connected to the support 300, so that the conductive layer 200 is electrically connected to the LED chip 400 and the support 300, and after the LED is packaged, the package adhesive covers the connection between the housing 100 and the support 300, so that the connection stability between the housing 100 and the support 300 is improved.

The two conductive layers 200 are respectively located at two sides of the housing 100, and the two conductive layers 200 are respectively used for connecting the anode of the LED chip 400 and the anode of the bracket 300 and the cathode of the LED chip 400 and the bracket 300, so that a conductive path is formed between the LED chip 400 and the bracket 300. The shape of the groove 110 can be set according to the shape of the housing 100 and the relative positions of the positive and negative electrodes of the LED chip 400 and the positive and negative electrodes of the support 300, so that the two ends of the conductive layer 200 can be respectively connected to the LED chip 400 and the support 300, and the conductive layer 200 can be bent or linear, such as curved lines, broken lines, and the like.

The end of the conductive layer 200 is provided with a connection contact 210, the connection contact 210 is used for being welded with the LED chip 400 or the bracket 300, so that the conductive layer 200 is stably connected with the LED chip 400 and the bracket 300 and forms electrical conduction, the bracket 300 is provided with a pin 310, and the pin 310 is used for being welded with the connection contact 210, so that the conductive layer 200 is connected with the bracket 300, and the stability of the connection of the LED chip 400 and the bracket 300 is improved.

The utility model also provides a LED lamp, including foretell LED module, can still include parts such as lamp body, radiator, lens in the LED lamp, the LED module is installed in the lamp body, through using the LED module, has improved the life and the stability of LED lamp.

The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art. Furthermore, the embodiments of the present invention and features of the embodiments may be combined with each other without conflict.

Claims (10)

1. An LED module, comprising:

   the LED chip is fixedly connected with the bracket;

   the surface of the shell is provided with a conducting layer, and two ends of the conducting layer are respectively electrically communicated with the LED chip and the bracket;

   and packaging glue is packaged between the shell and the support and between the shell and the LED chip.
2. 2. The LED module as claimed in claim 1, wherein the housing has a groove, and the conductive layer is embedded in the groove.
3. 3. The LED module of claim 2, wherein the conductive layer is lower than the surface of the housing.
4. 4. The LED module of claim 1, wherein the housing and the surface of the LED chip are encapsulated with an encapsulant.
5. 5. The LED module as claimed in claim 1, wherein the housing is recessed at a center thereof, and the housing spans over the LED chip.
6. 6. The LED module according to claim 1 or 5, wherein the number of the conductive layers is two, and the two conductive layers are respectively disposed on two sides of the housing.
7. 7. The LED module according to claim 1 or 5, wherein the conductive layer is bent or linear.
8. 8. The LED module according to claim 1, wherein the end of the conductive layer is provided with a connecting contact for soldering with the LED chip or the bracket.
9. 9. The LED module of claim 8, wherein the support has a pin, and the pin is soldered to the connection contact.
10. LED luminaire comprising a LED module according to any one of claims 1 to 9.

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