CN214447516U - Automatic wafer cutting machine - Google Patents
Automatic wafer cutting machine Download PDFInfo
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- CN214447516U CN214447516U CN202022504136.XU CN202022504136U CN214447516U CN 214447516 U CN214447516 U CN 214447516U CN 202022504136 U CN202022504136 U CN 202022504136U CN 214447516 U CN214447516 U CN 214447516U
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Abstract
The utility model relates to an automatic wafer cutting machine, which comprises a frame, a feeding mechanism, a carrying mechanism, a cutting mechanism, a discharging mechanism and a waste discharging mechanism, wherein the feeding mechanism, the carrying mechanism, the cutting mechanism, the discharging mechanism and the waste discharging mechanism are arranged on the frame; the feeding mechanism is used for stacking and feeding wafers, the carrying mechanism is used for conveying the wafers on the feeding mechanism to the cutting mechanism, the cutting mechanism is used for cutting the wafers, the cut wafers are sent out by the discharging mechanism, and waste materials are sent out by the waste discharging mechanism; the scheme provides a set of automatic wafer cutting equipment, which comprises the functions of automatic feeding, carrying, cutting, discharging and waste discharge; the whole machine does not need manual intervention in operation, so that the processing efficiency is improved, the manpower is reduced, and the risk of manual operation injury is avoided.
Description
Technical Field
The utility model relates to an automatic guillootine of wafer belongs to semiconductor processing equipment technical field.
Background
The wafer needs to be cut in the processing process, and the conventional processing processes include manual feeding and cutting, manual feeding, machine cutting, manual blanking and manual waste separation; the manual cutting and waste cleaning are carried out by personnel, the actions are complicated, the labor intensity is high, and the time, the labor and the cost are high; moreover, the worker manually operates the jig, and the safety risk exists in the cutting of the blade; the overall rhythm is slow, and the production cycle is long.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide an automatic wafer cutting machine for overcoming the defects of the prior art.
In order to achieve the above purpose, the utility model adopts the technical scheme that: an automatic wafer cutting machine comprises a rack, and a feeding mechanism, a carrying mechanism, a cutting mechanism, a discharging mechanism and a waste discharge mechanism which are arranged on the rack; the feeding mechanism is used for stacking and feeding wafers, the carrying mechanism sends the wafers on the feeding mechanism to the cutting mechanism, the cutting mechanism cuts the wafers, the cut wafers are sent out by the discharging mechanism, and waste materials are sent out by the waste discharging mechanism.
Preferably, feed mechanism contains material loading support and material loading elevating platform, is provided with material loading drive assembly, side guide board and back stock guide on the material loading support, and material loading drive assembly drives the material loading elevating platform and goes up and down, and the material loading elevating platform is used for piling up the wafer, and the side guide board sets up the both sides at the material loading elevating platform, and the back stock guide is located the discharge side of feed mechanism.
Preferably, the feeding driving assembly comprises a feeding driving motor, a motor driving belt mechanism and a lifting driving belt mechanism, and the feeding driving motor drives the lifting driving belt mechanism to move through the motor driving belt mechanism; the feeding support is provided with a vertical sliding rail, the feeding lifting table is in sliding fit with the vertical sliding rail, and the feeding lifting table is matched with the lifting transmission belt mechanism through a belt clamping plate; and a feeding sensing device is arranged at the top of the feeding support.
Preferably, the carrying mechanism comprises a transverse moving driving assembly, a transverse moving plate, a sucker lifting driving device and a disc frame; the transverse moving driving assembly drives the transverse moving plate to transversely move, the sucking disc lifting driving device is arranged on the transverse moving plate and drives the disc frame to lift, and a plurality of sucking discs distributed in an annular mode are arranged on the disc frame.
Preferably, the transverse moving driving assembly is a motor screw rod assembly, the transverse moving plate is of a transverse long structure, the sucking disc lifting driving device is arranged at one end of the transverse moving plate, and a balancing weight is arranged at the other end of the transverse moving plate; the transverse moving plate is also provided with a transverse moving position sensing frame which is used for matching with a transverse moving position sensor; the disc frame is provided with a reinforcing rib, and the reinforcing rib extends to the other side of the disc frame from the connecting part of the disc frame and the suction disc lifting driving device.
Preferably, the cutting mechanism comprises a cutting support, a pressure cylinder, a cutting guide frame, an upper cutting die and a lower cutting die, the pressure cylinder and the cutting guide frame are arranged on the upper portion of the cutting support, the lower cutting die is arranged on the lower portion of the cutting support, the upper cutting die and the cutting guide frame are matched, the pressure cylinder drives the upper cutting die to move, the upper cutting die and the lower cutting die are matched, and the wafer is cut.
Preferably, the bottom of the cutting support and the cutting lower die are both of a hollow structure, so that the cut wafer can directly fall on a lower blanking mechanism; the cutting support is also provided with a cutting height sensing support, and the cutting height sensing support is matched with the cutting guide frame.
Preferably, unloading mechanism contains unloading support, unloading lifting unit, upset base and roll-over table, and unloading lifting unit drives the lift of upset base, and the downside of roll-over table is provided with the upset linking arm, and the middle part of upset linking arm articulates on the upset base, is provided with the upset backstop part on the unloading support, and upset backstop part cooperates with roll-over table or upset linking arm.
Preferably, the overturning base is matched with the overturning platform or the overturning connecting arm through a resetting component, and the overturning stopping component is a roller.
Preferably, the waste discharge mechanism comprises a waste discharge support, a waste discharge transverse moving assembly, a clamping jaw air cylinder, a waste discharge clamping jaw and a waste discharge movement induction support, wherein the waste discharge transverse moving assembly is arranged on the waste discharge support, the waste discharge transverse moving assembly drives the clamping jaw air cylinder and the waste discharge movement induction support to move synchronously, the waste discharge movement induction support is used for installing a position sensing part, and the clamping jaw air cylinder drives the waste discharge clamping jaw to open and close.
Because of above-mentioned technical scheme's application, compared with the prior art, the utility model have the following advantage:
the scheme provides a set of automatic wafer cutting equipment, which comprises the functions of automatic feeding, carrying, cutting, discharging and waste discharge; the whole machine does not need manual intervention in operation, so that the processing efficiency is improved, the manpower is reduced, and the risk of manual operation injury is avoided.
Drawings
The technical scheme of the utility model is further explained by combining the attached drawings as follows:
fig. 1 is a schematic diagram of a three-dimensional structure of an automatic wafer cutting machine according to the present invention;
fig. 2 is a schematic three-dimensional structure diagram of the feeding mechanism of the present invention;
FIG. 3 is an enlarged view of FIG. 2 at A;
fig. 4 is a schematic three-dimensional structure diagram of the carrying mechanism of the present invention;
fig. 5 is a schematic three-dimensional structure diagram of the cutting mechanism of the present invention;
fig. 6 is a schematic perspective view of the blanking mechanism of the present invention;
fig. 7 is a schematic view of the three-dimensional structure of the waste discharge mechanism of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1-7, an automatic wafer cutting machine according to the present invention comprises a frame 10, and a feeding mechanism 1, a carrying mechanism 2, a cutting mechanism 3, a discharging mechanism 4, a waste discharging mechanism 5, a feeding side opening 6, a product discharging port 7 and a waste discharging port 8 which are arranged on the frame 10; the material loading side opening 6 is located one side of feed mechanism 1 for the material loading is piled to wafer work piece in batches, feed mechanism 1 upwards sees the wafer off, transport mechanism 2 sends the wafer on feed mechanism 1 to cutting mechanism 3, it cuts the wafer to cut mechanism 3, product discharge gate 7 is located one side of unloading mechanism 4, the wafer after cutting is seen off from product discharge gate 7 by unloading mechanism 4, waste material discharge gate 8 is located waste discharge mechanism 5 department, the waste material is sent to the waste material stacking space in frame 10 from waste material discharge gate 8 by waste discharge mechanism 5.
As shown in fig. 2-3, the feeding mechanism 1 includes a feeding support 11 and a feeding lifting platform 12, the feeding support 11 is provided with a feeding driving assembly, a side material guiding plate 13 and a rear material guiding plate 14, the feeding driving assembly drives the feeding lifting platform 12 to lift, the feeding lifting platform 12 is used for stacking wafers, the side material guiding plate 13 is disposed on two sides of the feeding lifting platform 12, and the rear material guiding plate 14 is located on a discharging side of the feeding mechanism.
The feeding driving assembly comprises a feeding driving motor 15, a motor driving belt mechanism 16 and a lifting driving belt mechanism 17, and the feeding driving motor 15 drives the lifting driving belt mechanism 17 to move through the motor driving belt mechanism 16; a vertical sliding rail is arranged on the feeding support 11, a supporting section bar is arranged at the bottom of the feeding lifting table 12, and the supporting section bar has a structure in sliding fit with the vertical sliding rail; the feeding lifting platform 12 is matched with a belt of a lifting transmission belt mechanism 17 through a belt clamping plate 18, and the belt drives the feeding lifting platform 12 to lift through the belt clamping plate 18 in the transmission process; and a feeding sensing device 19 is arranged at the top of the feeding support 11, and the feeding sensing device 19 is a photoelectric sensor.
Wafer workpieces are stacked and placed on the feeding lifting platform 12, the feeding driving motor 15 is a stepping motor, the height of the feeding lifting platform 12 for increasing the thickness of one wafer workpiece every time is controlled, when the topmost wafer workpiece rises to the top of the feeding support 11, the topmost wafer workpiece can be sensed by the feeding sensing device 19, the feeding driving motor 15 stops stepping at the moment, and the wafer workpieces have peripheral flat edges, so that in the rising process, the two side guide plates 13 and the rear guide plate 14 play roles in lifting protection and guiding for the workpieces, and wafer deflection and edge scratching are avoided.
As shown in fig. 4, the carrying mechanism 2 includes a traverse driving assembly 21, a traverse plate 22, a suction cup lifting driving device 23, and a disk rack 24; the transverse moving driving assembly 21 is a motor screw rod assembly, the transverse moving driving assembly 21 drives the transverse moving plate 22 to transversely move, the transverse moving plate 22 is of a transverse long structure, the sucking disc lifting driving device 23 is an air cylinder, the sucking disc lifting driving device 23 is arranged at one end of the transverse moving plate 22, and a balancing weight 26 is arranged at the other end of the transverse moving plate 22 so as to keep the balance of the transverse moving plate 22; the traverse plate 22 is also provided with a traverse position induction frame 27, and the traverse position induction frame 27 is used for matching with a traverse position sensor to avoid the situation that the traverse is not in place or exceeds the stroke; the suction cup lifting driving device 23 drives the disc frame 24 to lift, a plurality of suction cups 25 which are uniformly distributed in an annular shape are arranged on the disc frame 24, reinforcing ribs 28 are further arranged on the disc frame 24, and the reinforcing ribs 28 extend to the other side of the disc frame 24 from the connecting part of the disc frame 24 and the suction cup lifting driving device 23 so as to ensure the rigidity of the disc frame 24.
The transverse moving driving assembly 21 drives the disc frame 24 to move to the feeding mechanism 1, the suction disc lifting driving device 23 drives the disc frame 24 to lift and take materials, and then the transverse moving driving assembly 21 drives the disc frame 24 to move to the cutting mechanism 3 to discharge and cut materials.
As shown in fig. 5, the cutting mechanism 3 includes a cutting support 31, a pressure cylinder 32, a cutting guide 33, a cutting upper die 34 and a cutting lower die 35, the cutting support 31 is a rectangular frame, the pressure cylinder 32 and the cutting guide 33 are disposed on the upper portion of the cutting support 31, the cutting lower die 35 is disposed on the lower portion of the cutting support 31, the cutting upper die 34 is engaged with the cutting guide 33, the cutting guide 33 is a four-guide-post support, the cutting support 31 is further provided with a cutting height sensing support 36, and the cutting height sensing support 36 is engaged with the cutting guide 33; the pressurizing cylinder 32 drives the upper cutting die 34 to move, so that the upper cutting die is matched with the lower cutting die 35 to perform blanking and circular cutting on the wafer and remove waste materials on the periphery of the wafer; the bottom of the cutting support 31 and the cutting lower die 35 are both hollow structures, so that the cut wafer can directly fall on the lower blanking mechanism 4.
As shown in fig. 6, the blanking mechanism 4 includes a blanking support 41, a blanking lifting assembly 42, a turning base 43 and a turning table 44, the blanking lifting assembly 42 is of a cylinder guide post structure, the blanking lifting assembly 42 drives the turning base 43 to lift, a turning connecting arm 45 is arranged at the lower side of the turning table 44, the middle part of the turning connecting arm 45 is hinged on the turning base 43, a turning stopping component 46 is arranged on the blanking support 41, and the turning stopping component 46 is matched with the turning connecting arm 45.
The punched wafer falls on the overturning platform 44, then the blanking lifting assembly 42 drives the overturning platform 44 to descend, the rear end part of the overturning connecting arm 45 is contacted with the overturning stopping component 46 in the descending process of the overturning platform 44, and a lever effect is formed at the connecting part of the overturning connecting arm 45, so that the front side of the overturning platform 44 is overturned downwards, and the wafer on the overturning platform 44 is discharged from a discharge hole; the roll-over stop 46 is preferably a roller to prevent contact seizure; the overturning base 43 and the overturning platform 44 or the overturning connecting arm 45 can be matched through a reset component, such as a reset spring and the like, so that the overturning platform 44 can be overturned to a horizontal position in the process of lifting and returning after blanking; or a counterweight block can be directly arranged at the rear side of the overturning platform 44 or the overturning connecting arm 45, so that the weight of the rear side is greater than that of the front side, and a reverse overturning limiting structure of the rear side is designed.
As shown in fig. 7, the waste discharging mechanism 5 includes a waste discharging bracket 51, a waste discharging traverse assembly 52, a clamping jaw cylinder 53, a waste discharging clamping jaw 54 and a waste discharging moving induction bracket 55, the waste discharging traverse assembly 52 can be a motor screw rod or an electric cylinder, the waste discharging traverse assembly 52 is disposed on the waste discharging bracket 51, the waste discharging traverse assembly 52 drives the clamping jaw cylinder 53 and the waste discharging moving induction bracket 55 to move synchronously, the waste discharging moving induction bracket 55 is used for installing a position sensing component, the clamping jaw cylinder 53 drives the waste discharging clamping jaw 54 to open and close, and the waste on the outer ring of the wafer after being punched is clamped and is driven by the waste discharging traverse assembly 52 to move to a waste placing area.
The above is only a specific application example of the present invention, and does not constitute any limitation to the protection scope of the present invention. All the technical solutions formed by equivalent transformation or equivalent replacement fall within the protection scope of the present invention.
Claims (10)
1. The utility model provides an automatic guillootine of wafer which characterized in that: comprises a frame (10), and a feeding mechanism (1), a carrying mechanism (2), a cutting mechanism (3), a discharging mechanism (4) and a waste discharge mechanism (5) which are arranged on the frame (10); the feeding mechanism (1) is used for stacking and feeding wafers, the conveying mechanism (2) conveys the wafers on the feeding mechanism (1) to the cutting mechanism (3), the cutting mechanism (3) cuts the wafers, the cut wafers are conveyed out by the discharging mechanism (4), and waste materials are conveyed out by the waste discharging mechanism (5).
2. The automatic wafer cutting machine according to claim 1, characterized in that: the feeding mechanism (1) comprises a feeding support (11) and a feeding lifting platform (12), a feeding driving assembly, a side guide plate (13) and a rear guide plate (14) are arranged on the feeding support (11), the feeding driving assembly drives the feeding lifting platform (12) to lift, the feeding lifting platform (12) is used for stacking wafers, the side guide plate (13) is arranged on two sides of the feeding lifting platform (12), and the rear guide plate (14) is located on the discharging side of the feeding mechanism.
3. The automatic wafer cutting machine according to claim 2, characterized in that: the feeding driving assembly comprises a feeding driving motor (15), a motor driving belt mechanism (16) and a lifting driving belt mechanism (17), and the feeding driving motor (15) drives the lifting driving belt mechanism (17) to move through the motor driving belt mechanism (16); a vertical sliding rail is arranged on the feeding support (11), a feeding lifting table (12) is in sliding fit with the vertical sliding rail, and the feeding lifting table (12) is matched with a lifting transmission belt mechanism (17) through a belt clamping plate (18); and a feeding sensing device (19) is arranged at the top of the feeding support (11).
4. The automatic wafer cutting machine according to claim 1, characterized in that: the conveying mechanism (2) comprises a transverse moving driving assembly (21), a transverse moving plate (22), a sucker lifting driving device (23) and a disc frame (24); the transverse moving driving assembly (21) drives the transverse moving plate (22) to transversely move, the sucker lifting driving device (23) is arranged on the transverse moving plate (22), the sucker lifting driving device (23) drives the disc rack (24) to lift, and a plurality of suckers (25) distributed in an annular mode are arranged on the disc rack (24).
5. The automatic wafer cutting machine according to claim 4, characterized in that: the transverse moving driving assembly (21) is a motor screw rod assembly, the transverse moving plate (22) is of a transverse long structure, the sucking disc lifting driving device (23) is arranged at one end of the transverse moving plate (22), and a balancing weight (26) is arranged at the other end of the transverse moving plate (22); the transverse moving plate (22) is also provided with a transverse moving position sensing frame (27), and the transverse moving position sensing frame (27) is used for matching with a transverse moving position sensor; the disc frame (24) is provided with a reinforcing rib (28), and the reinforcing rib (28) extends to the other side of the disc frame (24) from the connecting part of the disc frame (24) and the suction disc lifting driving device (23).
6. The automatic wafer cutting machine according to claim 1, characterized in that: cutting mechanism (3) contain and cut support (31), pressure cylinder (32), guide frame (33) cut, cut mould (34) and cut bed die (35), pressure cylinder (32) and cut the upper portion that guide frame (33) set up at cutting support (31), cut down mould (35) and set up in the lower part that cuts support (31), cut mould (34) and cut guide frame (33) cooperation, pressure cylinder (32) drive and cut the motion of mould (34), make it and cut bed die (35) cooperation, cut the wafer.
7. The automatic wafer cutting machine according to claim 6, characterized in that: the bottom of the cutting support (31) and the cutting lower die (35) are both of hollow structures, so that the cut wafer can directly fall on the lower blanking mechanism (4); the cutting support (31) is further provided with a cutting height sensing support (36), and the cutting height sensing support (36) is matched with the cutting guide frame (33).
8. The automatic wafer cutting machine according to claim 1, characterized in that: unloading mechanism (4) contain unloading support (41), unloading lifting unit (42), upset base (43) and roll-over table (44), unloading lifting unit (42) drive upset base (43) and go up and down, and the downside of roll-over table (44) is provided with upset linking arm (45), and the middle part of upset linking arm (45) articulates on roll-over base (43), is provided with upset backstop part (46) on unloading support (41), upset backstop part (46) and roll-over table (44) or upset linking arm (45) cooperation.
9. The automatic wafer cutting machine of claim 8, wherein: the overturning base (43) is matched with the overturning platform (44) or the overturning connecting arm (45) through a resetting component, and the overturning stopping component (46) is a roller.
10. The automatic wafer cutting machine according to claim 1, characterized in that: waste discharge mechanism (5) contain waste discharge support (51), waste discharge sideslip subassembly (52), clamping jaw cylinder (53), waste discharge clamping jaw (54) and waste discharge removal response support (55), waste discharge sideslip subassembly (52) set up on waste discharge support (51), waste discharge sideslip subassembly (52) drive clamping jaw cylinder (53) and waste discharge removal response support (55) synchronous motion, waste discharge removal response support (55) are used for the mounted position sensing part, clamping jaw cylinder (53) drive waste discharge clamping jaw (54) open and shut.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022504136.XU CN214447516U (en) | 2020-11-03 | 2020-11-03 | Automatic wafer cutting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022504136.XU CN214447516U (en) | 2020-11-03 | 2020-11-03 | Automatic wafer cutting machine |
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| Publication Number | Publication Date |
|---|---|
| CN214447516U true CN214447516U (en) | 2021-10-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022504136.XU Active CN214447516U (en) | 2020-11-03 | 2020-11-03 | Automatic wafer cutting machine |
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| CN (1) | CN214447516U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112356326A (en) * | 2020-11-03 | 2021-02-12 | 太极半导体（苏州）有限公司 | Automatic wafer cutting machine |
| CN115255678A (en) * | 2022-09-22 | 2022-11-01 | 苏州芯海半导体科技有限公司 | Semiconductor wafer double-film cutting equipment |
-
2020
- 2020-11-03 CN CN202022504136.XU patent/CN214447516U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112356326A (en) * | 2020-11-03 | 2021-02-12 | 太极半导体（苏州）有限公司 | Automatic wafer cutting machine |
| CN115255678A (en) * | 2022-09-22 | 2022-11-01 | 苏州芯海半导体科技有限公司 | Semiconductor wafer double-film cutting equipment |
| CN115255678B (en) * | 2022-09-22 | 2022-12-09 | 苏州芯海半导体科技有限公司 | Semiconductor wafer double-film cutting equipment |
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