CN213366585U - Bonding gold wire with high tensile strength and high impact resistance - Google Patents
Bonding gold wire with high tensile strength and high impact resistance Download PDFInfo
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- CN213366585U CN213366585U CN202022214283.3U CN202022214283U CN213366585U CN 213366585 U CN213366585 U CN 213366585U CN 202022214283 U CN202022214283 U CN 202022214283U CN 213366585 U CN213366585 U CN 213366585U
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- gold
- alloy wire
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/4554—Coating
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Abstract
The utility model discloses a high tensile strength impact resistance's key alloy wire, it relates to semiconductor packaging material, including silver-calcium alloy wire, gold-plating layer and polymer protective layer, the gold-plating layer is on silver-calcium alloy wire surface, polymer protective layer is on gold-plating layer surface, silver-calcium alloy wire diameter is 0.01 to 0.09mm, the gold-plating layer thickness is 1-2um, the polymer protective layer is 5-8um, silver-calcium alloy wire is through twice annealing treatment. The cost of the alloy wire that this practicality made reduces by a wide margin, and microelement calcium in the bonding gold wire has improved the tensile strength and the shock resistance degree of bonding gold wire, and twice annealing in the bonding gold wire production process effectively eliminates the internal stress of bonding gold wire, further improves its tensile strength.
Description
Technical Field
The utility model relates to a semiconductor package technical field, in particular to high tensile strength impact resistance can strong key alloy line.
Background
Bond wires are important materials for the microelectronics industry for use in the bonding of die to leadframe. The gold content of the bonding alloy wire is more than or equal to 99.9 percent, the reliability is high, but the price of gold is higher. With the market competition getting bigger and bigger, production enterprises need to reduce production cost to improve market competitiveness. Although the price of the bonding copper wire is low, the bonding copper wire is easy to oxidize and has poor service life and stability. Silver was found to be as inert as gold and not as readily oxidized as copper. It is conceivable to replace the alloy wire with silver. And the alloy wire is easy to be bonded in the production process, so that the wire breakage is caused.
Therefore, the bonding alloy wire has high tensile strength and high impact resistance.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high tensile strength impact resistance can strong bonding alloy line to solve above-mentioned technical problem.
A bonding alloy wire with high tensile strength and high impact resistance is characterized in that: including silver-calcium alloy wire, gold plating layer and polymer protective layer, the gold plating layer is on silver-calcium alloy wire surface, polymer protective layer is on gold plating layer surface, silver-calcium alloy wire diameter is 0.01 to 0.09mm, the gold plating layer thickness is 1-2um, polymer protective layer is 5-8um, silver-calcium alloy wire is through twice annealing treatment.
Preferably, the silver-calcium alloy wire is formed by drawing in inert gas argon protection.
Compared with the prior art, the utility model has the advantages that: the cost of the alloy wire is greatly reduced, the market competitiveness is improved, and the tensile strength and the impact resistance of the gold bonding wire can be improved by the trace element calcium in the gold bonding wire. The two times of annealing in the production process of the gold bonding wire effectively eliminates the internal stress of the gold bonding wire and further improves the tensile strength of the gold bonding wire. The gold bonding wire is produced under the protection of inert gas argon, so that oxidation is avoided, and the product quality is improved. A dense protective layer is formed on the surface of the gold bonding wire by the polymer protective layer on the surface of the gold bonding wire, so that the gold bonding wire is further protected from being oxidized in the subsequent use process, and the service life and the stability of the gold bonding wire are improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below.
FIG. 1 is a schematic structural view of a high tensile strength and high impact strength bonding alloy wire provided in an embodiment of the present invention;
in the drawings: 1. silver-calcium alloy wires; 2. plating a gold layer; 3. a polymer protective layer.
Detailed Description
In view of the deficiencies in the prior art, the technical solution of the present invention can be provided through long-term research and a large amount of practice. The technical solution in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention.
Fig. 1 is a schematic structural view of a bonding alloy wire with high tensile strength and high impact resistance provided in an embodiment of the present invention. A bonding alloy wire with high tensile strength and high impact resistance is characterized in that: a bonding alloy wire with high tensile strength and high impact resistance is characterized in that: including silver-calcium alloy silk 1, gold-plating layer 2 and polymer protective layer 3, gold-plating layer 2 is on silver-calcium alloy silk 1 surface, polymer protective layer 3 is on gold-plating layer 2 surface, silver-calcium alloy silk 1 diameter is 0.01 to 0.09mm, gold-plating layer 2 thickness is 1-2um, polymer protective layer 3 is 5-8um, silver-calcium alloy silk 1 is through twice annealing treatment.
Further, the silver-calcium alloy wire 1 is formed by drawing in inert gas argon protection.
To sum up, the utility model provides a pair of bond alloy wire that high tensile strength impact resistance can be strong, the cost of alloy wire reduces by a wide margin, improves market competition, and microelement calcium in the bond gold wire can improve the tensile strength and the shock resistance of bond gold wire. The two times of annealing in the production process of the gold bonding wire effectively eliminates the internal stress of the gold bonding wire and further improves the tensile strength of the gold bonding wire. The polymer protective layer on the surface forms a compact protective layer on the surface of the bonding gold wire to protect the bonding alloy wire from being oxidized.
The utility model provides a pair of high tensile strength bond alloy wire that shock resistance is strong, it should be understood, above-mentioned embodiment is only for the explanation the utility model discloses a technical conception and characteristics, its aim at let the personage of familiar with this technique can understand the utility model discloses an according to in order to implement, can not restrict with this the utility model discloses a protection scope. All simple changes and replacements made by the contents of the utility model are included in the protection scope of the utility model.
Claims (2)
1. A bonding alloy wire with high tensile strength and high impact resistance is characterized in that: including silver-calcium alloy wire, gold plating layer and polymer protective layer, the gold plating layer is on silver-calcium alloy wire surface, polymer protective layer is on gold plating layer surface, silver-calcium alloy wire diameter is 0.01 to 0.09mm, the gold plating layer thickness is 1-2um, polymer protective layer is 5-8um, silver-calcium alloy wire is through twice annealing treatment.
2. The bonding alloy wire with high tensile strength and impact resistance as set forth in claim 1, wherein: and drawing and forming the silver-calcium alloy wire in the inert gas argon protection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022214283.3U CN213366585U (en) | 2020-10-08 | 2020-10-08 | Bonding gold wire with high tensile strength and high impact resistance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022214283.3U CN213366585U (en) | 2020-10-08 | 2020-10-08 | Bonding gold wire with high tensile strength and high impact resistance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213366585U true CN213366585U (en) | 2021-06-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022214283.3U Active CN213366585U (en) | 2020-10-08 | 2020-10-08 | Bonding gold wire with high tensile strength and high impact resistance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213366585U (en) |
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2020
- 2020-10-08 CN CN202022214283.3U patent/CN213366585U/en active Active
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