CN220342710U - Heat radiation plate - Google Patents
Heat radiation plate Download PDFInfo
- Publication number
- CN220342710U CN220342710U CN202321889606.6U CN202321889606U CN220342710U CN 220342710 U CN220342710 U CN 220342710U CN 202321889606 U CN202321889606 U CN 202321889606U CN 220342710 U CN220342710 U CN 220342710U
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- China
- Prior art keywords
- plate
- soldering
- copper plate
- positioning
- aluminum plate
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- 230000005855 radiation Effects 0.000 title description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 77
- 229910052802 copper Inorganic materials 0.000 claims abstract description 77
- 239000010949 copper Substances 0.000 claims abstract description 77
- 238000005476 soldering Methods 0.000 claims abstract description 76
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 62
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 62
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 37
- 230000017525 heat dissipation Effects 0.000 claims abstract description 28
- 230000004907 flux Effects 0.000 claims abstract description 5
- 238000001816 cooling Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 abstract description 26
- 238000003466 welding Methods 0.000 abstract description 14
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a heat dissipation plate, which comprises an aluminum plate and a copper plate fixed on the aluminum plate, wherein the edge of the copper plate is provided with at least two positioning notches, and the inner side of the lower surface of the copper plate along the edge is provided with a first tin soldering groove; the upper surface of the aluminum plate is provided with a positioning step and a second tin soldering bath corresponding to the positioning notch, wherein the positioning step is also provided with a positioning column; the positioning notch of the copper plate is arranged on the positioning step and is matched with the positioning column, so that a soldering gap is reserved between the aluminum plate and the copper plate, and the copper plate and the aluminum plate are fixed together through soldering, wherein soldering flux is contained by the soldering gap, the first soldering groove and the second soldering groove. The copper plate positioning device has the beneficial effects that the copper plate is positioned when welding is convenient, the soldering gap, the first soldering groove and the second soldering groove can contain soldered solder, the soldered solder is prevented from flowing to the outer side of the copper plate, the contact surface between the soldered solder and the aluminum plate as well as the copper plate is increased, the soldering firmness is improved, and the problem of tin dropping caused by exposure of the soldered solder is avoided.
Description
Technical Field
The utility model relates to the technical field of heat dissipation systems, in particular to a heat dissipation plate.
Background
The heat dissipating device is mainly used for dissipating heat of the easily-generated electronic element in the electric appliance, and the heat dissipating plate is a common structure in the heat dissipating device, and not only has a heat dissipating function, but also can be used as a mounting seat of other heat dissipating structures of the fan lamp. The material of the heat dissipation plate can be copper, aluminum or the like, wherein the copper has good heat conduction performance, but the price is relatively high, and the aluminum has low price, but the heat conduction performance is poor. In order to manufacture a heat dissipation plate with good heat conductivity and low price, most of the prior heat dissipation plates adopt a structure of aluminum-inlaid copper, and the copper plate is required to be fixed on an aluminum plate by utilizing soldering, but the prior heat dissipation plate has the problems of easy tin dropping, unstable welding and difficult welding positioning.
Therefore, it is necessary to provide a heat dissipating plate which is not easy to be dropped, unstable in welding, and easy to be positioned during welding.
Disclosure of Invention
First, the technical problem to be solved
In view of the above-mentioned drawbacks and shortcomings of the prior art, the present utility model provides a heat dissipation plate, which solves the technical problems of easy tin dropping, unstable welding and difficult welding positioning of the structure of the existing heat dissipation plate.
(II) technical scheme
In order to achieve the above purpose, the main technical scheme adopted by the utility model comprises the following steps:
in a first aspect, an embodiment of the present utility model provides a heat dissipating plate.
The embodiment of the utility model provides a heat dissipation plate, which comprises an aluminum plate and a copper plate fixed on the aluminum plate, wherein:
the edge of the copper plate is provided with at least two positioning notches, and the inner side of the lower surface of the copper plate along the edge is provided with a first tin soldering groove;
a positioning step is arranged on the upper surface of the aluminum plate corresponding to the positioning notch, and a second tin soldering groove is arranged corresponding to the first tin soldering groove, wherein a positioning column is further arranged on the positioning step;
the positioning notch of the copper plate is arranged on the positioning step and matched with the positioning column, so that a soldering gap is reserved between the aluminum plate and the copper plate, and the copper plate and the aluminum plate are fixed together through soldering, wherein soldering flux is contained by the soldering gap, the first soldering groove and the second soldering groove.
The positioning step and the positioning column are arranged on the aluminum plate, so that the copper plate is positioned when welding is conveniently performed, and a soldering gap can be reserved between the aluminum plate and the copper plate by the positioning step; meanwhile, the first tin soldering groove is formed in the inner side of the edge of the copper plate, and the second tin soldering groove is formed in the aluminum plate corresponding to the first tin soldering groove, so that soldered solder can be contained, the soldered solder is prevented from flowing to the outer side of the copper plate, the contact surface between the soldered solder and the aluminum plate as well as the copper plate is increased, the soldering firmness is improved, and the problem of tin dropping caused by exposure of the soldered solder is avoided.
Optionally, the copper plate is rectangular in shape, and the positioning notch is located at a diagonal of the rectangle. The positioning notch is arranged on the opposite angle of the rectangular copper plate, so that the copper plate can be stably placed during welding.
Optionally, the upper surface of aluminum plate still is equipped with the supporting legs, the height of supporting legs with the reference column parallel and level. The supporting legs with the height being flush with the positioning column are arranged, so that the heat dissipation plate can be stably placed, and the installation is convenient.
Optionally, a heat dissipation through hole is formed in the aluminum plate. The heat dissipation performance of the heat dissipation plate can be improved through the heat dissipation holes.
Optionally, a mounting structure for mounting a heat dissipating device is arranged on the lower surface of the aluminum plate, and is used for mounting a heat dissipating device such as a fan.
(III) beneficial effects
The beneficial effects of the utility model are as follows: according to the heat radiation plate, the positioning steps and the positioning columns are arranged on the aluminum plate, so that the copper plate is conveniently positioned during welding, and a soldering gap can be reserved between the aluminum plate and the copper plate by the positioning steps; meanwhile, the first tin soldering groove is formed in the inner side of the edge of the copper plate, and the second tin soldering groove is formed in the aluminum plate corresponding to the first tin soldering groove, so that soldered solder can be contained, the soldered solder is prevented from flowing to the outer side of the copper plate, the contact surface between the soldered solder and the aluminum plate as well as the copper plate is increased, the soldering firmness is improved, and the problem of tin dropping caused by exposure of the soldered solder is avoided.
Drawings
Fig. 1 is a perspective view of embodiment 1 of a heat dissipating plate of the present utility model;
FIG. 2 is an exploded view of the heat spreader plate of FIG. 1;
fig. 3 is a schematic view of the front surface of the copper plate of fig. 1;
FIG. 4 is a schematic illustration of the mating of the copper and aluminum plates of FIG. 1;
fig. 5 is a schematic view of the front surface of the aluminum plate of fig. 1.
[ reference numerals description ]
10, aluminum plate; 11, positioning the step; 111, positioning columns; 12, a second tin soldering bath; 13, supporting the feet; 14, heat dissipation holes; 15, a mounting structure;
20, copper plate; 21, positioning the notch; 22, a first solder bath;
30, soldering gap.
Detailed Description
The utility model will be better explained by the following detailed description of the embodiments with reference to the drawings. Wherein references herein to "upper", "lower", "etc. are made with reference to the orientation of fig. 1.
The embodiment of the utility model provides a heat dissipation plate, which comprises an aluminum plate and a copper plate fixed on the aluminum plate, wherein: the edge of the copper plate is provided with at least two positioning notches, and the inner side of the lower surface of the copper plate along the edge is provided with a first tin soldering groove; a positioning step is arranged on the upper surface of the aluminum plate corresponding to the positioning notch, and a second tin soldering groove is arranged corresponding to the first tin soldering groove, wherein a positioning column is further arranged on the positioning step; the positioning notch of the copper plate is arranged on the positioning step and matched with the positioning column, so that a soldering gap is reserved between the aluminum plate and the copper plate, and the copper plate and the aluminum plate are fixed together through soldering, wherein soldering flux is contained by the soldering gap, the first soldering groove and the second soldering groove.
The positioning step and the positioning column are arranged on the aluminum plate, so that the copper plate is positioned when welding is conveniently performed, and a soldering gap can be reserved between the aluminum plate and the copper plate by the positioning step; meanwhile, the first tin soldering groove is formed in the inner side of the edge of the copper plate, and the second tin soldering groove is formed in the aluminum plate corresponding to the first tin soldering groove, so that soldered solder can be contained, the soldered solder is prevented from flowing to the outer side of the copper plate, the contact surface between the soldered solder and the aluminum plate as well as the copper plate is increased, the soldering firmness is improved, and the problem of tin dropping caused by exposure of the soldered solder is avoided.
In order that the above-described aspects may be better understood, exemplary embodiments of the present utility model will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present utility model are shown in the drawings, it should be understood that the present utility model may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the utility model to those skilled in the art.
Description of the preferred embodiments section
Example 1:
referring to fig. 1 to 5, the heat dissipating plate of the present embodiment includes an aluminum plate 10 and a copper plate 20 fixed to the aluminum plate 10.
The edge of the copper plate 20 is provided with two positioning notches 21, and the lower surface of the copper plate 20 is provided with a first solder bath 22 along the inner side of the edge. The upper surface of the aluminum plate 10 is provided with a positioning step 11 corresponding to the positioning notch 21, and a second tin soldering bath 12 corresponding to the first tin soldering bath 22, wherein the positioning step 11 is also provided with a positioning column 111.
The positioning notch 21 of the copper plate 20 is placed on the positioning step 11 and is matched with the positioning column 111, so that a soldering gap 30 is reserved between the aluminum plate 10 and the copper plate 20, the copper plate 20 and the aluminum plate 10 are fixed together through soldering, and the soldering flux is accommodated by the soldering gap 30, the first soldering bath 22 and the second soldering bath 12.
The positioning step 11 and the positioning column 111 are arranged on the aluminum plate 10, so that the copper plate 20 can be positioned during welding conveniently, and a soldering gap can be reserved between the aluminum plate 10 and the copper plate 20 by the positioning step 11; meanwhile, the first tin soldering groove 22 is arranged on the inner side of the edge of the copper plate 20, and the second tin soldering groove 12 is arranged on the aluminum plate 10 corresponding to the first tin soldering groove 22, so that soldered solder can be contained, the soldered solder is prevented from flowing to the outer side of the copper plate 20, the contact surface between the soldered solder and the aluminum plate 10 and the copper plate 20 is increased, the soldering firmness is improved, and the problem of tin dropping caused by exposure of the soldered solder is also avoided.
In some possible embodiments, the copper plate 20 may be rectangular in shape, with the locating notch 21 being located diagonally to the rectangle. The positioning notch 21 is arranged on the opposite angle of the rectangular copper plate 20, so that the copper plate 20 can be stably placed during welding.
In practical applications, the copper plate 20 may be in other shapes such as a circle, a polygon, etc., and the positioning notch 21 and the positioning step 11 should be positioned so that the copper plate 20 can be placed on the positioning step 11 as stably as possible.
In some possible solutions, the upper surface of the aluminium plate 10 is also provided with support feet 13, the height of the support feet 13 being flush with the positioning posts 111. The supporting legs 13 with the height being flush with the positioning columns are arranged, so that the heat dissipation plate can be stably placed, and the installation is convenient.
In some possible solutions, the aluminium plate 10 is provided with heat dissipation through holes 14. The heat dissipation holes 14 can improve the heat dissipation performance of the heat dissipation plate.
In practice, the number of the heat dissipation holes 14 may be one or more.
In some possible embodiments, the lower surface of the aluminum plate 10 is further provided with a mounting structure 15 for mounting a heat sink, such as a mounting post, screw hole, etc., for mounting a heat sink such as a fan.
In practical applications, the positions of the heat dissipation holes 14, the mounting structure 15 and the copper plate 20 on the aluminum plate 10 may be set according to practical needs, as long as the positions of the heat dissipation holes 14, the mounting structure 15 and the copper plate 20 do not interfere with each other.
The heat dissipation plate is characterized in that the aluminum plate is provided with the positioning step and the positioning column, so that the copper plate is conveniently positioned during welding, and a soldering gap for soldering can be reserved between the aluminum plate and the copper plate by the positioning step; meanwhile, the first tin soldering groove is formed in the inner side of the edge of the copper plate, and the second tin soldering groove is formed in the aluminum plate corresponding to the first tin soldering groove, so that soldered solder can be contained, the soldered solder is prevented from flowing to the outer side of the copper plate, the contact surface between the soldered solder and the aluminum plate as well as the copper plate is increased, the soldering firmness is improved, and the problem of tin dropping caused by exposure of the soldered solder is avoided.
In the description of the present utility model, it should be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium; may be a communication between two elements or an interaction between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present utility model, unless expressly stated or limited otherwise, a first feature is "on" or "under" a second feature, which may be in direct contact with the first and second features, or in indirect contact with the first and second features via an intervening medium. Moreover, a first feature "above," "over" and "on" a second feature may be a first feature directly above or obliquely above the second feature, or simply indicate that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is level lower than the second feature.
In the description of the present specification, the terms "one embodiment," "some embodiments," "examples," "particular examples," or "some examples," etc., refer to particular features, structures, materials, or characteristics described in connection with the embodiment or example as being included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
While embodiments of the present utility model have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the utility model, and that alterations, modifications, substitutions and variations may be made in the above embodiments by those skilled in the art within the scope of the utility model.
Claims (5)
1. A cooling plate comprising an aluminum plate (10) and a copper plate (20) fixed on the aluminum plate (10), characterized in that:
the edge of the copper plate (20) is provided with at least two positioning notches (21), and the inner side of the lower surface of the copper plate (20) along the edge is provided with a first tin soldering groove (22);
the upper surface of the aluminum plate (10) is provided with a positioning step (11) corresponding to the positioning notch (21), and a second tin soldering bath (12) corresponding to the first tin soldering bath (22), wherein the positioning step (11) is also provided with a positioning column (111);
the positioning notch (21) of the copper plate (20) is arranged on the positioning step (11) and is matched with the positioning column (111), so that a soldering gap (30) is reserved between the aluminum plate (10) and the copper plate (20), and the copper plate (20) and the aluminum plate (10) are fixed together through soldering, wherein soldering flux is contained in the soldering gap (30), the first soldering groove (22) and the second soldering groove (12).
2. The heat dissipating plate according to claim 1, wherein: the copper plate (20) is rectangular in shape, and the positioning notch (21) is formed in the opposite corner of the rectangle.
3. The heat dissipating plate according to claim 1, wherein: the upper surface of aluminum plate (10) still is equipped with supporting legs (13), the height of supporting legs (13) with reference column (111) parallel and level.
4. The heat dissipating plate according to claim 1, wherein: and the aluminum plate (10) is provided with a heat dissipation through hole (14).
5. The heat dissipating plate according to claim 1, wherein: the lower surface of the aluminum plate (10) is provided with a mounting structure (15) for mounting the heat dissipation device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321889606.6U CN220342710U (en) | 2023-07-18 | 2023-07-18 | Heat radiation plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321889606.6U CN220342710U (en) | 2023-07-18 | 2023-07-18 | Heat radiation plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220342710U true CN220342710U (en) | 2024-01-12 |
Family
ID=89447977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321889606.6U Active CN220342710U (en) | 2023-07-18 | 2023-07-18 | Heat radiation plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220342710U (en) |
-
2023
- 2023-07-18 CN CN202321889606.6U patent/CN220342710U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |