CN215069956U

CN215069956U - Insulating single tube device

Info

Publication number: CN215069956U
Application number: CN202120261971.7U
Authority: CN
Inventors: 谢峰; 张刚
Original assignee: Shenzhen Hopewind Electric Co Ltd
Current assignee: Shenzhen Hopewind Electric Co Ltd
Priority date: 2021-01-30
Filing date: 2021-01-30
Publication date: 2021-12-07
Anticipated expiration: 2031-01-30

Abstract

The application discloses an insulated single-tube device, which comprises at least one TO-packaged discrete device, an insulated heat conduction material, an insulated shell and a packaging material; the insulating shell is provided with a containing space, and the packaging material is used for packaging the discrete devices of the TO package and the insulating heat conduction material in the containing space. This application repacks through the discrete device TO TO encapsulation, can reduce the ann rule distance between device and the radiator, between device and the device, reduces the device interval, improves power electronic device's power density, reduction system cost.

Description

Insulating single tube device

Technical Field

The application relates to the technical field of power electronics, in particular to an insulating single tube device.

Background

Compared with an IPM (Intelligent Power Module) and a PIM (Power Integrated Module), the discrete device has the advantages of simple structure and low price, so that the discrete device is widely applied to the fields of variable frequency speed regulation, servo drive, variable frequency household appliances, photovoltaic Power generation and the like.

The heat dissipation and insulation of the discrete devices directly determine whether their performance is satisfactory. Because the single-tube device is not insulated, the mainstream scheme at present is that an insulating heat conduction material, such as a ceramic sheet, is added between the heat dissipation surface of the discrete device and the radiator, and heat conduction interface materials (TIM), such as silicone grease, are added on two sides of the ceramic sheet to fill interface gaps. The scheme has the problems that the installation process is complex, and the positioning of the device and the insulating heat-conducting fin is difficult; in addition, while internally insulated single-tube devices can solve the insulation problem, there are problems with insufficient electrical clearance and creepage distance from the pins to the heat sink. As shown in fig. 1-3, the electrical clearance of the TO247 device 6 TO the heat sink 1 is only about 2.5mm from the pin 61 TO the surface of the heat sink 1 (the thickness of the thermal interface material 3 is neglected for a small time). The problem that creepage distance is not enough can't be solved to the mode through the stitch cover pyrocondensation pipe, and common solution is insulating heat conduction material 2 that usable floor area is greater than contact surface 62 at the bottom of the device, then creepage distance is a + b + c, increases creepage distance b through the size that increases insulating material 2 promptly, increases creepage distance c through the thickness that increases insulating heat conduction material 2.

However, as system voltage and power levels increase, such as 1500V photovoltaic inverter systems, more discrete devices and greater insulation standoff distances are required. A larger area of insulating and heat conducting material will increase the size of the whole system and reduce the power density; in addition, the installation and positioning of the additional insulating and heat conducting gasket bring difficulties to production. Therefore, it is very important to solve the safety distance between the devices and the heat sink.

SUMMERY OF THE UTILITY MODEL

In view of this, the present application provides an insulated single-tube device, which aims to solve the problem of the safety distance between discrete devices and heat sinks.

According TO one aspect of the application, an insulated single-tube device is provided, which comprises at least one TO packaged discrete device, an insulated heat conducting material, an insulated housing and an encapsulating material;

the insulating shell is provided with a containing space, and the packaging material is used for packaging the discrete devices of the TO package and the insulating heat conduction material in the containing space.

In one embodiment, the discrete devices of the TO package are located above the insulating and thermally conductive material.

In one embodiment, the encapsulant fills the receiving space beyond the top surface of the discrete devices of the TO package.

In one embodiment, the insulated single-tube device further comprises a thermal interface material, and the thermal interface material is used for filling gaps between the TO packaged discrete devices and the insulated thermal conductive material.

In one embodiment, the thermally conductive interface material comprises silicone grease.

In one embodiment, the insulating and heat conducting material comprises at least one of aluminum oxide, aluminum nitride and silicon nitride.

In one embodiment, the encapsulating material comprises an epoxy resin.

In one embodiment, the insulated single-tube device comprises a first TO packaged discrete device, a second TO packaged discrete device and a circuit board;

the packaging material is used for packaging the discrete device of the first TO package, the discrete device of the second TO package and the insulating heat conduction material in the accommodating space;

the circuit board is used for connecting the discrete device of the first TO package and the discrete device of the second TO package.

In one embodiment, the insulated single-tube device further comprises a heat sink, and the insulating housing is fixed to the heat sink.

In one embodiment, the insulated single tube device further comprises a fixture, the insulated housing having a through hole; the fixing piece is matched with the through hole so as to fix the insulating shell on the radiator.

The insulating single tube device provided by the embodiment of the application repacks the discrete device packaged by the TO, so that the safety distance between the device and the radiator and between the device and the device can be reduced, the device interval is reduced, the power density of the power electronic device is improved, and the system cost is reduced.

Drawings

FIG. 1 is a schematic diagram of a prior art TO packaged discrete device structure;

FIG. 2 is another schematic view of a prior art TO-packaged discrete device structure;

FIG. 3 is a schematic diagram of a discrete device in a prior art TO packaged discrete device structure;

fig. 4 is a schematic structural diagram of an insulated single-tube device provided in an embodiment of the present application;

fig. 5 is a schematic view of another perspective of an insulated single-tube device structure according to an embodiment of the present application;

fig. 6 is a schematic view of another perspective of an insulated single-tube device structure according to an embodiment of the present application;

fig. 7 is a schematic diagram of an insulating housing in an insulated single-tube device structure according to an embodiment of the present application;

fig. 8 is a schematic structural diagram of another insulated single-tube device provided in an embodiment of the present application;

fig. 9 is a schematic view of another insulated single-tube device structure according to an embodiment of the present application from another perspective.

The implementation, functional features and advantages of the objectives of the present application will be further explained with reference to the accompanying drawings.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer and clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

In the description of the present application, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Example one

As shown in fig. 4-7, according TO one embodiment of the present application, there is provided an insulated single-tube device, which includes a TO-packaged discrete device 61, an insulating thermal conductive material 21, a thermal interface material 31, an insulating housing 51, and an encapsulating material 41.

In this example, the TO packaged discrete devices 61 include, but are not limited TO, MOSFETs, IGBTs, diodes. The thermal interface material 31 comprises silicone grease. The insulating heat conduction material 21 comprises at least one of aluminum oxide, aluminum nitride and silicon nitride, and can satisfy the insulating voltage of more than 2500V. The encapsulating material 41 includes epoxy resin.

In this example, the insulating housing 51 has a receiving space 511, and the encapsulating material 41 is used TO encapsulate the TO-encapsulated discrete device 61 and the insulating and thermally conductive material 21 in the receiving space 511. When packaged, the TO packaged discrete devices 61 are positioned over the insulating and thermally conductive material 21. The thermal interface material 31 is used for filling a gap between the TO packaged discrete device 61 and the insulating and thermal conductive material 21, so that heat dissipation is facilitated; specifically, the thermal interface material 31 may be coated on the upper surface of the insulating and thermally conductive material 21, and then the TO packaged discrete device 61 is disposed above the insulating and thermally conductive material 21. When the encapsulating material 41 is poured into the accommodating space 511, the encapsulating material 41 exceeds the upper surface of the TO-packaged discrete device 61.

The repackaged device does not need to consider the electrical gap, but only the creepage distance, which is the minimum of a1+ b1 and c1+ b 1. a1 and c1 are the transverse distance and longitudinal distance from the pins 611 to the whole edge of the packaged device, respectively, and b1 is the whole height of the packaged device, which is at least the sum of the height of the device 61 and the height of the insulating and heat-conducting material 21. Therefore, the creepage distance after repackaging is significantly increased, and the area of the insulating and heat conducting material 21 can be greatly reduced. And the creepage distance can easily reach 8mm, thus meeting the application of photovoltaic 1500V system. And for the occasion with higher insulation requirement, the safety distance can be increased by increasing the size of the insulating shell 51, the cost is low, and the realization is easy.

Example two:

as will be understood with reference TO fig. 8 TO 9, unlike the first embodiment, the second embodiment provides an insulated single-tube device including a first TO-packaged discrete device 62 and a second TO-packaged discrete device 63. The first TO packaged discrete device 62 and the second TO packaged discrete device 63 may be of the same type and connected in parallel, or may be formed by combining an IGBT, a MOS, or a Diode into different topologies, such as a half bridge, a Boost, a Buck, and the like.

The packaging material 41 encapsulates the first TO packaged discrete device 62, the second TO packaged discrete device 63 and the insulating and thermally conductive material 21 in the accommodating space 511. It should be noted that the number of the insulating thermal conductive material 21 and the thermal interface material 31 may be consistent with the number of discrete devices of the TO package. It should also be noted that the number of discrete devices in the TO package may be two or more, and is also feasible.

The insulated single-tube device provided by the second embodiment further comprises a fixing member 71, a circuit board 81, and a heat sink 91, and the insulated housing 51 further has a through hole 521. The wiring board 81 is used TO connect the first TO packaged discrete device 62 and the second TO packaged discrete device 63. After the fixing member 71 passes through the circuit board 81 and the through hole 521, the insulating housing 51 is fixed on the heat sink 91; the fixing member 71 can fix the wiring board 81 at the same time. The fixing member 71 may be a screw.

The insulating single tube device provided by the second embodiment can solve the insulating safety problem caused by the conduction of the screw in the traditional installation mode. The safety distance between devices and between the devices and the radiator is greatly reduced. Meanwhile, two or more devices are integrally packaged, so that the mounting quantity and the space between the devices can be reduced, and the device is convenient to fix.

The preferred embodiments of the present application have been described above with reference to the accompanying drawings, and are not intended to limit the scope of the claims of the application accordingly. Any modifications, equivalents and improvements which may occur to those skilled in the art without departing from the scope and spirit of the present application are intended to be within the scope of the claims of the present application.

Claims

1. An insulated single-tube device is characterized by comprising at least one TO packaged discrete device, an insulated heat conduction material, an insulated shell and a packaging material;

2. The insulated single-tube device of claim 1, wherein the discrete devices of the TO package are located above the insulating and thermally conductive material.

3. The insulated single-tube device according TO claim 2, wherein the encapsulating material is poured into the receiving space beyond the upper surface of the discrete devices of the TO package.

4. The insulated single-tube device of claim 2, further comprising a thermally conductive interface material TO fill gaps between the TO packaged discrete devices and the insulating thermally conductive material.

5. The insulated single-tube device of claim 4, wherein the thermally conductive interface material comprises silicone grease.

6. The insulated single-tube device of claim 1, wherein the encapsulation material comprises an epoxy.

7. The isolated single-tube device according TO claim 1, wherein the isolated single-tube device comprises a first TO-packaged discrete device, a second TO-packaged discrete device, and a wiring board;

8. The isolated single tube device according to any one of claims 1 to 7, wherein said isolated single tube device further comprises a heat sink, said insulating housing being secured to said heat sink.

9. The insulated single tube device of claim 8, further comprising a mount, the insulated housing having a through-hole; the fixing piece is matched with the through hole so as to fix the insulating shell on the radiator.