CN214166617U

CN214166617U - Wafer cutting and blanking mechanism

Info

Publication number: CN214166617U
Application number: CN202022504119.6U
Authority: CN
Inventors: 苏磊; 郑其金; 辛利平
Original assignee: Taiji Semiconductor Suzhou Co ltd
Current assignee: Taiji Semiconductor Suzhou Co ltd
Priority date: 2020-11-03
Filing date: 2020-11-03
Publication date: 2021-09-10
Anticipated expiration: 2030-11-03

Abstract

The utility model relates to a wafer cutting and blanking mechanism, which comprises a frame, a cutting mechanism, a blanking mechanism and a waste discharge mechanism, wherein the cutting mechanism, the blanking mechanism and the waste discharge mechanism are arranged on the frame; the cutting mechanism comprises a cutting support, a pressure cylinder, a cutting guide frame, an upper cutting die and a lower cutting die; the blanking mechanism comprises a blanking bracket, a blanking lifting component, a turnover base and a turnover table; the waste discharge mechanism comprises a waste discharge bracket, a waste discharge transverse moving assembly, a clamping jaw cylinder, a waste discharge clamping jaw and a waste discharge moving induction bracket; the scheme provides an automatic wafer cutting and blanking mechanism, a workpiece cut by the cutting mechanism is automatically blanked by the blanking mechanism, and waste materials are automatically discharged by the waste discharge mechanism; the whole operation process does not need manual intervention, the processing efficiency is improved, the manpower is reduced, and the risk of manual operation injury is reduced.

Description

Wafer cutting and blanking mechanism

Technical Field

The utility model relates to a wafer cuts unloading mechanism belongs to semiconductor processing equipment technical field.

Background

The wafer needs to be cut in the processing process, and the conventional processing processes include manual feeding and cutting, machine cutting, manual blanking and manual waste separation; personnel carry out manual blanking and waste cleaning, the actions are complicated, the labor intensity is high, time and labor are wasted, the cost is high, and the safety risk exists; the overall rhythm is slow, and the production cycle is long.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a wafer cuts unloading mechanism in order to overcome prior art's not enough.

In order to achieve the above purpose, the utility model adopts the technical scheme that: a wafer cutting and blanking mechanism comprises a rack, and a cutting mechanism, a blanking mechanism and a waste discharge mechanism which are arranged on the rack; the cutting mechanism comprises a cutting support, a pressure cylinder, a cutting guide frame, an upper cutting die and a lower cutting die, wherein the pressure cylinder and the cutting guide frame are arranged at the upper part of the cutting support; the blanking mechanism comprises a blanking support, a blanking lifting assembly, a turnover base and a turnover table, the blanking lifting assembly drives the turnover base to lift, a turnover connecting arm is arranged on the lower side of the turnover table, the middle part of the turnover connecting arm is hinged to the turnover base, a turnover stopping component is arranged on the blanking support, and the turnover stopping component is matched with the turnover table or the turnover connecting arm; the waste discharge mechanism comprises a waste discharge support, a waste discharge transverse moving assembly, a clamping jaw air cylinder, a waste discharge clamping jaw and a waste discharge movement induction support, wherein the waste discharge transverse moving assembly is arranged on the waste discharge support, the waste discharge transverse moving assembly drives the clamping jaw air cylinder and the waste discharge movement induction support to move synchronously, the waste discharge movement induction support is used for installing a position sensing part, and the clamping jaw air cylinder drives the waste discharge clamping jaw to open and close.

Preferably, the bottom of the cutting support and the cutting lower die are both of a hollow structure, so that the cut wafer can directly fall on a lower blanking mechanism.

Preferably, the cutting support is further provided with a cutting height sensing support, and the cutting height sensing support is matched with the cutting guide frame.

Preferably, the overturning base is matched with the overturning platform or the overturning connecting arm through a resetting component.

Preferably, the tumble stop member is a roller.

Because of above-mentioned technical scheme's application, compared with the prior art, the utility model have the following advantage:

the scheme provides an automatic wafer cutting and blanking mechanism, a workpiece cut by the cutting mechanism is automatically blanked by the blanking mechanism, and waste materials are automatically discharged by the waste discharge mechanism; the whole operation process does not need manual intervention, the processing efficiency is improved, the manpower is reduced, and the risk of manual operation injury is reduced.

Drawings

The technical scheme of the utility model is further explained by combining the attached drawings as follows:

fig. 1 is a schematic perspective view of a wafer cutting and blanking mechanism according to the present invention;

fig. 2 is a schematic three-dimensional structure diagram of the cutting mechanism of the present invention;

fig. 3 is a schematic three-dimensional structure diagram of the blanking mechanism of the present invention;

fig. 4 is a schematic perspective view of the waste discharge mechanism of the present invention.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.

As shown in fig. 1-4, a wafer cutting and blanking mechanism according to the present invention comprises a frame 10, and a cutting mechanism 3, a blanking mechanism 4 and a waste discharge mechanism 5 disposed on the frame 10; the cutting mechanism 3 comprises a cutting support 31, a pressure cylinder 32, a cutting guide frame 33, an upper cutting die 34 and a lower cutting die 35, the cutting support 31 is a rectangular frame, the pressure cylinder 32 and the cutting guide frame 33 are arranged on the upper portion of the cutting support 31, the lower cutting die 35 is arranged on the lower portion of the cutting support 31, the upper cutting die 34 is matched with the cutting guide frame 33, the cutting guide frame 33 is a four-guide-post support, a cutting height sensing support 36 is further arranged on the cutting support 31, and the cutting height sensing support 36 is matched with the cutting guide frame 33; the pressurizing cylinder 32 drives the upper cutting die 34 to move, so that the upper cutting die is matched with the lower cutting die 35 to perform blanking and circular cutting on the wafer and remove waste materials on the periphery of the wafer; the bottom of the cutting support 31 and the cutting lower die 35 are both hollow structures, so that the cut wafer can directly fall on the lower blanking mechanism 4.

As shown in fig. 3, the blanking mechanism 4 includes a blanking support 41, a blanking lifting assembly 42, a turning base 43 and a turning table 44, the blanking lifting assembly 42 is of a cylinder guide post structure, the blanking lifting assembly 42 drives the turning base 43 to lift, a turning connecting arm 45 is arranged at the lower side of the turning table 44, the middle part of the turning connecting arm 45 is hinged on the turning base 43, a turning stopping component 46 is arranged on the blanking support 41, and the turning stopping component 46 is matched with the turning connecting arm 45.

The punched wafer falls on the overturning platform 44, then the blanking lifting assembly 42 drives the overturning platform 44 to descend, the rear end part of the overturning connecting arm 45 is contacted with the overturning stopping component 46 in the descending process of the overturning platform 44, and a lever effect is formed at the connecting part of the overturning connecting arm 45, so that the front side of the overturning platform 44 is overturned downwards, and the wafer on the overturning platform 44 is discharged from a discharge hole; the roll-over stop 46 is preferably a roller to prevent contact seizure; the overturning base 43 and the overturning platform 44 or the overturning connecting arm 45 can be matched through a reset component, such as a reset spring and the like, so that the overturning platform 44 can be overturned to a horizontal position in the process of lifting and returning after blanking; or a counterweight block can be directly arranged at the rear side of the overturning platform 44 or the overturning connecting arm 45, so that the weight of the rear side is greater than that of the front side, and a reverse overturning limiting structure of the rear side is designed.

As shown in fig. 4, the waste discharging mechanism 5 includes a waste discharging bracket 51, a waste discharging traverse assembly 52, a clamping jaw cylinder 53, a waste discharging clamping jaw 54 and a waste discharging moving induction bracket 55, the waste discharging traverse assembly 52 can be a motor screw rod or an electric cylinder, the waste discharging traverse assembly 52 is arranged on the waste discharging bracket 51, the waste discharging traverse assembly 52 drives the clamping jaw cylinder 53 and the waste discharging moving induction bracket 55 to move synchronously, the waste discharging moving induction bracket 55 is used for installing a position sensing component, the clamping jaw cylinder 53 drives the waste discharging clamping jaw 54 to open and close, and the waste on the outer circle of the wafer after being punched is clamped and is driven by the waste discharging traverse assembly 52 to move the waste to a waste placing area.

The above is only a specific application example of the present invention, and does not constitute any limitation to the protection scope of the present invention. All the technical solutions formed by equivalent transformation or equivalent replacement fall within the protection scope of the present invention.

Claims

1. The utility model provides a wafer cuts unloading mechanism which characterized in that: comprises a frame (10), and a cutting mechanism (3), a blanking mechanism (4) and a waste discharge mechanism (5) which are arranged on the frame (10); the cutting mechanism (3) comprises a cutting support (31), a pressure cylinder (32), a cutting guide frame (33), an upper cutting die (34) and a lower cutting die (35), the pressure cylinder (32) and the cutting guide frame (33) are arranged on the upper portion of the cutting support (31), the lower cutting die (35) is arranged on the lower portion of the cutting support (31), the upper cutting die (34) is matched with the cutting guide frame (33), and the pressure cylinder (32) drives the upper cutting die (34) to move so as to be matched with the lower cutting die (35) to cut a wafer; the blanking mechanism (4) comprises a blanking support (41), a blanking lifting assembly (42), a turnover base (43) and a turnover table (44), the blanking lifting assembly (42) drives the turnover base (43) to lift, a turnover connecting arm (45) is arranged on the lower side of the turnover table (44), the middle part of the turnover connecting arm (45) is hinged to the turnover base (43), a turnover stopping component (46) is arranged on the blanking support (41), and the turnover stopping component (46) is matched with the turnover table (44) or the turnover connecting arm (45); waste discharge mechanism (5) contain waste discharge support (51), waste discharge sideslip subassembly (52), clamping jaw cylinder (53), waste discharge clamping jaw (54) and waste discharge removal response support (55), waste discharge sideslip subassembly (52) set up on waste discharge support (51), waste discharge sideslip subassembly (52) drive clamping jaw cylinder (53) and waste discharge removal response support (55) synchronous motion, waste discharge removal response support (55) are used for the mounted position sensing part, clamping jaw cylinder (53) drive waste discharge clamping jaw (54) open and shut.

2. The wafer cutting blanking mechanism of claim 1, wherein: the bottom of the cutting support (31) and the cutting lower die (35) are both of hollow structures, so that the cut wafer can directly fall on the lower blanking mechanism (4).

3. The wafer cutting blanking mechanism of claim 1, wherein: the cutting support (31) is further provided with a cutting height sensing support (36), and the cutting height sensing support (36) is matched with the cutting guide frame (33).

4. The wafer cutting blanking mechanism of claim 1, wherein: the overturning base (43) is matched with the overturning platform (44) or the overturning connecting arm (45) through a resetting component.

5. The wafer cutting blanking mechanism of claim 1, wherein: the roll-over stop member (46) is a roller.