CN212316234U - Twin rotary sputtering cathode device capable of timely adjusting angle of magnetic field - Google Patents
Twin rotary sputtering cathode device capable of timely adjusting angle of magnetic field Download PDFInfo
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- CN212316234U CN212316234U CN202021643957.5U CN202021643957U CN212316234U CN 212316234 U CN212316234 U CN 212316234U CN 202021643957 U CN202021643957 U CN 202021643957U CN 212316234 U CN212316234 U CN 212316234U
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Abstract
The utility model belongs to the technical field of the film preparation technique and specifically relates to a but twin rotation sputtering cathode device of in good time adjustment magnetic field angle, its characterized in that: including outside rotatory cathode means and inside rotatory bar magnet device, wherein inside rotatory bar magnet device include the bar magnet and with the bar magnet rotation control device that the bar magnet is independent to be connected, bar magnet rotation control device connects the drive the bar magnet is rotatory, outside rotatory cathode means including the cover establish bar magnet outlying target pipe and with the target pipe rotation control device that the target pipe is connected, target pipe rotation control device connects the drive the target pipe is rotatory. The utility model has the advantages that: 1) the rotation of the magnetic bar is added in the rotary cathode structure, so that the protection of the target material and the control of the film forming uniformity are realized; 2) the film forming process becomes more flexible; 3) the problem of uniform deposition of the film layer of the workpiece with curvature in the direction parallel to the cathode is effectively solved; 4) the problem of pre-sputtering is effectively solved.
Description
Technical Field
The utility model belongs to the technical field of the film preparation technique and specifically relates to a twin rotating sputtering cathode device capable of adjusting the angle of a magnetic field in due time.
Background
Improving the uniformity of film formation on workpieces has been a pursuit goal in the film production process. The increasing demand for film formation on some non-flat-plate type workpieces in the market makes it difficult for a conventional magnetron sputtering device to meet some refinement requirements of a film formation process.
For the traditional twin magnetron sputtering rotating cathode, two structures are adopted at present. One is that in the normal process, the fixed angle of the magnetic bar is not changed, and the outer target tube rotates. The circumferential sputtering of the target material is achieved by the rotation of the outer target tube and the direction of the sputtered particles is directional. In the other process, the magnetic bar rotates and the outer target tube does not move. Sputtering of the target tube material is achieved by the circumferential rotation of the magnetic field of the magnetic bar, the direction of the sputtered particles being all-directional, and film deposition is achieved by this type of film forming apparatus mainly by means of rotation of the workpiece around the cathode. The first mode is that the direction of sputtered particles is fixed due to the fixation of a magnetic field, and the uniform deposition of a film layer is difficult to realize for a workpiece which rotates or moves in parallel, especially for a workpiece with curvature in a direction parallel to a cathode. In some special coating equipment, vacuum breaking is performed in each furnace, after the vacuum breaking, a target material which is sensitive to water vapor or oxygen in the atmosphere is polluted or oxidized, and a pre-sputtering operation needs to be performed on the target material before the next furnace process is performed, so that the normal performance of the target material is recovered. The traditional twin magnetron sputtering device is additionally provided with a rotatable shield or an openable shield in front of the sputtering device, and the structure easily causes the problem that the shield is blocked or particles are generated due to temperature rise and film adhesion.
Disclosure of Invention
The utility model aims at providing a but twin rotation sputtering cathode device of in good time adjustment magnetic field angle according to above-mentioned prior art is not enough, through can be respectively the rotatory bar magnet of independent control and target pipe, solve the even deposit problem and the sputtering problem in advance to being on a parallel with the rete of the work piece that the negative pole direction has the curvature.
The utility model discloses the purpose is realized accomplishing by following technical scheme:
a twin rotary sputtering cathode device capable of timely adjusting the angle of a magnetic field is characterized in that: including outside rotatory cathode means and inside rotatory bar magnet device, wherein inside rotatory bar magnet device include the bar magnet and with the bar magnet rotation control device that the bar magnet is independent to be connected, bar magnet rotation control device connects the drive the bar magnet is rotatory, outside rotatory cathode means including the cover establish bar magnet outlying target pipe and with the target pipe rotation control device that the target pipe is connected, target pipe rotation control device connects the drive the target pipe is rotatory.
Still include cathode mounting flange, outside rotatory cathode means with the one end of inside rotatory bar magnet device all with cathode mounting flange installs fixedly mutually to constitute the fixed bayonet structure of single-ended that is located the atmosphere side.
The magnetic bar rotation control device is a magnetic bar motor arranged on the atmosphere side, and the magnetic bar motor and the magnetic bar form transmission fit and are connected to drive the magnetic bar to rotate.
The target tube rotation control device comprises a target tube motor arranged on the atmosphere side, and the target tube motor and the target tube form transmission fit and are connected to drive the target tube to rotate.
The magnetic rod rotation control device further comprises a magnetic rod positioning sensor, wherein the magnetic rod positioning sensor is used for measuring the rotation position state of the magnetic rod and feeding back the measurement result to the magnetic rod rotation control device through data interaction, so that the rotation state control of the magnetic rod is realized.
The device also comprises an electric brush which is electrically communicated with the target tube.
The magnetic rod cooling device further comprises a cooling water pipeline and a sealing structure thereof, and the cooling water pipeline is used for cooling the magnetic rod.
The utility model has the advantages that: 1) the rotation of the magnetic bar is added in the rotary cathode structure, so that the protection of the target material and the control of the film forming uniformity are realized; 2) the film forming process becomes more flexible; 3) the problem of uniform deposition of the film layer of the workpiece with curvature in the direction parallel to the cathode is effectively solved; 4) the problem of pre-sputtering is effectively solved.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural diagram of a pre-sputtering system in a pre-sputtering state according to the present invention;
FIG. 3 is a schematic diagram of the pre-sputtering system of FIG. 2 in a normal process state;
FIG. 4 is a flow chart of the present invention applied to a film forming process of a workpiece having curvature parallel to the cathode direction.
Detailed Description
The features of the present invention and other related features are described in further detail below by way of example in conjunction with the accompanying drawings to facilitate understanding by those skilled in the art:
as shown in fig. 1-4, reference numerals 1-20 in the drawings denote: the device comprises a cathode mounting flange 1, a target pipe 2, a gear 3, a target pipe motor 4, a magnetic rod 5, a magnetic rod motor 6, an electric brush 7, a water inlet sealing structure 8, a water outlet sealing structure 9, a magnetic rod positioning sensor 10, a magnetic rod motor mounting flange 11, a vacuum cavity gate 12, a vacuum cavity body 13, a mounting system 14, a process gas system 15, a baffle 16, a vacuum cavity 17, a left magnetic rod 18, a right magnetic rod 19 and a curved surface workpiece 20.
Example (b): as shown in fig. 1, the twin rotary sputtering cathode device capable of timely adjusting the angle of the magnetic field in the embodiment includes an external rotary cathode device, an internal rotary magnetic rod device, and a cathode mounting flange 1, wherein one end of the external rotary cathode device and one end of the internal rotary magnetic rod device are both fixed to the cathode mounting flange 1, and the cathode mounting flange 1 can be mounted on one side of a vacuum cavity of a vacuum coating chamber to form a single-end fixed plug-in structure located on an atmospheric side, thereby realizing power introduction from the atmospheric side to the vacuum side, and facilitating installation and later maintenance.
As shown in fig. 1, the internal rotating magnetic rod device includes a magnetic rod 5 and a magnetic rod motor 6, which are directly connected through an insulating coupling as a transmission member and located at the top of the whole device. Wherein, the magnetic rod motor 6 positioned at the atmosphere side can drive the magnetic rod 5 positioned at the vacuum side to axially rotate through the insulation coupling.
The magnetic rod motor 6 is fixedly connected with the cathode mounting flange 1 through a magnetic rod motor mounting flange 11. A magnetic rod positioning sensor 10 is installed inside the magnetic rod motor mounting flange 11, and the magnetic rod positioning sensor 10 is used for measuring the rotation state of the positioning magnetic rod 5. The measurement data of the magnetic bar positioning sensor 10 can be acquired through a servo controller and a related PLC control system, the controller or the control system controls the magnetic bar motor 6, and the magnetic bar 5 is subjected to origin point returning operation, so that the accuracy of rotation or positioning of the magnetic bar 5 is ensured; meanwhile, the rotation angle of the magnetic rod 5 can be accurately controlled through the positioning of the magnetic rod positioning sensor 10, so that the sputtering direction is accurately controlled, and the film forming quality is improved.
And a cooling water pipeline is arranged on one side of the magnetic rod 5, and cooling water is used for circulating in the cooling water pipeline so as to take away energy generated by sputtering of the target material, thereby ensuring that the working temperature of the magnetic rod 5 meets the technological requirements. The cooling water inlet and outlet of the cooling water pipeline are both arranged at the atmosphere side of the cathode mounting flange 1. A water inlet sealing structure 8 is arranged at the position of a cooling water inlet, and a water outlet sealing structure 9 is arranged at the position of a cooling water outlet; and cooling water enters the inside of the internal rotating magnetic rod device at the vacuum side from the atmosphere side through a cooling water inlet at the position of the water inlet sealing structure 8 and then flows out through a cooling outlet at the position of the water outlet sealing structure 9, so that cooling is realized. At the moment, the sealing performance of the cooling water pipeline is guaranteed through the two sealing structures, and the cooling effect of the cooling water is further guaranteed.
As shown in fig. 1, the external rotary magnetic rod device includes a target tube 2 and a target tube motor 4, which are engaged with each other through a gear 3 to form a driving engagement, so that the target tube motor 4 located on the atmosphere side can drive the target tube 2 located on the vacuum side to rotate.
Based on this, the target tube 2 and the magnetic rod 5 in this embodiment are both driven to rotate by independently connected motors.
As shown in fig. 1, a brush 7 is installed at the atmospheric side of the cathode mounting flange 1, which is connected to a medium frequency power source to conduct electricity to the target tube 2 located at the vacuum side, thereby implementing a sputter coating process.
As shown in fig. 2 and 3, the present embodiment, when applied, can be applied to a pre-sputtering system of a target tube.
As shown in fig. 2 or fig. 3, the pre-sputtering system includes a vacuum chamber body 13, and a film forming space is formed inside the vacuum chamber body. A mounting system 14 is provided inside the vacuum chamber body 13, and the mounting system 14 is used for mounting a workpiece as a product. In some embodiments, the mounting system 14 can rotate inside the vacuum chamber 13 by providing a central rotation driving mechanism at the center thereof to ensure the uniformity of film formation on the workpiece. A vacuum chamber gate 12 which can be opened and closed is arranged on one side of the vacuum chamber body 13, and a film forming space in the vacuum chamber body 1 can be opened or closed by opening and closing the vacuum chamber gate 12, so as to meet necessary process requirements, such as: loading and unloading of workpieces on the mounting system 14, adjustment and replacement of the magnetic rod 5 and the target tube 2 and the like. A process gas system 15 is provided at one side of the vacuum chamber body 13, and the process gas system 15 is used to input process gas used in the sputtering film forming process into the inside of the vacuum chamber body 13.
As shown in fig. 2, the pre-sputtering system needs to enter a pre-sputtering state before performing the film-forming process, that is, the contaminated part of the surface of the target material is sputtered out in a pre-sputtering manner, so as to recover the performance of the target material and meet the requirements of the film-forming process. During pre-sputtering, the magnetic rod 5 is rotated by the magnetic rod motor 6, so that the magnetic rod 5 faces away from the mounting system 3, at the moment, the magnet on the magnetic rod 5 rotates 180 degrees, the sputtering direction faces to the baffle 7, and the sputtered target material is deposited on the baffle 7 on the cathode back plate, so that sputtering to other positions in the vacuum cavity body 13 is avoided. After the magnetic bar 5 is rotated, the target tube 5 is cleaned at the same time to ensure the quality of the film forming process.
As shown in fig. 3, after the pre-sputtering is completed, the magnetic rod 5 is rotated by 180 ° again under the driving of the magnetic rod motor 6, and is restored to the normal film coating position, at this time, the magnet on the magnetic rod 5 directs the sputtering direction to the mounting system 3 loaded with the workpiece, and then the normal film forming process can be performed.
As shown in fig. 4, this embodiment can be applied to solve the problem of uniform deposition of a film on a workpiece having a curvature parallel to the cathode direction.
As shown in fig. 4, the film forming system includes a vacuum chamber 17, and the curved workpiece 20 is a workpiece to be formed in the vacuum chamber 17, and has a curvature at both end portions. The displacement path of the curved workpiece 20 in the vacuum chamber 17 is parallel to the cathode device in this embodiment. The cathode device comprises a left magnetic rod 18 and a right magnetic rod 19, and the left magnetic rod 18 and the right magnetic rod 19 can rotate under the driving of a magnetic rod motor which is independently connected with the left magnetic rod 18 and the right magnetic rod 19. When the curved surface workpiece 20 passes through, the angles of the left magnetic rod 18 and the right magnetic rod 19 are timely adjusted according to the walking position of the curved surface workpiece 20 (from left to right as shown in fig. 4), so as to control the included angle between the magnetic rod 5 and the curvature part, thereby controlling the film deposition thickness of the curved part of the curved surface workpiece 20, enabling the film deposition thickness of the curved area and the flat area to be consistent, and remarkably improving the film forming quality.
In the specific implementation of the two embodiments, the magnetic rod 5 can be measured and positioned by the magnetic rod positioning sensor 10, so that the rotation state of the magnetic rod 5 can be accurately controlled, and the film forming effect can be improved.
Although the conception and the embodiments of the present invention have been described in detail with reference to the drawings, those skilled in the art will recognize that various changes and modifications can be made therein without departing from the scope of the appended claims, and therefore, the description thereof is not repeated herein.
Claims (7)
1. A twin rotary sputtering cathode device capable of timely adjusting the angle of a magnetic field is characterized in that: including outside rotatory cathode means and inside rotatory bar magnet device, wherein inside rotatory bar magnet device include the bar magnet and with the bar magnet rotation control device that the bar magnet is independent to be connected, bar magnet rotation control device connects the drive the bar magnet is rotatory, outside rotatory cathode means including the cover establish bar magnet outlying target pipe and with the target pipe rotation control device that the target pipe is connected, target pipe rotation control device connects the drive the target pipe is rotatory.
2. The twin rotary sputtering cathode device capable of timely adjusting the angle of the magnetic field according to claim 1, wherein: still include cathode mounting flange, outside rotatory cathode means with the one end of inside rotatory bar magnet device all with the cathode mounting flange installation is fixed to constitute the fixed bayonet structure of single-ended that is located the atmosphere side.
3. The twin rotary sputtering cathode device capable of timely adjusting the angle of the magnetic field according to claim 1, wherein: the magnetic bar rotation control device is a magnetic bar motor arranged on the atmosphere side, and the magnetic bar motor and the magnetic bar form transmission fit and are connected to drive the magnetic bar to rotate.
4. The twin rotary sputtering cathode device capable of timely adjusting the angle of the magnetic field according to claim 1, wherein: the target tube rotation control device comprises a target tube motor arranged on the atmosphere side, and the target tube motor and the target tube form transmission fit and are connected to drive the target tube to rotate.
5. The twin rotary sputtering cathode device capable of timely adjusting the angle of the magnetic field according to claim 1, wherein: the magnetic rod rotation control device further comprises a magnetic rod positioning sensor, wherein the magnetic rod positioning sensor is used for measuring the rotation position state of the magnetic rod and feeding back the measurement result to the magnetic rod rotation control device through data interaction, so that the rotation state control of the magnetic rod is realized.
6. The twin rotary sputtering cathode device capable of timely adjusting the angle of the magnetic field according to claim 1, wherein: the device also comprises an electric brush which is electrically communicated with the target tube.
7. The twin rotary sputtering cathode device capable of timely adjusting the angle of the magnetic field according to claim 1, wherein: the magnetic rod cooling device further comprises a cooling water pipeline and a sealing structure thereof, and the cooling water pipeline is used for cooling the magnetic rod.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202021643957.5U CN212316234U (en) | 2020-08-10 | 2020-08-10 | Twin rotary sputtering cathode device capable of timely adjusting angle of magnetic field |
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| CN202021643957.5U CN212316234U (en) | 2020-08-10 | 2020-08-10 | Twin rotary sputtering cathode device capable of timely adjusting angle of magnetic field |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111733394A (en) * | 2020-08-10 | 2020-10-02 | 光驰科技(上海)有限公司 | Twin rotary sputtering cathode device capable of timely adjusting angle of magnetic field |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111733394A (en) * | 2020-08-10 | 2020-10-02 | 光驰科技(上海)有限公司 | Twin rotary sputtering cathode device capable of timely adjusting angle of magnetic field |
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