CN214455044U - Wafer material loading and carrying mechanism - Google Patents
Wafer material loading and carrying mechanism Download PDFInfo
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- CN214455044U CN214455044U CN202022504120.9U CN202022504120U CN214455044U CN 214455044 U CN214455044 U CN 214455044U CN 202022504120 U CN202022504120 U CN 202022504120U CN 214455044 U CN214455044 U CN 214455044U
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Abstract
The utility model relates to a wafer loading and transporting mechanism, which comprises a frame, a loading mechanism and a transporting mechanism, wherein the loading mechanism and the transporting mechanism are arranged on the frame; the feeding mechanism comprises a feeding support and a feeding lifting platform, a feeding driving assembly, side guide plates and rear guide plates are arranged on the feeding support, the feeding lifting platform is used for stacking wafers, the side guide plates are arranged on two sides of the feeding lifting platform, and the rear guide plates are located on the discharging side of the feeding mechanism; the carrying mechanism comprises a transverse moving driving assembly, a transverse moving plate, a sucker lifting driving device and a disc frame; the sucking disc lifting driving device is arranged on the transverse moving plate, and a plurality of sucking discs which are distributed annularly are arranged on the disc rack; the scheme provides an automatic wafer loading and transporting mechanism, stacked wafer workpieces can be sequentially and automatically loaded, and the wafer workpieces are transported to the next station by the transporting mechanism for processing; the whole process does not need manual intervention, the processing efficiency is improved, the manpower is reduced, and the risk of manual operation injury is avoided.
Description
Technical Field
The utility model relates to a wafer material loading transport mechanism belongs to semiconductor processing equipment technical field.
Background
The wafers need to be loaded and transported in the processing process, most of the conventional processing processes are manual loading and transporting, the actions are complicated, the labor intensity is high, and time, labor and cost are wasted; and if the personnel carry the workpiece to the cutting equipment manually, the safety risk exists; the overall feeding and carrying rhythm is slow, and the production cycle is long.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a wafer material-carrying mechanism for overcoming the defects of the prior art.
In order to achieve the above purpose, the utility model adopts the technical scheme that: a wafer loading and conveying mechanism comprises a rack, a loading mechanism and a conveying mechanism, wherein the loading mechanism and the conveying mechanism are arranged on the rack; the feeding mechanism comprises a feeding support and a feeding lifting platform, a feeding driving assembly, side guide plates and rear guide plates are arranged on the feeding support, the feeding driving assembly drives the feeding lifting platform to lift, the feeding lifting platform is used for stacking wafers, the side guide plates are arranged on two sides of the feeding lifting platform, and the rear guide plates are positioned on the discharging side of the feeding mechanism; the carrying mechanism comprises a transverse moving driving assembly, a transverse moving plate, a sucker lifting driving device and a disc frame; the transverse moving driving assembly drives the transverse moving plate to transversely move, the sucking disc lifting driving device is arranged on the transverse moving plate and drives the disc frame to lift, and a plurality of sucking discs distributed in an annular mode are arranged on the disc frame.
Preferably, the feeding driving assembly comprises a feeding driving motor, a motor driving belt mechanism and a lifting driving belt mechanism, and the feeding driving motor drives the lifting driving belt mechanism to move through the motor driving belt mechanism; the feeding device is characterized in that a vertical sliding rail is arranged on the feeding support, the feeding lifting table is in sliding fit with the vertical sliding rail, and the feeding lifting table is matched with the lifting transmission belt mechanism through a belt clamping plate.
Preferably, a feeding induction device is arranged at the top of the feeding support.
Preferably, the transverse moving driving assembly is a motor screw rod assembly, the transverse moving plate is of a transverse long structure, the sucking disc lifting driving device is arranged at one end of the transverse moving plate, and the other end of the transverse moving plate is provided with a balancing weight.
Preferably, the traverse plate is further provided with a traverse position sensing frame, and the traverse position sensing frame is used for being matched with a traverse position sensor.
Preferably, the disc rack is provided with a reinforcing rib, and the reinforcing rib extends to the other side of the disc rack from the connecting part of the disc rack and the suction disc lifting driving device.
Because of above-mentioned technical scheme's application, compared with the prior art, the utility model have the following advantage:
the scheme provides an automatic wafer loading and transporting mechanism, stacked wafer workpieces can be sequentially and automatically loaded, and the wafer workpieces are transported to the next station by the transporting mechanism for processing; the whole process does not need manual intervention, the processing efficiency is improved, the manpower is reduced, and the risk of manual operation injury is avoided.
Drawings
The technical scheme of the utility model is further explained by combining the attached drawings as follows:
fig. 1 is a schematic perspective view of a wafer loading and transporting mechanism according to the present invention;
fig. 2 is a schematic three-dimensional structure diagram of the feeding mechanism of the present invention;
FIG. 3 is an enlarged view of FIG. 2 at A;
fig. 4 is a schematic perspective view of the carrying mechanism of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1-4, a wafer loading and transporting mechanism according to the present invention includes a frame 10, and a loading mechanism 1 and a transporting mechanism 2 disposed on the frame 10; the feeding mechanism 1 comprises a feeding support 11 and a feeding lifting platform 12, a feeding driving assembly, a side guide plate 13 and a rear guide plate 14 are arranged on the feeding support 11, the feeding driving assembly drives the feeding lifting platform 12 to lift, the feeding lifting platform 12 is used for stacking wafers, the side guide plate 13 is arranged on two sides of the feeding lifting platform 12, and the rear guide plate 14 is located on the discharging side of the feeding mechanism.
As shown in fig. 3, the feeding driving assembly includes a feeding driving motor 15, a motor belt mechanism 16 and a lifting belt mechanism 17, and the feeding driving motor 15 drives the lifting belt mechanism 17 to move through the motor belt mechanism 16; a vertical sliding rail is arranged on the feeding support 11, a supporting section bar is arranged at the bottom of the feeding lifting table 12, and the supporting section bar has a structure in sliding fit with the vertical sliding rail; the feeding lifting platform 12 is matched with a belt of a lifting transmission belt mechanism 17 through a belt clamping plate 18, and the belt drives the feeding lifting platform 12 to lift through the belt clamping plate 18 in the transmission process; and a feeding sensing device 19 is arranged at the top of the feeding support 11, and the feeding sensing device 19 is a photoelectric sensor.
Wafer workpieces are stacked and placed on the feeding lifting platform 12, the feeding driving motor 15 is a stepping motor, the height of the feeding lifting platform 12 for increasing the thickness of one wafer workpiece every time is controlled, when the topmost wafer workpiece rises to the top of the feeding support 11, the topmost wafer workpiece can be sensed by the feeding sensing device 19, the feeding driving motor 15 stops stepping at the moment, and the wafer workpieces have peripheral flat edges, so that in the rising process, the two side guide plates 13 and the rear guide plate 14 play roles in lifting protection and guiding for the workpieces, and wafer deflection and edge scratching are avoided.
As shown in fig. 4, the carrying mechanism 2 includes a traverse driving assembly 21, a traverse plate 22, a suction cup lifting driving device 23, and a disk rack 24; the transverse moving driving assembly 21 is a motor screw rod assembly, the transverse moving driving assembly 21 drives the transverse moving plate 22 to transversely move, the transverse moving plate 22 is of a transverse long structure, the sucking disc lifting driving device 23 is an air cylinder, the sucking disc lifting driving device 23 is arranged at one end of the transverse moving plate 22, and a balancing weight 26 is arranged at the other end of the transverse moving plate 22 so as to keep the balance of the transverse moving plate 22; the traverse plate 22 is also provided with a traverse position induction frame 27, and the traverse position induction frame 27 is used for matching with a traverse position sensor to avoid the situation that the traverse is not in place or exceeds the stroke; the suction cup lifting driving device 23 drives the disc frame 24 to lift, a plurality of suction cups 25 which are uniformly distributed in an annular shape are arranged on the disc frame 24, reinforcing ribs 28 are further arranged on the disc frame 24, and the reinforcing ribs 28 extend to the other side of the disc frame 24 from the connecting part of the disc frame 24 and the suction cup lifting driving device 23 so as to ensure the rigidity of the disc frame 24.
The transverse moving driving assembly 21 drives the disc rack 24 to move to the feeding mechanism 1, the suction disc lifting driving device 23 drives the disc rack 24 to lift and take materials, and then the transverse moving driving assembly 21 drives the disc rack 24 to move to the next station for processing.
The above is only a specific application example of the present invention, and does not constitute any limitation to the protection scope of the present invention. All the technical solutions formed by equivalent transformation or equivalent replacement fall within the protection scope of the present invention.
Claims (6)
1. A wafer material handling mechanism which characterized in that: comprises a frame (10), a feeding mechanism (1) and a carrying mechanism (2) which are arranged on the frame (10); the feeding mechanism (1) comprises a feeding support (11) and a feeding lifting platform (12), a feeding driving assembly, a side guide plate (13) and a rear guide plate (14) are arranged on the feeding support (11), the feeding driving assembly drives the feeding lifting platform (12) to lift, the feeding lifting platform (12) is used for stacking wafers, the side guide plate (13) is arranged on two sides of the feeding lifting platform (12), and the rear guide plate (14) is located on the discharging side of the feeding mechanism; the conveying mechanism (2) comprises a transverse moving driving assembly (21), a transverse moving plate (22), a sucker lifting driving device (23) and a disc frame (24); the transverse moving driving assembly (21) drives the transverse moving plate (22) to transversely move, the sucker lifting driving device (23) is arranged on the transverse moving plate (22), the sucker lifting driving device (23) drives the disc rack (24) to lift, and a plurality of suckers (25) distributed in an annular mode are arranged on the disc rack (24).
2. The wafer loading handling mechanism of claim 1, wherein: the feeding driving assembly comprises a feeding driving motor (15), a motor driving belt mechanism (16) and a lifting driving belt mechanism (17), and the feeding driving motor (15) drives the lifting driving belt mechanism (17) to move through the motor driving belt mechanism (16); the automatic feeding device is characterized in that vertical sliding rails are arranged on the feeding support (11), the feeding lifting table (12) is in sliding fit with the vertical sliding rails, and the feeding lifting table (12) is matched with the lifting transmission belt mechanism (17) through a belt clamping plate (18).
3. The wafer loading handling mechanism of claim 1, wherein: and a feeding sensing device (19) is arranged at the top of the feeding support (11).
4. The wafer loading handling mechanism of claim 1, wherein: the transverse moving driving assembly (21) is a motor screw rod assembly, the transverse moving plate (22) is of a transverse long structure, the sucking disc lifting driving device (23) is arranged at one end of the transverse moving plate (22), and a balancing weight (26) is arranged at the other end of the transverse moving plate (22).
5. The wafer loading handling mechanism of claim 1, wherein: the transverse moving plate (22) is further provided with a transverse moving position sensing frame (27), and the transverse moving position sensing frame (27) is used for being matched with a transverse moving position sensor.
6. The wafer loading handling mechanism of claim 1, wherein: the disc frame (24) is provided with a reinforcing rib (28), and the reinforcing rib (28) extends to the other side of the disc frame (24) from the connecting part of the disc frame (24) and the suction disc lifting driving device (23).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022504120.9U CN214455044U (en) | 2020-11-03 | 2020-11-03 | Wafer material loading and carrying mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022504120.9U CN214455044U (en) | 2020-11-03 | 2020-11-03 | Wafer material loading and carrying mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214455044U true CN214455044U (en) | 2021-10-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022504120.9U Active CN214455044U (en) | 2020-11-03 | 2020-11-03 | Wafer material loading and carrying mechanism |
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| Country | Link |
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| CN (1) | CN214455044U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115064476A (en) * | 2022-08-17 | 2022-09-16 | 佛山市蓝箭电子股份有限公司 | Conveying and feeding device and conveying and feeding method of automatic wafer stripping equipment |
| CN115241099A (en) * | 2022-09-22 | 2022-10-25 | 佛山市蓝箭电子股份有限公司 | Automatic material equipment of shelling of wafer |
| CN117410226A (en) * | 2023-10-10 | 2024-01-16 | 新启航半导体有限公司 | Wafer carrying manipulator |
-
2020
- 2020-11-03 CN CN202022504120.9U patent/CN214455044U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115064476A (en) * | 2022-08-17 | 2022-09-16 | 佛山市蓝箭电子股份有限公司 | Conveying and feeding device and conveying and feeding method of automatic wafer stripping equipment |
| CN115241099A (en) * | 2022-09-22 | 2022-10-25 | 佛山市蓝箭电子股份有限公司 | Automatic material equipment of shelling of wafer |
| CN117410226A (en) * | 2023-10-10 | 2024-01-16 | 新启航半导体有限公司 | Wafer carrying manipulator |
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