CN212677451U - Assembly printed circuit board and electronic equipment - Google Patents
Assembly printed circuit board and electronic equipment Download PDFInfo
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- CN212677451U CN212677451U CN202020595154.0U CN202020595154U CN212677451U CN 212677451 U CN212677451 U CN 212677451U CN 202020595154 U CN202020595154 U CN 202020595154U CN 212677451 U CN212677451 U CN 212677451U
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- printed circuit
- circuit board
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- frame plate
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Abstract
The utility model provides an assembly printed circuit board and electronic equipment relates to electronic equipment technical field. The assembled printed circuit board includes a first printed circuit board, a second printed circuit board, and a frame plate. The frame plate is arranged between the first printed circuit board and the second printed circuit board and used for supporting the first printed circuit board and the second printed circuit board. The first printed circuit board is connected with the frame plate in a welding mode, and circuit conduction and mechanical connection between the first printed circuit board and the frame plate are achieved in a welding spot mode. The frame plate is provided with a first groove on the surface for connecting with the first printed circuit board, the first groove is filled with a filling layer, and the filling layer fills a gap between the first groove and the first printed circuit board. When the equipment printed circuit board is in a scene with uneven stress such as transportation or falling, the risk of fracture of welding spots between the first printed circuit board and the frame plate can be reduced through the supporting effect of the filling layer on the first printed circuit board.
Description
Technical Field
The utility model relates to an electronic equipment technical field especially involves an assembly printed circuit board and electronic equipment.
Background
As electronic products are being packaged in high density, package structures are often stacked to provide more space for arranging batteries and other functional modules in electronic devices. Thus, the size of a Printed Circuit Board (PCB) for carrying the structure to be packaged can be prevented from being increased while the structure to be packaged is effectively packaged.
In addition, in order to meet the functional requirements of the electronic device, two PCBs may be stacked by a frame to provide sufficient space for arranging a plurality of functional modules, so as to form a Printed Circuit Board Assembly (PCBA). In the PCBA, the PCBs and the frame, and the functional modules and the PCBs can be connected in a welding mode, so that the purpose of conduction and mechanical connection between circuits is achieved through welding spots. However, because the number of functional modules carried by the PCB is large, the problems of solder joint fracture or crater crack in the position of the solder joint of the PCB may be caused in the scene of uneven stress such as falling.
SUMMERY OF THE UTILITY MODEL
In a first aspect, the present invention provides an assembled printed circuit board that may include a first printed circuit board, a second printed circuit board, and a frame plate. The frame plate is arranged between the first printed circuit board and the second printed circuit board and used for supporting the first printed circuit board and the second printed circuit board. The first printed circuit board is connected with the frame plate in a welding mode, and circuit conduction and mechanical connection between the first printed circuit board and the frame plate are achieved in a welding spot mode. The frame plate is provided with a first groove on the surface for connecting with the first printed circuit board, the first groove is filled with a filling layer, and in addition, the filling layer fills the gap between the first groove and the first printed circuit board so as to enable the filling layer to play a supporting role for the first printed circuit board. Therefore, when the equipment printed circuit board is in a scene with uneven stress, such as transportation or falling, the risk of fracture of welding points between the first printed circuit board and the frame plate can be reduced through the supporting effect of the filling layer on the first printed circuit board.
The utility model discloses in a possible implementation, when specifically setting up first recess, can make the degree of depth more than or equal to 0.05mm of first recess. So that a sufficient amount of the filling layer can be filled in the first groove to satisfy a supporting function for the first printed circuit board.
In addition, the first groove can be arranged in an elongated structure, so that the width of the first groove is greater than or equal to 0.05 mm. To further meet the requirements for the setting space of the filling layer.
The utility model discloses an among the possible implementation, the distribution mode of first recess on the frame board can be multiple, and is exemplary, can set up first recess between the solder joint, can play the support protection to the solder joint like this while, can also avoid increasing the size of first printed circuit board and frame board, and it is favorable to realizing equipping printed circuit board's miniaturized design.
In addition, according to the distribution mode of the welding points, the arrangement position of the first groove on the frame plate can be adjusted, and for example, the first groove can be arranged in the edge area of the frame plate, so that the filling layer filled into the first groove can play a role in stably supporting the edge area of the first printed circuit board. Also, since, in general, there is a higher risk of the weld points at the corner regions breaking, it is also possible to provide the first recesses at the corner regions of the frame plate for enhanced support protection of the weld points at the corner regions. Of course, the first recess may also be provided in both the edge area and the corner area of the frame plate to further improve the supporting effect of the frame plate on the first printed circuit board.
In one possible implementation manner of the present invention, the second printed circuit board may be connected to the frame plate by a solder joint; and a second groove is arranged on the surface of the frame plate connected with the second printed circuit board, a filling layer is filled in the second groove, and the filling layer fills the gap between the first groove and the second printed circuit board. The first groove and the second groove are formed in the surface of the frame plate, so that the arrangement of the filling layer between the first printed circuit board and the frame plate and between the frame plate and the second printed circuit board is realized, and the structural stability of the equipment printed circuit board can be effectively improved. In addition, in the scene of uneven stress such as transportation or falling of the equipment printed circuit board, the filling layer can play a role in buffering, so that the risk of fracture of welding spots between the first printed circuit board and the frame plate and between the frame plate and the second printed circuit board can be reduced.
In a possible implementation manner of the present invention, the number of the first grooves is plural, and the plural first grooves are communicated with each other; in addition, the second groove can also be a plurality of grooves which are communicated with each other. At this time, the first groove or the second groove can be filled with filling materials with fluidity, such as glue, so as to improve the convenience of processing the filling layer in the first groove or the second groove.
The utility model discloses in a possible implementation, can also be provided with the third recess in the side of frame plate to make first recess and second recess be linked together through the third recess. Thus, when the first groove or the second groove is filled with filling materials with fluidity such as glue and the like, the filling can be carried out in the groove on one side of the frame plate, and the convenience of the setting of the filling layer is further improved.
The utility model discloses in a possible implementation, first printed circuit board is provided with functional module, and functional module passes through the solder joint with first printed circuit board and is connected. A fourth groove is formed in the surface, connected with the functional module, of the first printed circuit board, a filling layer is filled in the fourth groove, and a gap between the fourth groove and the functional module is filled with the filling layer. So as to realize the support of the filling layer for the functional module, thereby reducing the risk of the fracture of the welding spot between the functional module and the second printed circuit board. It is understood that the fourth recess may also open on the functional module.
In a second aspect, the present invention further provides an electronic device, which includes a display screen, a middle frame, a rear case, and the equipment printed circuit board of the first aspect. Wherein: the middle frame is used for supporting the display screen and the equipment printed circuit board, and the display screen and the equipment printed circuit board are arranged on two sides of the middle frame. The rear case is located on a side of the mounting printed circuit board away from the center frame.
The utility model discloses electronic equipment is in the transportation or when falling the inhomogeneous scene of atress such as, owing to be provided with first recess on the frame board of equipping printed circuit board, and first recess intussuseption is filled with the filling layer that can be used to play the supporting role to first printed circuit board, like this can effectually reduce the cracked risk of solder joint between first printed circuit board and the frame board.
Drawings
Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a conventional assembled printed circuit board;
fig. 3 is a schematic structural diagram of an assembled pcb according to an embodiment of the present invention;
fig. 4 is a schematic perspective view of a frame plate according to an embodiment of the present invention;
fig. 5 is a side view of a frame plate according to an embodiment of the present invention;
fig. 6 is a top view of a frame plate according to an embodiment of the present invention;
fig. 7 is a top view of a frame plate according to another embodiment of the present invention;
fig. 8 is a top view of a frame plate according to another embodiment of the present invention;
fig. 9 is a schematic structural view of an assembled pcb according to another embodiment of the present invention;
fig. 10 is a schematic perspective view of a frame plate according to another embodiment of the present invention;
fig. 11 is a side view of a frame plate according to another embodiment of the present invention;
fig. 12 is a schematic perspective view of a frame plate according to another embodiment of the present invention;
fig. 13 is a schematic perspective view of a frame plate according to another embodiment of the present invention;
fig. 14 is a schematic structural view of an assembled pcb according to another embodiment of the present invention;
fig. 15 is a schematic perspective view of a frame plate according to another embodiment of the present invention;
fig. 16 is a schematic structural view of an assembled pcb according to another embodiment of the present invention;
fig. 17 is a schematic structural diagram of an assembled printed circuit board according to another embodiment of the present invention.
Reference numerals:
101-a display screen; 102-middle frame; 103-rear shell; 104-equipment printed circuit board; 201-a first printed circuit board;
202-a second printed circuit board; 203-a frame plate; 204-functional module; 205-welding points; 301-a fill layer;
401A, 401B, 401C-grooves.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in further detail with reference to the accompanying drawings.
The terminology used in the following examples is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the specification and the appended claims, the singular forms "a", "an", "the", and "the" are intended to include the plural forms as well, such as "one or more", unless the context clearly indicates otherwise.
Reference throughout this specification to "one embodiment" or "some embodiments," or the like, means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present invention. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," or the like, in various places throughout this specification are not necessarily all referring to the same embodiment, but rather "one or more but not all embodiments" unless specifically stated otherwise. The terms "comprising," "including," "having," and variations thereof mean "including, but not limited to," unless expressly specified otherwise.
In order to facilitate understanding of the present invention, a specific application scenario of the equipment printed circuit board is first described below, but the embodiment of the present invention provides an equipment printed circuit board that can be disposed in an electronic device such as a mobile phone, a tablet computer, a wearable device, or a Personal Digital Assistant (PDA) to satisfy the requirements of the electronic device for setting a function module and circuit connection.
Referring to fig. 1, fig. 1 provides a schematic structural diagram of an electronic device. The electronic device may generally include a display 101, a bezel 102, a rear case 103, and a Printed Circuit Board Assembly (PCBA) 104. The middle frame 102 can be used to carry the device printed circuit board 104 and the display screen 101, the display screen 101 and the device printed circuit board 104 are located on two sides of the middle frame 102, and the rear housing 103 is located on one side of the device printed circuit board 104 far from the middle frame 102.
Referring to fig. 2, fig. 2 provides a conventional mounting printed circuit board 104, and when the mounting printed circuit board 104 is specifically disposed, the mounting printed circuit board 104 includes a first printed circuit board 201 (PCB), a second printed circuit board 202, and a frame plate 203 disposed between the first printed circuit board 201 and the second printed circuit board 202. The first printed circuit board 201 and the second printed circuit board 202 are provided with a functional module 204, and the functional module 204 can be connected between the first printed circuit board 201 and the frame plate 203, between the second printed circuit board 202 and the frame plate 203, and between the functional module 204 and the first printed circuit board 201 or the second printed circuit board 202 by welding, so as to realize conduction between circuits and fixed connection between the structures by a welding spot 205. However, in order to meet the functional requirements of the electronic device, more functional modules 204 need to be arranged on the first printed circuit board 201 and the second printed circuit board 202, so that under the scene of uneven stress such as falling, the problem of fracture of the solder joints 205 or crater crack of the positions of the printed circuit boards for arranging the solder joints 205 may be caused. The embodiment of the utility model provides an equipment printed circuit board aims at solving above-mentioned problem, and it is right below to combine the figure the utility model provides an equipment printed circuit board's structure carries out detailed explanation.
First, referring to fig. 3, an embodiment of the present invention provides an equipment pcb 104, which includes a first pcb 201, a second pcb 202, and a frame plate 203 disposed between the first pcb 201 and the second pcb 202. Among other things, the frame plate 203 may serve to support the first and second printed circuit boards 201 and 202 to achieve a stacked arrangement of the first and second printed circuit boards 201 and 202. In addition, a functional module 204 is disposed on each of the first printed circuit board 201 and the second printed circuit board 202, and the functional module 204 may be, but is not limited to, a chip element such as an integrated circuit (SOC) chip or a Central Processing Unit (CPU) chip. The frame plate 203 may be provided in a ring-shaped configuration to provide sufficient space for the first and second printed circuit boards 201 and 202 to be provided with the functional modules 204 while supporting the first and second printed circuit boards 201 and 202.
With continued reference to fig. 3, the first printed circuit board 201 and the frame plate 203, the second printed circuit board 202 and the frame plate 203, and the functional module 204 and the first printed circuit board 201 or the second printed circuit board 202 can be connected by soldering, so as to achieve conduction between circuits and fixed connection between the structures by soldering points 205.
In order to achieve effective support of the frame plate 203 for the first printed circuit board 201, referring to fig. 4 and 5 together, a groove 401A is cut on a surface of the frame plate 203 for supporting the first printed circuit board 201. It is to be understood that, in this embodiment, the frame plate 203 is turned 180 ° in the stacking direction of the first printed circuit board 201, the frame plate 203, and the second printed circuit board 202, in order to describe the specific structure of the groove 401A. With reference to fig. 3, the groove 401A may be further filled with a filling layer 301, and the filling layer 301 fills a gap between the groove 401A and the first printed circuit board 201, so that the filling layer 301 can support the first printed circuit board 201. It is understood that the filling layer 301 may be, but not limited to, an adhesive glue, so that the first printed circuit board 201 is supported by the adhesive glue, and at the same time, the first printed circuit board 201 and the frame plate 203 are connected by the adhesive property of the adhesive glue, thereby improving the connection reliability therebetween.
In the utility model discloses in equipment printed circuit board 104 of the embodiment, recess 401A is seted up to the accessible on frame plate 203 to the mode that packs filling layer 301 in recess 401A realizes the support to first printed circuit board 201. Thus, under the scene of uneven stress such as transportation or falling, the risk of fracture of the welding point 205 between the first printed circuit board 201 and the frame plate 203 or crater crack at the welding point 205 position of the first printed circuit board 201 can be effectively reduced.
When specifically providing the groove 401A, referring to fig. 5, the depth H of the groove 401A may be set to be equal to or greater than 0.05 mm; in addition, when width W of concave groove 401A is set, as shown in fig. 5 and 6, width W of concave groove 401A is 0.05mm or more. Based on this, the groove 401A may be configured as an elongated strip, so that the groove 401A can be filled with a sufficient amount of the filling layer 301 to achieve effective support of the first printed circuit board 201.
In addition, when the elongated grooves 401A are specifically arranged, as shown in fig. 6, the grooves 401A may be arranged between the welding spots 205. This can avoid affecting the arrangement of the solder joints 205, thereby satisfying the electrical connection requirement between the first printed circuit board 201 and the frame plate 203. Moreover, by disposing the grooves 401A between the solder joints 205, it is not necessary to additionally increase the area of the first printed circuit board 201 and the frame plate 203, which is advantageous for realizing the miniaturized design of the equipment printed circuit board 104, and thus can satisfy the miniaturized design requirement of the electronic device provided with the equipment printed circuit board 104.
The specific distribution manner of the grooves 401A on the frame plate 203 is not limited, and for example, referring to fig. 6 or 7, the grooves 401A may be arranged around the welding points 205. In addition, with continued reference to either FIG. 6 or FIG. 7, it is also possible, but not limited to, to place a plurality of grooves 401A in communication. At this time, the groove 401A may be filled with a filling material having fluidity, such as glue, so as to improve convenience of filling the groove 401A.
In the embodiment shown in fig. 5 to 7, a groove 401A may be provided at the edge of the frame plate 203 to reduce the risk of breaking the solder joint 205 between the first printed circuit board 201 and the frame plate 203 by increasing the supporting strength of the frame plate 203 to the edge area of the first printed circuit board 201.
In addition to the above-mentioned setting positions, referring to fig. 8, in some embodiments of the present invention, a groove 401A may be further opened at each corner position of the frame plate 203 to improve the supporting strength for the corner region of the first printed circuit board 201. In addition, in some other embodiments of the present invention, the density of the grooves 401A at the corner positions of the frame plate 203 may be made larger, or the width of the grooves 401A at the corner positions thereof may be made larger, so as to increase the area of the filling layer 301 disposed between the first printed circuit board 201 and the frame plate 203, thereby improving the supporting strength of the first printed circuit board 201. It will be appreciated that the grooves 401A may be provided in both the edge area and the corner area of the frame plate 203 to further enhance the supporting effect of the frame plate 203 on the first printed circuit board 201.
Since the frame plate 203 and the second printed circuit board 202 are also electrically and mechanically connected by the solder 205. Referring to fig. 9 and 10 together, in some embodiments of the present invention, a groove 401B may be further formed on the surface of the frame plate 203 for connecting with the second printed circuit board 202, and the groove 401B may be filled with the filling layer 301, so that the filling layer 301 may support the frame plate 203. It is understood that, when the groove 401B on the surface of the frame plate 203 for connecting with the second printed circuit board 202 is specifically arranged, reference may be made to the arrangement manner of the groove 401A on the surface of the frame plate 203 for connecting with the first printed circuit board 201, and the description thereof is omitted.
The utility model discloses in the equipment printed circuit board 104 of this embodiment, through set up recess 401A and recess 401B on the surface of frame board 203, realize between first printed circuit board 201 and the frame board 203 to and the setting of filling layer 301 between frame board 203 and the second printed circuit board 202, can effectual improvement equip printed circuit board 104's structural stability. In addition, in a scene of uneven stress such as transportation or dropping of the equipment printed circuit board 104, the filling layer 301 can play a role of buffering, so that the risk of fracture of the welding spots 205 between the first printed circuit board 201 and the frame plate 203 and between the frame plate 203 and the second printed circuit board 202 can be reduced.
Referring to fig. 10 and 11, the number of the grooves 401A and 401B may be made the same, and the grooves 401A and 401B are oppositely disposed in the stacking direction of the first printed circuit board 201, the frame plate 203, and the second printed circuit board 202. In addition, referring also to fig. 12, the grooves 401A and 401B are arranged alternately in the stacking direction of the first printed circuit board 201, the frame plate 203, and the second printed circuit board 202. Of course, referring to fig. 13, the number of grooves 401A and 401B may be made different. It is understood that the above embodiments are only some exemplary illustrations given by the present invention regarding the distribution of the grooves 401A and 401B, and the distribution of the grooves 401A and 401B is not limited thereto and is not listed here.
Referring to fig. 14 and 15, in other embodiments of the present invention, a groove 401C may be further formed on the side surface of the frame plate 203, and the groove 401C may be used to communicate the groove 401A with the groove 401B. In this way, when the grooves 401A and 401B are filled with a filling material having fluidity such as glue, the filling material may be filled only in the grooves 401A or 401B to form the filling layer 301 on both surfaces of the frame plate 203, thereby simplifying the processing of the filling layer 301 and contributing to the improvement of the production efficiency.
When specifically providing the grooves 401C, referring to fig. 15, the grooves 401C, the grooves 401A, and the grooves 401B are communicated in a one-to-one correspondence. It is understood that when all the grooves 401A of the frame plate 203 communicate with each other and all the grooves 401B communicate with each other, a groove 401C may be formed in the side surface of the frame plate 203.
Referring to fig. 16, in other embodiments of the present invention, the manner of disposing the functional module 204 on the printed circuit board is described by taking the first printed circuit board 201 and the functional module 204 disposed thereon as an example. With continued reference to fig. 16, at this time, the filling layer 301 may support the functional module 204 by providing a groove on the first printed circuit board 201 and filling the filling layer 301 in the groove, so as to reduce the risk of breaking the solder joint 205 between the functional module 204 and the first printed circuit board 201.
In addition, referring to fig. 17, for some functional modules 204 with lower height of the solder joints 205, such as a quad flat no-lead package (QFN) module, a grid array package (land grid array) module, and the like, a groove may also be disposed on the functional module 204 to achieve the effect of disposing the filling layer 301 for protecting the solder joints 205.
The above embodiments are only specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of changes or substitutions within the technical scope of the present invention, and all should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (11)
1. An assembled printed circuit board comprising a first printed circuit board, a second printed circuit board, and a frame plate disposed between the first printed circuit board and the second printed circuit board, wherein:
the first printed circuit board is connected with the frame plate through welding spots;
the frame plate is provided with a first groove on the surface for connecting with the first printed circuit board, the first groove is filled with a filling layer, and the filling layer fills a gap between the first groove and the first printed circuit board.
2. The assembled printed circuit board of claim 1, wherein the depth of the first recess is 0.05mm or greater; and/or the first groove is arranged in a slender strip shape, and the width of the first groove is greater than or equal to 0.05 mm.
3. The assembled printed circuit board of claim 1 or 2, wherein the first recess is disposed between the solder bumps.
4. The assembled printed circuit board of claim 1 or 2, wherein the first recess is provided only in an edge area of the frame plate; or, the first groove is only arranged at the corner area of the frame plate; or, the first groove is provided at an edge region of the frame plate and a corner region of the frame plate.
5. The assembled printed circuit board of claim 1 or 2, wherein the second printed circuit board is connected to the frame plate by a solder joint; and a second groove is formed in the surface of the frame plate connected with the second printed circuit board, a filling layer is filled in the second groove, and a gap between the second groove and the second printed circuit board is filled with the filling layer.
6. The assembled printed circuit board of claim 5, wherein the first recesses are plural, and the plural first recesses are in communication; and/or the second grooves are multiple and communicated with each other.
7. The assembled printed circuit board according to claim 6, wherein the first recess is disposed opposite to the second recess in a stacking direction of the first printed circuit board, the frame plate, and the second printed circuit board; or the first grooves and the second grooves are arranged in a staggered mode.
8. The assembled printed circuit board according to claim 6 or 7, wherein the side surface of the frame plate is further provided with a third groove through which the first groove and the second groove communicate.
9. The assembled printed circuit board of claim 1 or 2, wherein the first printed circuit board is provided with a functional module, the functional module being connected to the first printed circuit board by solder joints;
and a fourth groove is formed in the surface of the first printed circuit board connected with the functional module, a filling layer is filled in the fourth groove, and a gap between the fourth groove and the functional module is filled with the filling layer.
10. The assembled printed circuit board of claim 1 or 2, wherein the filler layer is a layer of adhesive material.
11. An electronic device comprising a display screen, a middle frame, a rear case, and the mounting printed circuit board of any one of claims 1 to 10, wherein:
the middle frame is used for supporting the display screen and the equipment printed circuit board, and the display screen and the equipment printed circuit board are arranged on two sides of the middle frame;
the rear shell is positioned on one side, far away from the middle frame, of the equipment printed circuit board.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020595154.0U CN212677451U (en) | 2020-04-20 | 2020-04-20 | Assembly printed circuit board and electronic equipment |
| CN202120381101.3U CN215010855U (en) | 2020-04-20 | 2020-04-20 | Assembly printed circuit board and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020595154.0U CN212677451U (en) | 2020-04-20 | 2020-04-20 | Assembly printed circuit board and electronic equipment |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120381101.3U Division CN215010855U (en) | 2020-04-20 | 2020-04-20 | Assembly printed circuit board and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212677451U true CN212677451U (en) | 2021-03-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020595154.0U Active CN212677451U (en) | 2020-04-20 | 2020-04-20 | Assembly printed circuit board and electronic equipment |
| CN202120381101.3U Active CN215010855U (en) | 2020-04-20 | 2020-04-20 | Assembly printed circuit board and electronic equipment |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120381101.3U Active CN215010855U (en) | 2020-04-20 | 2020-04-20 | Assembly printed circuit board and electronic equipment |
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| CN (2) | CN212677451U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023040572A1 (en) * | 2021-09-18 | 2023-03-23 | 荣耀终端有限公司 | Circuit board assembly and electronic device |
| WO2023045642A1 (en) * | 2021-09-23 | 2023-03-30 | 荣耀终端有限公司 | Circuit board assembly and electronic device |
-
2020
- 2020-04-20 CN CN202020595154.0U patent/CN212677451U/en active Active
- 2020-04-20 CN CN202120381101.3U patent/CN215010855U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023040572A1 (en) * | 2021-09-18 | 2023-03-23 | 荣耀终端有限公司 | Circuit board assembly and electronic device |
| CN116602062A (en) * | 2021-09-18 | 2023-08-15 | 荣耀终端有限公司 | Circuit board assembly and electronic equipment |
| CN116602062B (en) * | 2021-09-18 | 2024-03-26 | 荣耀终端有限公司 | Circuit board assembly and electronic equipment |
| WO2023045642A1 (en) * | 2021-09-23 | 2023-03-30 | 荣耀终端有限公司 | Circuit board assembly and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN215010855U (en) | 2021-12-03 |
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Effective date of registration: 20210512 Address after: Unit 3401, unit a, building 6, Shenye Zhongcheng, No. 8089, Hongli West Road, Donghai community, Xiangmihu street, Futian District, Shenzhen, Guangdong 518040 Patentee after: Honor Device Co.,Ltd. Address before: 518129 Bantian HUAWEI headquarters office building, Longgang District, Guangdong, Shenzhen Patentee before: HUAWEI TECHNOLOGIES Co.,Ltd. |