CN212097595U

CN212097595U - Hot melting device is used in production of semiconductor element shell

Info

Publication number: CN212097595U
Application number: CN202020621782.1U
Authority: CN
Inventors: 李建立
Original assignee: Wuxi Cote Core Technology Co ltd
Current assignee: Wuxi Cote Core Technology Co ltd
Priority date: 2020-04-22
Filing date: 2020-04-22
Publication date: 2020-12-08
Anticipated expiration: 2030-04-22

Abstract

The utility model discloses a hot melting device is used in production of semiconductor element shell, the on-line screen storage device comprises a base, inner chamber of the base's positive fixedly connected with mounting panel, the first cylinder of the back fixedly connected with of mounting panel, the back fixedly connected with push pedal of first cylinder, the top fixedly connected with support column of push pedal, the top of support column runs through to the top of base and fixedly connected with places the board. The utility model discloses a set up base, mounting panel, first cylinder, push pedal, support column, place the board, a supporting plate, the second cylinder, a pressing plate, hot melt dish, sliding sleeve, pulley, spout, mutually supporting of slider and slide bar, the advantage that the security performance is high has been reached, the problem that current hot melt device security performance is low has been solved, when people are using hot melt device, be convenient for take out the product after accomplishing, and can not touch the hot melt board when taking out, can not cause the injury to people, make things convenient for people to use.

Description

Hot melting device is used in production of semiconductor element shell

Technical Field

The utility model relates to a semiconductor element shell production technical field specifically is a hot melting device is used in semiconductor element shell production.

Background

The semiconductor element shell refers to a process of processing a wafer passing a test according to a product model and a function requirement to obtain an independent chip, and the packaging process comprises the following steps: the wafer from the previous wafer process is cut into small chips (Die) through a scribing process, then the cut chips are pasted on the small islands of the corresponding substrate (Lead frame) frame through glue, then the bonding pads (Bond pads) of the chips are connected to the corresponding pins (Lead) of the substrate through superfine metal (gold tin copper aluminum) wires or conductive resin to form a required circuit, and then the independent chips are packaged and protected through plastic shells.

In semiconductor element shell production and processing process, need use hot melt device, present hot melt device, the security performance is low, when people are using hot melt device, is not convenient for take out the product after accomplishing, and touches the hot melt board easily when taking out, leads to causing the injury to people, and inconvenient people use.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

Not enough to prior art, the utility model provides a hot melting device is used in semiconductor element shell production possesses the advantage that the security performance is high, has solved the problem that current hot melting device security performance is low.

(II) technical scheme

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a hot melting device is used in semiconductor element shell production, includes the base, the positive fixedly connected with mounting panel of base inner chamber, the first cylinder of back fixedly connected with of mounting panel, the back fixedly connected with push pedal of first cylinder, the top fixedly connected with support column of push pedal, the top of support column runs through to the top of base and fixedly connected with places the board, the equal fixedly connected with slide bar in front side and the rear side of base top both sides, the top fixedly connected with backup pad of slide bar, the top fixedly connected with second cylinder of backup pad, the bottom of second cylinder runs through to the bottom and the fixedly connected with clamp plate of backup pad, the bottom fixedly connected with of clamp plate with place the hot melt dish that the board cooperation was used.

Preferably, the surface of the sliding rod is connected with a sliding sleeve in a sliding manner, and the inner side of the sliding sleeve is fixedly connected with the front side and the rear side of the two sides of the pressing plate.

Preferably, the front side and the rear side of the two sides of the bottom of the placing plate are both fixedly connected with pulleys, and the bottoms of the pulleys are in contact with the top of the base.

Preferably, the bottom of the inner cavity of the base is provided with a sliding groove, the inner cavity of the sliding groove is connected with a sliding block in a sliding mode, and the top of the sliding block is fixedly connected with the bottom of the push plate.

Preferably, the top and the bottom of the back of the mounting plate are both provided with bolts, and the front of each bolt is fixedly connected with the front of the inner cavity of the base.

(III) advantageous effects

Compared with the prior art, the utility model provides a hot melting device is used in production of semiconductor element shell possesses following beneficial effect:

1. the utility model discloses a set up base, mounting panel, first cylinder, push pedal, support column, place the board, a supporting plate, the second cylinder, a pressing plate, hot melt dish, sliding sleeve, pulley, spout, mutually supporting of slider and slide bar, the advantage that the security performance is high has been reached, the problem that current hot melt device security performance is low has been solved, when people are using hot melt device, be convenient for take out the product after accomplishing, and can not touch the hot melt board when taking out, can not cause the injury to people, make things convenient for people to use.

2. The utility model discloses a set up spout and slider, played the stable effect of removal to the push pedal when using, through setting up the mounting panel, played fixed stable effect when using to first cylinder, through setting up the sliding sleeve, played the effect of preventing rocking when using to the clamp plate.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a left side view of the base structure of the present invention;

fig. 3 is a left side sectional view of the base structure of the present invention.

In the figure: 1. a base; 2. mounting a plate; 3. a first cylinder; 4. pushing the plate; 5. a support pillar; 6. placing the plate; 7. a support plate; 8. a second cylinder; 9. pressing a plate; 10. a hot-melting tray; 11. a sliding sleeve; 12. a pulley; 13. a chute; 14. a slider; 15. a slide bar.

Detailed Description

In order to make the technical solution of the present invention better understood, the present invention is described in detail below with reference to the accompanying drawings, and the description of the present invention is only exemplary and explanatory, and should not be construed as limiting the scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

It should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like refer to the orientation or positional relationship shown in the drawings, or the orientation or positional relationship that the utility model is usually placed when in use, and are used for convenience of description and simplification of description, but do not refer to or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

Furthermore, the terms "horizontal", "vertical", "overhang" and the like do not imply that the components are required to be absolutely horizontal or overhang, but may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1-3, a hot melting device for producing a semiconductor element shell comprises a base 1, a chute 13 is arranged at the bottom of an inner cavity of the base 1, the chute 13 and a slider 14 are arranged to play a role of stabilizing movement of a push plate 4 when in use, the inner cavity of the chute 13 is connected with the slider 14 in a sliding manner, the top of the slider 14 is fixedly connected with the bottom of the push plate 4, a mounting plate 2 is fixedly connected with the front of the inner cavity of the base 1, the mounting plate 2 is arranged to play a role of stabilizing fixation of a first cylinder 3 when in use, bolts are arranged at the top and the bottom of the back of the mounting plate 2, the front of the bolts is fixedly connected with the front of the inner cavity of the base 1, a first cylinder 3 is fixedly connected with the back of the mounting plate 2, the push plate 4 is fixedly connected with the back of the first cylinder 3, a support pillar 5 is fixedly connected with the top of the push, the front side and the rear side of two sides of the bottom of the placing plate 6 are fixedly connected with pulleys 12, the bottom of each pulley 12 is in contact with the top of the base 1, the front side and the rear side of two sides of the top of the base 1 are fixedly connected with slide rods 15, the surface of each slide rod 15 is connected with a slide sleeve 11 in a sliding manner, the pressing plate 9 plays a role of preventing shaking in use by arranging the slide sleeves 11, the inner side of each slide sleeve 11 is fixedly connected with the front side and the rear side of two sides of the pressing plate 9, the top of each slide rod 15 is fixedly connected with a supporting plate 7, the top of each supporting plate 7 is fixedly connected with a second air cylinder 8, the bottom of each second air cylinder 8 penetrates to the bottom of the corresponding supporting plate 7 and is fixedly connected with the corresponding pressing plate 9, the bottom of each pressing plate 9 is fixedly connected with a hot melting disc 10 matched with the placing plate 6 for use, and the base 1, The pressing plate 9, the hot melting disc 10, the sliding sleeve 11, the pulley 12, the sliding groove 13, the sliding block 14 and the sliding rod 15 are mutually matched, the advantage of high safety performance is achieved, the problem of low safety performance of the existing hot melting device is solved, when people use the hot melting device, the finished product can be conveniently taken out, the hot melting plate cannot be touched when being taken out, the injury to people cannot be caused, and the use by people is facilitated.

During the use, people open hot melt dish 10 at first in proper order, second cylinder 8 and first cylinder 3, second cylinder 8 drives hot melt dish 10 downstream through clamp plate 9 and sliding sleeve 11, make it carry out the hot melt to placing the work piece on board 6, after the completion, first cylinder 3 begins working, first cylinder 3 drives push pedal 4 and begins to move, push pedal 4 drives slider 14 and slides in spout 13, push pedal 4 drives through support column 5 and pulley 12 simultaneously and places board 6 and move to the front side on base 1, make it shift out outside slide bar 15, the people of being convenient for take out the work piece, when people use hot melting device, be convenient for take out the product after accomplishing, and can not touch the hot melt board when taking out, can not cause the injury to people, make things convenient for people to use.

All standard parts used in this application file can purchase from the market, all parts in this application file can be customized according to the record of description and attached drawing, the concrete connected mode of each part all adopts conventional means such as ripe bolt, rivet, welding among the prior art, machinery, part and equipment all adopt conventional model among the prior art, the electrical components that appear in this paper all with external main control unit and 220V commercial power electricity connection to main control unit can be for first cylinder, second cylinder and hot melt dish etc. play the conventional known equipment of control.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

The principles and embodiments of the present invention have been explained herein using specific examples, which are presented only to assist in understanding the methods and their core concepts. It should be noted that there are infinite specific structures due to the limited character expressions, and it will be apparent to those skilled in the art that various improvements, decorations or changes can be made without departing from the principles of the present invention, and the technical features can be combined in a suitable manner; the application of these modifications, variations or combinations, or the application of the concepts and solutions of the present invention in other contexts without modification, is not intended to be considered as a limitation of the present invention.

Claims

1. A hot melting device for producing a semiconductor element shell comprises a base (1) and is characterized in that: the front surface of the inner cavity of the base (1) is fixedly connected with a mounting plate (2), the back surface of the mounting plate (2) is fixedly connected with a first air cylinder (3), the back of the first cylinder (3) is fixedly connected with a push plate (4), the top of the push plate (4) is fixedly connected with a support pillar (5), the top of the supporting column (5) penetrates to the top of the base (1) and is fixedly connected with a placing plate (6), the front side and the rear side of the two sides of the top of the base (1) are both fixedly connected with a slide bar (15), the top of the sliding rod (15) is fixedly connected with a supporting plate (7), the top of the supporting plate (7) is fixedly connected with a second air cylinder (8), the bottom of the second cylinder (8) penetrates to the bottom of the supporting plate (7) and is fixedly connected with a pressing plate (9), the bottom of the pressing plate (9) is fixedly connected with a hot melting disc (10) matched with the placing plate (6).

2. A heat fusion apparatus for producing a semiconductor device package as claimed in claim 1, wherein: the surface of the sliding rod (15) is connected with a sliding sleeve (11) in a sliding manner, and the inner side of the sliding sleeve (11) is fixedly connected with the front side and the rear side of the two sides of the pressing plate (9).

3. A heat fusion apparatus for producing a semiconductor device package as claimed in claim 1, wherein: the front side and the rear side of the two sides of the bottom of the placing plate (6) are fixedly connected with pulleys (12), and the bottoms of the pulleys (12) are in contact with the top of the base (1).

4. A heat fusion apparatus for producing a semiconductor device package as claimed in claim 1, wherein: the bottom of the inner cavity of the base (1) is provided with a sliding groove (13), the inner cavity of the sliding groove (13) is connected with a sliding block (14) in a sliding manner, and the top of the sliding block (14) is fixedly connected with the bottom of the push plate (4).

5. A heat fusion apparatus for producing a semiconductor device package as claimed in claim 1, wherein: the top and the bottom at the back of the mounting plate (2) are both provided with bolts, and the front of the bolts is fixedly connected with the front of the inner cavity of the base (1).