CN100362654C - Ball format array structure possessing heat sinks - Google Patents
Ball format array structure possessing heat sinks Download PDFInfo
- Publication number
- CN100362654C CN100362654C CNB2003101225606A CN200310122560A CN100362654C CN 100362654 C CN100362654 C CN 100362654C CN B2003101225606 A CNB2003101225606 A CN B2003101225606A CN 200310122560 A CN200310122560 A CN 200310122560A CN 100362654 C CN100362654 C CN 100362654C
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- heat
- bga package
- dissipation element
- heat dissipation
- radiating subassembly
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention provides a heat radiation mechanism for improving the heat radiation efficiency of a ball-lattice type array structure. A heat radiation device comprises a first heat radiation assembly and a second heat radiation assembly, wherein the first heat radiation assembly comprises a heat radiation fin positioned on the main body of the heat radiation mechanism, at least two heat-conductive support pillars positioned at the back side of the main body of the heat radiation mechanism and used for fixing the heat radiation device and conducting the heat, and a heat-conductive lug positioned at the back side of the main body of the heat radiation mechanism for contacting the ball-lattice type array structure to improve the heat radiation efficiency; the second heat radiation assembly comprises a lower fixing slice for contacting the back side of a printed circuit board to improve the heat radiation effect and removing the heat generated by a chip above the printed circuit board, and the lower fixing slice is connected with the heat-conductive support pillars of the main body of the heat radiation mechanism to make the first heat radiation assembly and the second heat radiation assembly tightly fixed.
Description
Technical field
The present invention relevant for provide a kind of in integrated circuit the heat abstractor in order to heat radiation, the BGA Package that more particularly has a heat abstractor can reduce thermal resistance and promote radiating efficiency.
Background technology
In electronics and computer industry, utilize the electronic encapsulated components and the integrated circuit (IC) wafer of various different types, for example, PENTIUM central processing unit (CPU; Central processing unit) make by Intel, and random access memory (RAM; Random access memory).These integrated circuit (IC) wafer have pin grid array encapsulation (PGA; Pin Grid Array Package) and be installed in usually on the socket (socket), the mode of this stitch Background Grid array packages utilization welding is welded on the circuit board of computer.These integrated circuit components, particularly the central processing unit wafer can produce a large amount of heats in the process of running, therefore must remove these heats to prevent to be unfavorable for the operation of PENTIUM microprocessor, because the PENTIUM microprocessor comprises millions of electric crystals, can have high sensitive for overheated operation, when overheated the time, can destroy microprocessor element itself, or other is near near the element the microprocessor.
Except the above-mentioned microprocessor of discussing, also have the pattern of many kinds of semiconductor element encapsulation, these normally are used on the computer equipment.For example resistor (resistor) and electro-hot regulator (thermistor) can produce a large amount of heats when general operation, and do not have the in good time heat that removes when reducing operating temperature, and these heats cause the fault or the damage of element.
Similarly, retaining element generally is mounted in the circuit board, or is installed on the motherboard in regular turn or on other main circuit boards.For example, microprocessor is called transaction card (processor card) as PENTIUMII and the Celeron processor by Intel Company's manufacturing, these microprocessors are installed on the motherboard in the computer system, are similar to built-in type modem (or being called modem) and (Modem) are installed on the motherboard.At known transaction card is that typical semiconductor processes element is one of indispensable element for the operation of interface card, as cache memory chips (cache chip) or other has the wafer of identity function.And processor encapsulation can encapsulate (PGA), BGA Package (BGA) and Organic Land Grid Array (Land grid array) via pin grid array and be positioned at wafer (ZIF on the socket (socket); Zero Insertion Force) or ball bar socket (ball grid socket).
In addition, for above-mentioned traditional semiconductor element is discussed, the electronic component of many different kenels can't bear overheated and have problems.For example, electronic package has overheated phenomenon.Yet many electronic components need cool off in order to reduce temperature and produce superheating phenomenon in order to avoid produce too much heat.Yet the size of these electronic components is too little so that can't provide and hold traditional heat dissipation metal device.These traditional heat dissipation metal devices generally are to utilize the heat conduction adhesive tape directly to stick together on electronic component, or utilize mechanical structure for example spring clip (spring clip) heat abstractor is aimed at and is installed on the electronic package.Further, gap pad (gap pad) normally need be used in the interface surface outside between electronic package and the cooling mechanism to obtain suitable conduction effect.With reference to the problem that is produced in previous and these electronic components, provide a radiating fin to be positioned at the cooling mechanism top, or other can increase the assembly of good area of dissipation, its processing procedure difficulty and processing procedure cost can improve.
Traditional heat abstractor bears by many elements and the expensive together shortcoming of many combination of elements in the narration in front.These elements with cooling mechanism comprise expensive machinery or as aluminium can extrusion molding heat-conducting metal.With regard to other partly with regard to, for processing procedure, spring or additional have the elasticity clamp and need separate mechanical step and/or press mold for example.Therefore, these assemblies and method are not suitable completely for the electronic component of major part.
With reference to Fig. 1 and Fig. 2, side view and end view that expression tradition has the BGA Package 100 of fin, its BGA Package with fin comprise the top that the embedded fin 106 of top, a modified form that a base plate for packaging ball grid array 102, a wafer 104 be positioned at base plate for packaging ball grid array 102 is positioned at wafer 104 and base plate for packaging ball grid array 102.Pour into pressing mold compound (molding compound) 108 then to finish a BGA Package processing procedure.(Figure 1B) can know by end view; in traditional BGA Package 100; its wafer 104 is coated under the casting die compound (molding compound) 108, its heat radiation approach be subject to compound 108 low thermal conductivity and can't the bigger heating power of dissipation.The method of general head it off is to add an embedded fin (embedded heat slug) above wafer, when the shortcoming of this technology is in response to bigger radiating requirements, meet just before wafer can't be produced a large amount of heats remove in good time to around environment, and cause overheatedly, and make wafer to operate
Summary of the invention
Main purpose of the present invention is to provide a cast type the integrated cooling mechanism main body that has in the heat abstractor, and wherein this cooling mechanism main body is to form in order to increase radiating efficiency in the mode of casting.
The back side that another object of the present invention is to provide a heat conduction projection to be positioned at the cooling mechanism body also is connected to promote conduction of heat with groove on the BGA Package of the embedded fin of tool modified form.
A further object of the present invention is that the both sides that provide at least two heat conduction supporting column to be positioned at the cooling mechanism main body are positioned at the opening of stator both sides down in order to connection.
A time purpose of the present invention be to provide stator has at least two heat conduction supporting column with connection first radiating subassembly with the dorsal part of contact print circuit board in order to guiding by heat that wafer was produced, make that heat can be by the dorsal part of printed circuit board (PCB) via the conductor pillar of stator to the first radiating subassembly both sides down, conduct heat to be positioned at first radiating subassembly top radiating fin to remove heat.
According to above all purposes, the invention provides on a kind of BGA Package that can be used for the embedded fin of tool modified form to increase the heat abstractor of radiating efficiency.Its heat abstractor comprises one first radiating subassembly and second radiating subassembly, and wherein first radiating subassembly comprises a radiating fin and at least two heat conduction supporting column of being positioned at cooling mechanism main body top and is positioned at the both sides of cooling mechanism main body below in order to increase the area of dissipation of cooling mechanism main body; One heat conduction projection is positioned at the back side of cooling mechanism main body, and this heat conduction projection is to increase the effect of heat conduction in order to the groove in the fin of the U type on the BGA Package that connects the embedded fin of tool modified form.In addition, second radiating subassembly is stator, the opening that has the part of a projection and be positioned at both sides in the middle of it, part of projection is in order to the dorsal part of contact print circuit board in the middle of it, removing the heat that produced by wafer increasing radiating effect, and be connected printed circuit board (PCB) to fix first, second radiating subassembly and between first and second radiating subassembly, to have BGA Package with at least two heat conduction supporting column of cooling mechanism main body.
For further specifying above-mentioned purpose of the present invention, design feature and effect, the present invention is described in detail below with reference to accompanying drawing.
Description of drawings
Fig. 1 is the technology that discloses according to tradition, and expression has the end view of the chip package of embedded fin;
Fig. 2 is the technology that discloses according to tradition, and expression has the schematic cross-section of the chip package of embedded fin;
Fig. 3 is according to disclosed technology, and expression has the radiating fin that is positioned at this top of cooling mechanism, at least two heat conduction supporting column that are positioned at cooling mechanism main body below and the structural representation that is positioned at the heat conduction projection at the cooling mechanism body back side;
Fig. 4 is according to disclosed technology, and expression heat conduction adhesive tape is coated on the back side of cooling mechanism main body to increase the schematic cross-section of radiating efficiency;
Fig. 5 is according to disclosed technology, and expression is positioned at the schematic cross-section of the ball grid array package structure on the printed circuit board (PCB);
Fig. 6 is according to disclosed technology, the rough schematic of second radiating subassembly in heat abstractor;
Fig. 7 is according to disclosed technology, illustrate heat conduction supporting column in the cooling mechanism main body penetrated printed circuit board (PCB) reserve at least two holes to the backboard of printed circuit board (PCB) to reach the rough schematic of fixing purpose; And
Fig. 8 is according to disclosed technology, by printed circuit board (PCB) heat is sent to down the rough schematic of stator to the cooling mechanism main body.
Embodiment
Some embodiments of the present invention can be described in detail as follows.Yet except describing in detail, the present invention can also be widely implements at other embodiment, and scope of the present invention do not limited, its with after claim be as the criterion.
The present invention is that the BGA Package for the embedded fin of tool modified form provides a kind of heat abstractor in order to reduce thermal resistance and to increase radiating efficiency.Fig. 3 to 7 be the explanation heat abstractor each structure, function with and interconnected relationship and Fig. 8 be that explanation is according to its heat radiation approach of disclosed heat abstractor.Fig. 3 illustrate in the heat abstractor the first radiating subassembly 1A its comprise and have second heat dissipation element 4, for example radiating fin is positioned at the top of first heat dissipation element 2, wherein first heat dissipation element 2 is the cooling mechanism main body of the first radiating subassembly 1A, and its second heat dissipation element 4 is for the area of dissipation that increases by first heat dissipation element 2 and promotes radiating efficiency simultaneously.In addition, the below that is positioned at first heat dissipation element 2 has at least two heat conduction supporting column 6 to be positioned at the printed circuit board (PCB) (as Fig. 5) of the BGA Package with the embedded fin of tool modified form and to connect second radiating subassembly (as Fig. 4) in order to connection.
Disclosed technology be characterised in that the first heat dissipation element 1A be by conductor material made and with the casting (casting) the mode moulding, its objective is in order to promote radiating efficiency.In addition, another feature of the present invention is that the heat conduction supporting column 6 that is positioned at first heat dissipation element, 2 belows replaces traditional function of only fixing with the radiating efficiency and the tool that promote the capacity of heat transmission and increase entire heat dissipation device as the plastic cement pillar of supporting role.
Further, equally with reference to Fig. 3, in preferred embodiment of the present invention, first heat dissipation element 2 also comprises the back side that a heat conduction projection 8 is positioned at first heat dissipation element 2.When can produce a large amount of heats when integrated circuit is being operated, the groove 12 (as shown in Figure 5) that heat conduction projection 8 is used for contacting the fin of the BGA Package top that is positioned at the embedded fin of tool modified form increases radiating efficiency.
In another preferred embodiment of the present invention, as shown in Figure 4, be that heat conduction adhesive tape (thermalconductive adhesive tape) 10 is coated on the back side of first heat dissipation element 2, and heat conduction adhesive tape 10 be coated on whole first heat dissipation element 2 the back side but except the part of heat conduction projection 8.This feature is because the hole that provides heat conduction supporting column to pass through is not provided on the printed circuit board (PCB), must by heat conduction adhesive tape 10 as with the usefulness of the BGA Package pressing mold compound surface engagement of the embedded fin of tool modified form, heat conduction projection 8 then is to embed in the groove 12 of the fin on the BGA Package of the embedded fin of tool modified form, and the top engages; Can also add conduction material (expression) in the drawings as between the two then thing.In addition, one of feature of the present invention be to be positioned at the heat conduction projection 8 at first heat dissipation element, 2 back sides can be with first heat dissipation element 2 simultaneously via casting integrated moulding or add to the back side of first heat dissipation element 2 outside after moulding.
With reference to Fig. 5; expression is positioned at the structure of the BGA Package of the embedded fin of tool modified form on the printed circuit board (PCB); its structure comprises the top that a substrate 20, one embedded fin 22 is positioned at substrate 20; wherein embedded fin 22 has a groove 24; this groove 24 can reduce the thickness after the pressing mold compound pressing mold; and in embedded fin 22, pressing mold compound 26 is arranged, have most tin balls 28 to be positioned at the below of substrate 20 in addition in order to connect printed circuit board (PCB) 12.Wherein the fin in the BGA Package is embedded fin 22 and has a groove 24 and be positioned at wafer (expression) in the drawings top in order to engaging heat conduction projection 8, and the thickness that can reduce pressing mold compound 26 is to increase heat-sinking capability.
In addition, having at least two holes 14 on printed circuit board (PCB) 12 passes in order to heat conduction supporting column to be provided; In another embodiment, when first heat dissipation element 2 does not have heat conduction supporting column 6, then can not need on the printed circuit board (PCB) 12 existence of hole 14 the heat conduction projection 8 on first heat dissipation element 2 can be engaged with groove 24, and also can see through conduction material both are engaged.
With reference to Fig. 6 is the second heat dissipation element group 1B of explanation in the heat abstractor, and its second heat dissipation element 1B is stator.The both sides of following stator 1B have at least two openings 34, in order to heat conduction supporting column 6 structures among the first radiating subassembly 1A, utilize the snib 36 of opening 34 tops to combine and fix with the flute 7 of heat conduction supporting column 6.In addition, following stator 1B intermediate projections partly 32 can contact with the backboard of printed circuit board (PCB) 12, be sent to heat conduction supporting column 6 with the convenient heat that printed circuit board (PCB) is loose by stator 1B down outward, by heat conduction supporting column 6 heat be sent to second heat dissipation element 4 with conduction pattern again and remove.The advantage of the method is the backboard heat radiation bad (particularly for printed circuit board (PCB) 12 below insufficient space poor heat radiation) of printed circuit board (PCB) 12 effective especially.No matter be that upwards transmission or transmission downwards can remove heat effectively therefore for the heat that produces.In addition, for traditional BGA Package or hot promotion formula BGA Package, only need remove heat conduction projection 8 can use this heat abstractor.
With reference to figure 7, be the heat conduction supporting column 6 of explanation in first heat dissipation element 2 penetrated printed circuit board (PCB) 12 at least two holes 14 of reserving to the backboard of printed circuit board (PCB) 12 to reach fixing purpose.Because the angle of Machine Design, heat conduction supporting column 6 must keep tolerance with the hole wall (not expression in the drawings) of hole 14 and can not contact.But purpose according to disclosed technology, be in order to improve the characteristic of heat radiation, therefore with ground plane (ground plane) the 12A conducting of hole 14 with printed circuit board (PCB) 12, after heat conduction supporting column 6 penetrated the hole 14 of printed circuit board (PCB) 12, conduction material 42 is filled to space between hole wall and the heat conduction supporting column 6, therefore can heat be conducted to air and heat is removed by ground plane 12A, heat conduction supporting column 6 and first heat dissipation element 2 of printed circuit board (PCB) 12; Or heat removed heat to air by BGA Package, fin 22, the second radiating subassembly 1B, heat conduction supporting column 6 and ground plane of printed circuit board 12A exclude.And this kind construction for heat radiating device has only not having following stator 1B under the structure of heat conduction supporting column 6 and spring 40 and stands good.
And one of feature of the present invention is that the following stator 1B with center protrusion part 32 and opening 34 is made by Heat Conduction Material, can increase the radiating efficiency of entire heat dissipation device.In addition, the second radiating subassembly 1B also comprises the heat conduction supporting column 6 that at least two springs 40 are enclosed within the hole 14 that penetrated on the printed circuit board (PCB) 12, in order to strain first heat dissipation element 2 and following stator 1B, makes heat conduction supporting column 6 and following stator 1B constitute transmission mechanism.
Then, Fig. 8 is the ball grid array package structure schematic cross-section that explanation has heat abstractor 1.When computer in when operation, its heat can be produced by wafer, therefore the heat that is produced must remove to reduce operating temperature to keep the stability of computation.Its heat can be removed by path 1, and its path 1 is that heat is upwards conducted to fin 22 on the BGA Package, and conducts to heat conduction projection 8, first heat dissipation element, 2 to second heat dissipation elements 4 and heat is removed.On the other hand, heat dissipation path 2 is that the heat that will conduct to the backboard of printed circuit board (PCB) 12 equally upwards is sent to the first radiating subassembly 1A via heat conduction supporting column 6, or heat conduction downwards conducted to down stator 1B via printed circuit board (PCB) hole (filling heat-conducting filler matter), and then conduct heat to ground plane of printed circuit board 12A, or be that its heat can be conducted to down the part 32 of stator 1B center protrusion by the backboard of printed circuit board (PCB) 12, and then it is outwards lost with heat to conduct heat to ground plane of printed circuit board 12A.
Though the present invention describes with reference to current specific embodiment, but those of ordinary skill in the art will be appreciated that, above embodiment is used for illustrating the present invention, under the situation that does not break away from spirit of the present invention, also can make the variation and the modification of various equivalences, therefore, as long as variation, the modification to the foregoing description all will drop in the scope of claims of the present invention in connotation scope of the present invention.
Claims (10)
1. heat abstractor that is used to have the BGA Package of modified form internal embedded fin, the heat abstractor that is used to have the BGA Package of the embedded fin of modified form comprises:
Second heat dissipation element that first radiating subassembly, this first radiating subassembly comprise first heat dissipation element and be positioned at this first heat dissipation element top;
Printed circuit board (PCB) with a BGA Package; And
Second radiating subassembly, this second radiating subassembly has center protrusion part and at least two openings in both sides, and wherein this first radiating subassembly is positioned at the top of this printed circuit board (PCB) with this BGA Package and the below that this second radiating subassembly is positioned at this printed circuit board (PCB) with this BGA Package.
2. the heat abstractor that is used to have the BGA Package of the embedded fin of modified form as claimed in claim 1 is characterized in that a heat conduction projection is positioned at the back side of this first heat dissipation element.
3. the heat abstractor that is used to have the BGA Package of the embedded fin of modified form as claimed in claim 1 is characterized in that a heat conduction adhesive tape is positioned at the back side of this first heat dissipation element.
4. the heat abstractor that is used to have the BGA Package of the embedded fin of modified form as claimed in claim 1, it is characterized in that, also comprise a conduction material, this conduction material between this first heat dissipation element and this BGA Package in order to be connected this first heat dissipation element and this BGA Package.
5. heat abstractor that is used to have the BGA Package of the embedded fin of modified form is used to have the heat abstractor of the BGA Package of the embedded fin of modified form, comprises:
One first radiating subassembly, this radiating subassembly comprise first heat dissipation element with a heat conduction adhesive tape, wherein this heat conduction adhesive tape second heat dissipation element of being positioned at the dorsal part of this first heat dissipation element and being positioned at this first heat dissipation element top;
Printed circuit board (PCB) with a BGA Package, wherein this BGA Package comprises an embedded fin of groove; And
One heat conduction projection, this heat conduction projection is embedded in this groove of this BGA Package, wherein this first radiating subassembly is positioned at the top of this printed circuit board (PCB) with this BGA Package, and this heat conduction projection that is positioned at this groove of this BGA Package engages with the back side of this first heat dissipation element.
6. the heat abstractor that is used to have the BGA Package of the embedded fin of modified form as claimed in claim 5 is characterized in that also comprise a conduction material, this conduction material is between this first heat dissipation element and this BGA Package.
7. the heat abstractor that is used to have the BGA Package of the embedded fin of modified form as claimed in claim 5 is characterized in that also comprise second radiating subassembly, this second radiating subassembly is positioned at the below of this printed circuit board (PCB) with this BGA Package.
8. the heat abstractor of a BGA Package, this heat abstractor comprises:
First radiating subassembly, this first radiating subassembly comprise integrated have first heat dissipation element of a heat conduction projection, at least two heat conduction supporting column that are positioned at second heat dissipation element of this first heat dissipation element top and are positioned at this first heat dissipation element below;
Printed circuit board (PCB) with a BGA Package, wherein this printed circuit board (PCB) has at least two holes; And
Second radiating subassembly, this second radiating subassembly has a center protrusion partly and the opening that is positioned at both sides, and wherein this first radiating subassembly these at least two holes of utilizing these at least two heat conduction supporting column to pass this printed circuit board (PCB) engage with this opening that is positioned at the second radiating subassembly both sides.
9. the heat abstractor of BGA Package as claimed in claim 8, its feature in, also comprise a conduction material, this conduction material is filled at least two heat conduction supporting column of these at least two holes and this is engaged.
10. the heat abstractor of BGA Package as claimed in claim 8 is characterized in that, also comprises at least two springs, and these at least two springs are enclosed within respectively on these two heat conduction supporting column at least.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2003101225606A CN100362654C (en) | 2003-12-12 | 2003-12-12 | Ball format array structure possessing heat sinks |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2003101225606A CN100362654C (en) | 2003-12-12 | 2003-12-12 | Ball format array structure possessing heat sinks |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1627507A CN1627507A (en) | 2005-06-15 |
| CN100362654C true CN100362654C (en) | 2008-01-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2003101225606A Expired - Fee Related CN100362654C (en) | 2003-12-12 | 2003-12-12 | Ball format array structure possessing heat sinks |
Country Status (1)
| Country | Link |
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| CN (1) | CN100362654C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5017977B2 (en) * | 2006-09-14 | 2012-09-05 | 富士通セミコンダクター株式会社 | Semiconductor device and manufacturing method thereof |
| US20080080142A1 (en) * | 2006-09-28 | 2008-04-03 | Mediatek Inc. | Electronic devices with enhanced heat spreading |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07302865A (en) * | 1994-04-28 | 1995-11-14 | Sony Corp | Heat radiation method and heat radiator for chip package such as semiconductor ic, etc. |
| US5710459A (en) * | 1995-05-12 | 1998-01-20 | Industrial Technology Research Institute | Integrated circuit package provided with multiple heat-conducting paths for enhancing heat dissipation and wrapping around cap for improving integrity and reliability |
| US5990550A (en) * | 1997-03-28 | 1999-11-23 | Nec Corporation | Integrated circuit device cooling structure |
-
2003
- 2003-12-12 CN CNB2003101225606A patent/CN100362654C/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07302865A (en) * | 1994-04-28 | 1995-11-14 | Sony Corp | Heat radiation method and heat radiator for chip package such as semiconductor ic, etc. |
| US5710459A (en) * | 1995-05-12 | 1998-01-20 | Industrial Technology Research Institute | Integrated circuit package provided with multiple heat-conducting paths for enhancing heat dissipation and wrapping around cap for improving integrity and reliability |
| US5990550A (en) * | 1997-03-28 | 1999-11-23 | Nec Corporation | Integrated circuit device cooling structure |
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| Publication number | Publication date |
|---|---|
| CN1627507A (en) | 2005-06-15 |
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Granted publication date: 20080116 Termination date: 20100112 |