CN213304090U - 一种igbt键合机料盘传送定位装置 - Google Patents
一种igbt键合机料盘传送定位装置 Download PDFInfo
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- CN213304090U CN213304090U CN202022258506.6U CN202022258506U CN213304090U CN 213304090 U CN213304090 U CN 213304090U CN 202022258506 U CN202022258506 U CN 202022258506U CN 213304090 U CN213304090 U CN 213304090U
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- 230000007246 mechanism Effects 0.000 claims abstract description 39
- 230000000694 effects Effects 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims description 27
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000003754 machining Methods 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 description 13
- 238000007599 discharging Methods 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
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- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
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GR01 | Patent grant | ||
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EE01 | Entry into force of recordation of patent licensing contract | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Anhui Xingtai Financial Leasing Co.,Ltd. Assignor: Hefei Zhongheng Micro Semiconductor Co.,Ltd. Contract record no.: X2022980017557 Denomination of utility model: An IGBT bonding machine tray conveying positioning device Granted publication date: 20210528 License type: Exclusive License Record date: 20221009 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: An IGBT bonding machine tray conveying positioning device Effective date of registration: 20221010 Granted publication date: 20210528 Pledgee: Anhui Xingtai Financial Leasing Co.,Ltd. Pledgor: Hefei Zhongheng Micro Semiconductor Co.,Ltd. Registration number: Y2022980017833 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20231115 Granted publication date: 20210528 Pledgee: Anhui Xingtai Financial Leasing Co.,Ltd. Pledgor: Hefei Zhongheng Micro Semiconductor Co.,Ltd. Registration number: Y2022980017833 |
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EC01 | Cancellation of recordation of patent licensing contract | ||
EC01 | Cancellation of recordation of patent licensing contract |
Assignee: Anhui Xingtai Financial Leasing Co.,Ltd. Assignor: Hefei Zhongheng Micro Semiconductor Co.,Ltd. Contract record no.: X2022980017557 Date of cancellation: 20231129 |