CN105870313A - Novel LED encapsulating technological method - Google Patents
Novel LED encapsulating technological method Download PDFInfo
- Publication number
- CN105870313A CN105870313A CN201610295308.2A CN201610295308A CN105870313A CN 105870313 A CN105870313 A CN 105870313A CN 201610295308 A CN201610295308 A CN 201610295308A CN 105870313 A CN105870313 A CN 105870313A
- Authority
- CN
- China
- Prior art keywords
- novel led
- wire
- packaging process
- led packaging
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention belongs to the technical field of LED encapsulation and particularly relates to a novel LED encapsulating technological method. The novel LED encapsulating technological method achieves the technical purposes of low cost and high reliability. According to the technical scheme, the novel LED encapsulating technological method comprises the steps that one end of a lead is bonded to a metal layer of a chip with a wire ball bonding method, and the other end of the lead is bonded to a lead frame, wherein a copper wire serves as the lead. The novel LED encapsulating technological method is suitable for the LED encapsulation field.
Description
Technical field
The invention belongs to the technical field of LED encapsulation, be specifically related to a kind of novel LED packaging process.
Background technology
At present, LED welded encapsulation all uses pompon to weld, pompon weldering is the most representational solder technology in wire bonding, it is at a certain temperature, the pressure of effect bonding tool chopper, and load ultrasonic vibration, lead-in wire one end is bonded on the metal level of chip, the other end is bonded on lead frame, it is achieved chip internal circuits and the electrical connection of peripheral circuit.Owing to pompon weldering is easy to operate, flexible and solder joint firm, and pressure point area is big (for 2.5-3 times of wire diameter), the most non-directional, therefore can realize high-speed automated welding.Pompon welds widely used gold wire, spun gold has the advantages such as big, corrosion-resistant, the good toughness of electrical conductivity, is widely used in integrated circuit, and aluminium wire is owing to existing the problems such as shape ball is extremely difficult, Wedge Bond can only be used, be mainly used in power device, microwave device and photoelectric device.Along with the development of high-density packages, the high cost shortcoming of gold ball bonding will become increasingly conspicuous, and microelectronic industry, for reducing cost, improving reliability, will seek good, the cheap metal material of processing performance to replace expensive gold.
When carrying out bonding wire selection, there is some requirement following: 1, filament materials must be high connductivity, to guarantee that signal integrity is not destroyed；2, the wire diameter of ball bond does not exceeds the 1/4 of pad size；3, pad and the shear strength of bonding material and tensile strength are critically important, and yield strength is greater than in bonding the stress produced；4, bonding material to have certain diffusion constant, to form certain IMC, thus obtains the weld strength of needs, but in working life, growth is not too many, otherwise can cause component failure；5, bonding welding pad impurity to be controlled, to improve bond ability, the metal deposition parametres of bonding surface strictly to control, and prevents the entrance of gas；6, silk thread and pad hardness to be mated, if silk thread hardness is more than pad, can produce crater, if less than pad, then easily energy being passed to substrate.
Summary of the invention
The present invention overcomes the deficiency that prior art exists, technical problem to be solved to be: provide the novel LED packaging process that a kind of cost is relatively low, reliability is higher.
In order to solve above-mentioned technical problem, the technical solution used in the present invention is: a kind of novel LED packaging process, including: using pompon soldering method to be bonded on the metal level of chip one end of lead-in wire, be bonded on the lead frames by the other end of lead-in wire, described lead-in wire is copper cash.
Preferably, described copper cash is the monocrystalline copper cash that with the addition of trace element.
Preferably, in pompon welding machine, it is provided with oxygen-proof protecting device.
Preferably, described oxygen-proof protecting device is reducibility gas generating means, and in burning ball and bonding process, described reducibility gas generating means constantly produces reducibility gas, makes copper cash be in the atmosphere that being reduced property gas surrounds.
Preferably, described reducibility gas includes the N of 95%2With 5% H2。
Preferably, the supersonic frequency of pompon welding machine is 120MHz.
Preferably, the copper alloy wire of a diameter of 0.7mil disconnected B point or break C point time, the pulling force of copper alloy wire be more than 6g, ball thickness is 10 μm ~ 13 μm.
Preferably, bond wire pattern uses Normal pattern.
Preferably, two soldering sets have fish tail, pulling force to be not enough to disconnected D point.
Preferably, bonding wire uses copper cash porcelain mouth.
The present invention compared with prior art has the advantages that
In the present invention, during the pompon of LED packaging technology welds, the silk thread used is copper cash, owing to the cost of copper wire only has the 1/3 ~ 1/10 of spun gold, therefore use copper wire as bonding wire, reduce the cost of LED packaging technology on the whole, in addition, for copper wire bonding to aluminum metallization pad, under equal conditions, C
The intermetallic compound growth speed at u/Al interface ratio slow 10 times of Au/Al interface, therefore, the reliability of copper ball bonding solder joint is higher than gold ball bonding solder joint, also improves the reliability of LED packaging technology on the whole.
Detailed description of the invention
For making the purpose of the embodiment of the present invention, technical scheme and advantage clearer, technical scheme in the embodiment of the present invention will be clearly and completely described below, obviously, described embodiment is a part of embodiment of the present invention rather than whole embodiments；Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art are obtained under not making creative work premise, broadly fall into the scope of protection of the invention.
A kind of novel LED packaging process, including: using pompon soldering method to be bonded on the metal level of chip one end of lead-in wire, be bonded on the lead frames by the other end of lead-in wire, described lead-in wire is copper cash.
Further, described copper cash can be the monocrystalline copper cash that with the addition of trace element, add the copper cash purity after trace element can >=99.99%, the physical parameters such as the hardness of copper, yield strength are higher than gold and aluminium, need during bonding to apply bigger ultrasonic energy and bonding pressure, therefore silicon easily cause damage even destroy, by adding the problem that trace element can solve copper cash hardness and yield strength.
Further, can be provided with oxygen-proof protecting device in pompon welding machine, in all metals, the electric conductivity of copper is only second to silver, but price is better than silver, but the chemical stability of copper is not as silver, oxidizable, sulfuration.
Further, described oxygen-proof protecting device can be reducibility gas generating means, and in burning ball and bonding process, described reducibility gas generating means constantly produces reducibility gas, makes copper cash be in the atmosphere that being reduced property gas surrounds.
Yet further, described reducibility gas can include the N2 of the 95% and H2 of 5%.
Further, the supersonic frequency of pompon welding machine can be 120MHz, and in the present embodiment, bonding apparatus can use the ConnX pompon welding machine that K ＆ S company produces, and oxygen-proof protecting device can be selected for the oxygen-proof protecting device of Copper Kit.
Further, the copper alloy wire of a diameter of 0.7mil disconnected B point or break C point time, the pulling force of copper alloy wire be more than 6g, ball thickness is 10 μm ~ 13 μm.
Further, bond wire pattern uses Normal pattern.
Further, two soldering sets have fish tail, pulling force to be not enough to disconnected D point.
Further, bonding wire uses copper cash porcelain mouth, needs the abrasion condition of periodic detection porcelain mouth during use, beyond requiring should change porcelain mouth in time.
The copper wire of all size used in wire bonding, its cost only has the 1/3 ~ 1/10 of spun gold；The high rigidity of the copper relative gold wire of lead-in wire makes it be more suitable for tiny wire bonding；The electrical conductivity of copper is 0.62(μ Ω/cm)-1, bigger than the electrical conductivity [0.42(μ Ω/cm)-1] of gold, the thermal conductivity of copper is also above gold simultaneously, therefore under conditions of diameter is identical, copper wire can carry bigger electric current, copper lead-in wire is applied not only in power device, is also applied to smaller diameter lead-in wire to adapt to high density integrated circuit encapsulation；For gold wire bonds to aluminum metallization pad, microstructure and interface oxidation process study to Interface Microstructure are more, allow most and there is a concern that " purple plague purpura " (AuAl2) and " hickie " (Au2Al) problem, and because the diffusion rate of two kinds of elements of Au with Al is different, cause interface to form Kirkendall hole and crackle, reduce solder joint mechanical property and electric property；For copper wire bonding to aluminum metallization pad, under equal conditions, the intermetallic compound growth speed at Cu/Al interface ratio slow 10 times of Au/Al interface, therefore, the reliability of copper ball bonding solder joint is higher than gold ball bonding solder joint；Numerous results of study show that copper is the best substitute of gold.
Last it is noted that various embodiments above is only in order to illustrate technical scheme, it is not intended to limit；Although the present invention being described in detail with reference to foregoing embodiments, it will be understood by those within the art that: the technical scheme described in foregoing embodiments still can be modified by it, or the most some or all of technical characteristic is carried out equivalent；And these amendments or replacement, do not make the essence of appropriate technical solution depart from the scope of various embodiments of the present invention technical scheme.
Claims (10)
1. a novel LED packaging process, including: use pompon soldering method to be bonded on the metal level of chip one end of lead-in wire, the other end of lead-in wire be bonded on the lead frames, it is characterised in that: described lead-in wire is copper cash.
A kind of novel LED packaging process the most according to claim 1, it is characterised in that: described copper cash is the monocrystalline copper cash that with the addition of trace element.
A kind of novel LED packaging process the most according to claim 1, it is characterised in that: in pompon welding machine, it is provided with oxygen-proof protecting device.
A kind of novel LED packaging process the most according to claim 3; it is characterized in that: described oxygen-proof protecting device is reducibility gas generating means; in burning ball and bonding process; described reducibility gas generating means constantly produces reducibility gas, makes copper cash be in the atmosphere that being reduced property gas surrounds.
A kind of novel LED packaging process the most according to claim 4, it is characterised in that: described reducibility gas includes the N of 95%2With 5% H2。
A kind of novel LED packaging process the most according to claim 1, it is characterised in that: the supersonic frequency of pompon welding machine is 120MHz.
A kind of novel LED packaging process the most according to claim 1, it is characterised in that: the copper alloy wire of a diameter of 0.7mil disconnected B point or break C point time, the pulling force of copper alloy wire be more than 6g, ball thickness is 10 μm ~ 13 μm.
A kind of novel LED packaging process the most according to claim 1, it is characterised in that: bond wire pattern uses Normal pattern.
A kind of novel LED packaging process the most according to claim 1, it is characterised in that: two soldering sets have fish tail, pulling force to be not enough to disconnected D point.
A kind of novel LED packaging process the most according to claim 1, it is characterised in that: bonding wire uses copper cash porcelain mouth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610295308.2A CN105870313A (en) | 2016-05-06 | 2016-05-06 | Novel LED encapsulating technological method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610295308.2A CN105870313A (en) | 2016-05-06 | 2016-05-06 | Novel LED encapsulating technological method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105870313A true CN105870313A (en) | 2016-08-17 |
Family
ID=56631160
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610295308.2A Pending CN105870313A (en) | 2016-05-06 | 2016-05-06 | Novel LED encapsulating technological method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105870313A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110284023A (en) * | 2019-07-22 | 2019-09-27 | 安徽广宇电子材料有限公司 | One Albatra metal bonding wire and its preparation method and application |
-
2016
- 2016-05-06 CN CN201610295308.2A patent/CN105870313A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110284023A (en) * | 2019-07-22 | 2019-09-27 | 安徽广宇电子材料有限公司 | One Albatra metal bonding wire and its preparation method and application |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6088950B2 (en) | Stud bump structure and manufacturing method thereof | |
| JP5616739B2 (en) | Multilayer copper bonding wire bonding structure | |
| TWI496900B (en) | Copper alloy bonding wire for semiconductors | |
| Kaimori et al. | The development of Cu bonding wire with oxidation-resistant metal coating | |
| EP0435009B1 (en) | Semiconductor package connecting method and semiconductor package connecting wires | |
| KR20010070397A (en) | Semiconductor device | |
| JP5064577B2 (en) | Ball bonding wire | |
| JP2010225722A (en) | Coated copper wire for ball bonding | |
| JP2015130502A (en) | Stud bump and its package structure, and production method thereof | |
| WO2013018238A1 (en) | Ball bonding wire | |
| JP5343069B2 (en) | Bonding wire bonding structure | |
| JP2011077193A (en) | Method for manufacturing semiconductor device | |
| CN102017107B (en) | Joint structure and electronic component | |
| JP2014055327A (en) | Silver gold palladium-based alloy bump wire | |
| TW201809299A (en) | Metallic ribbon for power module packaging | |
| JP2005268771A (en) | Gold bonding wire for semiconductor device and its method of connection | |
| CN105870313A (en) | Novel LED encapsulating technological method | |
| TW202307225A (en) | Bonding wire for semiconductor device | |
| JP2013048169A (en) | Wire for ball bonding | |
| CN104218012A (en) | Metal bonding wire and manufacturing method thereof | |
| US9799624B1 (en) | Wire bonding method and wire bonding structure | |
| CN105870268A (en) | LED encapsulating technical method based on gold-plated wire | |
| JP2003297874A (en) | Connection structure and connection method for electronic component | |
| JP2013042105A (en) | Bonding wire | |
| JP2006352175A (en) | Semiconductor integrated circuit device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160817 |
|
| WD01 | Invention patent application deemed withdrawn after publication |