CN220325910U - Novel bonding pad for circuit board - Google Patents
Novel bonding pad for circuit board Download PDFInfo
- Publication number
- CN220325910U CN220325910U CN202321999063.3U CN202321999063U CN220325910U CN 220325910 U CN220325910 U CN 220325910U CN 202321999063 U CN202321999063 U CN 202321999063U CN 220325910 U CN220325910 U CN 220325910U
- Authority
- CN
- China
- Prior art keywords
- bonding pad
- circuit board
- pad body
- fixedly connected
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910052802 copper Inorganic materials 0.000 claims abstract description 7
- 239000010949 copper Substances 0.000 claims abstract description 7
- 238000003466 welding Methods 0.000 claims description 9
- 239000011889 copper foil Substances 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 238000000576 coating method Methods 0.000 abstract description 5
- 239000007788 liquid Substances 0.000 abstract description 3
- 238000005266 casting Methods 0.000 abstract 1
- 238000005476 soldering Methods 0.000 description 14
- 238000010438 heat treatment Methods 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses a novel bonding pad for a circuit board, which belongs to the technical field of circuit boards and comprises a circuit board body, wherein two groups of bonding pad grooves are formed in the upper surface of the circuit board body, two groups of positioning wedge pins are fixedly connected to the inner bottom wall of each bonding pad groove, the bonding pad body is arranged in each bonding pad groove, each positioning wedge pin is positioned in the bonding pad body, the bonding pad body is formed by a copper coating process, the upper surface of each bonding pad body is provided with a groove, the bonding pad body can be effectively fastened and limited in the copper coating process through the bonding pad grooves, the positioning wedge pins and a copper foil ring, the bonding pad body can be effectively fixed, the phenomenon of lifting and tilting of the bonding pad body is avoided, the bonding pad body can be stably used, the pins of a component can be effectively welded and the casting liquid can be effectively increased, the stability of the component in the bonding pad body can be effectively improved, and the stable operation of the circuit board can be conveniently realized.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a novel bonding pad for a circuit board.
Background
The circuit board is generally referred to as a circuit board, which is an important role in miniaturizing and visualizing circuits, mass-producing fixed circuits and optimizing the layout of electrical appliances, and may be called a printed circuit board or a printed circuit board, wherein a bonding pad is a metal contact point for soldering components on a Printed Circuit Board (PCB), also called a bonding pad, which is formed by a copper-coating process, and is generally formed on both a surface and an inner layer of the PCB, and the design and manufacture of the bonding pad have an important influence on the performance and stability of an electronic product.
The Chinese patent with the publication number of CN210629973U discloses a bonding pad for a backlight flexible circuit board, but certain defects exist in the use process of the patent, the bonding pad cannot be effectively limited and fixed to the bonding pad in the use process of the circuit board, the bonding pad is easy to generate a tilting phenomenon, and the bonding pad is poor in welding firmness when being welded with pins of components and parts, so that the use effect of the circuit board is reduced, and therefore, a novel bonding pad for the circuit board is provided by a person skilled in the art to solve the problem in the background art.
Disclosure of Invention
The utility model aims to provide a novel bonding pad for a circuit board, which solves the problems in the prior art.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
the utility model provides a novel bonding pad for circuit board, includes the circuit board body, two sets of bonding pad grooves have been seted up to the upper surface of circuit board body, every the equal fixedly connected with of interior diapire in bonding pad groove is two sets of location contract feet, every the inside in bonding pad groove all is equipped with the bonding pad body, every the location contract foot all is located the inside of bonding pad body, the bonding pad body forms through covering copper technology, every the upper surface of bonding pad body is all seted up flutedly, every the equal fixedly connected with pin welding post of interior diapire in recess.
As still further aspects of the utility model: the outer surface of each bonding pad body is fixedly connected with a copper foil ring, and the outer surface of each copper foil ring is fixedly connected with the inner wall of the bonding pad groove.
As still further aspects of the utility model: four groups of connecting wire grooves are formed in the upper surface of the circuit board body, and copper foil wires are fixedly connected to the inner wall of each connecting wire groove.
As still further aspects of the utility model: the bottom surface fixedly connected with heating panel of circuit board body, the heating panel is the heat conduction silica gel material.
As still further aspects of the utility model: two groups of mounting holes are formed in the upper surface of the circuit board body, and the number of the mounting holes is at least four.
Compared with the prior art, the utility model has the beneficial effects that:
this novel pad for circuit board through the bonding pad groove, location contract foot and the copper foil circle that set up, can be in covering copper technology effectual bonding pad body and fasten spacingly, effectively increase the firm of bonding pad body and decide, avoid appearing the bonding pad body and appear raising the phenomenon, the stable use of bonding pad body of being convenient for to through recess and the pin welding post that set up, can carry out effective welding to the pin of components and parts, and pour soldering tin liquid, effectively increase components and parts at bonding pad body welded stability, the steady operation of circuit board of being convenient for.
Drawings
FIG. 1 is a schematic diagram of the overall perspective structure of a novel bonding pad for a circuit board;
FIG. 2 is a bottom view of a circuit board body in a novel bonding pad for a circuit board;
FIG. 3 is a top view of a circuit board body in a novel bonding pad for a circuit board;
fig. 4 is a schematic perspective view of a circuit board body in a novel bonding pad for a circuit board.
In the figure: 1. a circuit board body; 2. a pad body; 3. a groove; 4. pin welding columns; 5. a pad groove; 6. a mounting hole; 7. copper foil rings; 8. a connecting wire slot; 9. copper foil wires; 10. positioning wedge legs; 11. and a heat dissipation plate.
Detailed Description
In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art in a specific case.
Referring to fig. 1 to 4, in the embodiment of the utility model, a novel bonding pad for a circuit board comprises a circuit board body 1, two groups of bonding pad grooves 5 are formed on the upper surface of the circuit board body 1, two groups of positioning wedge pins 10 are fixedly connected to the inner bottom wall of each bonding pad groove 5, a bonding pad body 2 is arranged in each bonding pad groove 5, each positioning wedge pin 10 is positioned in the bonding pad body 2, the bonding pad body 2 is formed by a copper coating process, grooves 3 are formed on the upper surface of each bonding pad body 2, and pin welding columns 4 are fixedly connected to the inner bottom wall of each groove 3.
The surface of every pad body 2 is equal fixedly connected with copper foil circle 7, and the surface of every copper foil circle 7 all with the inner wall fixed connection of pad groove 5, can restrict spacing to pad body 2, increase the stability of pad body 2, four sets of connection wire casing 8 have all been seted up to the upper surface of circuit board body 1, and the equal fixedly connected with copper foil line 9 of the inner wall of every connection wire casing 8 can carry out line connection to the components and parts, the line connection of circuit board body 1 of being convenient for.
The bottom surface fixedly connected with heating panel 11 of circuit board body 1, heating panel 11 be the heat conduction silica gel material, can dispel the heat to the welding dish body 2, and the stable safe handling of circuit board body 1 is convenient for, and two sets of mounting holes 6 have been seted up to the upper surface of circuit board body 1, and the quantity of mounting hole 6 is four at least, and the installation that can be convenient for circuit board body 1 is fixed, the installation work of staff of being convenient for.
The working principle of the utility model is as follows: when the soldering pad is used, firstly, the soldering pad body 2 is fixed in the soldering pad groove 5 through a copper coating process, meanwhile, the soldering pad body 2 is wrapped outside the positioning wedge 10, the soldering pad body 2 is positioned, then the copper foil ring 7 is fixed on the outer wall of the soldering pad body 2, and meanwhile, the copper foil ring is fixed on the inner wall of the soldering pad groove 5, so that secondary limiting of the soldering pad body 2 is realized, stable assembly of the soldering pad body 2 is realized, then components are placed on the soldering pad body 2, pins of the components are contacted with the pin welding columns 4, and meanwhile, the components are welded on the soldering pad body 2 through soldering tin liquid, so that assembly production of a circuit board is completed.
While the utility model has been described with reference to the preferred embodiments, it will be apparent to those skilled in the art that the utility model is not limited to the details of the exemplary embodiments and that the utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof, as long as the scope of the utility model is defined by the claims and its spirit and scope. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.
Claims (5)
1. The utility model provides a novel bonding pad for circuit board, includes circuit board body (1), its characterized in that, two sets of bonding pad grooves (5) have been seted up to the upper surface of circuit board body (1), every the equal fixedly connected with of interior bottom wall in bonding pad groove (5) is two sets of location wedge feet (10), every the inside in bonding pad groove (5) all is equipped with bonding pad body (2), every location wedge foot (10) all are located the inside of bonding pad body (2), bonding pad body (2) are formed through covering copper technology, every recess (3) have all been seted up to the upper surface of bonding pad body (2), every the equal fixedly connected with pin welding post (4) of interior diapire of recess (3).
2. The novel bonding pad for the circuit board according to claim 1, wherein the outer surface of each bonding pad body (2) is fixedly connected with a copper foil ring (7), and the outer surface of each copper foil ring (7) is fixedly connected with the inner wall of the bonding pad groove (5).
3. The novel bonding pad for the circuit board according to claim 1, wherein four groups of connecting wire grooves (8) are formed in the upper surface of the circuit board body (1), and copper foil wires (9) are fixedly connected to the inner wall of each connecting wire groove (8).
4. The novel bonding pad for the circuit board according to claim 1, wherein the bottom surface of the circuit board body (1) is fixedly connected with a heat dissipation plate (11), and the heat dissipation plate (11) is made of heat-conducting silica gel.
5. The novel bonding pad for a circuit board according to claim 1, wherein two groups of mounting holes (6) are formed in the upper surface of the circuit board body (1), and the number of the mounting holes (6) is at least four.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321999063.3U CN220325910U (en) | 2023-07-27 | 2023-07-27 | Novel bonding pad for circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321999063.3U CN220325910U (en) | 2023-07-27 | 2023-07-27 | Novel bonding pad for circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220325910U true CN220325910U (en) | 2024-01-09 |
Family
ID=89420766
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321999063.3U Active CN220325910U (en) | 2023-07-27 | 2023-07-27 | Novel bonding pad for circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220325910U (en) |
-
2023
- 2023-07-27 CN CN202321999063.3U patent/CN220325910U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |