CN213276562U

CN213276562U - Embedded ARM core module

Info

Publication number: CN213276562U
Application number: CN202022675947.6U
Authority: CN
Inventors: 陈辛鑫; 赵振兴
Original assignee: Guangzhou Realarm Information Technology Co ltd
Current assignee: Guangzhou Realarm Information Technology Co ltd
Priority date: 2020-11-18
Filing date: 2020-11-18
Publication date: 2021-05-25
Anticipated expiration: 2030-11-18

Abstract

The utility model discloses an embedded ARM core module, which comprises a mainboard, wherein a fixed seat is arranged at the middle position of the upper surface of the mainboard, the outer layer of the fixed seat is arranged with electronic elements, the upper end of the fixed seat is fixedly provided with a core element, a bottom groove is arranged inside the fixed seat, pins are arranged outside the fixed seat, fixed pins are fixedly arranged at four end corners of the lower surface of the main board, the middle position of the lower surface of the main board is provided with a heat conducting seat, the lower end of the heat conducting seat is fixedly provided with a heat radiating structure, the two sides of the heat dissipation structure are arranged with side heat dissipation frames, the middle position of the upper surface of the heat dissipation structure is provided with a matching seat, the radiating structure is characterized in that bottom side radiating fins are arranged in the middle of the lower surface of the radiating structure, connecting seats are fixedly mounted at four end corners of the upper surface of the radiating structure, and inner grooves are formed in the connecting seats. The utility model discloses make the device realize making things convenient for the fixed function of core unit to and installed heat radiation structure additional.

Description

Embedded ARM core module

Technical Field

The utility model relates to an embedded ARM core module technical field specifically is an embedded ARM core module.

Background

The core is also called as kernel, which is the most important component of CPU, the raised chip in the CPU center is the core, which is made of monocrystalline silicon by certain production process, all the calculation, receiving/storing command and processing data of CPU are executed by the core, various CPU cores have fixed logic structure, and the logic units such as first-level cache, second-level cache, execution unit, instruction level unit and bus interface have scientific layout.

However, when the existing embedded ARM core module is used, the installation is not simple enough, an embedded installation method is lacked, and the mechanism operation is easily influenced by overhigh heat of the main board; therefore, the existing requirements are not met, and an embedded ARM core module is provided for the requirement.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an embedded ARM core module to the embedded ARM core module who proposes in solving above-mentioned background art when using, the installation is not simple and convenient enough, lacks an embedded mounting method, and the mainboard heat is too high influences mechanism operation scheduling problem easily.

In order to achieve the above object, the utility model provides a following technical scheme: an embedded ARM core module comprises a mainboard, wherein a fixed seat is arranged in the middle of the upper surface of the mainboard, the outer layer of the fixed seat is arranged with electronic elements, the upper end of the fixed seat is fixedly provided with a core element, a bottom groove is arranged inside the fixed seat, pins are arranged outside the fixed seat, fixed pins are fixedly arranged at four end corners of the lower surface of the main board, the middle position of the lower surface of the main board is provided with a heat conducting seat, the lower end of the heat conducting seat is fixedly provided with a heat radiating structure, the two sides of the heat dissipation structure are arranged with side heat dissipation frames, the middle position of the upper surface of the heat dissipation structure is provided with a matching seat, bottom edge radiating fins are arranged in the middle of the lower surface of the radiating structure, connecting seats are fixedly arranged at four end corners of the upper surface of the radiating structure, the inside of connecting seat is provided with the inside groove, the outside fixed mounting of fixed pin lower extreme has the spacing ring.

Preferably, the limiting ring is made of rubber, and the limiting ring is fixed with the outer side of the fixing pin through a groove.

Preferably, the bottom surface of the inner wall of the inner groove is provided with an inner annular groove, and the inner annular groove and the limiting ring are fixed through a clamping groove.

Preferably, the heat dissipation structure is made of aluminum materials, and the heat dissipation structure and the matching seat are integrally cast.

Preferably, slots are arranged on the inner wall of the bottom groove, and the core element is connected with the bottom groove through the matching of pins and the slots.

Preferably, the one end of side heat dissipation frame is provided with the heat dissipation circle, the heat dissipation circle is oval shape, fixing base and stitch electric connection.

Preferably, the lower surface of the inner wall of the heat conducting seat is provided with a groove, and the groove is completely attached to the upper surface of the matching seat.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses an imbed the inside of kerve with the core component, guarantee each stitch all to contact with the inside of slot simultaneously, make and form the conducting state between fixing base and the core component, through the cooperation of core component and fixing base, can realize the installation and the fixed function of core part, and the installation only needs to correspond stitch and slot and can accomplish the connection operation, convenient to use, easy operation, fix mainboard and heat radiation structure's upper surface again, insert the fixed pin inside the inside of inside groove, make the spacing ring imbed in the inner ring groove inside the inside groove, form the fixed state, the upper surface of guaranteeing simultaneously contacts with the lower surface of heat-conducting seat;

2. the utility model discloses a heat conduction seat absorbs the heat that mainboard inside produced, passes to and heat radiation structure's inside again, and the word has side heat dissipation frame and base fin to carry out the heat dissipation to be handled at last, can provide normal operational environment for the mainboard to side heat dissipation frame and base fin can be according to the in service behavior, through the technological means, reduce its high radiating effect that also can not influence.

Drawings

Fig. 1 is a schematic overall structure diagram of the present invention;

FIG. 2 is a schematic view of the connection structure between the core component and the fixing base of the present invention;

FIG. 3 is a schematic view of the heat conducting base of the present invention;

fig. 4 is a schematic view of the mounting structure of the fixing pin and the connecting seat of the present invention.

In the figure: 1. a main board; 2. a fixed seat; 3. an electronic component; 4. a core element; 5. a bottom groove; 6. a stitch; 7. a fixing pin; 8. a heat conducting base; 9. a heat dissipation structure; 10. a mating seat; 11. a side heat dissipation frame; 12. a bottom edge heat sink; 13. a connecting seat; 14. an inner tank; 15. a limit ring.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1 to 4, the present invention provides an embodiment: an embedded ARM core module comprises a mainboard 1, a fixed seat 2 is arranged at the middle position of the upper surface of the mainboard 1, electronic elements 3 are arranged on the outer layer of the fixed seat 2, a core element 4 is fixedly installed at the upper end of the fixed seat 2, a bottom groove 5 is arranged inside the fixed seat 2, pins 6 are arranged at the outer side of the fixed seat 2, fixed pins 7 are fixedly installed at four end corners of the lower surface of the mainboard 1, a heat conducting seat 8 is arranged at the middle position of the lower surface of the mainboard 1, a heat dissipation structure 9 is fixedly installed at the lower end of the heat conducting seat 8, heat conduction and heat dissipation requirements can be provided for the heat conducting seat 8 by adopting the technical scheme, side edge heat dissipation frames 11 are arranged at two sides of the heat dissipation structure 9, a matching seat 10 is arranged at the middle position of the upper surface of the heat dissipation structure 9, the function of quickly transferring internal heat can be realized by adopting the technical scheme, the four end corners of the upper surface of the heat dissipation structure 9 are fixedly provided with connecting seats 13, inner grooves 14 are formed in the connecting seats 13, and the outer sides of the lower ends of the fixing pins 7 are fixedly provided with limiting rings 15.

Further, the limiting ring 15 is made of rubber, and the limiting ring 15 and the outer side of the fixing pin 7 are fixed through a groove.

Through adopting above-mentioned technical scheme, can realize the convenient fixed connection's of device function.

Further, an inner annular groove is formed in the bottom surface of the inner wall of the inner groove 14, and the inner annular groove and the limiting ring 15 are fixed through a clamping groove.

Through adopting above-mentioned technical scheme, can realize the convenient fixed function between the device inside.

Further, the heat dissipation structure 9 is made of aluminum, and the heat dissipation structure 9 and the matching seat 10 are integrally cast.

Through adopting above-mentioned technical scheme, can provide heat conduction and heat dissipation demand for heat conduction seat 8.

Furthermore, slots are arranged on the inner wall of the bottom groove 5, and the core element 4 is connected with the bottom groove 5 through the matching of pins 6 and the slots.

Through adopting above-mentioned technical scheme, can realize the convenient fixed function of device.

Further, one end of the side heat dissipation frame 11 is provided with a heat dissipation ring, the heat dissipation ring is oval, and the fixing seat 2 is electrically connected with the pins 6.

Through adopting above-mentioned technical scheme, can realize the inside high-efficient radiating function of device.

Further, the lower surface of the inner wall of the heat conducting seat 8 is provided with a groove, and the groove is completely attached to the upper surface of the matching seat 10.

Through adopting above-mentioned technical scheme, can realize the function of the quick transfer of inside heat.

The working principle is as follows: when in use, the core element 4 is firstly corresponding to the upper surface of the fixed seat 2, then the core element 4 is embedded into the bottom groove 5, and simultaneously each pin 6 is ensured to be contacted with the inside of the slot, so that a conductive state is formed between the fixed seat 2 and the core element 4, the core component can be installed and fixed by matching the core element 4 and the fixed seat 2, and the installation can be completed by only corresponding the pin 6 to the slot, the operation is convenient and simple, then the mainboard 1 is connected and fixed with the upper surface of the heat dissipation structure 9, the fixed pin 7 is inserted into the inside of the inner groove 14, the limit ring 15 is embedded into the inner ring groove inside the inner groove 14 to form a fixed state, and simultaneously the upper surface of the matching seat 10 is ensured to be contacted with the lower surface of the heat conduction seat 8, the heat generated inside the mainboard 1 is absorbed by the heat conduction seat 8 and then is transferred to the matching seat 10 and the inside of the heat dissipation structure 9, finally, the side radiating frame 11 and the bottom radiating fins 12 are used for radiating, so that a normal working environment can be provided for the motherboard 1, and the side radiating frame 11 and the bottom radiating fins 12 can be reduced in height according to the use condition through a technological means without affecting the radiating effect.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Claims

1. The utility model provides an embedded ARM core module, includes mainboard (1), its characterized in that: the heat dissipation structure is characterized in that a fixing seat (2) is arranged at the middle position of the upper surface of the main board (1), electronic elements (3) are arranged on the outer layer of the fixing seat (2), a core element (4) is fixedly mounted at the upper end of the fixing seat (2), a bottom groove (5) is arranged in the fixing seat (2), pins (6) are arranged at the outer side of the fixing seat (2), fixing pins (7) are fixedly mounted at four end corners of the lower surface of the main board (1), a heat conduction seat (8) is arranged at the middle position of the lower surface of the main board (1), a heat dissipation structure (9) is fixedly mounted at the lower end of the heat conduction seat (8), side heat dissipation frames (11) are arranged at two sides of the heat dissipation structure (9), a matching seat (10) is arranged at the middle position of the upper surface of the heat dissipation structure (9), and bottom side heat dissipation fins, the heat dissipation structure is characterized in that connecting seats (13) are fixedly mounted at four end corners of the upper surface of the heat dissipation structure (9), inner grooves (14) are formed in the connecting seats (13), and limiting rings (15) are fixedly mounted on the outer sides of the lower ends of the fixing pins (7).

2. The embedded ARM core module of claim 1, wherein: the limiting ring (15) is made of rubber, and the limiting ring (15) is fixed with the outer side of the fixing pin (7) through a groove.

3. The embedded ARM core module of claim 1, wherein: the bottom surface of the inner wall of the inner groove (14) is provided with an inner annular groove, and the inner annular groove is fixed with the limiting ring (15) through a clamping groove.

4. The embedded ARM core module of claim 1, wherein: the heat dissipation structure (9) is made of aluminum materials, and the heat dissipation structure (9) and the matching seat (10) are integrally cast.

5. The embedded ARM core module of claim 1, wherein: the inner wall of the bottom groove (5) is provided with slots, and the core element (4) is connected with the bottom groove (5) through the matching of pins (6) and the slots.

6. The embedded ARM core module of claim 5, wherein: one end of the side heat dissipation frame (11) is provided with a heat dissipation ring, the heat dissipation ring is oval, and the fixing seat (2) is electrically connected with the pins (6).

7. The embedded ARM core module of claim 1, wherein: the lower surface of the inner wall of the heat conducting seat (8) is provided with a groove, and the groove is completely attached to the upper surface of the matching seat (10).