CN214096434U - Film type pressure sensor and electronic equipment - Google Patents
Film type pressure sensor and electronic equipment Download PDFInfo
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- CN214096434U CN214096434U CN202023002812.XU CN202023002812U CN214096434U CN 214096434 U CN214096434 U CN 214096434U CN 202023002812 U CN202023002812 U CN 202023002812U CN 214096434 U CN214096434 U CN 214096434U
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Abstract
The utility model relates to a pressure sensor's technical field provides a film formula pressure sensor and electronic equipment, and wherein film formula pressure sensor includes: a force transmission structure having a predetermined elasticity; the pressing base material is a flexible body and is arranged on the lower surface of the force transmission structure; a support base material which is laminated with the pressing base material and is provided with a base material lead for electrical connection, wherein the mechanical strength of the support base material is higher than that of the pressing base material; a sensing material provided between the pressing base material and the supporting base material; the sensing electrode is arranged between the pressing base material and the supporting base material and is opposite to the sensing material, and the sensing electrode is electrically connected with the base material lead; one of the sensing material and the sensing electrode is arranged on the lower surface of the pressing substrate, and the other of the sensing material and the sensing electrode is arranged on the upper surface of the supporting substrate; the electronic device comprises a thin film pressure sensor; the scheme has the advantages of convenient assembly, low cost, space saving and smaller size.
Description
Technical Field
The utility model relates to a pressure sensor's technical field, more specifically say, relate to a film formula pressure sensor and electronic equipment.
Background
The existing film type pressure sensor mostly adopts flexible electronic substrates such as PET and PI substrates, and the film type pressure sensor is integrated, so that the problem mainly brought is that large-scale patch welding production process can not be carried out due to limitation of sensor materials when the film type pressure sensor is applied in the field of consumer electronics, manual welding can only be adopted, and the problems of connection consistency, efficiency and welding precision can be brought by the manual welding. Meanwhile, the flexible substrate also brings challenges to the performance consistency of the sensor, and the sensor based on the contact pressure measurement principle needs a supporting substrate below the sensor when the sensor is applied to a pressing application of an application scene end such as an earphone and a toothbrush, so that the overall design and the assembly process of the structure become more complicated, and the sensor is more unfavorable for processing and production particularly in a small space application.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a film formula pressure sensor and electronic equipment to solve the film formula pressure sensor equipment degree of difficulty that exists among the prior art and big and the technical problem of inefficiency.
In order to achieve the above object, the utility model discloses a technical scheme is a film type pressure sensor, include:
a force transmission structure having a predetermined elasticity;
the pressing base material is a flexible body and is arranged on the lower surface of the force transmission structure;
a support base material which is laminated with the pressing base material and is provided with a base material lead for electrical connection, wherein the mechanical strength of the support base material is higher than that of the pressing base material;
a sensing material provided between the pressing base material and the supporting base material;
the sensing electrode is arranged between the pressing base material and the supporting base material and is opposite to the sensing material, and the sensing electrode is electrically connected with the base material lead;
one of the sensing material and the sensing electrode is provided on the lower surface of the pressing substrate, and the other of the sensing material and the sensing electrode is provided on the upper surface of the supporting substrate.
By adopting the technical scheme, firstly, the sensing material or the sensing electrode is borne by the supporting base material, and the mechanical strength of the supporting base material is higher than that of the pressing base material, so that an additional supporting structure of a bracket is not needed, and the space is saved; secondly, because the supporting base material has higher mechanical strength and is made of high-temperature resistant materials, the thin-film pressure sensor can be arranged on the mainboard by adopting a surface mounting (reflow) process, the welding precision and the welding efficiency of the surface mounting process are far higher than those of manual welding, the assembly is convenient, the integration level is higher, and the size can be smaller; thirdly, the force transmission structure has preset elasticity, is mainly used for increasing the fault tolerance under the condition of inconsistency caused by structural tolerance and assembly tolerance on an application scene, and gives an initial pre-pressure to the assembled sensor, so that the initial self-calibration function of an algorithm end is facilitated; finally, the sensing material and the sensing electrode are arranged between the supporting base material and the pressing base material, but the positions of the sensing material and the sensing electrode can be interchanged, so that the assembly applicability is improved.
In one embodiment, the sensing electrode is a printed structure, or the sensing electrode is an etched structure.
Specifically, a sensing electrode is arranged on a pressing substrate or a supporting substrate through a printing process or an etching process; it should be further explained that, when the supporting substrate is a PCB, the sensing electrode can be fabricated when the PCB is fabricated with its own circuit substrate lead, thereby saving the process steps and improving the efficiency.
By adopting the technical scheme, the sensing electrode is prepared when the base material or the supporting base material is pressed, the processing efficiency can be improved, meanwhile, the thickness of the pressing base material or the supporting base material cannot be increased, the integration level is improved, and the size is reduced.
In one embodiment, when the sensing electrode is arranged on the lower surface of the pressing substrate, the sensing electrode is connected with the substrate lead through an electric connection structure; when the sensing electrode is arranged on the upper surface of the supporting substrate, the sensing electrode is directly connected with the substrate lead.
Specifically, when the sensing electrode is disposed on the upper surface of the supporting substrate, the sensing electrode is directly electrically connected to the substrate wire of the supporting substrate; when the sensing electrode is disposed on the lower surface of the pressing substrate, the sensing electrode needs to be electrically connected to the substrate wire of the supporting substrate through an electrical connection structure, and the electrical connection structure is erected between the pressing substrate and the supporting substrate.
Through adopting above-mentioned technical scheme, sensing electrode passes through electrical connection structure with the substrate wire and is connected for sensing electrode's the position that sets up can be on supporting the substrate, also can set up on pressing the substrate, has improved sensing electrode and has set up the selectivity of position, does benefit to the degree of difficulty that reduces technology.
In one embodiment, the electrical connection structure includes a solder or conductive paste.
Specifically, the sensing electrode is connected to a substrate lead of the support substrate by soldering, for example, with solder, or is connected to a substrate lead of the support substrate by a conductive paste.
By adopting the technical scheme, the sensing electrode can be connected with the supporting base material in a patch (reflow soldering) mode, and the processing efficiency is improved.
In one embodiment, when the sensing material is disposed on the upper surface of the supporting substrate and the sensing electrode is disposed on the lower surface of the pressing substrate, the sensing electrode is electrically connected to the substrate wire of the supporting substrate through a welding, bonding and pressing process. Specifically, the sensing electrode is connected with a substrate lead of a supporting substrate through a welding, bonding or pressing process, the process specifically may refer to arranging A Conductive Film (ACF) on the substrate lead, and then connecting the sensing electrode and the substrate lead through the process, and a cavity structure may or may not be formed between the sensing material and the sensing electrode; or the substrate wire of the supporting substrate and the sensing electrode are connected with each other through a process of mounting (reflow soldering).
In another embodiment, when the sensing material is disposed on the lower surface of the pressing substrate and the sensing electrode is disposed on the upper surface of the supporting substrate, the sensing material is connected to the supporting substrate through a bonding and pressing process.
By adopting the technical scheme, the processing efficiency between the sensing material and the sensing electrode can be improved.
By adopting the technical scheme, the processing technology is simple and convenient, and the processing efficiency is favorably improved.
In one embodiment, the device further comprises a processing structure disposed on the pressing substrate and/or the supporting substrate, wherein when the processing structure is disposed on the pressing substrate, the processing structure is located on the upper surface or the lower surface of the pressing substrate, and when the processing structure is disposed on the supporting substrate, the processing structure is located on the upper surface or the lower surface of the supporting substrate, and the processing structure is electrically connected to the substrate wires.
Through adopting above-mentioned technical scheme, can also integrate on supporting the substrate or pressing the substrate and have treater chip or other types of chip, scalability is strong, conveniently with treater chip and other types of core chip mutually integrated, provides abundanter solution.
In one embodiment, the processing structure is disposed between the support substrate and the pressing substrate.
In particular, the processing structure is disposed between the support substrate and the press substrate, avoiding an increase in overall height when the processing structure is disposed.
By adopting the technical scheme, the integration level of the film type pressure sensor is improved, and the volume is reduced.
Another object of the present invention is to provide an electronic device, including a motherboard and the above-mentioned film pressure sensor, the film pressure sensor is electrically connected to the motherboard.
By adopting the technical scheme, firstly, the sensing material or the sensing electrode is borne by the supporting base material, and the mechanical strength of the supporting base material is higher than that of the pressing base material, so that a support does not need to be additionally used as a supporting structure, and the space is saved; secondly, as the material of the sensor can resist high temperature, the thin film type pressure sensor can be arranged on the mainboard by adopting a chip mounting (reflow soldering) process, the welding precision and efficiency of the chip mounting process are far higher than those of manual welding, the assembly is convenient, the integration level is higher, and the size can be smaller; finally, the sensing material and the sensing electrode are arranged between the supporting base material and the pressing base material, but the positions of the sensing material and the sensing electrode can be interchanged, which is also beneficial to improving the applicability in assembly.
In one embodiment, the main board is provided with a connecting member structure for electrically connecting with the supporting substrate, and the connecting member structure is a buckle structure.
Specifically, the buckle structure comprises a clamping groove and a buckle, one of the clamping groove and the buckle is arranged on the mainboard, and the other of the clamping groove and the buckle is connected with the sensing electrode.
Through adopting above-mentioned technical scheme, the connecting piece structure is the metal material, directly welds on the mainboard through the mode of paster, then is connected with the sensing electrode on the support substrate through draw-in groove/buckle design, and its connected mode is simple reliable.
In one embodiment, the thin film type pressure sensor comprises the main board and the thin film type pressure sensor which is electrically connected with the main board through a welding process.
Specifically, the entire sensor is mounted on the motherboard by a reflow process.
By adopting the technical scheme, the processing efficiency of the electronic equipment is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a three-dimensional structure diagram of a thin film pressure sensor according to an embodiment of the present invention;
fig. 2 is a three-dimensional structure diagram of the thin film pressure sensor provided by the embodiment of the present invention after being connected to the main board;
fig. 3 is a cross-sectional view of a thin film pressure sensor according to a first embodiment of the present invention;
fig. 4 is a sectional view of a thin film pressure sensor according to a second embodiment of the present invention.
The figures are numbered:
100-thin film pressure sensors;
1-pressing the substrate;
2-a support substrate;
3-a sensing material;
4-a sensing electrode;
5, a main board;
6-connector structure;
7-force conducting structure.
Detailed Description
In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected or indirectly connected to the other element.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the invention, and are not intended to indicate that a device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention.
Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating relative importance or as indicating a number of technical features. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise. The following describes the specific implementation of the present invention in more detail with reference to specific embodiments:
as shown in fig. 1 to 4, an embodiment of the present invention provides a thin film pressure sensor 100, which is applied to a consumer electronic device such as an earphone or an electric toothbrush.
The thin film type pressure sensor 100 of the present embodiment includes: a force transmission structure 7, a pressing base material 1, a supporting base material 2, a sensing material 3, and a sensing electrode 4; the force conducting structure 7 has a predetermined elasticity; the pressing substrate 1 is a flexible piece and is arranged on the lower surface of the force transmission structure 7; the supporting substrate 2 and the pressing substrate 1 are arranged in a laminated manner, and are provided with substrate leads for electrical connection, and the mechanical strength of the supporting substrate 2 is higher than that of the pressing substrate 1; the sensing material 3 is provided between the pressing substrate 1 and the supporting substrate 2; the sensing electrode 4 is arranged between the pressing substrate 1 and the supporting substrate 2, is opposite to the sensing material 3, can be separated by a preset distance, and can also be partially contacted with each other, and the sensing electrode 4 is electrically connected with a substrate lead; one of the sensor material 3 and the sensor electrode 4 is provided on the lower surface of the pressing substrate 1, and the other of the sensor material 3 and the sensor electrode 4 is provided on the upper surface of the supporting substrate 2.
The working principle of the thin film pressure sensor 100 provided in this embodiment is as follows:
when a user presses the upper surface of the force conduction structure 7 with a hand, the force conduction structure 7 has preset elasticity, so that the force conduction structure 7 deforms due to pressure, and further drives the pressing base material arranged on the lower surface of the force conduction structure 7 to deform, when the sensing electrode 4 is arranged on the pressing base material 1 and the sensing material 3 is arranged on the supporting base material 2 (as shown in fig. 3), the pressing base material 1 deforms towards the sensing material 3 due to pressure, the contact area of the sensing electrode 4 and the sensing material 3 changes, and further the electrical property changes (the resistance, the capacitance or the impedance changes), so that the output electrical signal changes, and pressure sensing is realized; similarly, when the sensing material 3 is disposed on the pressing substrate 1 and the sensing electrode 4 is disposed on the supporting substrate 2 (as shown in fig. 4), the pressing substrate 1 is pressed to cause the sensing material 3 to deform toward the sensing electrode 4 and the contact area to change, so that the electrical property (resistance, capacitance, or impedance) changes, thereby causing the output electrical signal to change and realizing pressure sensing.
By adopting the technical scheme, firstly, the sensing material 3 or the sensing electrode 4 is carried by the supporting base material 2, and the mechanical strength of the supporting base material 2 is higher than that of the pressing base material 1, so that a bracket is not needed to be additionally used as a supporting structure, and the space is saved; secondly, as the sensors are made of high-temperature-resistant materials, the thin-film pressure sensor 100 can be arranged on the mainboard by adopting a chip mounting (reflow soldering) process, the welding precision of the chip mounting process is far higher than that of manual welding, the assembly is convenient, the integration level is higher, and the size can be smaller; thirdly, the force transmission structure 7 has preset elasticity, is mainly used for increasing the fault tolerance under the condition of inconsistency caused by structural tolerance and assembly tolerance on an application scene, and provides an initial pre-pressure for the assembled sensor, so that the initial self-calibration function of an algorithm end is facilitated; finally, the sensing material 3 and the sensing electrode 4 are provided between the supporting base material 2 and the pressing base material 1, but the positions of the sensing material 3 and the sensing electrode 4 may be interchanged, which is also advantageous in improving the applicability in assembly.
It should be further explained that the supporting substrate 2 can be a PCB, and the PCB can be used as a carrier for carrying the sensing material 3 and the sensing electrode 4 due to its high mechanical strength, which is beneficial for the operator to process and is also beneficial for processing with a higher efficiency process; the force transmission structure 7 has preset elasticity, which means that the force transmission structure can deform to a preset degree under the pressing of an operator so as to change the contact area between the sensing material 3 and the sensing electrode 4 and further change the electric signal output by the sensing electrode 4; the force transmission structure 7 may also be made of a buffer material, which has a certain elastic structure, such as foam, silicone, fabric, leather, or elastic sheet, and is mainly used to increase the fault tolerance under the condition of inconsistency caused by the structural tolerance and the assembly tolerance in the application scene, and to give an initial pre-pressure to the assembled film-type pressure sensor 100, so as to facilitate the initial self-calibration function of the algorithm end.
In one embodiment, the sensing electrode 4 is a printed structure or the sensing electrode 4 is an etched structure.
Specifically, the pressing substrate 1 or the supporting substrate 2 is provided with a sensing electrode 4 by a printing process or an etching process; it should be further explained that, when the supporting substrate 2 is a PCB, the sensing electrode 4 can be fabricated when the PCB is fabricated with its own substrate lead, thereby saving the process steps and improving the efficiency.
Through adopting above-mentioned technical scheme, when pressing substrate 1 or supporting substrate 2 with sensing electrode 4 printing, can improve the efficiency of processing, also can not increase the thickness of pressing substrate 1 or supporting substrate 2 simultaneously, improved the integrated level, also reduced the volume.
In one embodiment, when the sensing electrode 4 is disposed on the lower surface of the pressing substrate 1, the sensing electrode 4 is connected to the substrate wire through an electrical connection structure; when the sensing electrode 4 is disposed on the upper surface of the supporting substrate 2, the sensing electrode 4 is directly connected to a substrate wire.
Specifically, when the sensing electrode 4 is disposed on the upper surface of the supporting substrate 2, the sensing electrode 4 is directly electrically connected to the substrate wire of the supporting substrate 2; when the sensing electrode 4 is disposed on the upper surface of the pressing substrate 1, the sensing electrode 4 needs to be electrically connected to the substrate wire of the supporting substrate 2 through an electrical connection structure, and the electrical connection structure is erected between the pressing substrate 1 and the supporting substrate 2.
Through adopting above-mentioned technical scheme, sensing electrode 4 passes through electric connection structure with the substrate wire to be connected for sensing electrode 4 sets up the position and can be on supporting substrate 2, also can set up on pressing substrate 1, has improved sensing electrode 4 and has set up the selectivity of position, does benefit to the degree of difficulty that reduces technology.
In one embodiment, the electrical connection structure comprises a solder or conductive glue.
Specifically, the sensor electrode 4 is connected to the substrate lead of the support substrate 2 by soldering, for example, or connected to the substrate lead of the support substrate 2 by a conductive paste.
By adopting the technical scheme, the sensing electrode 4 can be connected with the supporting substrate 2 in a patch (reflow soldering) or ACF (anisotropic conductive film) attaching mode, and the processing efficiency is improved.
In one embodiment, when the sensing material 3 is disposed on the upper surface of the supporting substrate 2 and the sensing electrode 4 is disposed on the lower surface of the pressing substrate 1, the sensing electrode 4 is connected to the substrate wire of the supporting substrate 2 by a welding, bonding or pressing process.
Specifically, the sensing electrode 4 is connected to the substrate wire through a bonding process or a pressing process, and the above process may specifically refer to a process in which A Conductive Film (ACF) is disposed on the sensing electrode 4, and then the sensing electrode 4 and the substrate wire are connected through the above process; a cavity structure can be formed between the sensing material 3 and the sensing electrode 4, or the cavity structure is not formed; or the sensing material 3 and the sensing electrode 4 are connected to each other by a process of bonding (reflow soldering).
In another embodiment, when the sensing material is disposed on the lower surface of the pressing substrate and the sensing electrode is disposed on the upper surface of the supporting substrate, the sensing material is connected to the supporting substrate through a bonding and pressing process.
By adopting the technical scheme, the processing efficiency between the sensing material 3 and the sensing electrode 4 can be improved.
In one embodiment, the thin film pressure sensor 100 further includes a processing structure disposed on the pressing substrate 1 and/or the supporting substrate 2, wherein when the processing structure is disposed on the pressing substrate 1, the processing structure is located on the upper surface or the lower surface of the pressing substrate 1, and when the processing structure is disposed on the supporting substrate 2, the processing structure is located on the upper surface or the lower surface of the supporting substrate 2, and the processing structure is electrically connected to the substrate wires.
Through adopting above-mentioned technical scheme, processing structure can be microprocessor, including gathering chip, processing chip or other chips, and scalability is strong, conveniently with processing chip and other types of core plate looks integration, provides abundanter solution. In one embodiment, the processing structure is provided between the support substrate 2 and the press substrate 1.
In particular, the processing structure is interposed between the support substrate 2 and the pressing substrate 1, avoiding an increase in the overall height when the processing structure is provided.
By adopting the technical scheme, the integration level of the film type pressure sensor 100 is improved, and the volume is reduced.
The present embodiment further provides an electronic device, which includes a main board 5 and the thin film pressure sensor 100, wherein the main board 5 is electrically connected to the supporting substrate 2.
By adopting the technical scheme, firstly, the sensing material 3 or the sensing electrode 4 is supported by the supporting base material 2, and the mechanical strength of the supporting base material 2 is higher than that of the pressing base material 1, so that a bracket is not required to be additionally used as the supporting base material, and the space is saved; secondly, because the materials of the sensor are all high temperature resistant, the thin film type pressure sensor 100 can be arranged on the main board 5 by adopting a chip mounting (reflow soldering) process, the welding precision of the chip mounting process is far higher than that of manual welding, the assembly is convenient, the integration level is higher, and the size can be smaller; finally, the sensing material 3 and the sensing electrode 4 are provided between the supporting base material 2 and the pressing base material 1, but the positions of the sensing material 3 and the sensing electrode 4 may be interchanged, which is also advantageous in improving the applicability in assembly.
In one embodiment, the main board 5 is provided with a connector structure 6 for electrically connecting with the supporting substrate 2, and the connector structure 6 is a snap structure.
Specifically, the clip structure includes a card slot and a clip, one of the card slot and the clip is provided on the main board 5, and the other of the card slot and the clip is connected to the film pressure sensor 100.
Through adopting above-mentioned technical scheme, connecting piece structure 6 is the metal material, directly welds on mainboard 5 through the mode of paster, then is connected with sensing electrode 4 on the support substrate 2 through draw-in groove/buckle design, and its connected mode is simple reliable.
In one embodiment, the thin film type pressure sensor includes a main board 5 and a thin film type pressure sensor 100 electrically connected to the main board 5 through a soldering process.
Specifically, the thin film pressure sensor 100 is disposed on the main board 5 by a soldering process, and the electrical connection between the upper and lower surfaces of the support substrate 2 includes, but is not limited to: the substrate electrode on the upper surface of the support substrate 2 is electrically connected to the lower surface of the support substrate 2 through the through hole of the support substrate 2.
By adopting the technical scheme, the processing efficiency of the electronic equipment is improved.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (10)
1. A thin film pressure sensor, comprising:
a force transmission structure having a predetermined elasticity;
the pressing base material is a flexible body and is arranged on the lower surface of the force transmission structure;
a support base material which is laminated with the pressing base material and is provided with a base material lead for electrical connection, wherein the mechanical strength of the support base material is higher than that of the pressing base material;
a sensing material provided between the pressing base material and the supporting base material;
the sensing electrode is arranged between the pressing base material and the supporting base material and is opposite to the sensing material, and the sensing electrode is electrically connected with the base material lead;
one of the sensing material and the sensing electrode is provided on the lower surface of the pressing substrate, and the other of the sensing material and the sensing electrode is provided on the upper surface of the supporting substrate.
2. The thin film pressure sensor of claim 1, wherein the sensing electrode is a printed structure or the sensing electrode is an etched structure.
3. The thin film pressure sensor according to claim 2, wherein when the sensing electrode is provided on the lower surface of the pressing substrate, the sensing electrode is connected to the substrate wire by an electrical connection structure; when the sensing electrode is arranged on the upper surface of the supporting substrate, the sensing electrode is directly connected with the substrate lead.
4. The thin film pressure sensor of claim 3, wherein the electrical connection structure comprises a solder or conductive gel.
5. The thin film pressure sensor of claim 1, wherein when the sensing material is disposed on the upper surface of the supporting substrate and the sensing electrode is disposed on the lower surface of the pressing substrate, the sensing electrode is electrically connected to the substrate lead by a welding, bonding, and pressing process; when the sensing material is arranged on the lower surface of the pressing base material and the sensing electrode is arranged on the upper surface of the supporting base material, the sensing material is connected with the supporting base material through a laminating or pressing process.
6. The thin film pressure sensor according to claim 1, further comprising a processing structure disposed on the pressing substrate and/or the supporting substrate, wherein the processing structure is disposed on an upper surface or a lower surface of the pressing substrate when the processing structure is disposed on the pressing substrate, and wherein the processing structure is disposed on an upper surface or a lower surface of the supporting substrate when the processing structure is disposed on the supporting substrate, and wherein the processing structure is electrically connected to the substrate wire.
7. The thin film pressure sensor of claim 6, wherein the processing structure is disposed between the support substrate and the pressing substrate.
8. An electronic device comprising a main board and the thin film pressure sensor according to any one of claims 1 to 7, wherein the thin film pressure sensor is electrically connected to the main board.
9. The electronic device of claim 8, wherein the motherboard has a connector structure for electrically connecting to the support substrate, and the connector structure is a snap structure.
10. The electronic device of claim 8, comprising the motherboard and the thin film pressure sensor electrically connected to the motherboard by a soldering process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023002812.XU CN214096434U (en) | 2020-12-14 | 2020-12-14 | Film type pressure sensor and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023002812.XU CN214096434U (en) | 2020-12-14 | 2020-12-14 | Film type pressure sensor and electronic equipment |
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| Publication Number | Publication Date |
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| CN214096434U true CN214096434U (en) | 2021-08-31 |
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| CN202023002812.XU Active CN214096434U (en) | 2020-12-14 | 2020-12-14 | Film type pressure sensor and electronic equipment |
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| CN (1) | CN214096434U (en) |
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