CN211062898U - Connection structure and electronic device - Google Patents
Connection structure and electronic device Download PDFInfo
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- CN211062898U CN211062898U CN202020117980.4U CN202020117980U CN211062898U CN 211062898 U CN211062898 U CN 211062898U CN 202020117980 U CN202020117980 U CN 202020117980U CN 211062898 U CN211062898 U CN 211062898U
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Abstract
The utility model provides a connection structure and electron device, wherein, connection structure includes circuit board, response membrane and connecting piece, the response membrane includes the base film and locates signal channel on the base film with run through in the signal through-hole of signal channel's terminal, the connecting piece passes the signal through-hole with the circuit board is connected, so that signal channel with the circuit board electricity is connected, and the technical scheme that this embodiment adopted is through setting up promptly the signal through-hole inserts the connecting piece makes through the connecting piece the signal channel of response membrane with form the turn-on circuit between the circuit board, thereby need not the line is walked to the marginal printing silver colloid of response membrane, saves the cost and saves the line space of walking of silver colloid.
Description
Technical Field
The utility model relates to a touch screen field, in particular to connection structure and electron device.
Background
At present, an ACF (Anisotropic Conductive Film) is attached between an induction Film and a Flexible Printed Circuit (FPC) flat cable of a touch sensor for thermocompression bonding, so that a signal channel of the induction Film is communicated with the FPC flat cable, and a signal of the touch sensor is transmitted to a chip processor through the FPC flat cable for processing. The edge of the touch sensor in the scheme generally needs to adopt the silver colloid wiring to lead out signals, but the cost of the silver colloid wiring is high, and the wiring space is large.
SUMMERY OF THE UTILITY MODEL
The main objective of the present invention is to provide a connection structure and an electronic device, which aims to save the cost and the routing space of the silver paste.
In order to achieve the above object, the utility model provides a connection structure, include:
a circuit board;
the induction film comprises a base film, a signal channel arranged on the base film and a signal through hole penetrating through a terminal of the signal channel;
and the connecting piece penetrates through the signal through hole to be connected with the circuit board so as to enable the signal channel to be electrically connected with the circuit board.
Furthermore, a female seat is arranged on the circuit board, the connecting piece comprises a contact pin, and the contact pin penetrates through the signal through hole and is inserted in the female seat.
Further, the contact pin includes plug and with the inserted bar of plug connection, the inserted bar passes the signal through-hole and plug-in female seat, the plug butt in the response membrane deviates from one side of circuit board.
Further, the connection structure includes a first conductive member, and the first conductive member is disposed between the plug and the sensing film.
Furthermore, the connecting piece still includes close nail and FFC winding displacement, the one end of FFC winding displacement is equipped with the via hole, close nail pass the signal through-hole and the via hole with the response membrane is connected the one end of FFC winding displacement, the other end of FFC winding displacement is connected with the circuit board.
Furthermore, the nail comprises a rod body and two abutting heads arranged at two ends of the rod body, the rod body penetrates through the signal through hole and the via hole, one of the abutting heads abuts against one end, deviating from the FFC flat cable, of the induction film, and the other abutting head abuts against one end, deviating from the induction film, of the FFC flat cable.
Furthermore, a conductive channel is arranged at one end of the FFC flat cable connected with the induction film, and the through hole penetrates through the conductive channel.
Further, the connecting structure includes a second conductive member, and the second conductive member is disposed between the signal channel and the conductive channel.
Furthermore, the circuit board is further provided with a flat cable seat, and the other end of the FFC flat cable is inserted in the flat cable seat so as to form a conduction loop between the induction film and the circuit board through the FFC flat cable.
In order to achieve the above object, the present invention provides an electronic device, which includes the connection structure as described above.
The utility model provides a connection structure and electron device, wherein, connection structure includes circuit board, response membrane and connecting piece, the response membrane includes the base film and locates signal channel on the base film with run through in the signal through-hole of signal channel's terminal, the connecting piece passes the signal through-hole with the circuit board is connected, so that signal channel with the circuit board electricity is connected, and the technical scheme that this embodiment adopted is through setting up promptly the signal through-hole inserts the connecting piece makes through the connecting piece the signal channel of response membrane with form the turn-on circuit between the circuit board, thereby need not the line is walked to the marginal printing silver colloid of response membrane, saves the cost and saves the line space of walking of silver colloid.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments or examples of the present invention, the drawings used in the embodiments or examples will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a circuit board according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of an induction membrane according to an embodiment of the present invention;
fig. 3 is a schematic cross-sectional view of a connection structure according to an embodiment of the present invention;
fig. 4 is a schematic cross-sectional view of a connection structure according to another embodiment of the present invention;
fig. 5 is a schematic structural view of an FFC bus bar according to an embodiment of the present invention.
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit ly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
As shown in FIGS. 1-5, the utility model provides a connection structure.
In an embodiment, the connection structure provided in the present embodiment is a touch sensor, such as a capacitive touch sensor. As shown in fig. 1 to 3, the connection structure includes a circuit board 1, an inductive film 2 and a connection member 3, where the connection member 3 is used to connect the circuit board 1 and the inductive film 2, where the circuit board 1 may be integrated with a Microcontroller 4 (MCU), or may not be integrated with the Microcontroller 4, and the circuit board 1 is connected with the Microcontroller 4, that is, the connection member 3 may form a conduction loop between the inductive film 2 and the Microcontroller 4, so as to realize signal transmission between the inductive film 2 and the Microcontroller 4, that is, transmit a signal of the inductive film 2 to the Microcontroller 4, and the Microcontroller 4 is used to receive the signal transmitted by the inductive film 2 and process the signal.
Further, as shown in fig. 1 or 2, the sensing film 2 includes a base film 21, and a signal channel 22 provided on the base film 21 and a signal via 23 penetrating a terminal of the signal channel 22. The signal through hole 23 may be located at terminals at two ends of the signal channel 21, or may be located only at a terminal at one end of the signal channel 21. The base film 21 may be a plastic film.
Optionally, a plurality of signal channels 22 are disposed on the base film 21. Wherein the signal channel 22 may be a transparent metal layer laid on the base film 21.
Further, the signal through holes 23 are located at two ends of the signal channel 22, and the signal through holes 23 penetrate through the base film 21 and the signal channel 22.
Further, the connecting member 3 passes through the signal through hole 23 to be connected to the circuit board 1, so that the signal channel 22 is electrically connected to the circuit board 1, that is, the connecting member 3 can conduct a path between the sensing film 2 and the circuit board 1, thereby realizing signal transmission between the sensing film 2 and the microcontroller 4.
In this embodiment, the signal through hole 23 is formed at the terminal of the signal channel 22 on the sensing film 2, and the sensing film 2 and the circuit board 1 are connected through the connecting member 3, so that a conductive loop is formed between the sensing film 2 and the circuit board 1, and at this time, it is not necessary to print a silver adhesive trace on the edge of the sensing film 2, so as to lead out the signal of the sensing film 2 through the silver adhesive trace, thereby saving the cost and saving the trace space of the silver adhesive.
It is understood that the above connection structure can be applied to intelligent interactive devices, such as: interactive screen etc. this moment, can save the line space of walking of silver colloid through the technical scheme of this embodiment to realize the narrow frame of interactive screen. In addition, the technical scheme adopted by this embodiment directly connects the sensing film 2 and the circuit board 1 through the connecting piece 3, and does not need to connect through an FPC, and does not need to perform pressing through an ACF, thereby reducing the material cost and reducing the influence of the hot pressing on the material. The ACF is a conductive film which connects the electrodes between the IC chip and the substrate through conductive particles to be conductive and can avoid the conduction short circuit between two adjacent electrodes.
The utility model discloses an in the embodiment, connection structure includes circuit board 1, response membrane 2 and connecting piece 3, sensing 2 includes base film 21 and locates signal channel 22 on the base film 21 with run through in the signal through-hole 23 of signal channel 22's terminal, connecting piece 3 passes signal through-hole 23 with circuit board 1 is connected, so that signal channel 22 with circuit board 1 electricity is connected, and the technical scheme that this embodiment adopted promptly is through setting up signal through-hole 23 with connecting piece 3 makes response membrane 2 with form the turn-on circuit between the circuit board 1, thereby need not the line is walked to the marginal printing silver of response membrane 2 and the line space of walking of saving cost and saving silver glue.
In one embodiment, as shown in fig. 2, the circuit board 1 is provided with a female socket 11, and the connector 3 includes a pin 31, and the pin 31 passes through the signal through hole 23 and is inserted into the female socket 11. In this embodiment, the size of the pin 31 is smaller than that of the signal through hole 23, so that the pin 31 can pass through the signal through hole 23.
Furthermore, a jack 111 is formed in the female socket 11, and an elastic piece 112 is disposed on an inner wall of the jack 111, that is, after the pin 31 passes through the signal channel 22, the pin 31 extends toward the female socket 11 and is inserted into the jack 111. When the pin 31 is inserted into the insertion hole 111, the pin 31 abuts against the elastic sheet 112; the elastic sheet 112 has an elastic force, that is, when the pin 31 is inserted, the elastic sheet 112 extends toward the inner wall of the insertion hole 111; when the pin 31 is pulled out, the elastic sheet 112 extends toward the center of the insertion hole 111.
Further, the signal channel 22 is disposed on a surface of the sensing film 2 facing away from the circuit board 1. At this time, the contact pin 31 includes a plug 311 and an insertion rod 312 connected to the plug 311, the insertion rod 312 passes through the signal through hole 23 and is inserted into the female socket 11, and the plug 311 abuts against a side of the sensing film 2 away from the circuit board 1. The pin 31 is a metal piece, that is, the pin 31 can be used to transmit a signal of the sensing film 2.
Optionally, since the plug 311 abuts against one side of the sensing film 2 where the signal channel 22 is disposed, and the signal through holes 23 are disposed at two ends of the signal channel 22, that is, at this time, the signal of the sensing film 2 can be transmitted to the plug 311 through the signal channel 22, and sequentially transmitted to the insertion rod 312 and the female seat 11 through the plug 311, so that the signal of the sensing film 2 can be transmitted to the microcontroller 4 for processing, even if a conductive loop is formed between the sensing film 2 and the microcontroller 4, thereby realizing the transmission of the signal.
Further, in order to enhance the connectivity between the plug 311 and the sensing film 2, the connection structure includes a first conductive member 5, and the first conductive member 5 is disposed between the plug 311 and the sensing film 2. The first conductive member 5 may be conductive glue, that is, the conductive glue is coated on a contact area between the signal channel 22 and the plug 311, and/or after the contact pin 31 is inserted into the signal through hole 23, the conductive glue is poured into the signal through hole 23. When the plug 311 abuts on the signal channel 22, the connectivity between the plug 311 and the sensing film 2 can be increased by conductive glue, so as to indirectly enhance the signal transmission between the plug 311 and the sensing film 2.
Further, the diameter of the plug 311 is less than or equal to 5mm, when the connection structure is applied to an interactive screen, the edge of the sensing film 2 in the technical scheme of this embodiment only needs a space of 5mm, and compared with a method of routing with silver paste, a routing space of about 30mm is needed, that is, the routing space of silver paste is saved, so that a narrow frame of the interactive screen is realized.
In another embodiment, as shown in fig. 4 and 5, the connecting member 3 includes a dowel 32 and an FFC flat cable 33, one end of the FFC flat cable 33 is provided with a via hole 331, the dowel 32 passes through the signal through hole 23 and the via hole 331 to connect the sensing film 2 to one end of the FFC flat cable 33, and the other end of the FFC flat cable 33 is connected to the circuit board 1, that is, the dowel 32 and the FFC flat cable 33 are used to connect the sensing film 2 and the circuit board 1, so that a conductive loop is formed between the sensing film 2 and the microcontroller 4. When the sensing film 2 is connected to the FFC bus bar 33, the signal through hole 23 on the signal channel 22 corresponds to the via hole 331, that is, the dowel 32 can sequentially pass through the signal through hole 23 and the via hole 331, so as to connect the sensing film 2 to the FFC bus bar 33.
Optionally, the signal through hole 23 and the via hole 331 are both larger than the diameter of the dowel 32, so that the dowel 32 can be conveniently arranged on the signal through hole 23 and the via hole 331.
Further, the dowel 32 includes a rod 321 and two abutting heads 322 disposed at two ends of the rod, the rod 321 passes through the signal through hole 233 and the via hole 331, one of the abutting heads 322 abuts against one end of the sensing film 2 away from the FFC bus bar 33, and the other abutting head 322 abuts against one end of the FFC bus bar 33 away from the sensing film 2. That is, the close nail 32 of this embodiment can respectively abut against the sensing film 2 and the FFC flat cable 33 through the two abutting heads 322, so as to enhance the connection stability between the sensing film 2 and the FFC flat cable 33.
Further, in order to enable the signal on the sensing film 2 to be transmitted to the FFC flat cable 33, that is, a conductive channel 332 is disposed at one end of the FFC flat cable 33 connected to the sensing film 2, the via 331 penetrates through the conductive channel 332, and the signal channel 22 is disposed at one side of the sensing film 2 contacting the conductive channel 332, that is, the signal of the sensing film 2 can be transmitted to the conductive channel 332 through the signal channel 22.
Further, in order to connect the FFC flat cable 33 and the circuit board 1, the circuit board 1 is further provided with a flat cable seat 12 (as shown in fig. 1), and the other end of the FFC flat cable 33 is inserted into the flat cable seat 12, so that a conductive loop is formed between the sensing film 2 and the circuit board 1 through the FFC flat cable 33. Namely, since the other end of the FFC flat cable 33 is connected to the circuit board 1, the signal of the sensing film 2 received by the FFC flat cable 33 can be transmitted to the circuit board 1, and then transmitted to the microcontroller 4 connected to the circuit board 1 for processing.
Further, in order to enhance the connectivity between the signal channel 22 and the conductive channel 332, the connecting structure includes a second conductive member 6 (as shown in fig. 4), and the second conductive member 6 is disposed between the signal channel 22 and the conductive channel 332. The second conductive member 6 may be a conductive glue, that is, the conductive glue is coated on a contact area between the signal channel 22 and the conductive channel 332, and when the conductive channel 332 contacts the signal channel 22, the connectivity between the signal channel 22 and the conductive channel 332 may be increased by the conductive glue, so as to indirectly enhance signal transmission between the signal channel 22 and the conductive channel 332.
The utility model discloses an in the embodiment, connection structure includes circuit board 1, response membrane 2 and connecting piece 3, response membrane 2 includes base film 21 and locates signal channel 22 on the base film 21 with run through in the signal through-hole 23 of signal channel 22's terminal, connecting piece 3 passes signal through-hole 23 with circuit board 1 is connected, so that signal channel 22 with circuit board 1 electricity is connected, and the technical scheme that this embodiment adopted promptly is through setting up signal through-hole 23 with connecting piece 3 makes response membrane 2 with form the turn-on circuit between the circuit board 1, thereby need not the line is walked to the marginal printing silver of response membrane 2 and the line space of walking of saving cost and saving silver glue.
Based on the above embodiment, the utility model also provides an electron device.
In an embodiment, the electronic device includes the connection structure according to the above embodiment, and the detailed description refers to the description of the above embodiment and is not repeated herein.
Since the electronic device provided by the present invention includes the connection structure of the above embodiment, that is, the electronic device includes all the technical features of the connection structure of the above embodiment and the achieved advantageous effects, therefore, the electronic device of the present embodiment also achieves all the technical effects of the above embodiment, and it is not limited herein with specific reference to the description of the above embodiment.
The above is only the optional embodiment of the present invention, and not therefore the limit to the patent scope of the present invention, all the concepts of the present invention utilize the equivalent transformation made by the contents of the specification and the drawings, or the direct/indirect application in other related technical fields are included in the patent protection scope of the present invention.
Claims (10)
1. A connecting structure, characterized by comprising:
a circuit board;
the induction film comprises a base film, a signal channel arranged on the base film and a signal through hole penetrating through a terminal of the signal channel;
and the connecting piece penetrates through the signal through hole to be connected with the circuit board so as to enable the signal channel to be electrically connected with the circuit board.
2. The connecting structure according to claim 1, wherein a female socket is provided on the circuit board, and the connecting member includes a pin inserted through the signal through hole and into the female socket.
3. The connecting structure of claim 2, wherein the contact pin comprises a plug and a plug rod connected with the plug, the plug rod passes through the signal through hole and is inserted into the female socket, and the plug abuts against one side of the sensing film, which faces away from the circuit board.
4. The connection structure of claim 3, wherein the connection structure comprises a first conductive member disposed between the plug and the inductive film.
5. The connecting structure of claim 1, wherein the connecting member comprises a dowel and an FFC cable, a via hole is formed at one end of the FFC cable, the dowel passes through the signal through hole and the via hole to connect the sensing film to one end of the FFC cable, and the other end of the FFC cable is connected to the circuit board.
6. The connecting structure of claim 5, wherein the dowel comprises a rod body and two abutting heads arranged at two ends of the rod body, the rod body passes through the signal through hole and the via hole, one of the abutting heads abuts against one end, away from the FFC flat cable, of the sensing film, and the other abutting head abuts against one end, away from the sensing film, of the FFC flat cable.
7. The connecting structure of claim 6, wherein a conductive channel is disposed at an end of the FFC flat cable connected to the sensing film, and the via hole penetrates through the conductive channel.
8. The connection structure of claim 7, wherein the connection structure includes a second conductive member disposed between the signal channel and the conductive channel.
9. The connecting structure of claim 5, wherein a flat cable seat is further disposed on the circuit board, and the other end of the FFC flat cable is inserted into the flat cable seat, so as to form a conductive loop between the sensing film and the circuit board through the FFC flat cable.
10. An electronic device, characterized in that the electronic device comprises a connecting structure according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020117980.4U CN211062898U (en) | 2020-01-17 | 2020-01-17 | Connection structure and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020117980.4U CN211062898U (en) | 2020-01-17 | 2020-01-17 | Connection structure and electronic device |
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| Publication Number | Publication Date |
|---|---|
| CN211062898U true CN211062898U (en) | 2020-07-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202020117980.4U Active CN211062898U (en) | 2020-01-17 | 2020-01-17 | Connection structure and electronic device |
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| CN (1) | CN211062898U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022062217A1 (en) * | 2020-09-28 | 2022-03-31 | 广州视源电子科技股份有限公司 | Touch screen and touch display apparatus having same |
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2020
- 2020-01-17 CN CN202020117980.4U patent/CN211062898U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022062217A1 (en) * | 2020-09-28 | 2022-03-31 | 广州视源电子科技股份有限公司 | Touch screen and touch display apparatus having same |
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