CN215430337U - Rectangular silicon wafer discharging device and sorting machine - Google Patents
Rectangular silicon wafer discharging device and sorting machine Download PDFInfo
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- CN215430337U CN215430337U CN202120057994.6U CN202120057994U CN215430337U CN 215430337 U CN215430337 U CN 215430337U CN 202120057994 U CN202120057994 U CN 202120057994U CN 215430337 U CN215430337 U CN 215430337U
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Abstract
The utility model relates to a rectangular silicon wafer discharging device and a sorting machine. The rectangular silicon wafer discharging device comprises a branch line transmission mechanism, an auxiliary transmission mechanism and a material receiving mechanism; the branch transmission mechanism comprises a jacking mechanism and branch transmission lines, each branch transmission line comprises two outer transmission lines, each outer transmission line comprises a belt wheel and an outer conveyer belt, a conveying surface formed by the outer conveyer belts is provided with a pit for the main transmission line to pass through, and the width of each outer conveyer belt is 10-20 mm; the jacking mechanism drives the branch conveying line to ascend and contact the rectangular silicon wafers on the main conveying line, so that the rectangular silicon wafers conveyed on the main conveying line are separated from the main conveying line and are conveyed to the auxiliary conveying mechanism under the driving of the branch conveying line; the auxiliary conveying mechanism conveys the silicon wafers to the material receiving mechanism. Through setting up the width of outside conveyer belt, make its effective area of contact with rectangular silicon chip obtain guaranteeing, increased the frictional force of silicon chip with the conveyer belt, can avoid the silicon chip to rock and drop.
Description
Technical Field
The utility model relates to solar cell production equipment, in particular to a rectangular silicon wafer discharging device and a sorting machine.
Background
After the silicon wafer is detected, the silicon wafers need to be classified according to the detection result and then are placed in a silicon wafer receiving box.
There are generally two types of silicon wafers, one is a standard square wafer and the other is a rectangular wafer. The existing sorting machine is generally designed for standard square silicon wafers, and when the rectangular silicon wafers are sorted, because the contact area between the rectangular silicon wafers and a conveying belt is small, the rectangular silicon wafers are easy to convey unstably and even fall off, so that the silicon wafers are damaged.
SUMMERY OF THE UTILITY MODEL
The utility model provides a rectangular silicon wafer discharging device with stable conveying and a sorting machine, aiming at the problem that the existing silicon wafer sorting machine is unstable in conveying rectangular silicon wafers.
The technical scheme of the rectangular silicon wafer discharging device is as follows: a rectangular silicon wafer discharging device comprises a branch line transmission mechanism, an auxiliary conveying mechanism and a material receiving mechanism which are connected in sequence; wherein: the transmission direction of the branch transmission mechanism is vertical to the transmission direction of the main transmission line; when the rectangular silicon wafer is positioned on the main conveying line, the long edge of the rectangular silicon wafer is parallel to the conveying direction of the main conveying line; when the rectangular silicon chip is positioned on the branch line conveying line, the long edge of the rectangular silicon chip is vertical to the transmission direction of the branch line conveying line; the branch transmission mechanism comprises a jacking mechanism and branch transmission lines, each branch transmission line comprises two outer transmission lines which are arranged in parallel, each outer transmission line comprises a plurality of belt wheels and outer conveying belts wound on the belt wheels, corresponding pits for the main transmission line to pass through are formed on a transmission surface formed by the outer conveying belts, and the width of each outer conveying belt is 10-20 mm; the jacking mechanism drives the branch conveying line to ascend and contact the rectangular silicon wafers on the main conveying line, so that the rectangular silicon wafers conveyed on the main conveying line are separated from the main conveying line and are conveyed to the auxiliary conveying mechanism under the driving of the branch conveying line; the auxiliary conveying mechanism is configured to convey the rectangular silicon wafers to the material receiving mechanism in a speed reducing manner; the material receiving mechanism is configured to receive the rectangular silicon wafers conveyed by the auxiliary conveying mechanism.
Through setting up the width of outside conveyer belt, make its effective area of contact with rectangular silicon chip obtain guaranteeing, increased the frictional force of silicon chip with the conveyer belt, can avoid the silicon chip to rock and drop.
Optionally, each outer conveying line has at least two belt pulleys located on the same side of the main conveying line, and at least two belt pulleys form a conveying surface.
The number of the belt pulleys which are positioned on the same side outside the main conveying line of each outer side conveying line is set to be at least two, so that the silicon wafers are in surface contact with the conveying lines when being transmitted to the part of the outer side conveying line, and the silicon wafers are stably transferred to the auxiliary conveying mechanism.
Optionally, the jacking mechanism comprises a jacking motor, an eccentric shaft and a connecting rod, the eccentric shaft is fixedly connected to a rotating part of the jacking motor, and the connecting rod is connected between a rotating end of the eccentric shaft and the mounting seat of the branch conveying line; the jacking mechanism further comprises a jacking plate, the jacking plate is mounted on the jacking end of the connecting rod, and an adsorption hole is formed in the jacking plate.
The jacking mechanism adopts an eccentric structure, so that the structure is simple, and the occupied space is small; the jacking mechanism is also provided with an adsorption hole, so that the silicon wafer is adsorbed and fixed on the conveying belt, and the stability of the silicon wafer is improved when the jacking mechanism jacks.
Optionally, the material receiving mechanism comprises a lifting mechanism, a sliding plate, a plurality of material receiving boxes and at least one rotating mechanism; the sliding plate is arranged on a movable part of the lifting mechanism, the plurality of material receiving boxes are arranged on the sliding plate at intervals, and the at least one rotating mechanism is arranged between one of the material receiving boxes and the sliding plate; the rotating mechanism is used for driving the corresponding material receiving boxes to rotate, so that the corresponding material receiving boxes are staggered with the material receiving boxes above and/or below the material receiving boxes.
The receiving agencies is provided with rotary mechanism, can drive the material collecting box rotatory, avoids producing the interference between the material collecting box, the ejection of compact of being convenient for.
Optionally, the receiving mechanism further comprises a guide mechanism, the guide mechanism is installed between the sliding plate and the lifting mechanism, and the sliding plate slides along the guide mechanism under the driving of the lifting mechanism.
Through setting up guiding mechanism, play the guide effect to the lift of receiving the material box, make the material box steady lift.
Optionally, the material receiving mechanism further comprises a rotation sensing device for detecting whether the material receiving box rotates to the position; the rotation sensing device comprises an opposite type photoelectric sensor and a positioning sheet, the opposite type photoelectric sensor is arranged on the lifting mechanism, and the positioning sheet is arranged on the material receiving box.
Whether the material receiving box rotates to the position or not is sensed by the rotation sensing device, so that the condition that the material receiving box is damaged by misoperation can be avoided.
Optionally, the material receiving mechanism further comprises a rotary adsorption device, and the rotary adsorption device is mounted on the lifting mechanism and used for adsorbing the material receiving box when the material receiving box rotates in place.
The material collecting box which rotates to the position is fixed on the lifting mechanism through the rotary adsorption device, and the material collecting box is prevented from shaking.
Optionally, the material receiving mechanism further comprises a sensing device installed on the lifting mechanism, and the sensing device comprises an upper limit sensor, a middle sensor and a lower limit sensor which are installed in sequence from top to bottom.
The upper limit and the lower limit of the lifting mechanism are sensed through the sensing device, so that the material collecting box is prevented from exceeding the limit in the lifting process.
The technical scheme of the sorting machine provided by the utility model is as follows: a sorting machine comprises a main conveying line and a rectangular silicon wafer discharging device; wherein: the main conveying line is used for conveying rectangular silicon wafers to be graded; the main conveying line comprises two main conveying belts which are arranged in parallel, and the center distance of the two main conveying belts is 62-94 mm; the branch line transmission mechanism is arranged below the main conveying line, and the auxiliary conveying mechanism and the material receiving mechanism are arranged on one side or two sides of the main conveying line; the branch line transmission mechanism is used for transmitting the rectangular silicon wafers after being graded on the main transmission line to the auxiliary transmission mechanism; the auxiliary conveying mechanism is used for conveying the rectangular silicon wafers conveyed by the branch line conveying mechanism to the material receiving mechanism after decelerating; the receiving mechanism is used for receiving the rectangular silicon wafers after grading.
The discharging device is provided with at least three conveying lines, so that the contact area between the silicon wafer and the conveying lines is increased, the sorting machine can be used for conveying the rectangular silicon wafer, and the application range of the sorting machine is enlarged. The width of the outer side conveying belt of the sorting machine discharging device and the center distance of the two main conveying belts are arranged, so that the effective contact area of the outer side conveying belt and the main conveying belts and the rectangular silicon wafer is ensured, the friction force between the silicon wafer and the conveying belts is increased, and the silicon wafer can be prevented from shaking and falling.
Optionally, the sorting machine further comprises a regulating mechanism arranged at the feeding end of the main conveying line and/or a waste material box arranged at the discharging end of the main conveying line; the regulating mechanism is used for regulating the rectangular silicon wafers entering the main conveying line; the waste box is used for collecting rectangular silicon wafers which are not detected completely and are caused by the abnormity of the main conveying line.
The rectangular silicon wafers entering the main conveying line are regulated by the arrangement of the regulating mechanism, so that the silicon wafers can be prevented from being deviated on the main conveying line; the waste material box is arranged to collect waste materials, so that the continuous operation of the sorting machine can be guaranteed, and the sorting machine is prevented from being broken down.
Drawings
Fig. 1 is a schematic perspective view of one embodiment of the separator of the present invention.
Fig. 2 is a perspective view of a spur transport mechanism in the embodiment of the sorter shown in fig. 1.
Fig. 3 is a perspective view of fig. 2 from another perspective.
Fig. 4 is a perspective view of a receiving mechanism in the embodiment of the sorting machine shown in fig. 1.
Fig. 5 is an enlarged perspective view of the rotation mechanism in fig. 4.
Fig. 6 is a perspective view of the receiving mechanism shown in fig. 4 from another perspective.
In fig. 1 to 6, the apparatus includes a sorter 1, a main conveyor line 10, a branch conveyor line 20, a lift mechanism 21, a lift motor 211, an eccentric shaft 212, a connecting rod 213, a guide 214, a lift plate 215, a branch conveyor line 22, an outer conveyor line 221, an outer conveyor line 222, a mounting base 223, a conveyor motor 224, an upper pulley 225, a tension pulley 226, a lower pulley 227, a recess 228, an intermediate conveyor line 23, an auxiliary conveyor mechanism 30, a material receiving mechanism 40, a lift mechanism 41, a lift motor 411, a timing belt mechanism 412, a connecting block 413, a sliding plate 42, a rotating mechanism 43, a rotating block 431, a rotating shaft 432, a rotating shaft mounting base 433, a material receiving box 44, a guide mechanism 45, a rotation sensing device 46, a correlation type photoelectric sensor 461, a positioning plate 462, a rotation adsorbing device 47, an upper limit sensor 481, a middle sensor 482, a lower limit sensor 483, a photoelectric plate stopper 484, a waste box 50, a waste box, a, A rectangular silicon chip discharging device 60.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
The utility model discloses a rectangular silicon wafer discharging device 60 which is arranged in a sorting machine 1. The rectangular silicon wafer discharging device 60 is used for conveying the rectangular silicon wafers from the main conveying line 10 of the sorting machine 1 to the receiving mechanism 40 in a grading manner.
Fig. 1 shows an alternative embodiment of the sorting machine 1 including the rectangular silicon wafer discharging device 60, and fig. 1 is a perspective view of the sorting machine 1.
The sorting machine 1 mainly comprises a main conveying line 10 and a rectangular silicon wafer discharging device 60.
Wherein: the main conveying line 10 is used for conveying rectangular silicon wafers to be graded. The main conveying line 10 comprises two main conveying belts which are arranged in parallel, and the center distance between the two main conveying belts is 62-94 mm. Other components of the main conveyor line 10 may be of any construction known in the art.
The rectangular silicon wafer discharging device 60 may be provided in a plurality of sets, which are arranged at intervals along the main transfer line 10. Each set of rectangular silicon wafer discharging device 60 comprises a branch line transmission mechanism 20, an auxiliary conveying mechanism 30 and a material receiving mechanism 40 which are connected in sequence. The branch conveyor 20 is installed below the main conveyor line 10, and the sub-conveyor 30 and the material collector 40 are installed at one side or both sides of the main conveyor line 10.
The branch line transmission mechanism 20 is used for conveying the rectangular silicon wafers after grading on the main conveying line 10 to the auxiliary conveying mechanism 30; the auxiliary conveying mechanism 30 is used for conveying the rectangular silicon wafers conveyed by the branch line conveying mechanism 20 to the material receiving mechanism 40 after decelerating; the receiving mechanism 40 is used for receiving the graded rectangular silicon wafers.
The conveying direction of the branch conveying mechanism 20 is perpendicular to the conveying direction of the main conveying line 10. When the rectangular silicon wafer is positioned on the main conveying line 10, the long edge of the rectangular silicon wafer is parallel to the conveying direction of the main conveying line 10; when the rectangular silicon wafer is positioned on the branch conveyor line 22, the long side of the rectangular silicon wafer is perpendicular to the conveying direction of the branch conveyor line 22.
As shown in fig. 2 and 3, the branch line transportation mechanism 20 includes a jacking mechanism 21 and a branch line transportation line 22.
The branch line conveying line 22 includes at least two outer conveying lines 221 arranged in parallel. Each outer conveying line 221 comprises a plurality of belt wheels and outer conveying belts wound on the belt wheels, corresponding depressions 228 for the main conveying line 10 to pass through are formed on a conveying surface formed by the outer conveying belts, and the width of each outer conveying belt is 10-20 mm.
The jacking mechanism 21 drives the branch conveyor line 22 to ascend and contact the rectangular silicon wafers on the main conveyor line 10, so that the rectangular silicon wafers conveyed on the main conveyor line 10 are separated from the main conveyor line 10 and are conveyed to the auxiliary conveyor mechanism 30 under the driving of the branch conveyor line 22; the auxiliary conveying mechanism 30 is configured to convey the rectangular silicon wafers to the material receiving mechanism 40 at a reduced speed; the material receiving mechanism 40 is configured to receive the rectangular silicon wafer transferred by the auxiliary transfer mechanism 30.
The rectangular silicon wafer discharging device 60 ensures the effective contact area with the rectangular silicon wafer by setting the width of the outer side conveying belt, increases the friction force between the silicon wafer and the conveying belt, and can prevent the silicon wafer from shaking and falling.
The sorter 1 ensures that the effective contact area of the outer side conveying belt and the main conveying belt and the rectangular silicon wafer is ensured by setting the width of the outer side conveying belt of the rectangular silicon wafer discharging device 60 and the center distance of the two main conveying belts, increases the friction force between the silicon wafer and the conveying belt, and can prevent the silicon wafer from shaking and falling.
Optionally, each of the outer conveying lines 221 includes an outer conveying belt 221, a conveying motor 224, an upper pulley 225, a tension pulley 226, and a lower pulley 227. An upper belt wheel 225, a tension wheel 226 and a lower belt wheel 227 are arranged on the mounting base 223, the outer conveying belt 221 is wound on the upper belt wheel 225, the tension wheel 226 and the lower belt wheel 227, and the conveying motor 224 drives the outer conveying belt 221 to run on the upper belt wheel 225, the tension wheel 226 and the lower belt wheel 227 through a driving wheel. The tension roller 226 tensions the outer belt 221 so that a recess 228 is formed in the outer belt 221 through which the main conveyor line 10 passes.
Optionally, the number of pulleys of each outer conveying line 221 located on the same side of the main conveying line 10 (i.e., the upper pulley 225 in the figure) is at least two, and at least two pulleys form a conveying surface.
The number of the belt wheels of each outer conveying line 221 positioned on the same side of the main conveying line 10 is set to be at least two, so that the silicon wafers are in surface contact with the conveying lines when being conveyed to the part of the outer conveying line 221, and the silicon wafers are stably transferred to the auxiliary conveying mechanism 30.
Optionally, spur feed line 22 further comprises an intermediate conveyor belt 23. The middle conveyor belt 23 is located between the two outer conveyor belts 222, and is also driven by the conveyor motor 224. By arranging the middle conveying belt 23, the contact area between the rectangular silicon wafer and the conveying belt can be further increased, and the friction force is increased.
An alternative embodiment of the jacking mechanism 21 comprises a jacking motor 211, an eccentric shaft 212 and a connecting rod 213, wherein the eccentric shaft 212 is fixedly connected to a rotating part of the jacking motor 211, and the connecting rod 213 is connected between a rotating end of the eccentric shaft 212 and a mounting seat 223 of the branch conveying line 22; the jacking mechanism 21 further comprises a jacking plate, the jacking plate 215 is mounted on the jacking end of the connecting rod 213, and the jacking plate 215 is provided with an adsorption hole.
The jacking mechanism 21 adopts an eccentric structure, so that the structure is simple, and the occupied space is small; the jacking mechanism 21 is also provided with an adsorption hole, so that the silicon wafer is adsorbed and fixed on the conveyor belt, and the stability of the silicon wafer is improved when the jacking mechanism 21 jacks.
Optionally, the jacking mechanism 21 further comprises a plurality of guides 214. Optionally, the guide 214 is a linear bearing. The guide 214 guides the mount 223 when it ascends and descends.
As shown in fig. 1, an auxiliary conveying mechanism 30 is disposed between the main conveying line 10 and the material collecting mechanism 40 for decelerating auxiliary material collecting, which may be any one of the prior art structures.
As shown in fig. 4, 5 and 6, optionally, the material collecting mechanism 40 includes a lifting mechanism 41, a sliding plate 42, a plurality of material collecting boxes 44 and at least one rotating mechanism 43; the sliding plate 42 is mounted on the movable part of the lifting mechanism 41, the plurality of material receiving boxes 44 are mounted on the sliding plate 42 at intervals, and the at least one rotating mechanism 43 is mounted between one of the material receiving boxes 44 and the sliding plate 42; the rotating mechanism 43 is used to drive the corresponding material receiving box 44 to rotate, so that the corresponding material receiving box 44 is dislocated with the material receiving box 44 above and/or below the material receiving box 44.
The material receiving mechanism 40 is provided with a rotating mechanism 43, which can drive the material receiving boxes 44 to rotate, so as to avoid interference between the material receiving boxes 44 and facilitate material discharging.
An alternative embodiment of rotation mechanism 43 includes a rotation block 431, a shaft 432, and a shaft mount 433. The rotation shaft mounting base 433 is fixedly connected to the sliding plate 42, the rotation shaft 432 is mounted on the rotation shaft mounting base 433, the rotation block 431 is rotatably connected to the rotation shaft 432 and the rotation block 431 is fixedly connected to the material receiving box 44. The material receiving box 44 is rotatably mounted on the slide plate 42 by a rotating mechanism 43.
Alternatively, the lifting mechanism 41 includes a lifting motor 411 and a timing belt mechanism 412, and the material receiving box 44 is fixed to a timing belt of the timing belt mechanism 412 through a connecting block 413. The connecting block 413 is clamped on the timing belt and is fixedly connected with the sliding plate 42. The lifting motor 411 operates to drive the synchronous belt mechanism 412 to rotate, and the synchronous belt mechanism 412 drives the sliding plate 42 to lift. The elevation of the material receiving box 44 is controlled by the opening and closing of the elevation motor 411. The lifting mechanism 41 adopts a synchronous belt mechanism 12 for transmission, and the transmission ratio is accurate.
Optionally, the material collecting mechanism 40 further includes a guiding mechanism 45, the guiding mechanism 45 is installed between the sliding plate 42 and the lifting mechanism 41, and the sliding plate 42 slides along the guiding mechanism 45 under the driving of the lifting mechanism 41. The guide mechanism 45 typically employs two parallel slide rails on which the slide plate 42 is slidably mounted.
Through setting up guiding mechanism 45, play the guide effect to the lift of receipts material box 44, make receipts material box 44 steadily go up and down.
Optionally, the receiving mechanism 40 further comprises a rotation sensing device 46 for detecting whether the receiving box 44 is rotated in place. The rotation sensing device 46 includes a correlation type photoelectric sensor 461 and a positioning piece 462, the correlation type photoelectric sensor 461 is mounted on the elevating mechanism 41, and the positioning piece 462 is mounted on the material receiving box 44.
Whether the material receiving box 44 rotates in place or not is sensed by the rotation sensing device 46, so that the condition that the material receiving box 44 hurts an operator due to misoperation can be avoided.
The opposite-emission photoelectric sensor 461 is used to determine whether the material receiving box 44 is rotated to the right position, and when the positioning piece 462 blocks the opposite-emission photoelectric sensor, the material receiving box 44 is rotated to the right position.
Optionally, the material receiving mechanism 40 further includes a rotary adsorption device 47, and the rotary adsorption device 47 is mounted on the lifting mechanism 41 and is used for adsorbing the material receiving box 44 when the material receiving box 44 is rotated to the position. One embodiment of the rotary suction device 47 is a magnet.
The material receiving box 44 rotated to the position is fixed to the elevating mechanism 41 by rotating the adsorption device 47, and the material receiving box 44 is prevented from shaking.
Optionally, the material receiving mechanism 40 further comprises a sensing device installed on the lifting mechanism 41, and the sensing device comprises an upper limit sensor 481, a middle sensor 482 and a lower limit sensor 483 which are installed in sequence from top to bottom.
A photoelectric barrier 484 is fixedly connected to a connecting block 413 fixed to a timing belt mechanism 412 of the lifting mechanism 41, and the photoelectric barrier 484 moves between the upper and lower limit photoelectric sensors along with the lifting of the sliding plate 42. When the photoelectric barrier 484 is detected to be close to the upper limit sensor 481, the upper limit sensor 481 feeds back a signal to the console, and the console controls the lifting mechanism 41 to stop lifting; when the photoelectric blocking piece 484 is detected to be close to the lower limit sensor 483, the lower limit sensor 483 feeds a signal back to the control console, and the control console controls the lifting mechanism 41 to stop descending; the middle sensor 482 senses the current position of the photoelectric barrier 484 and feeds back a signal to the console, and the console calculates the distance that the lifting mechanism 41 needs to be lifted or lowered from the current position according to the signal and the position information of the upper limit sensor 481 and the lower limit sensor 483, so as to realize the matching of the material collecting box 44 and the discharge end of the auxiliary conveying mechanism 30.
The sensor senses the upper and lower limits of the lifting mechanism 41 to prevent the material receiving box 44 from lifting beyond the limits.
Referring again to fig. 1, the sorter 1 optionally further comprises a collating mechanism mounted at the feed end of the main conveyor line 10 and/or a scrap box 50 mounted at the discharge end of the main conveyor line 10. The regulating mechanism is used for regulating the rectangular silicon wafers entering the main conveying line 10; the waste bin 50 is used for collecting rectangular silicon wafers which are not detected completely due to the abnormality of the main conveyor line 10.
The rectangular silicon wafers entering the main conveying line 10 are regulated by arranging the regulating mechanism, so that the silicon wafers can be prevented from being deviated on the main conveying line 10; by providing the waste material box 50 to collect waste materials, the continuous operation of the sorting machine 1 can be ensured, and the malfunction of the sorting machine 1 can be prevented.
The working process of the utility model is as follows: when the first material receiving box 44 of the material receiving mechanism 40 is full of material, the lifting motor 411 drives the sliding plate 42 to lift until the second material receiving box 44 is in parallel butt joint with the auxiliary conveying mechanism 30, and before the second material receiving box 44 starts to receive material, namely before or after lifting, the second material receiving box 44 is rotated to the Y direction.
The first magazine 44 is rotated in the X direction to take out the silicon wafers from the magazine, and the first magazine 44 is rotated in the Y direction before the first magazine 44 starts to receive the silicon wafers, i.e., before or after the slide plate 42 is lowered.
The X direction is perpendicular to the Y direction, the X direction is parallel to the main conveyor line 10, and the Y direction is parallel to the branch line conveyor mechanism 20.
The utility model has been described above with a certain degree of particularity. It will be understood by those of ordinary skill in the art that the description of the embodiments is merely exemplary and that all changes that come within the true spirit and scope of the utility model are desired to be protected. The scope of the utility model is defined by the appended claims rather than by the foregoing description of the embodiments.
Claims (10)
1. The rectangular silicon wafer discharging device is characterized by comprising a branch line transmission mechanism, an auxiliary conveying mechanism and a material receiving mechanism which are connected in sequence; wherein:
the transmission direction of the branch transmission mechanism is vertical to the transmission direction of the main transmission line; when the rectangular silicon wafer is positioned on the main conveying line, the long edge of the rectangular silicon wafer is parallel to the conveying direction of the main conveying line; when the rectangular silicon wafer is positioned on the branch conveying line, the long edge of the rectangular silicon wafer is perpendicular to the transmission direction of the branch conveying line;
the branch transmission mechanism comprises a jacking mechanism and branch transmission lines, each branch transmission line comprises two outer side transmission lines which are arranged in parallel, each outer side transmission line comprises a plurality of belt wheels and outer side transmission belts wound on the belt wheels, corresponding pits for the main transmission lines to pass through are formed on a transmission surface formed by the outer side transmission belts, and the width of each outer side transmission belt is 10-20 mm; the jacking mechanism drives the branch conveying line to ascend and contact the rectangular silicon wafers on the main conveying line, so that the rectangular silicon wafers conveyed on the main conveying line are separated from the main conveying line and are conveyed to the auxiliary conveying mechanism under the driving of the branch conveying line;
the auxiliary conveying mechanism is configured to convey the rectangular silicon wafers to the material receiving mechanism in a speed reducing manner;
the material receiving mechanism is configured to receive the rectangular silicon wafers transmitted by the auxiliary conveying mechanism.
2. The rectangular silicon wafer discharging device according to claim 1, wherein each of the outer transport lines has at least two pulleys on the same side as and outside the main transport line, and the at least two pulleys form a transport surface.
3. The rectangular silicon wafer discharging device according to claim 1, wherein the jacking mechanism comprises a jacking motor, an eccentric shaft and a connecting rod, the eccentric shaft is fixedly connected to a rotating part of the jacking motor, and the connecting rod is connected between a rotating end of the eccentric shaft and a mounting seat of the branch line conveying line;
the jacking mechanism further comprises a jacking plate, the jacking plate is mounted on the jacking end of the connecting rod, and an adsorption hole is formed in the jacking plate.
4. The rectangular silicon wafer discharging device according to claim 1, wherein the material receiving mechanism comprises a lifting mechanism, a sliding plate, a plurality of material receiving boxes and at least one rotating mechanism; the sliding plate is mounted on a movable part of the lifting mechanism, the plurality of material receiving boxes are mounted on the sliding plate at intervals, and the at least one rotating mechanism is mounted between one of the material receiving boxes and the sliding plate; the rotating mechanism is used for driving the corresponding material receiving boxes to rotate, so that the corresponding material receiving boxes are staggered with the material receiving boxes above and/or below the material receiving boxes.
5. The rectangular silicon wafer discharging device according to claim 4, wherein the receiving mechanism further comprises a guiding mechanism, the guiding mechanism is installed between the sliding plate and the lifting mechanism, and the sliding plate slides along the guiding mechanism under the driving of the lifting mechanism.
6. The rectangular silicon wafer discharging device according to claim 4, wherein the material receiving mechanism further comprises a rotation sensing device for detecting whether the material receiving box is rotated to a position; the rotation sensing device comprises an opposite type photoelectric sensor and a positioning piece, the opposite type photoelectric sensor is installed on the lifting mechanism, and the positioning piece is installed on the material collecting box.
7. The rectangular silicon wafer discharging device according to claim 4, wherein the material receiving mechanism further comprises a rotary adsorption device, and the rotary adsorption device is mounted on the lifting mechanism and used for adsorbing the material receiving box when the material receiving box rotates to the position.
8. The rectangular silicon wafer discharging device according to claim 4, wherein the material receiving mechanism further comprises a sensing device installed on the lifting mechanism, and the sensing device comprises an upper limit sensor, a middle sensor and a lower limit sensor which are installed in sequence from top to bottom.
9. A sorting machine, characterized in that the sorting machine comprises a main conveying line and a rectangular silicon wafer discharging device according to any one of claims 1 to 8; wherein:
the main conveying line is used for conveying rectangular silicon wafers to be graded; the main conveying line comprises two main conveying belts which are arranged in parallel, and the center distance between the two main conveying belts is 62-94 mm;
the branch line transmission mechanism is arranged below the main conveying line, and the auxiliary conveying mechanism and the material receiving mechanism are arranged on one side or two sides of the main conveying line;
the branch line transmission mechanism is used for transmitting the rectangular silicon wafers after being graded on the main transmission line to the auxiliary transmission mechanism;
the auxiliary conveying mechanism is used for conveying the rectangular silicon wafers conveyed by the branch line conveying mechanism to the material receiving mechanism after decelerating;
the receiving mechanism is used for receiving the rectangular silicon wafers after grading.
10. The sorter of claim 9 further comprising a collating mechanism mounted at the feed end of the main conveyor line and/or a scrap box mounted at the discharge end of the main conveyor line;
the arranging mechanism is used for arranging the rectangular silicon wafers entering the main conveying line;
the waste material box is used for collecting the rectangular silicon wafers which are not detected completely and are caused by the abnormity of the main conveying line.
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| CN114733796A (en) * | 2022-05-09 | 2022-07-12 | 苏州天准科技股份有限公司 | Intelligent silicon wafer sorting system and analysis method |
| CN114871154A (en) * | 2022-05-09 | 2022-08-09 | 苏州天准科技股份有限公司 | Blanking sorting equipment, sorting system and blanking method |
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