CN212085034U - Silicon wafer collecting box and silicon wafer grading collecting device - Google Patents
Silicon wafer collecting box and silicon wafer grading collecting device Download PDFInfo
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- CN212085034U CN212085034U CN202021063982.6U CN202021063982U CN212085034U CN 212085034 U CN212085034 U CN 212085034U CN 202021063982 U CN202021063982 U CN 202021063982U CN 212085034 U CN212085034 U CN 212085034U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model relates to a silicon chip collecting box and silicon chip stepping material collecting device. The silicon wafer collecting box comprises a material box bottom plate, a first side plate and a material box adjusting plate; the first side plate is vertically and fixedly connected to the material box bottom plate; the material box adjusting plate comprises a bottom adjusting plate and a side adjusting plate, the side adjusting plate is vertically and fixedly connected to the bottom adjusting plate, the side adjusting plate is perpendicular to the first side plate, a sliding structure is mounted on the bottom adjusting plate, and the sliding structure enables the bottom adjusting plate to slide along the direction parallel to the first side plate. The silicon wafer receiving box is internally provided with the box adjusting plate, so that the size of a silicon wafer receiving space in the box can be changed, the receiving space is adaptive to the specification of the silicon wafer, and the silicon wafer receiving box can be compatible with the receiving of silicon wafers with various specifications. The utility model provides a silicon chip stepping material collecting device adopts the silicon chip material receiving box that can compatible many specifications silicon chip was accomodate, makes silicon chip stepping material collecting device's commonality good.
Description
Technical Field
The utility model relates to a solar cell production facility, specifically speaking are silicon chip material receiving box and silicon chip stepping material collecting device.
Background
After the silicon wafer is detected, the silicon wafers need to be classified according to the detection result and then are placed in a silicon wafer receiving box.
Because the silicon wafers have different specifications, the traditional silicon wafer sorting equipment and the traditional material receiving box only aim at the silicon wafers with specific sizes generally and cannot be compatible with the classification of the silicon wafers with different sizes.
In order to sort silicon wafers with different specifications, different silicon wafer sorting equipment needs to be prepared in a silicon wafer production factory, so that the production cost is increased, a plurality of fields of a production workshop are occupied, and the management cost is increased.
SUMMERY OF THE UTILITY MODEL
The utility model discloses to the problem that current silicon chip sorting facilities can not compatible multiple specification silicon chip, provide a compatible silicon chip collecting box who stores multiple specification silicon chip, still provide a silicon chip stepping material collecting device that can compatible multiple specification silicon chip of selecting separately simultaneously.
The utility model provides a silicon chip material collecting box's technical scheme as follows: a silicon chip collecting box comprises a box bottom plate, a first side plate and a box adjusting plate; wherein: the first side plate is vertically and fixedly connected to the material box bottom plate; the material box adjusting plate comprises a bottom adjusting plate and a side adjusting plate, the side adjusting plate is vertically and fixedly connected to the bottom adjusting plate, the side adjusting plate is perpendicular to the first side plate, a sliding structure is mounted on the bottom adjusting plate, and the sliding structure enables the bottom adjusting plate to slide along the direction parallel to the first side plate.
The silicon wafer receiving box is internally provided with the box adjusting plate, so that the size of a silicon wafer receiving space in the box can be changed, the receiving space is adaptive to the specification of the silicon wafer, and the silicon wafer receiving box can be compatible with the receiving of silicon wafers with various specifications.
Optionally, the sliding structure comprises at least one kidney-shaped hole arranged on the magazine bottom plate or the bottom regulating plate and extending in the sliding direction of the sliding structure, and a fastener mounted in the kidney-shaped hole to fix the bottom regulating plate relative to the magazine bottom plate.
The sliding structure of the material box adjusting plate adopts a waist-shaped hole, so that the structure is simple and the adjustment is convenient.
Optionally, the side adjusting plate and the first side plate are provided with backing plates, the bottom adjusting plate is provided with a material box upper layer backing plate, and/or the material box bottom plate and the bottom adjusting plate are provided with corresponding notches.
The material receiving box is internally provided with a backing plate or a backing plate on the upper layer of the material receiving box, so that the material receiving box has a buffering effect and can prevent the silicon wafer from being damaged; the material box bottom plate and the bottom adjusting plate are provided with notches, so that the silicon wafers are convenient to take and place.
Optionally, a second side plate is further mounted on the silicon wafer collecting box, the second side plate is adjacent to the first side plate, and the second side plate is perpendicular to the first side plate and the bottom plate of the material box.
A certain maximum accommodating space is formed by the second side plate and the first side plate, and the second side plate also plays a role in positioning the bottom adjusting plate.
The utility model provides a silicon chip stepping material collecting device's technical scheme as follows: a silicon wafer grading and receiving device comprises a silicon wafer conveying device, a grading conveying device and a receiving mechanism; wherein: the silicon wafer conveying device is used for conveying silicon wafers to be graded; the grading conveying device is at least one, is arranged below the silicon wafer conveying device and is used for conveying the silicon wafers graded on the silicon wafer conveying device to the material receiving mechanism; the silicon wafer receiving device is provided with at least one receiving mechanism, is arranged on one side of the silicon wafer conveying device and is used for receiving the corresponding graded silicon wafers; the receiving mechanism adopts the silicon wafer receiving box.
The silicon wafer grading material receiving device adopts the material receiving box which can compatibly receive silicon wafers of various specifications, so that the silicon wafer grading material receiving device is good in universality.
Optionally, the grading conveying device comprises a grading lifting mechanism and grading conveying lines, at least three grading conveying lines are arranged in parallel, and the conveying direction of the grading conveying lines is perpendicular to the conveying direction of the silicon wafer conveying device; the stepping lifting mechanism drives the stepping conveying line to ascend, so that the stepping conveying line contacts the silicon wafers on the silicon wafer conveying device and conveys the silicon wafers to the material receiving mechanism.
At least three grading conveying lines are adopted, two grading conveying lines are used when small-specification silicon wafers are conveyed, and all grading conveying lines are used when large-specification silicon wafers are conveyed, so that the compatibility problem of the conveying lines is solved.
Optionally, the stepping lifting mechanism comprises a stepping lifting motor, an eccentric wheel and a connecting rod, the eccentric wheel is fixedly connected to a rotating part of the stepping lifting motor, and the connecting rod is connected between a rotating end of the eccentric wheel and a mounting seat of the stepping conveying line.
The gear-shifting lifting mechanism adopts an eccentric wheel structure, and has simple structure and low cost.
Optionally, the material receiving mechanism further comprises a material box lifting mechanism, and the silicon wafer receiving boxes are arranged on the material box lifting mechanism in a lifting manner.
The material receiving mechanism adopts the material box lifting mechanism to drive the plurality of material receiving boxes, so that the material receiving capacity of the material receiving mechanism can be improved.
Optionally, a plurality of grading conveying devices are arranged at intervals along the conveying direction of the silicon wafer conveying device; and a plurality of material receiving mechanisms corresponding to the grading conveying devices are respectively arranged on one side and/or the other side of the silicon wafer conveying device.
The arrangement of a plurality of grading conveying devices can divide the silicon wafers into a plurality of classes to meet the production requirements.
Optionally, each grading conveyor is provided with an adsorption mechanism, and the adsorption mechanism is arranged between the grading conveyor lines and used for adsorbing the silicon wafers.
The adsorption mechanism is arranged on the grading conveying device, so that the silicon wafer can be firmly adsorbed, and the silicon wafer is prevented from falling.
Optionally, the silicon wafer grading and receiving device further comprises a guiding and conveying device, and the guiding and conveying device is installed between each grading and conveying device and the corresponding receiving mechanism.
The silicon wafers on the grading conveying device are guided to the material receiving mechanism through the guide conveying device, so that the silicon wafers can be prevented from falling and being damaged.
Drawings
Fig. 1 is a schematic view of a three-dimensional structure of an embodiment of a silicon wafer grading and receiving device of the present invention.
Fig. 2 is a top view of fig. 1.
Fig. 3 is a right side view of fig. 1.
Fig. 4 is a schematic perspective view of the stepped conveyor of fig. 1.
Fig. 5 is a schematic perspective view of the stepped lifting mechanism in fig. 4.
Fig. 6 is a schematic perspective view of the material receiving mechanism in fig. 1.
FIG. 7 is a schematic perspective view of the silicon wafer receiving cassette shown in FIG. 6.
FIG. 8 is a schematic perspective view of the silicon wafer collecting box in FIG. 6 with an upper pad of the upper material box.
In fig. 1 to 8, the silicon wafer grading material receiving device comprises a silicon wafer grading material receiving device 1, a silicon wafer conveying device 10, a grading conveying device 20, a grading lifting mechanism 21, a grading lifting motor 211, an eccentric wheel 212, a connecting rod 213, a grading conveying line 22, an adsorption mechanism 23, a material receiving mechanism 30, a silicon wafer receiving box 31, a box bottom plate 311, a first side plate 312, a second side plate 313, a box adjusting plate 314, a bottom adjusting plate 3141, a side adjusting plate 3142, a waist-shaped hole 3143, a base plate 315, a box upper layer base plate 316, a notch 317, a box lifting mechanism 32, a guiding conveying device 40 and a silicon wafer 100.
Detailed Description
In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention is described in detail with reference to the accompanying drawings and the detailed description.
The utility model relates to a silicon chip stepping material collecting device 1 to and be used for this silicon chip stepping material collecting device 1's silicon chip to receive magazine 31. After the silicon wafers 100 are detected, the silicon wafer grading and receiving device 1 is used for classifying the silicon wafers 100 according to the detection result and placing the classified silicon wafers 100 into the corresponding silicon wafer receiving boxes 31.
Fig. 1 to 3 show an alternative embodiment of a silicon wafer stepped material receiving device 1, fig. 1 is a perspective view of the device, fig. 2 is a top view of the device, and fig. 3 is a side view of the device.
As shown in fig. 1 to 3, the silicon wafer grading and receiving device 1 mainly includes a silicon wafer conveying device 10, a grading conveying device 20, and a receiving mechanism 30. Optionally, the silicon wafer stepped material receiving device 1 further comprises a guiding and conveying device 40.
The silicon wafer conveying apparatus 10 is used for conveying silicon wafers 100 to be graded. The silicon wafer conveying device 10 is installed on a base. The silicon wafer conveying device 10 may adopt one conveying belt or two parallel conveying belts, which are shown as two conveying belts. Two conveyor belts are generally used to more smoothly convey the silicon wafer 100.
The grading conveying device 20 is at least one, is installed below the silicon wafer conveying device 10, and is used for conveying the silicon wafers 100 graded on the silicon wafer conveying device 10 to the material receiving mechanism 30. Alternatively, there are several stepped conveyors 20 arranged at intervals along the conveying direction of the wafer conveyor 10. The arrangement of the plurality of step-by-step conveying devices 20 can divide the silicon wafers 100 into a plurality of types to meet the production requirements.
At least one material receiving mechanism 30 is installed at one side of the silicon wafer conveying device 10 and used for receiving the corresponding graded silicon wafers 100; the material receiving mechanism 30 employs a silicon wafer receiving box 31 capable of compatibly receiving silicon wafers 100 of various specifications. Optionally, a plurality of material receiving mechanisms 30 are provided, and are respectively installed at one side and/or the other side of the silicon wafer conveying device 10, and the positions thereof correspond to the stepped conveying device 20.
The silicon wafer grading material receiving device 1 adopts a material receiving box which can compatibly receive silicon wafers 100 with various specifications, so that the silicon wafer grading material receiving device 1 has good universality.
Fig. 4 shows an alternative embodiment of the staging device 20, and fig. 4 is a perspective view of the device.
As shown in fig. 4, the stepping conveyor 20 includes a stepping lifting mechanism 21 and a stepping conveyor line 22. The number of the grading conveyor lines 22 is at least three, and the conveying direction of the grading conveyor line 22 is perpendicular to the conveying direction of the silicon wafer conveying device 10. The stepping lifting mechanism 21 drives the stepping conveying line 22 to lift, so that the stepping conveying line 22 contacts the silicon wafer 100 on the silicon wafer conveying device 10, and the silicon wafer 100 is conveyed to the receiving mechanism 30. The grading conveyor line 22 is provided with a groove corresponding to the position of the conveyor belt of the silicon wafer conveyor device 10, and the groove is used for accommodating the conveyor belt of the silicon wafer conveyor device 10 when the grading conveyor line 22 is lifted, so that interference between the grading conveyor line and the conveyor belt can be avoided.
At least three grading conveying lines 22 are adopted, two of the grading conveying lines are used when the small-size silicon wafers 100 are conveyed, and all the grading conveying lines are used when the large-size silicon wafers 100 are conveyed, so that the compatibility problem of the conveying lines is solved.
The stepped conveying line 22 generally employs a conveying belt, and the conveying belt is driven by a motor to operate. One embodiment of the motor adopts a servo motor, the transmission speed and time of the conveying belt can be optimized according to signals fed back by the servo motor, and the slipping phenomenon during silicon wafer discharging is reduced.
As shown in fig. 5, the stepped lifting mechanism 21 may alternatively include a stepped lifting motor 211, an eccentric 212 and a connecting rod 213, the eccentric 212 is fixedly connected to a rotating member of the stepped lifting motor 211, and the connecting rod 213 is connected between a rotating end of the eccentric 212 and a mounting seat of the stepped conveying line 22.
The stepping lifting mechanism 21 adopts an eccentric wheel 212 structure, and has simple structure and low cost.
Optionally, the stepping lifting motor 211 also adopts a servo motor, and the speed and time for jacking the stepping lifting mechanism 21 can be optimized according to signals fed back by the servo motor, so that the slipping phenomenon during silicon wafer discharging is reduced.
Optionally, each of the staging conveyors 20 has an adsorption mechanism 23 mounted thereon, and the adsorption mechanism 23 is mounted between the staging conveyor lines 22 for adsorbing the silicon wafers 100.
The adsorption mechanism 23 is disposed on the stepped conveying device 20, so that the silicon wafer 100 can be firmly adsorbed and the silicon wafer 100 can be prevented from falling.
As shown in fig. 1 to fig. 3, optionally, the silicon wafer stepped material receiving device 1 further includes a guiding and conveying device 40, and the guiding and conveying device 40 is installed between each stepped conveying device 20 and the corresponding material receiving mechanism 30. The guiding and conveying device 40 is generally a conveyor belt, and is disposed obliquely from the shift conveying device 20 to the silicon wafer receiving box 31 of the receiving mechanism 30.
The silicon wafers 100 on the grading conveyor 20 are guided to the material receiving mechanism 30 by the guiding conveyor 40, so that the silicon wafers 100 can be prevented from falling and being damaged.
FIG. 6 shows an alternative embodiment of the receiving mechanism 30. The receiving mechanism 30 includes at least one silicon wafer receiving box 31 compatible with receiving the silicon wafers 100 of different specifications.
Optionally, the material receiving mechanism 30 further includes a magazine lifting mechanism 32, and the plurality of silicon wafer receiving magazines 31 are liftably mounted on the magazine lifting mechanism 32.
The material receiving mechanism 30 adopts the material box lifting mechanism 32 to drive a plurality of material receiving boxes, so that the material receiving capacity of the material receiving mechanism 30 can be improved.
Fig. 7 and 8 show an alternative embodiment of the silicon wafer receiving cassette 31 compatible with the receiving mechanism 30 shown in fig. 6 for receiving the silicon wafers 100 of multiple sizes, and fig. 7 and 8 are perspective views of the cassette.
As shown in fig. 7 and 8, the silicon wafer storage box 31 at least comprises a box bottom plate 311, a first side plate 312 and a box adjusting plate 314, wherein the first side plate 312 is vertically and fixedly connected to the box bottom plate 311.
The magazine adjusting plate 314 includes a bottom adjusting plate 3141 and a side adjusting plate 3142, the side adjusting plate 3142 is vertically and fixedly connected to the bottom adjusting plate 3141, and the side adjusting plate 3142 is perpendicular to the first side plate 312. The bottom adjustment plate 3141 has a sliding structure mounted thereon, which allows the bottom adjustment plate 3141 to slide in a direction parallel to the first side plate 312.
The silicon wafer receiving box 31 is provided with a box adjusting plate 314, which can change the size of the silicon wafer receiving space in the box, so that the receiving space is adapted to the specification of the silicon wafer 100, and the silicon wafer receiving box can be compatible with the receiving of silicon wafers 100 with various specifications.
An alternative embodiment of the sliding structure includes at least one kidney-shaped aperture 3143 and a fastener. A kidney-shaped hole 3143 is disposed on the magazine bottom plate 311 or the bottom regulation plate 3141 and extends along the sliding direction of the sliding structure, and a fastener is installed in the kidney-shaped hole 3143 to fix the bottom regulation plate 3141 with respect to the magazine bottom plate 311. As shown in fig. 7, the sliding structure includes two waist-shaped holes 3143 arranged in parallel.
The sliding structure of the material box adjusting plate 314 adopts a waist-shaped hole 3143, so that the structure is simple and the adjustment is convenient.
Optionally, the side adjusting plate 3142 and the first side plate 312 are provided with a backing plate 315.
Optionally, a cartridge upper layer pad 316 is mounted on the bottom regulating plate 3141.
Optionally, the side adjusting plate 3142 and the first side plate 312 are provided with a pad 315, and the bottom adjusting plate 3141 is provided with a magazine upper pad 316.
The receiving box is provided with a backing plate 315 or a backing plate 316 on the upper layer of the receiving box, which plays a role of buffering and can prevent the silicon chip 100 from being damaged.
Optionally, corresponding notches 317 are formed on the magazine bottom plate 311 and the bottom adjusting plate 3141. Notches 317 are formed in the material box bottom plate 311 and the bottom adjusting plate 3141, so that the silicon wafer 100 can be conveniently taken and placed.
Optionally, a second side plate 313 is further mounted on the silicon wafer receiving box 31. The second side plate 313 is adjacent to the first side plate 312, and the second side plate 313 is perpendicular to the first side plate 312 and the magazine bottom plate 311.
The second side plate 313 also serves to position the bottom adjustment plate 3141 by the second side plate 313 forming a certain maximum accommodation space with the first side plate 312.
The invention has been described above with a certain degree of particularity and detail. It will be understood by those of ordinary skill in the art that the description of the embodiments is merely exemplary and that all changes that may be made without departing from the true spirit and scope of the present invention are intended to be within the scope of the present invention. The scope of the invention is defined by the appended claims rather than by the foregoing description of the embodiments.
Claims (11)
1. The silicon wafer collecting box is characterized by comprising a box bottom plate, a first side plate and a box adjusting plate; wherein:
the first side plate is vertically and fixedly connected to the material box bottom plate;
the magazine regulating plate comprises a bottom regulating plate and a side regulating plate, the side regulating plate is vertically and fixedly connected to the bottom regulating plate, the side regulating plate is perpendicular to the first side plate, a sliding structure is installed on the bottom regulating plate, and the sliding structure enables the bottom regulating plate to slide along the direction parallel to the first side plate.
2. The silicon wafer collection cassette of claim 1, wherein the sliding structure comprises at least one kidney-shaped hole disposed on the cassette bottom plate or the bottom adjustment plate and extending along a sliding direction of the sliding structure, and a fastener installed in the kidney-shaped hole to fix the bottom adjustment plate with respect to the cassette bottom plate.
3. The silicon wafer collecting box of claim 1, wherein the side adjusting plate and the first side plate are provided with backing plates, the bottom adjusting plate is provided with a material box upper layer backing plate, and/or the material box bottom plate and the bottom adjusting plate are provided with corresponding notches.
4. The cassette of claim 1, further comprising a second side plate mounted to the cassette, the second side plate being adjacent to the first side plate and perpendicular to the first side plate and the cassette bottom plate.
5. The stepping silicon wafer receiving device is characterized by comprising a silicon wafer conveying device, a stepping conveying device and a receiving mechanism; wherein:
the silicon wafer conveying device is used for conveying silicon wafers to be graded;
the grading conveying device is at least one, is arranged below the silicon wafer conveying device and is used for conveying the silicon wafers graded on the silicon wafer conveying device to the material receiving mechanism;
the silicon wafer conveying device is provided with at least one material receiving mechanism, and the material receiving mechanisms are arranged on one side of the silicon wafer conveying device and used for receiving the corresponding graded silicon wafers; the receiving mechanism adopts the silicon chip receiving box as claimed in any one of claims 1 to 4.
6. The silicon wafer grading and receiving device as claimed in claim 5, wherein the grading conveyor device comprises a grading lifting mechanism and at least three grading conveyor lines arranged in parallel, and the conveying direction of the grading conveyor lines is perpendicular to the conveying direction of the silicon wafer conveyor device; the grading lifting mechanism drives the grading conveying line to ascend, so that the grading conveying line contacts the silicon wafer on the silicon wafer conveying device and conveys the silicon wafer to the material receiving mechanism.
7. The silicon wafer grading and receiving device according to claim 6, wherein the grading lifting mechanism comprises a grading lifting motor, an eccentric wheel and a connecting rod, the eccentric wheel is fixedly connected to a rotating part of the grading lifting motor, and the connecting rod is connected between a rotating end of the eccentric wheel and a mounting seat of the grading conveying line.
8. The silicon wafer stepped material receiving device according to claim 5, wherein the material receiving mechanism further comprises a magazine lifting mechanism, and a plurality of silicon wafer receiving magazines are liftably mounted on the magazine lifting mechanism.
9. The silicon wafer grading and receiving device as claimed in claim 5, wherein the grading and conveying device comprises a plurality of grading and conveying devices which are arranged at intervals along the conveying direction of the silicon wafer conveying device; and a plurality of material receiving mechanisms corresponding to the grading conveying device are respectively arranged on one side and/or the other side of the silicon wafer conveying device.
10. The silicon wafer grading and receiving device of claim 9, wherein each grading and conveying device is provided with an adsorption mechanism, and the adsorption mechanism is arranged between the grading and conveying lines and used for adsorbing the silicon wafers.
11. The silicon wafer stepped material receiving device according to claim 5, further comprising a guiding conveyor device installed between each stepped conveyor device and the corresponding material receiving mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021063982.6U CN212085034U (en) | 2020-06-10 | 2020-06-10 | Silicon wafer collecting box and silicon wafer grading collecting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021063982.6U CN212085034U (en) | 2020-06-10 | 2020-06-10 | Silicon wafer collecting box and silicon wafer grading collecting device |
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| Publication Number | Publication Date |
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| CN212085034U true CN212085034U (en) | 2020-12-04 |
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| CN202021063982.6U Active CN212085034U (en) | 2020-06-10 | 2020-06-10 | Silicon wafer collecting box and silicon wafer grading collecting device |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114871156A (en) * | 2022-05-09 | 2022-08-09 | 苏州天准科技股份有限公司 | Tail material box, blanking sorting equipment and sorting system |
| CN114871153A (en) * | 2022-05-09 | 2022-08-09 | 苏州天准科技股份有限公司 | Non-contact adsorption type slicing device, blanking sorting equipment and sorting system |
| CN114871157A (en) * | 2022-05-09 | 2022-08-09 | 苏州天准科技股份有限公司 | Multilayer staggered type magazine storage device, discharging and sorting equipment and sorting system |
| CN114871154A (en) * | 2022-05-09 | 2022-08-09 | 苏州天准科技股份有限公司 | Blanking sorting equipment, sorting system and blanking method |
-
2020
- 2020-06-10 CN CN202021063982.6U patent/CN212085034U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114871156A (en) * | 2022-05-09 | 2022-08-09 | 苏州天准科技股份有限公司 | Tail material box, blanking sorting equipment and sorting system |
| CN114871153A (en) * | 2022-05-09 | 2022-08-09 | 苏州天准科技股份有限公司 | Non-contact adsorption type slicing device, blanking sorting equipment and sorting system |
| CN114871157A (en) * | 2022-05-09 | 2022-08-09 | 苏州天准科技股份有限公司 | Multilayer staggered type magazine storage device, discharging and sorting equipment and sorting system |
| CN114871154A (en) * | 2022-05-09 | 2022-08-09 | 苏州天准科技股份有限公司 | Blanking sorting equipment, sorting system and blanking method |
| CN114871157B (en) * | 2022-05-09 | 2023-03-10 | 苏州天准科技股份有限公司 | Multilayer staggered type magazine storage device, discharging and sorting equipment and sorting system |
| WO2023216737A1 (en) * | 2022-05-09 | 2023-11-16 | 苏州天准科技股份有限公司 | Material discharging and sorting device, sorting system and material discharging method |
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