CN210609847U

CN210609847U - PCB circuit board with heat dissipation function

Info

Publication number: CN210609847U
Application number: CN201921535080.5U
Authority: CN
Inventors: 郭永红; 明成兴
Original assignee: Xinfeng Mingshengxing Electronic Co Ltd
Current assignee: Xinfeng Mingshengxing Electronic Co Ltd
Priority date: 2019-09-16
Filing date: 2019-09-16
Publication date: 2020-05-22
Anticipated expiration: 2029-09-16

Abstract

The utility model discloses a PCB circuit board with heat dissipation function relates to PCB circuit board technical field, which comprises a base plate, the bottom surface fixedly connected with heat-conducting plate of base plate, the below of heat-conducting plate is equipped with the fixed plate, the last fixed surface of fixed plate is connected with heat conduction silica gel layer, the upper surface on heat conduction silica gel layer and the bottom surface fixed connection of heat-conducting plate. The utility model relates to a rational in infrastructure, it can be through being provided with the heat-conducting plate, guide the heat that electronic components during operation produced, contact with heat conduction silica gel layer through setting up the fin, utilize the fast characteristics of heat conduction silica gel layer, with timely conduction to fin of heat on the heat-conducting plate, realize the radiating effect to the base plate, utilize the fan to blow simultaneously, at the connecting pipe, the cooperation of gas-distributing pipe and conveyer pipe is set up down, accelerate the radiating effect of fin, can reach the timely radiating effect to the base plate, avoid the high temperature to cause the damage to the base plate, guarantee that electrical components can normally work.

Description

PCB circuit board with heat dissipation function

Technical Field

The utility model relates to a PCB circuit board technical field specifically is a PCB circuit board with heat dissipation function.

Background

The PCB circuit board is also called as a printed circuit board, is a provider for electrical connection of electronic components, the design of the circuit board is mainly a layout design, and the adoption of the circuit board has the main advantages of greatly reducing errors of wiring and assembly and improving the automation level and the production labor rate.

Because a large amount of electronic components are installed on the PCB, a large amount of heat can be generated along with the start of the work of the electronic components, and the conventional PCB cannot effectively realize quick heat dissipation due to the structural design of the PCB, so that the temperature of the PCB continuously rises, and the normal work of the electronic components is influenced.

SUMMERY OF THE UTILITY MODEL

The utility model provides a PCB circuit board with heat dissipation function for solve the problem of proposing among the background art.

In order to solve the technical problem, the utility model provides a following technical scheme: a PCB circuit board with heat dissipation function comprises a substrate, wherein a heat conduction plate is fixedly connected to the bottom surface of the substrate, a fixing plate is arranged below the heat conduction plate, a heat conduction silica gel layer is fixedly connected to the upper surface of the fixing plate, the upper surface of the heat conduction silica gel layer is fixedly connected with the bottom surface of the heat conduction plate, air permeable grooves which are arranged equidistantly are formed in the bottom surface of the heat conduction silica gel layer, positioning grooves which are arranged equidistantly are formed in the upper surface of the fixing plate and correspond to the positioning grooves one by one, fixing pipes which are arranged equidistantly are fixedly embedded in the front surface of the fixing plate and correspond to the positioning grooves one by one, and the fixing pipes are fixedly communicated with the positioning;

every the equal joint in inside of constant head tank has symmetrical fin, the bottom surface of fin and the interior diapire fixed connection of constant head tank, and the upper surface of fin contacts with the bottom surface of heat-conducting plate, symmetrical through-hole has been seted up in the front of fin, the bottom surface fixedly connected with locating piece of fixed plate, the fixed bottom surface of locating piece is inlayed and is had the fan, the fixed intercommunication in gas outlet of fan has the connecting pipe, the fixed intercommunication of one end that the fan was kept away from to the connecting pipe has the gas distribution pipe, the fixed intercommunication of gas distribution pipe has the conveyer pipe that the equidistance was arranged, and conveyer pipe and fixed pipe one-to-one, every the conveyer pipe is kept away from the one end of.

As a preferred technical scheme of the utility model, be equipped with symmetrical draw-in groove between heat-conducting plate and the fixed plate, the below of base plate is equipped with symmetrical fixing base, the one end joint that the fixing base is close to the base plate is in the inside of draw-in groove, and the bottom surface of fixing base and the last fixed surface of fixed plate are connected.

As an optimized technical scheme of the utility model, the outer fixed surface of fixing base is connected with soft pad, the fixed orifices has been seted up to the bottom surface of fixing base.

As an optimal technical scheme of the utility model, the width value of ventilative groove equals with the width value of fin, and the both sides face of fin all contacts with the inside wall of ventilative groove.

As a preferred technical scheme of the utility model, the bottom surface fixedly connected with fixed block of fixed plate, and the bottom surface of fixed block and the last fixed surface of gas-distributing pipe are connected.

The utility model discloses the beneficial effect who reaches is: the utility model relates to a PCB circuit board with heat dissipation function, not enough department among the prior art, make following several point improvements, through being provided with the heat-conducting plate, the heat that produces electronic components during operation guides, contact with heat conduction silica gel layer through setting up the fin, utilize the fast characteristics of heat conduction silica gel layer, with timely conduction to fin of heat on the heat-conducting plate, realize the radiating effect to the base plate, utilize the fan to blow simultaneously, at the connecting pipe, the cooperation of gas distribution pipe and conveyer pipe is set up, accelerate the radiating effect of fin, can reach the timely radiating effect to the base plate, avoid high temperature to cause the damage to the base plate, guarantee that electrical components can normally work.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:

FIG. 1 is a schematic view of the PCB with heat dissipation function of the present invention;

FIG. 2 is a schematic view of the whole fixing plate of the present invention;

FIG. 3 is a schematic view of the whole heat sink of the present invention;

fig. 4 is a side view of the fixing plate of the present invention.

In the figure: 1. a substrate; 2. a heat conducting plate; 3. a fixing plate; 4. a heat conductive silica gel layer; 5. a ventilation groove; 6. a fixed seat; 7. a fixing hole; 8. a soft cushion; 9. a delivery pipe; 10. a fixed tube; 11. positioning a groove; 12. a heat sink; 13. a through hole; 14. positioning blocks; 15. a fan; 16. a gas distributing pipe; 17. a connecting pipe; 18. and (5) fixing blocks.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, a person skilled in the art can make all other embodiments obtained on the premise of creative work, and all the embodiments belong to the protection scope of the present invention.

Example (b): as shown in fig. 1-4, a PCB circuit board with heat dissipation function comprises a substrate 1, a heat conducting plate 2 is fixedly connected to the bottom surface of the substrate 1, a fixing plate 3 is arranged below the heat conducting plate 2, a heat conducting silica gel layer 4 is fixedly connected to the upper surface of the fixing plate 3, the upper surface of the heat conducting silica gel layer 4 is fixedly connected to the bottom surface of the heat conducting plate 2, air permeable grooves 5 arranged at equal intervals are formed in the bottom surface of the heat conducting silica gel layer 4, positioning grooves 11 arranged at equal intervals are formed in the upper surface of the fixing plate 3, the air permeable grooves 5 correspond to the positioning grooves 11 one by one, fixing tubes 10 arranged at equal intervals are fixedly embedded in the front surface of the fixing plate 3, the fixing tubes 10 correspond to the positioning grooves 11;

symmetrical fin 12 is all connected to the equal joint in inside of every constant head tank 11, the bottom surface of fin 12 and the interior diapire fixed connection of constant head tank 11, and the upper surface of fin 12 contacts with the bottom surface of heat-conducting plate 2, symmetrical through-hole 13 has been seted up in the front of fin 12, the bottom surface fixedly connected with locating piece 14 of fixed plate 3, the fixed bottom surface of locating piece 14 is inlayed and is had fan 15, the fixed intercommunication of fan 15's gas outlet has connecting pipe 17, the fixed intercommunication of the one end that fan 15 was kept away from to connecting pipe 17 has gas distribution pipe 16, the fixed intercommunication of gas distribution pipe 16 has conveyer pipe 9 that the equidistance was arranged, and conveyer pipe 9 and fixed pipe 10 one-to-one, the one end that gas distribution pipe 16.

Wherein, be equipped with symmetrical draw-in groove between heat-conducting plate 2 and the fixed plate 3, the below of base plate 1 is equipped with symmetrical fixing base 6, and fixing base 6 is close to the inside of the one end joint of base plate 1 at the draw-in groove, and the bottom surface of fixing base 6 and the fixed surface fixed connection of fixed plate 3.

Wherein, the outer fixed surface of fixing base 6 is connected with soft pad 8, and fixed orifices 7 have been seted up to the bottom surface of fixing base 6.

Wherein, the width value of the ventilation groove 5 is equal to the width value of the radiating fin 12, and two side surfaces of the radiating fin 12 are both contacted with the inner side wall of the ventilation groove 5.

Wherein, the bottom surface of fixed plate 3 is fixedly connected with fixed block 18, and the bottom surface of fixed block 18 is fixedly connected with the upper surface of gas-distributing pipe 16.

Specifically, the utility model discloses during the use, a PCB circuit board with heat dissipation function, when base plate 1 temperature rises, through being provided with heat-conducting plate 2, guide the heat that electronic components during operation produced, contact through setting up fin 12 and heat conduction silica gel layer 4, utilize the fast characteristics of heat conduction silica gel layer 4, with timely conduction to fin 12 of the heat on the heat-conducting plate 2, realize the radiating effect to base plate 1, utilize fan 15 to blow simultaneously, at connecting pipe 17, the cooperation of gas-distributing pipe 16 and conveyer pipe 9 is set up, accelerate the radiating effect of fin 12, can reach the timely radiating effect to base plate 1, avoid high temperature to cause the damage to base plate 1, guarantee that electrical components can normally work.

It should be noted that, in this document, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "fixedly," "mounted," "connected," and "connected" are to be construed broadly, e.g., "mounted" may be fixedly connected, or detachably connected, or integrally connected; "connected" may be mechanically or electrically connected; "connected" may be directly connected or indirectly connected through an intermediate member, or may be internal or external to two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A PCB circuit board with heat dissipation function, includes base plate (1), its characterized in that: the heat conduction plate is characterized in that a heat conduction plate (2) is fixedly connected to the bottom surface of the base plate (1), a fixing plate (3) is arranged below the heat conduction plate (2), a heat conduction silica gel layer (4) is fixedly connected to the upper surface of the fixing plate (3), the upper surface of the heat conduction silica gel layer (4) is fixedly connected with the bottom surface of the heat conduction plate (2), air permeable grooves (5) which are arranged equidistantly are formed in the bottom surface of the heat conduction silica gel layer (4), positioning grooves (11) which are arranged equidistantly are formed in the upper surface of the fixing plate (3), the air permeable grooves (5) correspond to the positioning grooves (11) in a one-to-one manner, fixing pipes (10) which are arranged equidistantly are fixedly embedded in the front surface of the fixing plate (3), the fixing pipes (10) correspond to the positioning grooves (11);

symmetrical radiating fins (12) are clamped in the positioning grooves (11), the bottom surface of the radiating fin (12) is fixedly connected with the inner bottom wall of the positioning groove (11), the upper surface of the radiating fin (12) is contacted with the bottom surface of the heat conducting plate (2), symmetrical through holes (13) are arranged on the front surface of the radiating fin (12), a positioning block (14) is fixedly connected to the bottom surface of the fixing plate (3), a fan (15) is fixedly embedded in the bottom surface of the positioning block (14), a connecting pipe (17) is fixedly communicated with an air outlet of the fan (15), an air distributing pipe (16) is fixedly communicated with one end of the connecting pipe (17) far away from the fan (15), the gas distributing pipe (16) is fixedly communicated with conveying pipes (9) which are arranged at equal intervals, and the conveying pipe (9) corresponds to the fixed pipe (10) one by one, and one end of the conveying pipe (9) far away from the gas distribution pipe (16) is fixedly communicated with the fixed pipe (10).

2. The PCB circuit board with heat dissipation function of claim 1, wherein: be equipped with symmetrical draw-in groove between heat-conducting plate (2) and fixed plate (3), the below of base plate (1) is equipped with symmetrical fixing base (6), the one end joint that fixing base (6) are close to base plate (1) is in the inside of draw-in groove, and the bottom surface of fixing base (6) is connected with the upper surface fixed of fixed plate (3).

3. The PCB circuit board with heat dissipation function of claim 2, wherein: the outer fixed surface of fixing base (6) is connected with soft pad (8), fixed orifices (7) have been seted up to the bottom surface of fixing base (6).

4. The PCB circuit board with heat dissipation function of claim 1, wherein: the width value of the ventilation groove (5) is equal to that of the radiating fin (12), and two side faces of the radiating fin (12) are in contact with the inner side wall of the ventilation groove (5).

5. The PCB circuit board with heat dissipation function of claim 1, wherein: the bottom surface of the fixed plate (3) is fixedly connected with a fixed block (18), and the bottom surface of the fixed block (18) is fixedly connected with the upper surface of the gas distribution pipe (16).