CN214070410U - Embedded capacitor multilayer printed board easy to metalize and conduct - Google Patents
Embedded capacitor multilayer printed board easy to metalize and conduct Download PDFInfo
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- CN214070410U CN214070410U CN202023098275.3U CN202023098275U CN214070410U CN 214070410 U CN214070410 U CN 214070410U CN 202023098275 U CN202023098275 U CN 202023098275U CN 214070410 U CN214070410 U CN 214070410U
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- printed board
- lateral wall
- copper
- plate
- upside
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- 239000003990 capacitor Substances 0.000 title claims abstract description 19
- 238000001465 metallisation Methods 0.000 claims abstract description 21
- 239000011111 cardboard Substances 0.000 claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 239000002184 metal Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 210000002421 cell wall Anatomy 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
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Abstract
The utility model relates to the technical field of printed boards, and discloses an easily metallized and conducted multilayer printed board with embedded capacitors, which comprises a printed board main body, wherein the printed board main body comprises a substrate, a printed board and a copper-clad plate, and the side wall of the upper side of the printed board main body is provided with a plurality of conducting holes; the utility model discloses a PCB, including base plate, printing plate upside, lateral wall fixedly connected with copper-clad plate of printing plate upside, a plurality of through-holes have been seted up to the lateral wall of copper-clad plate upside, the fixed intercommunication of lateral wall of printing plate upside has a plurality of electric capacity that are located the through-hole, the lateral wall of the printing plate main part left and right sides all overlaps and is equipped with U type buckle, the equal fixedly connected with cardboard of lateral wall of the relative one side of U type buckle. The utility model discloses can avoid multilayer printing board to use time division layer in high temperature environment, the effectual stability that improves multilayer printing board has still improved the convenience that the printing board metallization switched on.
Description
Technical Field
The utility model relates to a printing board technical field especially relates to an embedded electric capacity multilayer printing board that easy metallization switched on.
Background
The multilayer printed board is more than two layers of printed boards, consists of connecting wires on a plurality of layers of insulating substrates and bonding pads for assembling and welding electronic elements, and has the functions of conducting lines of all layers and insulating the lines mutually. The embedded capacitor multilayer circuit board is a printed board with a plurality of capacitors embedded inside, and the capacitors and the printed board are integrated, so that the capacitors can be prevented from excessively occupying the welding area of the printed board.
When the existing multilayer printed board with the embedded capacitor is used, because the multilayer printed board is formed by pressing a plurality of different boards, when the multilayer printed board is used in an environment with higher temperature, the connection part of the multilayer printed board is easy to separate, thereby influencing the normal use of the multilayer printed board.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the problem of using easy layering among the prior art among the multilayer printing board high temperature environment, and the embedded electric capacity multilayer printing board that easy metallization switched on that provides.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the multilayer printed board with the embedded capacitor and easy metallization conduction comprises a printed board main body, wherein the printed board main body comprises a substrate, a printed board and a copper-clad plate, and a plurality of conducting holes are formed in the side wall of the upper side of the printed board main body; the utility model discloses a PCB, including base plate upside, lateral wall fixedly connected with printing plate, printing plate upside's lateral wall fixedly connected with copper-clad plate, a plurality of through-holes have been seted up to the lateral wall of copper-clad plate upside, the fixed intercommunication of lateral wall of printing plate upside has a plurality of electric capacity that are located the through-hole, the lateral wall of printing plate main part left and right sides all overlaps and is equipped with U type buckle, the equal fixedly connected with cardboard of lateral wall of the relative one side of U type buckle, the lateral wall of base plate downside and the lateral wall of copper-clad plate upside all seted up the draw-in groove corresponding with the cardboard, the cardboard is located the draw-in groove, the equal fixedly connected with semicircular fixture block of lateral wall of the relative one side of U type buckle, the lateral wall of base plate downside and the lateral wall of copper-clad plate upside all set up the semicircular groove corresponding with semicircular fixture block, semicircular fixture block is located the semicircular groove.
Preferably, the shape of the via hole is a cone, and the aperture of the upper end of the via hole is larger than the aperture of the lower end of the via hole.
Preferably, the groove wall on the right side of the clamping groove is fixedly connected with a positioning block, the side wall on the right side of the clamping plate is provided with a positioning groove corresponding to the positioning block, and the positioning block is located in the positioning groove.
Preferably, the side walls of the upper side and the lower side of the U-shaped buckle plate are provided with anti-skid grains.
Preferably, a plurality of metal rings corresponding to the via holes are fixedly welded to the side wall of the lower side of the substrate.
Preferably, the groove wall on the right side of the clamping groove is arc-shaped.
Compared with the prior art, the utility model provides an embedded electric capacity multilayer printing board that easy metallization switched on possesses following beneficial effect:
1. this embedded electric capacity multilayer printed board that easy metallization switched on, through the printed board main part that sets up, the base plate, the printing plate, the copper-clad plate, the conducting hole, electric capacity, U type buckle, the cardboard, the draw-in groove, semi-circular fixture block and half slot, in use, aim at the draw-in groove with the cardboard on the U type buckle, press down the U type buckle, make cardboard card go into in the draw-in groove, U type buckle drives semi-circular fixture block and removes, make semi-circular fixture block card go into in the half slot, mutually support through semi-circular fixture block and half slot, can stabilize fixed to U type buckle, the U type buckle can be to the base plate, printing plate and copper-clad plate carry out stable fixed, thereby can avoid multilayer printed board to use time division layer in high temperature environment, the effectual stability that improves multilayer printed board.
2. This embedded electric capacity multilayer printed board that easy metallization switched on through the conducting hole of the toper structure that sets up, can be in the time of carrying out the metallization, be convenient for make complete metallization in the whole conducting hole, compare in the inconvenient conducting hole easier metallization of original diameter.
The device does not relate to the part and all is the same with prior art or can adopt prior art to realize, the utility model discloses can avoid multilayer printing board to use time layering in high temperature environment, the effectual stability that improves multilayer printing board has still improved the convenience that the printing board metallization switched on.
Drawings
Fig. 1 is a schematic structural diagram of an embedded capacitor multilayer printed board easy to be metallized and conducted according to the present invention;
FIG. 2 is a schematic structural view of portion A of FIG. 1;
FIG. 3 is a schematic structural diagram of portion B of FIG. 2;
fig. 4 is a schematic structural view of a portion C in fig. 1.
In the figure: the printed circuit board comprises a printed circuit board main body 1, a substrate 2, a printed circuit board 3, a copper-clad plate 4, a via hole 5, a capacitor 6, a U-shaped buckle plate 7, a clamping plate 8, a clamping groove 9, a semicircular clamping block 10, a semicircular groove 11, a positioning block 12, a positioning groove 13, anti-skid lines 14 and a metal ring 15.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Referring to fig. 1-4, the multilayer printed board with the embedded capacitor and easy metallization conduction comprises a printed board main body 1, wherein the printed board main body 1 comprises a substrate 2, a printed board 3 and a copper-clad plate 4, and a plurality of via holes 5 are formed in the side wall of the upper side of the printed board main body 1; the side wall of the upper side of the base plate 2 is fixedly connected with a printing plate 3, the side wall of the upper side of the printing plate 3 is fixedly connected with a copper-clad plate 4, the side wall of the upper side of the copper-clad plate 4 is provided with a plurality of through holes, the side wall of the upper side of the printing plate 3 is fixedly communicated with a plurality of capacitors 6 positioned in the through holes, the side walls of the left side and the right side of the printed plate main body 1 are respectively sleeved with a U-shaped buckle plate 7, the side wall of the opposite side of the U-shaped buckle plate 7 is respectively fixedly connected with a clamp plate 8, the side wall of the lower side of the base plate 2 and the side wall of the upper side of the copper-clad plate 4 are respectively provided with a clamp groove 9 corresponding to the clamp plate 8, the clamp plate 8 is positioned in the clamp groove 9, the side wall of the lower side of the base plate 2 and the side wall of the upper side of the copper-clad plate 4 are respectively provided with a semicircular clamp groove 11 corresponding to the semicircular clamp plate 10, the semicircular clamp plate 10 is positioned in the semicircular clamp groove 11 when in use, press U type buckle 7, make 8 card of cardboard go into in the draw-in groove 9, U type buckle 7 drives semi-circular fixture block 10 and removes, make semi-circular fixture block 10 card go into semi-circular groove 11, mutually support through semi-circular fixture block 10 and semi-circular groove 11, can carry out the fixed of stabilizing to U type buckle 7, U type buckle 7 can be to base plate 2, printing plate 3 and copper-clad plate 4 carry out stable fixed, thereby can avoid multilayer printed board to use time division layer in high temperature environment, the effectual stability that improves multilayer printed board.
The shape of via hole 5 is the toper, and the aperture of via hole 5 upper end is greater than the aperture of via hole 5 lower extreme, and through the via hole 5 of the toper structure that sets up, can be when carrying out the metallization, be convenient for make complete metallization in whole via hole 5, compare in the inconvenient via hole 5 easier metallization of original diameter.
Cell wall fixedly connected with locating piece 12 on draw-in groove 9 right side, lateral wall on cardboard 8 right side have seted up with the corresponding constant head tank 13 of locating piece 12, and locating piece 12 is located constant head tank 13, mutually supports through locating piece 12 and constant head tank 13, can fix a position semicircle fixture block 10, has improved the degree of accuracy of installation.
A plurality of eyelets 15 corresponding to the via holes are fixedly welded to the lower side wall of the substrate 2, and the eyelets 15 can improve the conductivity of the via holes 5.
The groove wall on the right side of the clamping groove 9 is arc-shaped, so that the semicircular clamping block 10 can slide conveniently.
In the utility model, when in use, the clamping plate 8 on the U-shaped buckle 7 is aligned to the clamping groove 9, the U-shaped buckle 7 is pressed, the clamping plate 8 is clamped into the clamping groove 9, the U-shaped buckle 7 drives the semicircular fixture block 10 to move, the semicircular fixture block 10 is clamped into the semicircular groove 11, the U-shaped buckle 7 can be stably fixed through the mutual matching of the semicircular fixture block 10 and the semicircular groove 11, the U-shaped buckle 7 can stably fix the substrate 2, the printing plate 3 and the copper-clad plate 4, so that the use of the multilayer printed board in a high-temperature environment can be avoided, and the stability of the multilayer printed board is effectively improved; through the via hole 5 of the toper structure that sets up, can be in the time of carrying out the metallization, be convenient for make complete metallization in whole via hole 5, compare in the inconvenient via hole 5 metallization of original diameter more easily.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (6)
1. The multilayer printed board with the embedded capacitor and easy metallization conduction comprises a printed board main body (1), and is characterized in that the printed board main body (1) comprises a substrate (2), a printed board (3) and a copper-clad plate (4), and a plurality of conducting holes (5) are formed in the side wall of the upper side of the printed board main body (1); lateral wall fixedly connected with printing plate (3) of base plate (2) upside, lateral wall fixedly connected with copper-clad plate (4) of printing plate (3) upside, a plurality of through-holes have been seted up to the lateral wall of copper-clad plate (4) upside, the lateral wall fixed intercommunication of printing plate (3) upside has a plurality of electric capacity (6) that are located the through-hole, the lateral wall of printing board main part (1) the left and right sides all overlaps and is equipped with U type buckle (7), the equal fixedly connected with cardboard (8) of lateral wall of the relative one side of U type buckle (7), draw-in groove (9) corresponding with cardboard (8) have all been seted up with the lateral wall of copper-clad plate (4) upside to the lateral wall of base plate (2) downside, cardboard (8) are located draw-in groove (9), the equal fixedly connected with semi-circular fixture block (10) of lateral wall of the relative one side of U type buckle (7), lateral wall and the lateral wall of copper-clad plate (4) upside of base plate (2) downside have all been seted up and are relative with semi-circular fixture block (10) relatively The semicircular groove (11) is formed, and the semicircular fixture block (10) is positioned in the semicircular groove (11).
2. The multilayer printed board with embedded capacitors and easy metallization conduction as claimed in claim 1, wherein the via hole (5) is conical in shape, and the aperture of the upper end of the via hole (5) is larger than that of the lower end of the via hole (5).
3. The multilayer printed board with embedded capacitors, which is easy to be metallized and conducted, according to claim 1, wherein a positioning block (12) is fixedly connected to a wall of the card slot (9) on the right side, a positioning groove (13) corresponding to the positioning block (12) is formed in a wall of the card board (8) on the right side, and the positioning block (12) is located in the positioning groove (13).
4. The multilayer printed board with the embedded capacitor, which is easy to metalize and conduct according to claim 1, is characterized in that the side walls of the upper side and the lower side of the U-shaped buckle plate (7) are provided with anti-skid grains (14).
5. The multilayer printed board with embedded capacitors and easy metallization and conduction as claimed in claim 1, wherein a plurality of metal rings (15) corresponding to the through holes are fixedly welded to the side wall of the lower side of the substrate (2).
6. The multilayer printed board with embedded capacitors, which is easy to be metallized and conducted, according to claim 1, wherein the groove wall on the right side of the slot (9) is arc-shaped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023098275.3U CN214070410U (en) | 2020-12-21 | 2020-12-21 | Embedded capacitor multilayer printed board easy to metalize and conduct |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023098275.3U CN214070410U (en) | 2020-12-21 | 2020-12-21 | Embedded capacitor multilayer printed board easy to metalize and conduct |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214070410U true CN214070410U (en) | 2021-08-27 |
Family
ID=77409898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023098275.3U Active CN214070410U (en) | 2020-12-21 | 2020-12-21 | Embedded capacitor multilayer printed board easy to metalize and conduct |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214070410U (en) |
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2020
- 2020-12-21 CN CN202023098275.3U patent/CN214070410U/en active Active
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|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240408 Address after: No. 69, Beichenzhuang Village, Yinchengpu Township, Fengrun District, Tangshan City, Hebei Province, 063000 Patentee after: Yao Qiang Country or region after: China Address before: No.185, building A9, phase II, software new town, No.156, tianguba Road, high tech Zone, Xi'an City, Shaanxi Province, 710075 Patentee before: Xi'an Jixin Liancheng Electronic Technology Co.,Ltd. Country or region before: China |