CN110838712A - Intelligent power module and air conditioner - Google Patents
Intelligent power module and air conditioner Download PDFInfo
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- CN110838712A CN110838712A CN201911179509.6A CN201911179509A CN110838712A CN 110838712 A CN110838712 A CN 110838712A CN 201911179509 A CN201911179509 A CN 201911179509A CN 110838712 A CN110838712 A CN 110838712A
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
- H02H7/00—Emergency protective circuit arrangements specially adapted for specific types of electric machines or apparatus or for sectionalised protection of cable or line systems, and effecting automatic switching in the event of an undesired change from normal working conditions
- H02H7/20—Emergency protective circuit arrangements specially adapted for specific types of electric machines or apparatus or for sectionalised protection of cable or line systems, and effecting automatic switching in the event of an undesired change from normal working conditions for electronic equipment
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
- H02H5/00—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal non-electric working conditions with or without subsequent reconnection
- H02H5/04—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal non-electric working conditions with or without subsequent reconnection responsive to abnormal temperature
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
- H02H5/00—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal non-electric working conditions with or without subsequent reconnection
- H02H5/04—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal non-electric working conditions with or without subsequent reconnection responsive to abnormal temperature
- H02H5/042—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal non-electric working conditions with or without subsequent reconnection responsive to abnormal temperature using temperature dependent resistors
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
- H02H7/00—Emergency protective circuit arrangements specially adapted for specific types of electric machines or apparatus or for sectionalised protection of cable or line systems, and effecting automatic switching in the event of an undesired change from normal working conditions
- H02H7/20—Emergency protective circuit arrangements specially adapted for specific types of electric machines or apparatus or for sectionalised protection of cable or line systems, and effecting automatic switching in the event of an undesired change from normal working conditions for electronic equipment
- H02H7/205—Emergency protective circuit arrangements specially adapted for specific types of electric machines or apparatus or for sectionalised protection of cable or line systems, and effecting automatic switching in the event of an undesired change from normal working conditions for electronic equipment for controlled semi-conductors which are not included in a specific circuit arrangement
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
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Abstract
The invention discloses an intelligent power module and an air conditioner, wherein the intelligent power module comprises: the mounting device comprises a mounting carrier, wherein a mounting position is arranged on the surface of one side of the mounting carrier; the power chip is arranged on the mounting position of the mounting carrier; the temperature detection device is arranged close to the power chip; and the driving chip is arranged on the mounting position of the mounting carrier, is electrically connected with the output end of the temperature detection device, and is used for controlling the power chip to stop working when the temperature detection device detects that the junction temperature of the power chip exceeds a preset temperature value. The invention improves the junction temperature detection accuracy and timeliness of the power chip.
Description
Technical Field
The invention relates to the technical field of electronic circuits, in particular to an intelligent power module and an air conditioner.
Background
The intelligent power module is usually integrated with a power device, and the temperature rise of the power device is severe, so that the junction temperature of the power device needs to be detected in real time. At present, the distance between a driving IC and a heating power device (IGBT and FRD) is far, and a temperature detection circuit inside the IC cannot detect the junction temperature of the power device. The NTC of IPM is generally mounted on a substrate, and is far away from the power device, so that the junction temperature of the power device cannot be detected.
Disclosure of Invention
The invention mainly aims to provide an intelligent power module and an air conditioner, and aims to improve junction temperature detection accuracy and timeliness of a power chip.
In order to achieve the above object, the present invention provides an intelligent power module, including:
the mounting device comprises a mounting carrier, wherein a mounting position is arranged on the surface of one side of the mounting carrier;
the power chip is arranged on the mounting position of the mounting carrier;
the temperature detection device is arranged close to the power chip;
and the driving chip is arranged on the mounting position of the mounting carrier, electrically connected with the output end of the temperature detection device and used for controlling the power chip to stop working when the temperature detection device detects that the junction temperature of the power chip exceeds a preset temperature value.
Optionally, the temperature detection device is stacked on the power die.
Optionally, the temperature detection device is a temperature sensitive resistor;
one end of the temperature-sensitive resistor is welded to the emitting electrode of the power chip, and the other end of the temperature-sensitive resistor is electrically connected with the temperature detection end of the driving chip through a metal lead.
Optionally, the smart power module further comprises:
the current sampling resistor is arranged on the mounting position of the mounting carrier, one end of the current sampling resistor is electrically connected with the emitting electrode of the power interval through a metal lead, and the other end of the current sampling resistor is grounded.
Optionally, the driving chip includes a driving circuit and a comparison circuit, a first input end of the comparison circuit is connected to an output end of the temperature detection device, a second input end of the comparison circuit is connected to a preset temperature threshold, an output end of the comparison circuit is connected to a temperature feedback end of the driving circuit, and an output end of the driving circuit is connected to a controlled end of the power chip.
Optionally, the number of the power chips is multiple; the driving chip is electrically connected with the plurality of power chip respectively through metal binding wires;
the positions and the number of the temperature detection devices correspond to the plurality of power chips.
Optionally, the mounting carrier comprises:
a heat-dissipating substrate; and the number of the first and second groups,
the circuit wiring layer and the insulating layer are sequentially arranged on the heat dissipation substrate;
the driving chip, the power chip and the temperature detection device are arranged on the circuit wiring layer.
Optionally, the intelligent power module further includes a package casing for packaging the driving chip, the power chip and the temperature detection device.
Optionally, the smart power module further includes a heat sink disposed on one side of the heat dissipation substrate.
The invention also provides an air conditioner which comprises the intelligent power module.
In the embodiment of the invention, the installation position is arranged on the installation substrate; arranging the power device on a mounting position of a mounting substrate; and arranging a temperature detection device close to the power device to detect the junction temperature of the power device and output the junction temperature to the driving chip, so that when the temperature detection device detects that the junction temperature of the power device exceeds a preset temperature value, the power device is controlled to stop working. The invention solves the problems that the distance between the driving chip and a heating power device (IGBT and a fast recovery diode) is long, so that a temperature detection circuit in the driving chip can not detect the junction temperature of the power device and can not perform over-temperature protection on the power chip. The junction temperature detection accuracy and the timeliness of the power chip are improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of an embodiment of an intelligent power module according to the present invention;
FIG. 2 is a schematic circuit diagram of an embodiment of an intelligent power module according to the invention;
fig. 3 is a schematic cross-sectional view of an embodiment of an intelligent power module according to the invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 10 | |
40 | |
| 11 | |
41 | |
| 12 | |
42 | |
| 13 | |
50 | |
| 20 | |
60 | |
| 21 | Fast recovery diode | Rs | |
| 30 | Temperature detection device |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides an intelligent power module.
An intelligent Power module, i.e., ipm (intelligent Power module), is a Power driving product combining Power electronics and integrated circuit technology. The intelligent power module integrates a power switch device and a high-voltage driving circuit and is internally provided with fault detection circuits such as overvoltage, overcurrent and overheat. The intelligent power module receives a control signal of the MCU to drive a subsequent circuit to work on one hand, and sends a state detection signal of the system back to the MCU on the other hand. Compared with the traditional discrete scheme, the intelligent power module wins a bigger and bigger market with the advantages of high integration degree, high reliability and the like, is particularly suitable for a frequency converter of a driving motor and various inverter power supplies, and is an ideal power electronic device for variable-frequency speed regulation, metallurgical machinery, electric traction, servo drive and variable-frequency household appliances. At present, the distance between a driving IC and a heating power device (IGBT and FRD) is far, and a temperature detection circuit inside the IC cannot detect the junction temperature of the power device. The NTC of IPM is generally mounted on a substrate, and is far away from the power device, so that the junction temperature of the power device cannot be detected.
Referring to fig. 1, in an embodiment of the present invention, the smart power module includes:
the mounting structure comprises a mounting carrier 10, wherein a mounting position is arranged on one side surface of the mounting carrier 10;
a power chip 20 disposed at the mounting position of the mounting carrier 10;
a temperature detection device 30 disposed near the power chip 20;
the driving chip 40 is disposed on the mounting position of the mounting carrier 10, the driving chip 40 is electrically connected to the output end of the temperature detection device 30, and the driving chip 40 is configured to control the power chip 20 to stop working when the temperature detection device 30 detects that the junction temperature of the power chip 20 exceeds a preset temperature value.
In this embodiment, the mounting carrier 10 may be implemented by any one of an aluminum substrate, an aluminum alloy substrate, a copper substrate, or a copper alloy substrate. The mounting carrier 10 is a mounting carrier 10 of IGBT chips and the driving chip 40, and the shape of the mounting carrier 10 may be determined according to the specific position, number and size of the IGBT chips, and may be a square, but is not limited to a square. The mounting carrier 10 is provided with a circuit wiring layer 12, and the circuit wiring layer 12 forms corresponding lines and mounting positions, i.e. pads, for mounting each electronic element in the IGBT chip on the mounting carrier 10 according to the circuit design of the intelligent power module.
When the mount carrier 10 is also realized by a DBC (copper clad ceramic substrate), the copper clad ceramic substrate includes an insulating heat dissipation layer and a circuit wiring layer 12 formed on the insulating heat dissipation layer. When the mounting carrier 10 made of a metal material is used, the mounting carrier 10 includes a heat dissipation substrate 13, an insulating layer 11 laid on the heat dissipation substrate 13, and a circuit wiring layer 12 formed on the insulating layer 11. In the present embodiment, the mount carrier 10 may be selected as a single-sided wiring board. The insulating layer 11 is sandwiched between the circuit wiring layer 12 and the metal mounting carrier 10. The insulating layer is used for realizing electrical isolation and electromagnetic shielding between the circuit wiring layer 12 and the metal mounting carrier 10 and reflecting external electromagnetic interference, so that external electromagnetic radiation is prevented from interfering normal work of an IGBT chip, and interference influence of electromagnetic radiation in the surrounding environment on electronic elements in the intelligent power module is reduced. The insulating layer 11 is made of a thermoplastic adhesive or a thermosetting adhesive, so as to achieve the fixed connection and insulation between the mounting carrier 10 and the circuit wiring layer 12. The insulating layer 11 may be a high thermal conductivity insulating layer 11 made of one or more of epoxy resin, alumina, and high thermal conductivity filling material. In the process of manufacturing the mount carrier 10, after the insulating layer 11 is provided on the heat dissipating substrate 13, a copper foil may be laid on the insulating layer 11 and etched in accordance with a predetermined circuit design, thereby forming the circuit wiring layer 12.
The mounting carrier 10 may also be implemented by a lead frame, the lead frame is provided with a base island and a connecting frame, and the driving chip 40 and each IGBT chip are disposed on the corresponding base island and electrically connected to the connecting frame through a metal lead.
The power chip 20 may be a gallium nitride (GaN) power chip 20, a Si-based power chip 20, or a SiC-based power chip 20, and the present embodiment preferably employs the gallium nitride (GaN) power chip 20. The number of the power chips 20 may be one or multiple, and when the number of the power chips 20 is multiple, the power chips 20 may include four power chips 20, or a multiple of four power chips, or six power chips 20, or a multiple of six power chips, and the six power chips 20 form an inverter circuit, so that the power converter is applied to electrical equipment such as an inverter power supply, a frequency converter, refrigeration equipment, metallurgical mechanical equipment, electric traction equipment, and particularly to frequency conversion household appliances. When the intelligent power module works, the driving chip 40 outputs a corresponding PWM control signal to drive and control the corresponding power chip 20 to be turned on/off, so as to output driving electric energy to drive a load such as a motor to work.
In this embodiment, the number and the positions of the fast recovery diodes 21 correspond to those of each power chip 20, and six fast recovery diodes may be selected. The fast recovery diode 21 is a high power anti-parallel diode for achieving fast turn-off of the power chip 20. The power chip 20 may be a power tube such as an IGBT or a MOSFET, and in the embodiment of the present invention, the IGBT is taken as an example for description. The power chip 20 may specifically be a SiC MOSFET or a SiC IGBT, or when a GaN HEMT device, the switching loss of the intelligent power module is reduced to be low, which is further beneficial to saving electric energy and reducing the heat generation of the module, and the fast recovery diode 21 may be implemented by a fast recovery diode 21 made of a Si material or a schottky diode, so that the production cost of the intelligent power module is reduced while the power consumption of the intelligent power module is low. In some embodiments, the power chip 20 may also be implemented by using an RC-IGBT, which integrates a fast recovery diode FRD packaged in anti-parallel with the IGBT power chip 20 on the same chip, thereby reducing the size of the inverter bridge circuit. So set up, be favorable to improving power density, reduce high integrated intelligent power module's volume, manufacturing cost and encapsulation process, still be favorable to improving high integrated intelligent power module's reliability simultaneously.
The driving chip 40 is integrated with a temperature detection trigger circuit and a driving circuit 41, and when the intelligent power module works, the driving circuit 4130 outputs a corresponding control signal to control the power chip 20 to be turned on/off, so as to output driving power to drive a load such as a motor to work. The power chip 20 generates high heat in this process, and if the temperature is too high and exceeds the junction temperature of the power chip 20, the power chip 20 is easily damaged. Therefore, the driving chip 40 receives the voltage signal of the temperature detection device 30 reflecting the junction temperature of the power chip 20, compares the voltage signal with the preset voltage threshold, and determines whether the junction temperature of the power chip 20 is too high according to the comparison result of the voltage signal and the preset voltage threshold, wherein the temperature corresponding to the preset voltage threshold is the over-temperature protection point of the IGBT.
In the embodiment of the invention, the installation position is arranged on the installation substrate; arranging the power device on a mounting position of a mounting substrate; and arranging a temperature detection device close to the power device to detect the junction temperature of the power device and output the junction temperature to the driving chip, so that when the temperature detection device detects that the junction temperature of the power device exceeds a preset temperature value, the power device is controlled to stop working. The invention solves the problems that the distance between the driving chip and a heating power device (IGBT and a fast recovery diode) is long, so that a temperature detection circuit in the driving chip can not detect the junction temperature of the power device and can not perform over-temperature protection on the power chip. The junction temperature detection accuracy and the timeliness of the power chip 20 can be improved.
Referring to fig. 1 to 3, in an embodiment, the temperature detection device 30 is stacked on the power chip 20.
In this embodiment, the temperature detection device 30 is a temperature sensitive resistor;
one end of the temperature sensitive resistor is welded to the emitter of the power chip 20, and the other end of the temperature sensitive resistor is electrically connected with the temperature detection end of the driving chip 40 through a metal lead.
In this embodiment, the temperature-sensitive resistor may be a positive temperature coefficient thermistor (PTC) or a negative temperature coefficient thermistor (NTC). When the IGBT chip is mounted on the mounting carrier 10, the mounting carrier 10 is provided with a pad. The IGBT die is provided with a metal layer for forming each pad of the IGBT, such as a gate pad, a collector pad, and an emitter pad, the gate pad and the emitter pad of the IGBT die may be disposed upward, the collector pad may be disposed downward, and the gate pad, the emitter pad, and the collector pad are connected to the mounting sites and pads formed by the circuit wiring layer of the mounting carrier 10 through metal binding wires. It is understood that the driving chip 40 and the power switch tube may be implemented by using a bare wafer, or may be implemented by using a packaged patch element. The temperature detecting device 30 is attached to the power switch, and specifically, may be stacked on the power chip 20 and soldered to an IGBT emitter pad by soldering, and the IGBT emitter pad is connected to the mounting carrier 10 by a lead, and then connected to a pad linked to a temperature feedback pin of the driving chip 40 by a bonding wire (metal lead), or directly connected to a pad of the temperature feedback pin of the driving chip 40. Under a certain current, the voltage of the temperature detection device 30, e.g., an NTC resistor, decreases as its own temperature increases, while the PTC is reversed. Therefore, the voltage fed back to the temperature feedback pin of the driving chip 40 also decreases as the NTC temperature increases, i.e. in practice, the NTC temperature voltage varies negatively with the IGBT junction temperature. Due to the fact that the NTC and the IGBT are welded through metal solder, the NTC temperature and the IGBT chip junction temperature are basically consistent. The driving chip 40 may determine that the voltage is lower than a certain threshold according to the voltage of the temperature feedback pin, and stop outputting the driving signal, so that the IGBT stops working, and the temperature detection and protection functions are performed.
Referring to fig. 1 to 3, in an embodiment, the smart power module further includes:
and the current sampling resistor Rs is arranged on the mounting position of the mounting carrier 10, one end of the current sampling resistor Rs is electrically connected with the emitting electrode of the power interval through a metal lead, and the other end of the current sampling resistor Rs is grounded.
In this embodiment, the intelligent power module is further provided with circuit modules for protecting the IGBT and the motor, such as an overcurrent protection circuit and an overvoltage protection circuit, and specifically, the driving chip 40 may be provided with a voltage comparator, a reference voltage output module, and the like. The current sampling resistor Rs collects current flowing through the power chip 20, and outputs a collected current signal to the driving chip 40, the driving chip 40 judges whether the current flowing through the power chip 20 is excessive according to the collected current, for example, when the phase current of the motor is too large, if the phase current is too large, the driving motor stalls, or the motor is controlled to continue to rotate at a high speed due to inertia when the motor is stopped, the phase current Iu, Iv and Iw of the motor-driven internal winding are too large, and at the moment, the phase current flows through the power chip 20 and is collected by the current sampling resistor Rs, and the driving chip 40 outputs the driving chip 40 to control the IGBT to stop working, so that the motor is braked, and the power chip 20 is prevented from being damaged due to the overcurrent. The current sampling resistor Rs can be selected as a low-temperature drift sampling resistor, so that the problem that the output state of the voltage comparator is unstable due to interference of a sampling signal output by the current sampling resistor Rs or fluctuation close to a reference voltage value, and the protection state of the intelligent power module is unstable is solved.
Referring to fig. 1 to 3, in an embodiment, the driving chip 40 includes a driving circuit 41 and a comparing circuit 42, a first input terminal of the comparing circuit 42 is connected to the output terminal of the temperature detecting device 30, a second input terminal of the comparing circuit 42 is connected to a preset temperature threshold, an output terminal of the comparing circuit 42 is connected to a temperature feedback terminal of the driving circuit 41, and an output terminal of the driving circuit 41 is connected to the controlled terminal of the power chip 20.
In this embodiment, the temperature detection device 30 may detect the junction temperature of the power chip 20, specifically, output a voltage signal reflecting the temperature of the power chip 20, compare the voltage signal with a preset voltage threshold, and determine whether the junction temperature of the power chip 20 is too high according to a comparison result between the detected voltage signal and the preset voltage threshold, where the temperature corresponding to the preset voltage threshold is an over-temperature protection point of the IGBT. The driving chip 40 may design logic to be a valid signal, i.e. a trigger signal, less than a certain threshold. When the logic circuit receives the valid signal, all the outputs of the driving chip 40 are turned off, so that the driving chip 40 stops working, and thus the junction temperature of the power chip 20 can be protected from exceeding the preset threshold.
It can be understood that, when the temperature detection device 30 is a ntc thermistor, the ntc thermistor is connected in series with the current sampling resistor Rs, and according to the principle of serial voltage division, the larger the ratio of the ntc thermistor to the current sampling resistor Rs, the larger the voltage divided by the ntc thermistor, and because the resistance value of the current sampling resistor Rs is smaller, the influence on the resistance value of the ntc thermistor when the ntc thermistor is connected in series can be almost ignored. Therefore, the temperature detection device 30 and the power chip 20 can be packaged into a whole, and the junction temperature of the IGBT emitter is detected, so that the junction temperature detection accuracy and the timeliness of the power chip 20 are improved.
Referring to fig. 1 to 3, in an embodiment, the number of the power chips 20 is multiple; the driving chip 40 is electrically connected to the plurality of power chips 20 through metal binding wires;
the positions and the number of the temperature detection devices 30 correspond to the plurality of power chips 20.
The driving chip 40 is integrated with a plurality of temperature detection trigger circuits, and the number of the temperature detection trigger circuits corresponds to the number of the power chips 20.
Or, the number of the driving chips 40 corresponds to the number of the power chips 20, and one temperature detection trigger circuit and one driving circuit 41 are integrated in each of the driving chips 40.
The number of the power chips 20 may be one or multiple, and when the number of the power chips 20 is multiple, the power chips 20 may include four power chips 20, or a multiple of four power chips, or six power chips 20, or a multiple of six power chips, and the six power chips 20 form an inverter circuit, so that the power converter is applied to electrical equipment such as an inverter power supply, a frequency converter, refrigeration equipment, metallurgical mechanical equipment, electric traction equipment, and particularly to frequency conversion household appliances. When the intelligent power module works, the driving chip 40 outputs a corresponding PWM control signal to drive and control the corresponding power chip 20 to be turned on/off, so as to output driving electric energy to drive a load such as a motor to work.
The number of the driving chips 40 may be one, for example, the HVIC driving chip 40, and the driving chip 40 is an integrated chip, in which the driving circuits 41 of the four-way, six-way or three-way power chips 20 are integrated, and the integration may be specifically configured according to the number of the driving chips 40. The number of the driving chips 40 may also be multiple, for example, two, four, or six, the number of the multiple driving chips 40 may correspond to the number of the power chips 20, and each driving chip 40 drives one power chip 20 to operate. The driving chip 40 may also be provided with two separate driving chips 40, namely an upper bridge arm driving chip 40 and a lower bridge arm driving chip 40, and respectively drive the upper bridge arm power chip 20 and the lower bridge arm power chip 20 to operate, and the power chips 20 and the driving chips 40 are electrically connected through metal leads to form a current loop. When the intelligent power module works, the driving chip 40 outputs a corresponding control signal to control the conduction of the corresponding power chip 20, so as to output driving electric energy to drive a motor and other loads to work, and heat generated by the power chip 20 in the process is conducted to the mounting carrier 10 through the heat sink 30, so as to be dissipated through the heat sink 30 and the mounting carrier 10.
When one driver chip 40 is provided, the driver chip 40 has the comparison circuits 42 integrated therein, the number of which corresponds to the number of the power chips 20, and when a plurality of driver chips 40 are provided, the number of the driver chips 40 corresponds to the number of the power chips 20. And each driver chip 40 has integrated therein a comparator circuit 42 for temperature protection of the power chip 20.
Referring to fig. 1 to 3, in an embodiment, the smart power module further includes a package housing 50 that encapsulates the driving chip 40 and the power chip 20.
In this embodiment, the package housing 50 may be made of epoxy resin, aluminum oxide, silicon dioxide, or other materials. When the package case 50 is manufactured, materials such as epoxy resin, aluminum oxide, boron nitride or aluminum nitride can be mixed, and then the mixed package material is heated; after cooling, the packaging material is crushed, and then the packaging shell 50 material is rolled and formed in a packaging mold by an ingot molding process to form the packaging shell 50, and then the driving chip 40 and the power chip 20 are packaged in the packaging shell 50. The smart power module may package the driving chip 40, the power chip 20 and the mounting carrier 10 in a full package or a half package. Or the mounting carrier 10 with the chip mounted thereon is placed in a mold through an injection molding process and an encapsulation mold, and then an encapsulation material is injected into the mold to encapsulate the chip and the mounting carrier 10 in the encapsulation housing 50, so as to form the encapsulation housing 50 after molding. Therefore, the chip can be subjected to insulation treatment, and the EMI performance of the intelligent power module can be improved.
In another embodiment, the smart power module may further be provided with a housing, and the housing may be implemented by a casing formed by plastic such as PPS material, PBT material, or the like. When the intelligent power module is subjected to plastic package, the installation carrier 10 provided with the driving chip 40 and the power chip 20 is placed in the shell, then the packaging material is injected into the shell, so that the packaging shell 50 is formed after molding, and the driving chip 40, the power chip 20 and the installation carrier 10 are packaged in the packaging shell 50. Thus, the driving chip 40 can be insulated, and the EMI performance of the smart power module can be improved. The driving chip 40, the power chip 20, the mounting carrier 10 and the like can be formed into an integral intelligent power module by filling the plastic package glue in the shell, and the isolation of the intelligent power module can be improved and the internal interference can be reduced by the insulation filling of the plastic package glue.
Referring to fig. 1 to 3, in an embodiment, the smart power module further includes a heat sink (not shown) disposed on a side of the mounting carrier 10 facing away from the power component 20.
In this embodiment, in order to improve the heat dissipation efficiency of the intelligent power module, a semi-encapsulated package may be adopted, that is, the driving power module of the intelligent power module is partially exposed outside the package housing 50, and when the intelligent power module is further provided with a heat sink, the surface of the driving power module exposed outside the package housing 50 of the intelligent power module may be better attached to the heat sink. The heat sink can be made of high thermal conductive materials with good heat dissipation effects such as aluminum and aluminum alloy, so that heat generated by the power switch tube in the driving power module is conducted to the heat sink through the mounting carrier 10, the contact area between the heat generated by the power chip 20 and air is further increased, and the heat dissipation rate is improved. The radiator can also be provided with a radiator body and a plurality of radiating blades, and the plurality of radiating blades are arranged on one side of the radiator body at intervals. So set up, can increase the area of contact of radiator and air, also be when the radiator during operation, increase the area of contact of heat on the radiator and air to accelerate the radiating rate of radiator. Meanwhile, the material of the radiator can be reduced, and the over-high cost caused by the excessive material application of the radiating fins 30 can be avoided.
Referring to fig. 1 to 3, in an embodiment, the smart power module further includes a pin 60, and the pin 60 is disposed on the circuit wiring layer 12 of the mounting carrier 10 and electrically connected to each of the driving chips 40 and the power chip 20 through a metal lead.
In this embodiment, the corresponding circuit wiring layer 12 is further provided with a pin pad 23 of the pin 60, and the pin 60 is correspondingly soldered on the pin pad.
The pins 60 may be implemented by gull-wing pins 60 or straight pins 60, and in this embodiment, preferably, the straight pins 60 are soldered at the pin pad positions on the mounting positions 221 corresponding to the circuit wiring layer 12, and the pins 60 are electrically connected to the power chips 20 and the driving chips 40 through metal leads. In another embodiment, one end of each pin 60 is fixed on the mounting carrier 10, and the other end of each pin 60 extends away from the mounting carrier 10, and the extending direction of each pin 60 is parallel to the plane of the mounting carrier 10.
The invention also provides an air conditioner which comprises the intelligent power module. The invention also provides an air conditioner which comprises the intelligent power module. The detailed structure of the intelligent power module can refer to the above embodiments, and is not described herein again; it can be understood that, because the intelligent power module is used in the air conditioner of the present invention, the embodiment of the air conditioner of the present invention includes all technical solutions of all embodiments of the intelligent power module, and the achieved technical effects are also completely the same, and are not described herein again.
The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A smart power module, comprising:
the mounting device comprises a mounting carrier, wherein a mounting position is arranged on the surface of one side of the mounting carrier;
the power chip is arranged on the mounting position of the mounting carrier;
the temperature detection device is arranged close to the power chip;
and the driving chip is arranged on the mounting position of the mounting carrier, electrically connected with the output end of the temperature detection device and used for controlling the power chip to stop working when the temperature detection device detects that the junction temperature of the power chip exceeds a preset temperature value.
2. The smart power module of claim 1 wherein said temperature sensing device is stacked on said power die.
3. The smart power module as recited in claim 1 wherein the temperature sensing device is a temperature sensitive resistor;
one end of the temperature-sensitive resistor is welded to the emitting electrode of the power chip, and the other end of the temperature-sensitive resistor is electrically connected with the temperature detection end of the driving chip through a metal lead.
4. The smart power module of claim 3, wherein the smart power module further comprises:
the current sampling resistor is arranged on the mounting position of the mounting carrier, one end of the current sampling resistor is electrically connected with the emitting electrode of the power interval through a metal lead, and the other end of the current sampling resistor is grounded.
5. The smart power module as claimed in claim 1, wherein the driving chip comprises a driving circuit and a comparing circuit, a first input terminal of the comparing circuit is connected to the output terminal of the temperature detecting device, a second input terminal of the comparing circuit is connected to a preset temperature threshold, an output terminal of the comparing circuit is connected to the temperature feedback terminal of the driving circuit, and an output terminal of the driving circuit is connected to the controlled terminal of the power chip.
6. The smart power module of claim 1 wherein the number of power chips is plural; the driving chip is electrically connected with the plurality of power chip respectively through metal binding wires;
the positions and the number of the temperature detection devices correspond to the plurality of power chips.
7. The smart power module of any of claims 1-6 wherein said mounting carrier comprises:
a heat-dissipating substrate; and the number of the first and second groups,
the circuit wiring layer and the insulating layer are sequentially arranged on the heat dissipation substrate;
the driving chip, the power chip and the temperature detection device are arranged on the circuit wiring layer.
8. The smart power module of claim 7 further comprising a package housing enclosing the driver chip, the power chip, and the temperature sensing device.
9. The smart power module of claim 7 further comprising a heat sink disposed on one side of the heat-dissipating substrate.
10. An air conditioner characterized in that it comprises a smart power module according to any one of claims 1 to 9.
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| CN201911179509.6A CN110838712A (en) | 2019-11-26 | 2019-11-26 | Intelligent power module and air conditioner |
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| CN201911179509.6A CN110838712A (en) | 2019-11-26 | 2019-11-26 | Intelligent power module and air conditioner |
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| CN113551796A (en) * | 2021-07-12 | 2021-10-26 | 珠海格力电器股份有限公司 | Bridge arm junction temperature detection device and method and air conditioner |
| CN115864302A (en) * | 2023-02-06 | 2023-03-28 | 广州中基国威电子科技有限公司 | Heating protection circuit, heating device and protection method |
| CN118100083A (en) * | 2024-04-29 | 2024-05-28 | 瓴芯电子科技(无锡)有限公司 | Temperature rise protection circuit and power switch chip |
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Application publication date: 20200225 |