CN218071928U - Polar element, circuit board and electronic equipment - Google Patents
Polar element, circuit board and electronic equipment Download PDFInfo
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- CN218071928U CN218071928U CN202221741995.3U CN202221741995U CN218071928U CN 218071928 U CN218071928 U CN 218071928U CN 202221741995 U CN202221741995 U CN 202221741995U CN 218071928 U CN218071928 U CN 218071928U
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Abstract
The application provides a polarity component, circuit board and electronic equipment, this polarity component includes: an element body; the first pin is connected with the anode of the element body at one end, and a first welding end is arranged at the other end of the element body; one end of the second pin is connected with the negative electrode of the element body, the other end of the second pin is a second welding end, and the section of the second welding end, which is vertical to the extending direction of the second welding end, is a second graph; the length of the first pattern is greater than that of the second pattern, and the width of the first pattern is smaller than that of the second pattern. The circuit board includes: a plate body; the first welding disc is fixedly arranged on the plate body and is used for being welded to the first pin; the first pad forms a first socket, and the first socket and the first welding end are in small clearance fit or transition fit; the second welding disc is fixedly arranged on the plate body and is used for being welded to the second pin; the second pad forms a second socket, and the second socket and the second welding end are in small clearance fit or transition fit.
Description
Technical Field
The present application belongs to the technical field of electronic devices, and more particularly, to a polar element, a circuit board and an electronic device.
Background
In general, the long leg of the solid with polarity passing through the wave-soldering device is positive, the short leg is negative, and the silk-screen printing on the solid distinguishes the positive electrode and the negative electrode, so that the phenomena of reverse insertion of the polar device by hand and the like frequently occur in the wave-soldering process, which causes serious problems of short circuit, reverse connection, even power-on explosion and the like of PCBA after soldering. When the PCB is provided with devices with the same polarity and the polarity directions are not consistent, reverse insertion is easily caused.
SUMMERY OF THE UTILITY MODEL
An object of the embodiments of the present application is to provide a polar element, a circuit board, and an electronic device, so as to solve the technical problem in the prior art that the polar element is easily inserted reversely on the circuit board.
In order to achieve the purpose, the technical scheme adopted by the application is as follows:
there is provided a polar element comprising:
an element body;
one end of the first pin is connected to the anode of the element body, the other end of the first pin is a first welding end, and the section of the first welding end, which is perpendicular to the extending direction of the first welding end, is a first figure;
one end of the second pin is connected to the negative electrode of the element body, the other end of the second pin is a second welding end, and the section of the second welding end, which is perpendicular to the extending direction of the second welding end, is a second graph;
the length of the first graph is larger than that of the second graph, and the width of the first graph is smaller than that of the second graph.
In one embodiment, the first pin is an integrally formed structure.
In one embodiment, the second pin is an integrally molded structure.
In one embodiment, the first pattern is a waist circle and the second pattern is a circle.
In one embodiment, the first weld end is extruded from a cylindrical pin.
In one embodiment, the element body is a diode.
There is also provided a circuit board for mounting the above-mentioned polar element, comprising:
a plate body;
the first welding disc is fixedly arranged on the plate body and is used for being welded to the first pin; the first pad forms a first socket, and the first socket and the first welding end are in small clearance fit or transition fit;
the second bonding pad is fixedly arranged on the plate body and is used for being welded to the second pin; the second pad forms a second socket, and the second socket and the second welding end are in small clearance fit or transition fit.
In one embodiment, the first and second outlets are each provided in a plurality, the first outlets being spaced apart in a first direction, and the second outlets being spaced apart in the first direction.
In one embodiment, further comprising:
the positive pole mark is arranged on the plate body and close to the first bonding pad;
and the negative pole mark is arranged on the plate body and close to the second welding disc.
The electronic device comprises the polar element and the circuit board, and the polar element is welded on the circuit board.
The application provides a polarity component, circuit board and electronic equipment's beneficial effect lies in:
the polar element includes: the device comprises an element body, a first pin and a second pin, wherein one end of the first pin is connected to the anode of the element body, the other end of the first pin is a first welding end, the first welding end is used for being welded on a welding disc, and the section of the first welding end, which is vertical to the extending direction of the first welding end, is a first graph; one end of the second pin is connected to the negative electrode of the element body, the other end of the second pin is a second welding end, and the section of the second welding end, which is perpendicular to the extending direction of the second welding end, is a second graph; the length of the first graph is larger than that of the second graph, and the width of the first graph is smaller than that of the second graph.
The circuit board corresponding to the polar element may include: the circuit board comprises a board body, a first welding disc and a second welding disc, wherein the first welding disc is fixedly arranged on the board body and is used for being welded to a first pin; the first pad forms a first socket, and the first socket and the first welding end are in small clearance fit or transition fit; the second welding disc is fixedly arranged on the plate body and used for welding a second pin; the second pad forms a second socket, and the second socket and the second welding end are in small clearance fit or transition fit.
Because the length of the first pattern is greater than the length of the second pattern, the first welding end can only be inserted into the first socket and can not be inserted into the second socket; the width of the first pattern is smaller than that of the second pattern, so that the second welding end can only be inserted into the second insertion opening but not into the first insertion opening; the design can ensure that the first pin can only be welded on the first bonding pad and the second pin can only be welded on the second bonding pad, thereby effectively avoiding a series of problems of open circuit, explosion and the like caused by opposite polarities when the polar element is welded on the circuit board; and for the polar element, only partial change is needed to be carried out on the shape of one of the first pin and the second pin, so that the production and the processing are convenient, and the cost is low.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
Fig. 1 is a schematic structural diagram of a polar element and a circuit board in a welding state according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of a polar element according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of a circuit board according to an embodiment of the present application.
Wherein, in the figures, the respective reference numerals:
100. a polar element; 110. an element body; 120. a first pin; 121. a first weld end; 130. a second pin; 131. a second weld end; 200. a circuit board; 210. a plate body; 220. a first bonding pad; 221. a first jack; 230. a second bonding pad; 231. a second socket.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings that is solely for the purpose of facilitating the description and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting the present application.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
The polar element, the circuit board, and the electronic device provided in the embodiments of the present application will now be described.
As shown in fig. 1, 2 and 3, an embodiment of the present application provides a polar element 100, where the polar element 100 includes: the device includes a device body 110, a first lead 120, and a second lead 130.
The device body 110 may be an electronic device such as a rectifier diode or an electrolytic capacitor, and in the specific embodiment of the present application, the device body 110 is taken as an example of a rectifier diode. The rectifier diode is provided with two pins, wherein one pin is a positive electrode pin, and the positive electrode pin is used for being connected to the positive electrode of the circuit; the other pin is a negative electrode pin which is used for being connected with a negative electrode of the circuit.
The first lead 120 may be a positive lead, and one end of the first lead 120 is connected to the positive electrode of the device body 110. Specifically, the first lead 120 may be electrically connected to the positive electrode of the component body 110 by welding or the like. The other end of the first lead 120 is a first bonding terminal 121. Specifically, the first bonding terminal 121 is used for bonding to a pad on the circuit board 200 for connection to the positive electrode. The first welding tip 121 has a first pattern in a cross section perpendicular to the extending direction thereof. Specifically, the first pattern may have a circular, rectangular, oval, or the like shape.
The second pin 130 may be a negative pin, and one end of the second pin 130 is connected to the negative electrode of the device body 110. Specifically, the second lead 130 may be electrically connected to the negative electrode of the component body 110 by welding or the like. The other end of the second lead 130 is a second solder terminal 131. Specifically, the second soldering terminal 131 is used for soldering to a pad on the circuit board 200 for connecting to the negative electrode. The second welding tip 131 has a second pattern in a cross section perpendicular to the extending direction thereof. Specifically, the second pattern may be in the shape of a circle, a rectangle, an ellipse, or the like.
The length of the first graph is larger than that of the second graph, and the width of the first graph is smaller than that of the second graph. The land on the circuit board 200 for connecting with the first soldering terminal 121 may be set to a shape corresponding to a first pattern, and the land on the circuit board 200 for connecting with the second soldering terminal 131 may be set to a shape corresponding to a second pattern, in which case, the first soldering terminal 121 may be only soldered to the first land 220, and the second soldering terminal 131 may be only soldered to the second land 230, so as to effectively avoid a series of problems such as disconnection and explosion caused by the opposite polarities of the polar element 100 soldered to the circuit board 200; and for the polar element 100, only partial change of the shape of one of the first pin 120 and the second pin 130 is needed, so that the production and the processing are convenient, and the cost is low.
In some embodiments of the present application, the first lead 120 is an integrally formed structure. That is, the end of the first lead 120 connected to the component body 110 and the first soldering terminal 121 are integrally formed, so as to facilitate manufacturing and save manufacturing cost.
In some embodiments of the present application, the second lead 130 is an integrally formed structure. That is, the end of the second lead 130 connected to the component body 110 and the second soldering terminal 131 are integrally formed, so as to facilitate production and save production cost.
In some embodiments of the present application, the first graphic may be a waist circle and the second graphic may be a circle. In the manufacturing process of the polar element 100, generally, the first lead 120 and the second lead 130 both use cylindrical conductive wires, and since the cylindrical conductive wires are common and have low cost, the manufacturing cost of the entire structure can be effectively reduced by using the cylindrical conductive wires to manufacture the first lead 120 and the second lead 130. In the embodiment of the present application, the first bonding end 121 only needs to have the first lead 120 with a cylindrical shape, and the first lead is extruded to form the structure with the oval shape in the first figure. Under the condition that the first pin 120 and the second pin 130 adopt cylindrical wires with the same specification, the first pin 120 is extruded, and the effects that the length of the first graph is larger than that of the second graph and the width of the first graph is smaller than that of the second graph can be achieved.
As shown in fig. 1, 2 and 3, an embodiment of the present application further provides a circuit board 200, where the circuit board 200 includes: a board body 210, a first pad 220, and a second pad 230.
The board body 210 may be in various forms such as a single-sided board, a double-sided board, and a multi-layer board. The board body 210 is a main structure of the circuit board 200, and the specific structure thereof may be any type of structure adopted by the circuit board 200 in the prior art.
The first pad 220 is fixedly mounted on the board body 210, the first pad 220 may be a positive pad, and the first pad 220 is configured to be soldered to the first lead 120. The first pad 220 forms a first socket 221, and the first socket 221 is shaped to fit the first soldering terminal 121 to achieve a small clearance fit or transition fit between the first socket 221 and the first soldering terminal 121. Specifically, the first receptacle 221 and the first welding end 121 may fit with a small clearance to facilitate insertion of the first welding end 121 into the first receptacle 221. In this case, since the width of the cross section of the second soldering terminal 131 is greater than that of the first soldering terminal 220, the second soldering terminal 131 cannot be inserted into the first insertion opening 221, so that it is ensured that the first insertion opening 221 can be inserted only by the first soldering terminal 121, and further it is ensured that the first soldering terminal 220 can be soldered only to the first lead 120.
The second pad 230 is fixedly mounted on the board body 210, the second pad 230 may be a negative pad, and the second pad 230 is used for being soldered to the second lead 130. The second land 230 forms a second socket 231, and the second socket 231 is shaped to conform to the second soldering terminal 131, so that a small clearance fit or transition fit between the second socket 231 and the second soldering terminal 131 is achieved. Specifically, the second socket 231 and the second welding tip 131 may be fit with a small clearance to facilitate insertion of the second welding tip 131 into the second socket 231. In this case, since the first welding terminal 121 has a larger cross-sectional length than the second pad 230, the first welding terminal 121 cannot be inserted into the second socket 231, thereby ensuring that the second socket 231 can be inserted only by the second welding terminal 131, and further ensuring that the second pad 230 can be welded only with the second lead 130.
In summary, by the cooperation of the polar element 100 and the circuit board 200, the positive pin of the polar element 100 can be only soldered to the positive pad of the circuit board 200, and the negative pin of the polar element 100 can be only soldered to the negative pad of the circuit board 200. Therefore, a series of problems such as disconnection, explosion and the like caused by the fact that the polarity of the polar element 100 is opposite when being welded on the circuit board 200 can be effectively avoided; and for the polar element 100, only partial change of the shape of one of the first pin 120 and the second pin 130 is needed, so that the production and the processing are convenient, and the cost is low.
In some embodiments of the present application, each of the first socket 221 and the second socket 231 may be provided in plurality, so as to enable soldering of a plurality of polar elements 100 on the circuit board 200. The plurality of first sockets 221 are spaced apart along a first direction, wherein the first direction may be a transverse direction of the circuit board 200. So that the first pins 120 of the plurality of polar elements 100 are soldered to the circuit board 200 at intervals in the transverse direction of the circuit board 200. The plurality of second sockets 231 are spaced apart in the second direction. So that the second leads 130 of the plurality of malformed elements are soldered to the circuit board 200 at intervals in the transverse direction of the circuit board 200. In this case, the plurality of polar elements 100 may be spaced apart along the first direction, so as to achieve the effects of soldering the plurality of polar elements 100 to the circuit board 200 and maintaining the polar elements 100 in a dense distribution and an attractive appearance.
In some embodiments of the present application, the circuit board 200 may further include: a positive sign and a negative sign.
The positive flag is disposed on the board body 210 and close to the first pad 220. Specifically, the positive mark may be formed integrally with the plate body 210, for example, the positive mark may be a "+" shaped pattern protruding from or recessed into the surface of the plate body 210. The positive pole mark can be used for further facilitating a user to distinguish the positive pole bonding pad from the negative pole bonding pad, and further avoiding a series of problems of circuit breaking, explosion and the like caused by the fact that the polarity of the polar element 100 is opposite when being welded on the circuit board 200.
The negative flag is disposed on the board body 210 and close to the second pad 230. Specifically, the negative pole indicator may be integrally formed with the plate body 210, for example, the negative pole indicator may be a "-" shaped pattern protruding from or recessed into the surface of the plate body 210. The negative pole mark can be used for further facilitating a user to distinguish the positive pole pad from the negative pole pad, and further avoiding a series of problems of disconnection, explosion and the like caused by the fact that the polarity of the polar element 100 is opposite when being welded on the circuit board 200.
The application also provides an electronic device, which comprises the polar element and a circuit board, wherein the polar element is welded on the circuit board. By utilizing the polar element to be matched with the circuit board, a series of problems of circuit breaking, explosion and the like caused by opposite polarities when the polar element is welded on the circuit board can be effectively avoided, and therefore the normal operation of the electronic equipment is effectively guaranteed.
The above description is only a preferred embodiment of the present application and should not be taken as limiting the present application, and any modifications, equivalents, improvements, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (10)
1. A polar element, comprising:
an element body;
the first pin is connected with the anode of the element body at one end, and a first welding end is arranged at the other end of the first pin, and the section of the first welding end, which is vertical to the extending direction of the first welding end, is a first graph;
one end of the second pin is connected to the negative electrode of the element body, the other end of the second pin is a second welding end, and the section of the second welding end, which is perpendicular to the extending direction of the second welding end, is a second graph;
the length of the first graph is larger than that of the second graph, and the width of the first graph is smaller than that of the second graph.
2. The polar element according to claim 1, wherein the first leg is a one-piece structure.
3. The polar element according to claim 1 or 2, wherein the second leg is of an integrally formed structure.
4. The polar element according to claim 3, wherein the first pattern is a waist circle and the second pattern is a circle.
5. The polar element according to claim 4, wherein the first weld end is extruded from a cylindrical pin.
6. The polar element according to claim 1, wherein the element body is a diode.
7. A circuit board for mounting the polar element according to any one of claims 1 to 6, comprising:
a plate body;
the first welding disc is fixedly arranged on the plate body and is used for being welded to the first pin; the first pad forms a first socket, and the first socket and the first welding end are in small clearance fit or transition fit;
the second welding disc is fixedly arranged on the plate body and is used for being welded on the second pin; the second pad forms a second socket, and the second socket and the second welding end are in small clearance fit or transition fit.
8. The circuit board of claim 7, wherein the first and second sockets are each provided in a plurality, the first sockets being spaced apart in a first direction, and the second sockets being spaced apart in the first direction.
9. The circuit board of claim 7, further comprising:
the positive pole mark is arranged on the plate body and close to the first bonding pad;
and the negative pole mark is arranged on the plate body and close to the second bonding pad.
10. An electronic device comprising the polar element according to any one of claims 1 to 6 and the circuit board according to any one of claims 7 to 9, the polar element being soldered to the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221741995.3U CN218071928U (en) | 2022-07-07 | 2022-07-07 | Polar element, circuit board and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221741995.3U CN218071928U (en) | 2022-07-07 | 2022-07-07 | Polar element, circuit board and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218071928U true CN218071928U (en) | 2022-12-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221741995.3U Active CN218071928U (en) | 2022-07-07 | 2022-07-07 | Polar element, circuit board and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218071928U (en) |
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2022
- 2022-07-07 CN CN202221741995.3U patent/CN218071928U/en active Active
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