CN214046271U - Circuit board with heat dissipation function - Google Patents

Circuit board with heat dissipation function Download PDF

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Publication number
CN214046271U
CN214046271U CN202023106722.5U CN202023106722U CN214046271U CN 214046271 U CN214046271 U CN 214046271U CN 202023106722 U CN202023106722 U CN 202023106722U CN 214046271 U CN214046271 U CN 214046271U
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Prior art keywords
circuit board
heat
heat dissipation
fixedly connected
dissipation function
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CN202023106722.5U
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Chinese (zh)
Inventor
陈铭
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Ningbo Kaixiang Intelligent Technology Co ltd
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Ningbo Kaixiang Intelligent Technology Co ltd
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Abstract

The utility model relates to the technical field of circuit boards, in particular to a circuit board with a heat dissipation function, which comprises a circuit board, wherein a plurality of square grooves are arranged at the top of the circuit board, and circuit elements, sensors and processing chips are fixedly connected at the square grooves; the utility model discloses a circuit element who sets up, cooperate the sensor and handle the chip, utilize the unique mode of arranging the connection, can concentrate on one side of circuit board with the great part of heat, utilize the guiding gutter that sets up, the combined action of heat-conducting plate and flabellum is being cooperated, can make the in-process of air horizontal circulation, timely take away the produced heat in circuit board top, make the use that carries on that whole circuit board can be better, and the locating hole that sets up can be convenient make circuit board and attaching plate carry out the built-up connection, can guarantee to have certain circulation of air scope between circuit board and the attaching plate at the in-process of connecting, make radiating effect of whole circuit board more excellent.

Description

Circuit board with heat dissipation function
Technical Field
The utility model relates to a circuit board technical field specifically is a circuit board that possesses heat dissipation function.
Background
The PCB board is called printed circuit board and printed circuit board by Chinese name, and the very important electronic component is the support body of the electronic component and the carrier for the electrical connection of the electronic component. It is called a printed circuit board because it is made by electronic printing. As long as there are electronic components such as integrated circuits, a PCB board is used.
In order to ensure that the electrical interconnection among all the elements needs to use the PCB, more electronic elements are carried on the board body of the PCB, the electronic elements can generate certain heat in the normal working process, if the heat is not dissipated in time, the service life of the whole PCB is easily influenced greatly, the problem that the internal electronic printed circuit is fused can be caused, the service life of the electronic elements connected above the electronic elements can be influenced, and the fault of the whole circuit board can be caused, the main heat dissipation measure of the existing circuit board is to dissipate the whole heat rapidly through external contact, but no better heat dissipation measure is provided at the connection part of the circuit board per se, and once the circuit board is applied to a narrow space, the heat dissipation measure cannot be installed well, the normal use of the whole circuit board cannot be ensured by means of the self heat dissipation capacity. Therefore, a circuit board with a heat dissipation function is provided.
SUMMERY OF THE UTILITY MODEL
The circuit board that is not enough to prior art, the utility model provides a possesses heat dissipation function possesses can be convenient make the circuit board itself also have certain heat-sinking capability, the advantage that can be better make electronic components on the circuit board obtain normal use has solved current circuit board and has not possessed the heat-sinking capability, receives the problem that external factor influences easily when using.
The utility model discloses a circuit board with heat dissipation function, including the circuit board, the top of circuit board is seted up a plurality of square grooves, this square groove fixedly connects with circuit component, sensor and processing chip, circuit component is equidistant vertical arrangement, the sensor is located one side of circuit component, and the bottom of this sensor closely laminates with the top of circuit board, the both ends of sensor all link to each other with circuit board welding through the tin bar, processing chip is located the one end of circuit board, and keeps fixed interval with sensor and circuit component, the locating hole has all been seted up to the left and right sides of circuit board, and the bottom of this circuit board is equipped with the attaching plate, can carry out stable connection with the circuit board through the attaching plate that sets up, makes the heat that circuit component, sensor and processing chip connected on the circuit board produce can in time conduct to the attaching plate, can make whole circuit board guarantee more stable environment of using.
The utility model discloses a circuit board that possesses heat dissipation function, wherein the top of attaching plate contacts with the circuit board bottom, just the bar recess has all been seted up to the top of attaching plate and the bottom of circuit board, this bar groove fixedly connected with carriage, and two sets of the carriage is crisscross arranges each other, sets up the bar recess of seting up on the circuit board through the attaching plate cooperation that sets up and can make the environment and the temperature that whole circuit board used when using and guarantee under the relatively stable condition.
The utility model discloses a circuit board that possesses heat dissipation function, wherein the plate body left and right sides of attaching plate all runs through with the locating hole with the corresponding department of circuit board and links to each other, and the inboard of this locating hole is equipped with the heat conduction rubber sleeve, the inside and outside of heat conduction rubber sleeve closely laminates with the inner wall of locating hole, and the locating hole that sets up through the heat conduction rubber sleeve cooperation that sets up makes attaching plate and circuit board connection that can be stable on the one hand, and on the other hand also can make whole device use that can be more stable.
The utility model discloses a circuit board that possesses heat dissipation function, wherein the equal fixedly connected with heat-conducting plate in the outside of connecting frame, just the heat-conducting plate thickness is less than the circuit board thickness, just the top of heat-conducting plate links to each other with the bottom of circuit board is fixed, and the connecting frame that can cooperate the setting through the heat-conducting plate that sets up makes produced heat can be more rapid conduction to the heat-conducting plate on the circuit board when using, utilizes setting up of connecting frame can be timely to conduct away the heat.
The utility model discloses a circuit board that possesses heat dissipation function, wherein the guiding gutter has been seted up to the inboard of connection frame, just the inboard coating of guiding gutter has the insulating cement, and thickness is 0.5mm-0.1mm, the three water conservancy diversion piece of the inboard fixedly connected with of guiding gutter, just annular groove has been seted up in the outside of water conservancy diversion piece, and this annular groove fixedly connected with flabellum of department, and be cyclic annular and arrange, through the guiding gutter cooperation flabellum that sets up, can be quick in the time of the use derive the heat that the circuit board produced.
Compared with the prior art, the beneficial effects of the utility model are as follows:
the utility model can concentrate a part with larger heat on one side of the circuit board by the arranged circuit element, the sensor and the processing chip are matched, and the unique arrangement and connection mode is utilized, the arranged diversion trench is utilized to match the combined action of the heat conducting plate and the fan blades, so that the heat generated at the top of the circuit board can be taken away in time in the process of transverse air circulation, the whole circuit board can be better used, the arranged positioning hole can conveniently combine and connect the circuit board and the attaching plate, a certain air circulation range can be ensured between the circuit board and the attaching plate in the connection process, the heat dissipation effect of the whole circuit board is more excellent, the heat of the part with larger heat productivity of the whole circuit board can be timely transmitted into the attaching plate by the arranged heat conducting plate, and the temperature can be timely reduced by utilizing the diversion blocks and the fan blades connected on the diversion trench, the normal use of the whole device is ensured.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
fig. 1 is a schematic view of a circuit board of the present invention in a top view;
FIG. 2 is a schematic top view of the attachment plate of the present invention;
FIG. 3 is an enlarged schematic view of the structure at A in FIG. 2 according to the present invention;
fig. 4 is a schematic view of the combined structure of the circuit board and the attachment plate of the present invention.
In the figure: 01. a circuit board; 02. a sensor; 03. processing the chip; 04. positioning holes; 05. a circuit element; 06. a diversion trench; 07. attaching a plate; 08. a heat conducting plate; 09. a connecting frame; 10. a flow guide block; 11. a fan blade.
Detailed Description
In the following description, numerous implementation details are set forth in order to provide a more thorough understanding of the present invention. It should be understood, however, that these implementation details should not be used to limit the invention. That is, in some embodiments of the invention, details of these implementations are not necessary. In addition, some conventional structures and components are shown in simplified schematic form in the drawings.
In addition, the descriptions related to "first", "second", etc. in the present invention are only for description purposes, not specifically referring to the order or sequence, and are not intended to limit the present invention, but only to distinguish the components or operations described in the same technical terms, and are not to be construed as indicating or implying any relative importance or implicit indication of the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
Please refer to fig. 1-4, the utility model discloses a circuit board with heat dissipation function, including circuit board 01, a plurality of square grooves have been seted up at the top of circuit board 01, this square groove fixedly connected with circuit element 05, sensor 02 and processing chip 03, circuit element 05 is equidistant vertical arrangement, sensor 02 is located one side of circuit element 05, and the bottom of this sensor 02 closely laminates with the top of circuit board 01, the both ends of sensor 02 all link to each other with circuit board 01 welding through the tin bar, processing chip 03 is located the one end of circuit board 01, and keep a fixed distance with sensor 02 and circuit element 05, locating hole 04 has all been seted up to the left and right sides of circuit board 01, and the bottom of this circuit board 01 is equipped with attaching plate 07, can carry out stable connection with circuit board 01 through attaching plate 07 that sets up, make the circuit element 05 connected on circuit board 01, but the circuit element 05 that connects, The heat generated by the sensor 02 and the processing chip 03 can be timely conducted to the laminating board 07, so that the whole circuit board 01 can ensure a more stable environment.
The top of attaching plate 07 contacts with the bottom of circuit board 01, and the top of attaching plate 07 and the bottom of circuit board 01 have all seted up the bar recess, and this bar recess fixedly connected with carriage 09, and two sets of carriage 09 crisscross the arranging of each other, and the bar recess of seting up on circuit board 01 through the cooperation of attaching plate 07 that sets up can make the environment and the temperature that whole circuit board 01 used when using guarantee under the relatively stable condition.
The corresponding department of the plate body left and right sides and circuit board 01 of attaching plate 07 all runs through with locating hole 04 and links to each other, and the inboard of this locating hole 04 is equipped with the heat conduction rubber sleeve, and the inside and outside of heat conduction rubber sleeve closely laminates with the inner wall of locating hole 04, and the locating hole 04 that sets up through the heat conduction rubber sleeve cooperation that sets up of setting makes attaching plate 07 and circuit board 01 connection that can be stable on the one hand, and on the other hand also can make whole device use more stable.
The equal fixedly connected with heat-conducting plate 08 in the outside of connecting frame 09, and the thickness of heat-conducting plate 08 is less than the thickness of circuit board 01, and the top of heat-conducting plate 08 links to each other with the bottom of circuit board 01 is fixed, can cooperate the connecting frame 09 that sets up through the heat-conducting plate 08 that sets up, make the heat that produces on the circuit board 01 can be more rapid conduct to heat-conducting plate 08 in the use, utilize setting up of connecting frame 09 can be timely go out the heat conduction.
Guiding gutter 06 has been seted up to the inboard of carriage 09, and the inboard coating of guiding gutter 06 has the insulating cement, and thickness is 0.5mm-0.1mm, the three water conservancy diversion piece 10 of the inboard fixedly connected with of guiding gutter 06, and the annular groove has been seted up in the outside of water conservancy diversion piece 10, this annular groove fixedly connected with flabellum 11 of department, and be cyclic annular arrangement, through the guiding gutter 06 cooperation flabellum 11 that sets up, can be quick when using with the timely derivation of the heat of work board circuit board 01 production.
When using the utility model discloses a time:
the circuit board 01 that at first will set up, utilize locating hole 04 to make up with attaching plate 07, when circuit board 01 normal use, the circuit component 05 sensor 02 and the processing chip 03 that the higher authority is connected can carry out normal work, the heat that gives off this moment can be through circuit board 01 conduction to heat-conducting plate 08 in, can utilize the inside guiding gutter 06 of the carriage 09 that connects on attaching plate 07 and circuit board 01 offered together in the heat-conducting plate 08, can make the air pass in the middle of circuit board 01 and attaching plate 07, at the in-process that passes, utilize the effect of flabellum 11 and water conservancy diversion piece 10, can be timely lead away the heat on the heat-conducting plate 08, be favorable to the use of whole device.
The above description is only an embodiment of the present invention, and is not intended to limit the present invention. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

Claims (5)

1. A circuit board that possesses heat dissipation function, includes circuit board (01), its characterized in that: a plurality of square grooves have been seted up at the top of circuit board (01), this square groove fixedly connected with circuit component (05), sensor (02) and processing chip (03), circuit component (05) are the equidistance vertical arrangement, sensor (02) are located one side of circuit component (05), and the bottom of this sensor (02) closely laminates with the top of circuit board (01), the both ends of sensor (02) all link to each other through tin bar and circuit board (01) welding, processing chip (03) are located the one end of circuit board (01), and all keep fixed spacing with sensor (02) and circuit component (05), locating hole (04) have all been seted up to the left and right sides of circuit board (01), and the bottom of this circuit board (01) is equipped with attaching plate (07).
2. The circuit board with heat dissipation function of claim 1, wherein: the top of attaching plate (07) contacts bottom circuit board (01), just the bar recess has all been seted up to the top of attaching plate (07) and the bottom of circuit board (01), this bar recess fixedly connected with connecting frame (09), and two sets of connecting frame (09) are crisscross arranges each other.
3. The circuit board with heat dissipation function of claim 1, wherein: the corresponding department of both sides and circuit board (01) all runs through with locating hole (04) about the plate body of attaching plate (07) and links to each other, and the inboard of this locating hole (04) is equipped with the heat conduction rubber sleeve, the inside and outside side of heat conduction rubber sleeve closely laminates with the inner wall of locating hole (04).
4. The circuit board with heat dissipation function of claim 2, wherein: the outer side of the connecting frame (09) is fixedly connected with a heat conducting plate (08), the thickness of the heat conducting plate (08) is smaller than that of the circuit board (01), and the top of the heat conducting plate (08) is fixedly connected with the bottom of the circuit board (01).
5. The circuit board with heat dissipation function of claim 2, wherein: guiding gutter (06) have been seted up to the inboard of connecting frame (09), just the inboard coating of guiding gutter (06) has the insulating cement, and thickness is 0.5mm-0.1mm, three water conservancy diversion piece (10) of the inboard fixedly connected with of guiding gutter (06), just annular groove has been seted up in the outside of water conservancy diversion piece (10), and this annular groove department fixedly connected with flabellum (11), and be cyclic annular and arrange.
CN202023106722.5U 2020-12-22 2020-12-22 Circuit board with heat dissipation function Active CN214046271U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202023106722.5U CN214046271U (en) 2020-12-22 2020-12-22 Circuit board with heat dissipation function

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202023106722.5U CN214046271U (en) 2020-12-22 2020-12-22 Circuit board with heat dissipation function

Publications (1)

Publication Number Publication Date
CN214046271U true CN214046271U (en) 2021-08-24

Family

ID=77339363

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202023106722.5U Active CN214046271U (en) 2020-12-22 2020-12-22 Circuit board with heat dissipation function

Country Status (1)

Country Link
CN (1) CN214046271U (en)

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