CN211378371U

CN211378371U - Wireless communication module chip welding PCB board

Info

Publication number: CN211378371U
Application number: CN201922485887.9U
Authority: CN
Inventors: 周黎华
Original assignee: Changzhou Inbo Technology Co ltd
Current assignee: Changzhou Inbo Technology Co ltd
Priority date: 2019-12-30
Filing date: 2019-12-30
Publication date: 2020-08-28
Anticipated expiration: 2029-12-30

Abstract

The utility model discloses a wireless communication module chip welding PCB board, the peripheral part interval of PCB board is equipped with breach portion, breach portion is equipped with the column pin that exposes in the chip peripheral part, the column pin has medial surface, lateral surface, is located the top surface of PCB board setting chip one side and deviates from the bottom surface of PCB board setting chip one side, and the medial surface is connected with the inner wall of PCB board breach portion, and the lateral surface is the indent arcwall face at the side that deviates from PCB board; a platform is formed between every two adjacent welding feet, 1 groove is at least formed in the notch portion, one end of each groove is located on the concave arc face of each pin, and the other end of each groove is located on the platform. When the PCB is connected with the integrated circuit mainboard through electric soldering, a welding structure of an upper cladding type and a lower cladding type is formed, so that the welding firmness of the wireless communication module chip welding PCB on the integrated circuit mainboard is favorably enhanced, and further the effectiveness and the practicability of the wireless communication module are ensured.

Description

Wireless communication module chip welding PCB board

Technical Field

The utility model belongs to the technical field of wireless communication, a wireless communication module is related to, a wireless communication module chip welding PCB board is specifically provided.

Background

The wireless communication module generally includes an antenna, a wireless communication chip, and an integrated circuit motherboard for mounting the antenna and the wireless communication chip (chip for short), where the wireless communication chip is a packaged chip. Packaging refers to the use of wire bonding of circuit pins on a silicon die to external connections for connection to other devices. For example, in Surface Mount Technology (SMT), i.e., component mounting technology on a Printed Circuit Board (PCB), a chip packaged by SMT is electrically connected to an integrated circuit main board through pins disposed on the PCB, such as a wireless communication chip disclosed in chinese patent document (application No. 201821740431.1), wherein although the disclosed pin form has a wide application range, the effectiveness of electrical connection between the wireless communication chip and the integrated circuit board cannot be guaranteed, and the disadvantage of poor soldering exists.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects of the prior art, the utility model provides a myriad of wireless communication module chip welding PCB boards.

In order to realize the purpose, the utility model discloses a technical scheme is: a wireless communication module chip welding PCB is characterized in that gap parts are arranged at intervals on the periphery of the PCB, columnar pins exposed out of the periphery of the chip are arranged in the gap parts, each columnar pin is provided with an inner side surface, an outer side surface, a top surface located on one side of the PCB where the chip is arranged and a bottom surface deviating from one side of the PCB where the chip is arranged, the inner side surface is connected with the inner wall of the gap part, and the outer side surface is an inwards concave arc-shaped surface deviating from one side of the PCB; be formed with the platform between two adjacent leg, 1 recess has been seted up at least to breach portion, the one end of recess is located the lateral surface, and the other end of recess is located the platform.

Further, the groove is in the horizontal direction, and the included angle between the inner side wall of the groove below the groove and the horizontal direction is 0 degree. Through this step optimization, the recess processing of being convenient for on the one hand, on the other hand soldering tin extends and covers the arcwall face via the top surface of column pin, and when partial soldering tin was filled in the breach, the recess inside wall of below formed bearing platform, is convenient for to the anchor of soldering tin, and then strengthens the welding fastness.

Further, the notch part is semicircular, semielliptical or semirectangular.

Compared with the prior art, the utility model discloses the technological effect who gains does: when the PCB is connected with the integrated circuit mainboard in a welding mode, an upper cladding type welding structure and a lower cladding type welding structure can be formed, namely, the soldering tin extends from the top surface of the columnar pin and covers the arc-shaped surface, part of the soldering tin is filled in the notch, the upper cladding limiting type welding structure and the lower cladding limiting type welding structure are formed, the welding firmness of the wireless communication module chip welding PCB on the integrated circuit mainboard is favorably enhanced, and then the effectiveness and the practicability of the wireless communication module are guaranteed.

Drawings

Fig. 1 is a schematic structural diagram (front view) of a wireless communication module chip-bonding PCB board in an embodiment of the present invention.

Fig. 2 is a top view of fig. 1.

Fig. 3 is a bottom view of fig. 1.

Fig. 4 is a schematic structural diagram of a PCB pin of a wireless communication module chip-bonding PCB in an embodiment of the present invention (only one side is illustrated in the figure).

The reference numbers in the figures are: the PCB comprises a PCB board, a chip, a pin.

Detailed Description

The utility model discloses not confine the following embodiment to, general technical personnel in this field can adopt other multiple embodiment to implement according to the utility model discloses a, perhaps all adopt the utility model discloses a design structure and thinking do simple change or change, all fall into the utility model discloses a protection scope. It should be noted that, in the present invention, the embodiments and features of the embodiments may be combined with each other without conflict.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.

The specific embodiment of the utility model is shown in fig. 1-4, a wireless communication module chip welding PCB board, the peripheral part interval of PCB board 1 is equipped with semicircular breach portion 4, breach portion 4 is equipped with exposes in the column pin 3 of 2 peripheral parts of chip, column pin 3 has medial surface 301, lateral surface 302, is located the top surface 303 that PCB board 1 set up chip 2 one side and deviates from PCB board 1 and sets up the bottom surface 304 of chip 2 one side, medial surface 301 is connected with the inner wall of breach portion 4, and lateral surface 302 is the indent arcwall face in the one side that deviates from PCB board 1; be formed with platform 5 between two adjacent leg, breach portion 4 is equipped with 1 recess, the one end of recess is located the indent arcwall face (being lateral surface 302) of pin 3, and the other end of recess is located platform 5. The recess is the horizontal direction, and the recess inside wall that is located the below is 0 with the contained angle of horizontal direction.

When the PCB board that will paste the chip is connected with integrated circuit mainboard welded, place the PCB board on the integrated circuit mainboard, melting soldering tin gets into the indent arcwall face of pin, it is big to increase the area of contact of soldering tin with the pin on the one hand, cladding formula's welded structure about on the other hand can form, soldering tin extends and covers the arcwall face via the top surface of column pin promptly, partial soldering tin is filled in the breach, cladding spacing formula's welded structure about forming, be favorable to strengthening wireless communication module chip welding PCB board welding fastness on the integrated circuit mainboard, and then guarantee wireless communication module's validity and practicality.

The above description is only the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can substitute or change the technical solution and the concept of the present invention within the technical scope disclosed in the present invention.

Claims

1. The utility model provides a wireless communication module chip welding PCB board which characterized in that: the chip packaging structure is characterized in that gap parts (4) are arranged at intervals on the periphery of the PCB (1), columnar pins (3) exposed out of the periphery of the chip (2) are arranged on the gap parts (4), each columnar pin (3) is provided with an inner side surface (301), an outer side surface (302), a top surface (303) located on one side, provided with the chip (2), of the PCB (1) and a bottom surface (304) deviating from one side, provided with the chip (2), of the PCB (1), the inner side surfaces (301) are connected with the inner wall of the gap parts (4) of the PCB, and the outer side surfaces (302) are arc-shaped surfaces deviating from one side of the PCB (1); be formed with platform (5) between two adjacent leg, 1 recess has been seted up at least in breach portion (4), the one end of recess is located lateral surface (302), and the other end of recess is located platform (5).

2. The wireless communication module chip solder PCB of claim 1, wherein: the recess is the horizontal direction, and the recess inside wall that is located the below is 0 with the contained angle of horizontal direction.

3. The wireless communication module chip solder PCB of claim 1, wherein: the notch part (4) is semicircular, semielliptical or semirectangular.