CN212209513U - Flexible polymer film support substrate structure with conductive capability - Google Patents

Flexible polymer film support substrate structure with conductive capability Download PDF

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Publication number
CN212209513U
CN212209513U CN202020555601.XU CN202020555601U CN212209513U CN 212209513 U CN212209513 U CN 212209513U CN 202020555601 U CN202020555601 U CN 202020555601U CN 212209513 U CN212209513 U CN 212209513U
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polymer film
flexible polymer
layer
film layer
conductive
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王钢
张露
费泽元
李健
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Sun Yat Sen University
National Sun Yat Sen University
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National Sun Yat Sen University
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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Abstract

The utility model discloses a flexible polymer film supporting substrate structure with conductive capability, which comprises a flexible polymer film layer, a conductive glue layer, a back ohmic contact layer, a battery function film layer, a front ohmic contact layer and a passivation film layer which are arranged in sequence; the flexible polymer film layer comprises conductive grid lines and lead wires, the conductive grid lines are in a grid shape and are uniformly distributed on the surface of the flexible polymer film layer, and the lead wires are connected with the edges of the conductive grid lines and lead out a lead wire contact. The utility model discloses a flexible polymer film is as supporting the basement, through the direct grid line pin connection with battery function thin layer and flexible polymer film of conductive glue to draw forth the lead contact so that follow-up cluster and parallel assembly, the utility model discloses complicated etching trompil technology can be avoided to the structure, helps the big application in batches of industrialization.

Description

Flexible polymer film support substrate structure with conductive capability
Technical Field
The utility model belongs to the technical field of semiconductor chip, concretely relates to flexible polymer film support basement structure as have conductivity.
Background
With the development and utilization of high-precision monitoring technology in reconnaissance or military striking and the like in China, the market of the space solar cell is continuously enlarged, the demand rises year by year, and the promotion of the rapid development of aerospace equipment has great strategic significance on national economic development and national defense safety. The fixed wing unmanned high-altitude aircraft has multiple tasks such as reconnaissance and attack in a future battlefield, and the flight performance of the fixed wing unmanned high-altitude aircraft is very important. NASA and aerovision corporation developed and planned mass production in recent years for the U.S. military, small unmanned fixed-wing aircraft for battlefield intelligence gathering and military surveillance. However, the ultimate specific power of Si solar cells cannot meet the requirements of high-speed and high-performance military aircraft, and GaAs-based solar cell technology is gradually adopted by the military of various countries in recent years.
The purpose of the solar cell project is to provide a long-term and stable power source for manned or unmanned reconnaissance and monitoring of the airplane. The solar cell of the military aircraft must be light, efficient and good in stability, and the flexible cell has the optimal power-weight ratio, namely the GaAs-based multi-junction flexible cell of the cell with unit weight can provide higher photoelectric conversion efficiency, and is very suitable for the light and efficient use requirement of space equipment. In addition, the GaAs solar cell is resistant to cosmic ray irradiation, has excellent temperature coefficient and good low-light performance, and is very suitable for being integrated on the wings of an airplane to be used in a severe environment. The GaAs flexible cell is currently the flexible cell with the highest photoelectric conversion efficiency, and the flexible cell based on the Cu thin film has been commercially produced and used. The conversion efficiency of the flexible GaAs single-junction battery of the Alta Devices reaches 28.8% under AM1.5G. The efficiency of the flexible InGaP/GaAs/InGaAs three-junction cell of the MicroLink reaches 37.75 percent. The light polymer film is adopted to replace a Cu film, so that the weight of the flexible battery can be further reduced, the power-weight ratio of the battery is improved, and the carrying and endurance capacities of the fixed-wing unmanned high-altitude aircraft are enhanced.
The existing structural design is to apply or spin-coat a polymer film on a battery functional film, take stress provided by the polymer film as driving force, transfer the battery functional film to the polymer film by adopting a chemical solvent corrosion method, and prepare an ohmic contact electrode on the battery functional film by adopting an etching and hole-opening method. However, the introduced etching, opening and routing leads to an increase in process complexity, and in addition, the polymer film cannot withstand high temperature, which leads to limitation in selection of a back ohmic contact metal system, and is not favorable for large-scale industrial application and popularization.
SUMMERY OF THE UTILITY MODEL
In order to solve the deficiencies of the prior art, the present invention provides a flexible polymer film supporting substrate structure with conductive capability, which comprises a polymer film containing conductive grid lines and leads, and eliminates the conventional etching and routing operations after peeling the polymer film.
In order to realize the purpose of the utility model, the utility model adopts the following technical scheme:
a flexible polymeric film support substrate structure having electrical conductivity comprising the structure:
a flexible polymer film layer;
the conductive glue layer is arranged on the flexible polymer film layer;
the back ohmic contact layer is arranged on the conductive glue layer;
the battery function thin film layer is arranged on the back ohmic contact layer;
the positive ohmic contact layer is arranged on the battery function film layer;
the passivation film layer is arranged on the front ohmic contact layer;
the flexible polymer film layer comprises conductive grid lines and lead wires, the conductive grid lines are in a grid shape and are uniformly distributed on the surface of the flexible polymer film layer, and the lead wires are connected with the edges of the conductive grid lines and lead out a lead wire contact.
The utility model discloses when the structural design, flexible polymer thin layer includes electrically conductive grid line and lead wire to draw forth a lead wire contact. The battery function thin film layer forms a good back ohmic contact layer, and then one side, containing the conductive grid line, of the flexible polymer thin film is attached to the back ohmic contact layer through conductive glue, so that the conductive grid line and the battery function thin film layer form good contact. And finally, depositing a front ohmic contact layer and a passivation film layer on the battery function film layer. In addition, the lead contacts led out by the leads can facilitate series-parallel connection between the batteries.
Preferably, the battery function thin film layer is a single-junction or multi-junction battery formed by combining one or more of GaAs, InAs, InP, GaP and AlP.
Preferably, the conductive grid line and the lead are printed on the flexible polymer thin film layer, and the conductive grid line is made of one of Cu, Al, Ag and Au.
Specifically, the lead is made of one of Cu, Al, Ag and Au.
Specifically, the conductive glue layer is one of epoxy resin, phenolic resin, polyimide and polyurethane polymer.
Preferably, the back ohmic contact layer is Ti/Pt/Au, Ti/Au or Pd/Au. The front ohmic contact layer is Ti/Au.
The passivation film layer is SiO2Or SiN.
The utility model provides an above-mentioned preparation technology as flexible polymer film support basement structure that has electrically conductive ability, including following step:
s1, sequentially depositing a sacrificial layer/barrier layer and a battery function thin film layer on a substrate;
s2, depositing back ohmic contact metal on the battery function thin film layer and annealing;
s3, coating conductive glue on the back ohmic contact metal;
s4, adhering a flexible polymer film layer on the conductive adhesive water to serve as a supporting substrate;
s5, removing the sacrificial layer/barrier layer on the substrate by adopting a chemical corrosion method, and transferring the battery function thin film layer to the flexible polymer thin film layer;
s6, preparing a front ohmic contact layer on the battery function thin film layer, annealing, passivating the film layer and cutting.
The utility model also provides a chip that flexible polymer film support basement structure preparation obtained as have conductivity ability.
Compared with the prior art, the beneficial effects of the utility model are that:
the prior art structure mainly adopts an insulating polymer film as a flexible supporting substrate, and processes such as photoetching, hole opening, metal filling and the like need to be carried out on the insulating polymer film. Compared with the prior art, the utility model discloses a flexible polymer film is as supporting the basement, directly connects battery function thin layer and flexible polymer film's grid line through electrically conductive glue to draw forth the lead wire contact so that follow-up cluster is parallelly connected and is assembled, the utility model discloses complicated etching trompil technology can be avoided to the structure, helps the big batch application of industrialization.
Drawings
Fig. 1 is a schematic structural diagram of the present invention;
fig. 2 is a schematic view of the structure of the flexible polymer film layer of the present invention.
The technical characteristics corresponding to the marks in the attached drawings are as follows: the solar cell comprises a flexible polymer film layer 1, a conductive glue layer 2, a back ohmic contact layer 3, a battery function film layer 4, a front ohmic contact layer 5 and a passivation film layer 6.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail with reference to the accompanying drawings and embodiments, but the scope of the present invention is not limited to the following specific embodiments.
As shown in fig. 1, a flexible polymer film support substrate structure as having a conductive capability includes:
a flexible polymer film layer 1;
the conductive glue layer 2 is arranged on the flexible polymer film layer;
the back ohmic contact layer 3 is arranged on the conductive glue layer;
the battery function thin film layer 4 is arranged on the back ohmic contact layer;
the front ohmic contact layer 5 is arranged on the battery function film layer;
and the passivation film layer 6 is arranged on the front ohmic contact layer.
As shown in fig. 2, the flexible polymer film layer 1 includes conductive gate lines and leads, the conductive gate lines are in a grid shape and are uniformly distributed on the surface of the flexible polymer film layer, and the leads are connected to the edges of the conductive gate lines and lead out a lead contact.
The utility model discloses when the structural design, flexible polymer thin layer includes electrically conductive grid line and lead wire to draw forth a lead wire contact. The battery function thin film layer forms a good back ohmic contact layer, and then one side, containing the conductive grid line, of the flexible polymer thin film is attached to the back ohmic contact layer through conductive glue, so that the conductive grid line and the battery function thin film layer form good contact. And finally, depositing a front ohmic contact layer and a passivation film layer on the battery function film layer. In addition, the lead contacts led out by the leads can facilitate series-parallel connection between the batteries.
Specifically, the battery function thin film layer is a single-junction or multi-junction battery formed by combining one or more of GaAs, InAs, InP, GaP and AlP. The passivation film layer is SiO2Or SiN.
Specifically, the conductive grid line and the lead are printed on the flexible polymer thin film layer, and the conductive grid line is made of one of Cu, Al, Ag and Au. The lead is made of one of Cu, Al, Ag and Au.
Specifically, the conductive glue layer is one of epoxy resin, phenolic resin, polyimide and polyurethane polymer.
Specifically, the back ohmic contact layer is Ti/Pt/Au, Ti/Au or Pd/Au. The front ohmic contact layer is Ti/Au.
The above description is only an embodiment of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions within the technical scope of the present disclosure should be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims, and the modifications and changes of the above embodiments can be made by those skilled in the art in light of the disclosure and guidance of the above description. Therefore, the present invention is not limited to the specific embodiments disclosed and described above, and some modifications and changes to the present invention should fall within the protection scope of the claims of the present invention. In addition, although specific terms are used in the specification, the terms are used for convenience of description and do not limit the utility model in any way.

Claims (7)

1. A flexible polymeric film support substrate structure having electrical conductivity comprising the structure:
a flexible polymer film layer;
the conductive glue layer is arranged on the flexible polymer film layer;
the back ohmic contact layer is arranged on the conductive glue layer;
the battery function thin film layer is arranged on the back ohmic contact layer;
the positive ohmic contact layer is arranged on the battery function film layer;
the passivation film layer is arranged on the front ohmic contact layer;
the flexible polymer film layer comprises conductive grid lines and lead wires, the conductive grid lines are in a grid shape and are uniformly distributed on the surface of the flexible polymer film layer, and the lead wires are connected with the edges of the conductive grid lines and lead out a lead wire contact.
2. A flexible polymer film support substrate structure with conductive capability as claimed in claim 1, wherein said conductive grid lines and leads are printed on said flexible polymer film layer, said conductive grid lines being made of one of Cu, Al, Ag and Au.
3. A flexible polymer film supporting substrate structure having electric conduction capability as claimed in claim 2, wherein said lead material is one of Cu, Al, Ag and Au.
4. A flexible polymeric film supporting substrate structure capable of conducting electricity according to claim 1, wherein said conductive glue layer is one of epoxy, phenolic, polyimide, polyurethane polymer.
5. A flexible polymer film supporting substrate structure capable of conducting electricity according to claim 1 wherein said backside ohmic contact layer is Ti/Pt/Au, Ti/Au or Pd/Au.
6. A flexible polymer film supporting substrate structure capable of conducting electricity according to claim 1 wherein said front ohmic contact layer is Ti/Au.
7. A flexible polymer film supporting substrate structure having electric conductivity according to claim 1, wherein said passivation film layer is SiO2Or SiN.
CN202020555601.XU 2020-04-15 2020-04-15 Flexible polymer film support substrate structure with conductive capability Active CN212209513U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020555601.XU CN212209513U (en) 2020-04-15 2020-04-15 Flexible polymer film support substrate structure with conductive capability

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020555601.XU CN212209513U (en) 2020-04-15 2020-04-15 Flexible polymer film support substrate structure with conductive capability

Publications (1)

Publication Number Publication Date
CN212209513U true CN212209513U (en) 2020-12-22

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202020555601.XU Active CN212209513U (en) 2020-04-15 2020-04-15 Flexible polymer film support substrate structure with conductive capability

Country Status (1)

Country Link
CN (1) CN212209513U (en)

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