CN210868315U - Special small plate and large plate connecting structure for tin soldering process - Google Patents
Special small plate and large plate connecting structure for tin soldering process Download PDFInfo
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- CN210868315U CN210868315U CN201922103546.0U CN201922103546U CN210868315U CN 210868315 U CN210868315 U CN 210868315U CN 201922103546 U CN201922103546 U CN 201922103546U CN 210868315 U CN210868315 U CN 210868315U
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- platelet
- soldering tin
- big board
- hole
- small plate
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Abstract
The utility model relates to a connection technology technical field, specifically speaking relates to a dedicated platelet of soldering tin technology and big board connection structure, including big board, platelet and be used for the soldering tin portion of fixed big board and platelet, the center department of big board has seted up the platelet jack, and the platelet passes the platelet jack and extends to the opposite side of big board, has seted up first soldering tin hole on the side of platelet, and first soldering tin hole is passed to soldering tin portion, has seted up two second soldering tin holes on the big board. The utility model discloses soldering tin portion passes first soldering tin hole and second soldering tin hole when the welding, it is fixed as a whole to go up and down can pass through soldering tin, thereby provide the reliability of platelet and big board, when the power of perpendicular platelet direction appears, because soldering tin portion passes first soldering tin hole and second soldering tin hole fixed with controlling of platelet, the upper and lower connection of big board is a fixed whole, platelet atress can be used in inside big board and platelet through the through hole, rather than the copper foil on surface, thereby improve the reliability that platelet and big board are connected.
Description
Technical Field
The utility model relates to a connection technology technical field specifically is a dedicated platelet of soldering tin technology and big board connection structure.
Background
The traditional small plate and large plate connection mode is shown in fig. 5, the joint of the small plate and the large plate is bare copper, and the small plate and the large plate are fixed through soldering tin during welding, so that the connection effect is achieved. This mode is when the platelet bears vertical direction's power, for example be the USB output port on the platelet, and the horizontal rocking when the user plug can lead to the platelet atress, can lead to the tie point reliability to reduce, and the tie point tin splits or even printed circuit board's copper skin drops.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a dedicated platelet of soldering tin technology and big board connection structure to propose the naked copper of current platelet and big board junction in solving above-mentioned background art, lead to tie point reliability to reduce, tie point tin splits the problem that printed circuit board's copper skin takes off even.
In order to achieve the above object, the utility model provides a following technical scheme:
the utility model provides a dedicated platelet of soldering tin technology and big board connection structure, includes big board, platelet and is used for the soldering tin portion of fixed big board and platelet, the central department of big board has seted up the platelet jack, the platelet passes the platelet jack extends to the opposite side of big board, first soldering tin hole has been seted up on the side of platelet, first soldering tin hole is passed to soldering tin portion.
Preferably, the small plate and the large plate are arranged vertically.
Preferably, the small plate is matched with the small plate insertion hole in cross section size and is in plug fit with the small plate insertion hole.
Preferably, the large plate is provided with two second solder holes.
Preferably, two second solder holes are symmetrically arranged on two sides of the small plate.
Preferably, the solder portion passes through the first solder hole and the second solder hole.
Compared with the prior art, the beneficial effects of the utility model are that:
1. this dedicated platelet of soldering tin technology and big board connection structure set up first soldering tin hole on the platelet, soldering tin portion passes first soldering tin hole when the welding, or two second soldering tin holes have been seted up on the big board, soldering tin portion passes first soldering tin hole and second soldering tin hole when the welding, can fix as a whole through soldering tin from top to bottom, thereby provide the reliability of platelet and big board, do not increase the cost of product simultaneously again, when the power of perpendicular platelet direction appears, because soldering tin portion passes first soldering tin hole and second soldering tin hole with the left and right sides of platelet fixed, the upper and lower connection of big board is a fixed whole, the platelet atress can be used in inside big board and platelet through the through hole, and not the copper foil on surface, thereby improve the reliability that platelet and big board are connected.
2. The small plate and the large plate are vertically arranged in the special small plate and large plate connecting structure for the tin soldering process, the small plate and the small plate are matched with each other in the cross section size of the small plate insertion hole and are in insertion fit with each other, the installation is convenient, and the production is convenient.
Drawings
FIG. 1 is a schematic perspective view of the present invention showing a soldering hole formed only in a small plate;
FIG. 2 is a schematic cross-sectional view of a small plate with solder holes according to the present invention;
FIG. 3 is a schematic view of the three-dimensional structure of the present invention with solder holes on the small plate and the large plate;
FIG. 4 is a schematic structural view of a cross-sectional view of the small plate and the large plate simultaneously provided with solder holes according to the present invention;
fig. 5 is a schematic view of a conventional welding structure.
In the figure: 1. a large plate; 11. a second solder hole; 12. a small plate jack; 2. a platelet; 21. a first solder hole; 3. and a solder portion.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
Referring to fig. 1-5, the present invention provides the following technical solutions:
the utility model provides a dedicated platelet of soldering tin technology and big board connection structure, as shown in fig. 1 and fig. 2, including big board 1, platelet 2 and be used for fixed big board 1 and the soldering tin portion 3 of platelet 2, platelet jack 12 has been seted up in the center department of big board 1, platelet 2 passes platelet jack 12 and extends to the opposite side of big board 1, has seted up first soldering tin hole 21 on the side of platelet 2, and soldering tin portion 3 passes first soldering tin hole 21.
Further, platelet 2 and big board 1 set up perpendicularly, platelet 2 and platelet jack 12's cross sectional dimension looks adaptation and both grafting cooperation, simple to operate, the production of being convenient for.
In a specific use, as shown in fig. 3 and 4, two second solder holes 11 are formed in the large plate 1, the two second solder holes 11 are symmetrically disposed on both sides of the small plate 2, and the solder portion 3 passes through the first solder hole 21 and the second solder hole 11.
In the small plate and large plate connection structure dedicated to the soldering process of the present embodiment, the first soldering hole 21 is formed in the small plate 2, and the soldering portion 3 passes through the first soldering hole 21 during soldering, as shown in fig. 1 and 2; or two second soldering tin holes 11 are arranged on the large plate 1, when welding, the soldering tin part 3 passes through the first soldering tin hole 21 and the second soldering tin hole 11, as shown in fig. 3 and fig. 4, the upper part and the lower part can be fixed into a whole through soldering tin, thereby providing the reliability of the small plate 2 and the large plate 31, and simultaneously not increasing the cost of the product, when the force vertical to the small plate 2 direction occurs, because the soldering tin part 3 passes through the first soldering tin hole 21 and the second soldering tin hole 11 to fix the small plate 2 left and right, the upper part and the lower part of the large plate 1 are connected into a fixed whole, the stress of the small plate 2 can act inside the large plate 1 and the small plate 2 through the through hole, but not the copper foil on the surface, thereby improving the reliability of the connection of the small plate 2 and the large.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the description in the above embodiments and the description is only preferred examples of the present invention, and is not intended to limit the present invention, and that the present invention can have various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications all fall into the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides a dedicated platelet of soldering tin technology and big board connection structure which characterized in that: including big board (1), platelet (2) and be used for fixing soldering tin portion (3) of big board (1) and platelet (2), the center department of big board (1) has seted up platelet jack (12), platelet (2) pass platelet jack (12) and extend to the opposite side of big board (1), first soldering tin hole (21) have been seted up on the side of platelet (2), first soldering tin hole (21) is passed in soldering tin portion (3).
2. The small plate and large plate connecting structure special for a soldering tin process according to claim 1, characterized in that: the small plate (2) and the large plate (1) are vertically arranged.
3. The small plate and large plate connecting structure special for a soldering tin process according to claim 1, characterized in that: the small plate (2) is matched with the small plate insertion hole (12) in cross section size in an inserted mode.
4. The small plate and large plate connecting structure special for a soldering tin process according to claim 1, characterized in that: two second soldering tin holes (11) are formed in the large plate (1).
5. The small plate and large plate connecting structure special for a soldering tin process according to claim 4, characterized in that: the two second soldering tin holes (11) are symmetrically arranged on two sides of the small plate (2).
6. The small plate and large plate connecting structure special for a soldering tin process according to claim 5, characterized in that: the solder part (3) passes through the first solder hole (21) and the second solder hole (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922103546.0U CN210868315U (en) | 2019-11-29 | 2019-11-29 | Special small plate and large plate connecting structure for tin soldering process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922103546.0U CN210868315U (en) | 2019-11-29 | 2019-11-29 | Special small plate and large plate connecting structure for tin soldering process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210868315U true CN210868315U (en) | 2020-06-26 |
Family
ID=71305577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922103546.0U Active CN210868315U (en) | 2019-11-29 | 2019-11-29 | Special small plate and large plate connecting structure for tin soldering process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210868315U (en) |
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2019
- 2019-11-29 CN CN201922103546.0U patent/CN210868315U/en active Active
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