CN212517204U - 双面芯片 - Google Patents
双面芯片 Download PDFInfo
- Publication number
- CN212517204U CN212517204U CN202021623389.2U CN202021623389U CN212517204U CN 212517204 U CN212517204 U CN 212517204U CN 202021623389 U CN202021623389 U CN 202021623389U CN 212517204 U CN212517204 U CN 212517204U
- Authority
- CN
- China
- Prior art keywords
- layer
- functional circuit
- chip
- circuit
- double
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Semiconductor Integrated Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202021623389.2U CN212517204U (zh) | 2020-08-06 | 2020-08-06 | 双面芯片 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202021623389.2U CN212517204U (zh) | 2020-08-06 | 2020-08-06 | 双面芯片 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN212517204U true CN212517204U (zh) | 2021-02-09 |
Family
ID=74383739
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202021623389.2U Active CN212517204U (zh) | 2020-08-06 | 2020-08-06 | 双面芯片 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN212517204U (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111769110A (zh) * | 2020-08-06 | 2020-10-13 | 谭小春 | 双面芯片 |
-
2020
- 2020-08-06 CN CN202021623389.2U patent/CN212517204U/zh active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111769110A (zh) * | 2020-08-06 | 2020-10-13 | 谭小春 | 双面芯片 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4751351B2 (ja) | 半導体装置とそれを用いた半導体モジュール | |
US4038488A (en) | Multilayer ceramic multi-chip, dual in-line packaging assembly | |
JP2603636B2 (ja) | 半導体装置 | |
CN206282838U (zh) | 无源器件与有源器件的集成封装结构 | |
EP0304263A2 (en) | Semiconductor chip assembly | |
KR20110054348A (ko) | 전자소자 내장형 인쇄회로기판 및 그 제조방법 | |
KR20090043896A (ko) | 칩 적층 패키지 | |
CN105762117A (zh) | 一种ltcc基板的交错层叠三维封装结构 | |
KR960706193A (ko) | 전도성 트레이스와 리드 프레임 리드를 결합하는 고밀도 집적회로 조립체(a high density integrated circuit assembly combining leadframe leads with conductive traces) | |
CN112259507A (zh) | 一种异质集成的系统级封装结构及封装方法 | |
CN212517204U (zh) | 双面芯片 | |
KR100621547B1 (ko) | 멀티칩 패키지 | |
US8736075B2 (en) | Semiconductor chip module, semiconductor package having the same and package module | |
US20210225734A1 (en) | Electronic module including a semiconductor package connected to a fluid heatsink | |
KR20040059746A (ko) | 사이드 브레이즈 패키지 | |
CN205723497U (zh) | 一种ltcc基板的交错层叠三维封装结构 | |
CN106449612A (zh) | 存储器芯片堆叠封装结构 | |
CN110060993A (zh) | 多层芯片架构及连接方法 | |
KR100673379B1 (ko) | 적층 패키지와 그 제조 방법 | |
CN111769110A (zh) | 双面芯片 | |
CN105390477B (zh) | 一种多芯片3d二次封装半导体器件及其封装方法 | |
KR20010073345A (ko) | 적층 패키지 | |
KR20030028127A (ko) | 반도체 전력용 모듈 및 그 제조방법 | |
JP2581532B2 (ja) | 半導体装置 | |
JP4083376B2 (ja) | 半導体モジュール |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20210220 Address after: No.33 lujiazhai, yangjiaxiang village, Huacao Town, Minhang District, Shanghai 201100 Patentee after: Lu Peiliang Address before: 230088 room 190, building H2, phase II, innovation industrial park, 2800 innovation Avenue, high tech Zone, Hefei City, Anhui Province Patentee before: HEFEI ZUAN INVESTMENT PARTNERSHIP ENTERPRISE |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20210408 Address after: No.6, Lianhui street, Xixing street, Binjiang District, Hangzhou City, Zhejiang Province Patentee after: Silergy Semiconductor Technology (Hangzhou) Ltd. Address before: No.33 lujiazhai, yangjiaxiang village, Huacao Town, Minhang District, Shanghai 201100 Patentee before: Lu Peiliang |