CN212046381U - Tin paste brushing mold - Google Patents
Tin paste brushing mold Download PDFInfo
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- CN212046381U CN212046381U CN201922402352.0U CN201922402352U CN212046381U CN 212046381 U CN212046381 U CN 212046381U CN 201922402352 U CN201922402352 U CN 201922402352U CN 212046381 U CN212046381 U CN 212046381U
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Abstract
The utility model discloses a tin paste brushing mold, which comprises at least one brushing unit, wherein the brushing unit comprises a frame body which is surrounded by a side wall to form a containing cavity; and a cover body which is positioned in the containing cavity and the bottom of which comprises an opening; the cover body comprises a shielding part fixedly connected with the side wall of the frame body and a side wall part extending downwards from the edge of the shielding part; the cover body is configured to cover and buckle the chip on the PCB; a through groove which penetrates through the upper surface and the lower surface of the die and is used for tin paste to flow in is arranged between the side wall part of the cover body and the side wall of the frame body, and a lower port of the through groove is configured to be used for tin paste to be printed on a PCB. The utility model provides a brush tin cream mould can once only accomplish the tin cream printing work of whole PCB board, the time of the printing tin cream that significantly reduces to improve packaging efficiency.
Description
Technical Field
The utility model relates to an electronic packaging technology field, more specifically, the utility model relates to a brush tin cream mould.
Background
With the development of the times and the progress of scientific technology, the technology of integrated circuits is continuously improved and developed, meanwhile, the product volume is continuously reduced, the functions are continuously improved, and the core of the integrated circuits, namely the electronic packaging technology, is more rigorous and important while the functions are continuously improved.
In the electronic packaging industry, after a chip and a lead thereof are mounted on a PCB, the chip and the lead thereof are packaged in a casing by using a suitable package casing, so as to isolate the chip from an external environment, thereby protecting the chip. Before the package of the package shell, solder paste is printed on the PCB, and the package shell and the PCB are fixed together by the solder paste. In the prior art, after chips and chip leads are mounted on a PCB, solder paste is printed on the periphery of each chip one by one. The traditional solder paste printing process needs to consume a large amount of time and labor, has low printing efficiency, and is easy to cause the solder paste to be stained on a chip or a chip lead so as to cause the damage of the chip.
Therefore, in order to overcome the defects of the prior art, a novel solder paste brushing mold is needed.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a brush tin cream mould can once only accomplish the tin cream printing work of whole PCB board, the time of the printing tin cream that significantly reduces to improve printing efficiency.
In order to solve the technical problem, the utility model provides a tin paste brushing mold, which comprises at least one brushing unit, wherein the brushing unit comprises a frame body which is surrounded by a side wall to form a containing cavity; and a cover body which is positioned in the containing cavity and the bottom of which comprises an opening; the cover body comprises a shielding part fixedly connected with the side wall of the frame body and a side wall part extending downwards from the edge of the shielding part; the cover body is configured to cover and buckle the chip on the PCB; a through groove which penetrates through the upper surface and the lower surface of the die and is used for tin paste to flow in is arranged between the side wall part of the cover body and the side wall of the frame body, and a lower port of the through groove is configured to be used for tin paste to be printed on a PCB.
Optionally, the through groove surrounds the side wall of the cover body for a circle to form a continuous annular structure.
Optionally, the mold comprises a plurality of brushing units arranged in an array, and two adjacent brushing units share one side wall.
Optionally, the side wall portion of the cover body and the side wall of the frame body are fixedly combined through a connecting bridge section.
Optionally, the connecting bridge segment is located at a top edge of the outside surface of the sidewall portion.
Optionally, the frame body, the cover body and the connecting bridge section are of an integrally formed structure.
Optionally, the bottom end of the side wall part and the bottom end of the side wall of the rack body are located on the same horizontal plane.
Optionally, the material of the mold is metal.
Optionally, the width of the through groove between the side wall part of the cover body and the side wall of the frame body is 0.15mm to 0.25 mm; the distance between the bottom surface of the shielding part and the PCB is 1mm to 2 mm.
The utility model has the advantages as follows:
1. the tin paste brushing die provided by the utility model can complete the tin paste printing work of the whole PCB at one time through the cover body provided with the cover buckle chip and the through groove, thereby greatly reducing the time for printing the tin paste and improving the printing efficiency; meanwhile, the cover body can prevent the chip or the lead of the chip from being stained on in the process of printing the solder paste, so that the chip is damaged.
2. The utility model provides a brush tin cream mould is continuous annular structure's logical groove through the setting, can enlarge the area that the tin cream printed on the PCB board, ensures that the tin cream encircles chip a week, improves PCB board and packaging shell's bonding strength.
3. The utility model provides a brush avris wall of a support body of brush between the unit is applied paint to adjacent two of tin cream mould, and two shielding parts of applying paint the unit with a brush are formed with logical groove respectively for an edge lateral wall, and its advantage lies in encapsulation shell such as being convenient for and PCB board combination fixed back, directly cuts the PCB board, can not cause the waste of tin cream.
4. The utility model provides a brush bottom of side wall portion of tin cream mould and the bottom of the limit lateral wall of support body are located same horizontal plane, ensure with the tin cream restriction on the PCB board with lead to the region that the groove corresponds, prevent that the tin cream from flowing out the mould, perhaps pollute the chip.
5. The utility model provides a brush tin cream mould can be applied to on the subsides are equipped with the PCB board of the chip of co-altitude, has enlarged the range of application of this mould.
Drawings
The following describes embodiments of the present invention in further detail with reference to the accompanying drawings.
Fig. 1 shows one of the schematic structural diagrams of the solder paste brushing mold provided by the present invention.
Fig. 2 shows a second schematic structural diagram of the solder paste brushing mold provided by the present invention.
Fig. 3 shows a top plan view of the solder paste brushing mold provided by the present invention.
Fig. 4 shows a bottom view of the solder paste brushing mold provided by the present invention.
Fig. 5 shows a schematic structural diagram of a solder paste brushing mold including a plurality of array arrangement brushing units provided by the present invention.
Fig. 6 shows a schematic diagram of the solder paste brushing mold and the PCB including a plurality of array arrangement brushing units provided by the present invention.
Fig. 7 shows an enlarged schematic view of a portion a of fig. 6.
Detailed Description
In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of one or more embodiments. It may be evident, however, that such embodiment(s) may be practiced without these specific details.
In order to explain the present invention more clearly, the present invention will be further described with reference to the preferred embodiments and the accompanying drawings. Similar parts in the figures are denoted by the same reference numerals. It is to be understood by persons skilled in the art that the following detailed description is illustrative and not restrictive, and is not to be taken as limiting the scope of the invention.
In the electronic packaging industry, after a chip and a lead thereof are mounted on a PCB, the chip and the lead thereof are packaged in a casing by using a suitable package casing, so as to isolate the chip from an external environment, thereby protecting the chip. Before the package of the package shell, solder paste is printed on the PCB, and the package shell and the PCB are fixed together by the solder paste. In the prior art, after chips and chip leads are mounted on a PCB, solder paste is printed on the periphery of each chip one by one. The traditional solder paste printing process needs to consume a large amount of time and labor, has low printing efficiency, and is easy to cause the solder paste to be stained on a chip or a chip lead so as to cause the damage of the chip.
In order to solve the above technical problem, as shown in fig. 1 to 4, the present invention provides a solder paste brushing mold, which includes at least one brushing unit 10, wherein the brushing unit 10 includes a frame body 1 surrounded by a side wall 11 to form a cavity; and a cover body 2 which is positioned in the containing cavity and the bottom of which comprises an opening 21; the cover body 2 comprises a shielding part 22 fixedly connected with the side wall 11 of the frame body 1 and a side wall part 23 extending downwards from the edge of the shielding part 22; an opening 21 is formed at the bottom end of the side wall portion 23. The cover body 2 is configured to cover and buckle the chip on the PCB, that is, cover and buckle the chip and the chip lead downwards through the opening 21, so that the chip and the chip lead are isolated from the external environment, and the subsequent solder paste is prevented from being stained on the chip or the chip lead. Can realize the circuit connection of chip and PCB board through the chip lead wire, the chip lead wire is for example the optional gold thread of using, the utility model discloses do not restrict to this. The utility model provides an in the mould, the lateral wall portion 23 of the cover body 2 with link up including having between the avris wall 11 of support body 1 the logical groove 3 that can supply the solder paste inflow of the upper and lower surface of mould, wherein the upper surface of mould comprises the top surface of limit lateral wall 11 top surface and occlusion part 22, and the lower surface of mould comprises the bottom surface of avris wall 11 bottom surface and lateral wall portion 23. The lower port of the through slot 3 is configured to allow solder paste to be printed onto the PCB board, i.e. by printing solder paste on the mould such that the solder paste is printed down the through slot onto the PCB board. Preferably, the width of the through groove between the side wall part 23 of the cover body 2 and the side wall 11 of the frame body 1 is 0.15mm to 0.25mm, so that the problem of uneven printing of solder paste on a PCB due to the narrow width of the through groove 3 can be avoided.
When printing the tin cream, place the brush tin cream mould that this embodiment provided on the PCB board earlier, cover body 2 is buckled the chip cover on the PCB board, shelters from chip on the PCB board, prints the tin cream on the brush tin cream mould afterwards for the tin cream is printed on the PCB board along leading to groove 3 downwards, and it is fixed to combine the tin cream that passes through on the PCB board with packaging shell and PCB board afterwards. It can be understood that, when the solder paste mould that uses this embodiment to provide prints the solder paste, chip and chip lead wire can paste the dress on the PCB board in advance, also can be after the solder paste prints on the PCB board, paste the dress on the PCB board with chip and chip lead wire again, the utility model discloses do not further limit to this. By adopting the solder paste printing die provided by the embodiment, the solder paste printing work on the PCB can be completed at one time through the through groove between the side wall part of the cover body and the side wall of the frame body, and the solder paste does not need to be printed on the periphery of the chip and the lead thereof one by one as in the prior art, so that the time for printing the solder paste is greatly reduced; the chip and the chip lead are temporarily isolated from the external environment through the cover body, so that the condition that the chip is damaged due to the fact that solder paste is stained on the chip or the lead of the chip in the solder paste printing process can be prevented.
In a specific embodiment, as shown in fig. 1 to 4, the frame body 1 of the painting unit includes four side walls 11 opposite to each other in pairs, the cover body 2 includes a shielding portion 22 respectively connected and fixed to the four side walls 11, the shielding portion 22 may be a rectangular structure corresponding to the shape of the chip, in addition, the cover body 2 further includes four side wall portions 23 extending downward from the edge of the shielding portion 22, and the four side wall portions 23 respectively correspond to the four side walls 11 on the frame body 1 one to one.
In a specific example, the through slots 3 are arranged around the side wall portion 23 of the cover body, and the through slots 3 are in a continuous annular structure. It can be understood that, the structure of the through slot 3 can make solder paste printed on the PCB also surround the side wall part of the cover body for a circle, and is in a continuous annular structure, so as to further enlarge the bonding and fixing area of the package housing and the PCB, and improve the bonding strength of the PCB and the package housing.
In a specific embodiment, the side wall portion 23 of the cover body 2 and the side wall 11 of the frame body 1 are fixedly combined through a connecting bridge section 4, as shown in fig. 1 to 4, the frame body 1 includes four side walls 11 opposite to each other in pairs, the cover body 2 includes four side wall portions 23 corresponding to the four side walls 11 on the frame body 1 one to one, in this specific embodiment, each side wall portion 23 on the cover body 2 and the corresponding side wall 11 on the frame body 1 are fixedly combined through a connecting bridge section 4, so as to ensure the combining strength between the cover body 2 and the frame body, prevent the cover body from deforming, and influence the tin brushing effect. In a further embodiment, the connecting bridge segment 4 is located at the top edge of the outer surface of said side wall portion 23. The preferred embodiment can avoid the connecting bridge section 4 from causing obstruction to solder paste printing on the PCB, enlarge the area of the solder paste printing on the PCB, ensure that the solder paste surrounds the side wall part of the cover body for one circle, and improve the bonding strength of the PCB and the packaging shell.
In a specific example, the frame body 1, the cover body 2 and the connecting bridge section 4 can be integrally formed by casting, so that the overall structural strength of the mold can be improved, and the mold is convenient to clean. It will be appreciated that the frame, cover and connecting bridge section may also be separate components and formed by subsequent assembly welding without regard to process effectiveness. In another embodiment, the mold is made of metal.
In one embodiment, with reference to the structure shown in the figure, the bottom end of the side wall portion 23 and the bottom end of the side wall 11 of the frame body 1 are located at the same horizontal plane, that is, when the mold is covered on a PCB, the bottom ends of the side wall portion 23 and the bottom end of the side wall 11 ensure that the solder paste is confined in the area of the PCB corresponding to the through slot 3, and the solder paste is prevented from flowing out of the mold or contaminating the chip. In another embodiment, the distance from the bottom surface of the shielding part 22 to the PCB is 1mm to 2mm, so that the mold can be applied to PCBs with chips of different heights attached thereto, and the application range of the mold is expanded.
Referring to fig. 5, in a specific embodiment, the mold includes a plurality of brushing units 10 arranged in an array, two adjacent brushing units 10 share a side wall 11 of the frame body 1, and the shielding portions 22 of the two brushing units 10 respectively form through grooves 3 with respect to the side wall 11, which is advantageous in that the tin brushing mold including a plurality of brushing units 10 can complete the tin paste printing work of the whole multi-chip PCB at one time, greatly reducing the time for printing the tin paste, and thus improving the printing efficiency; in addition wait that encapsulation shell and PCB board combine fixedly the back, brush the interval distance between the unit along adjacent two, can directly cut the PCB board, convenient and fast can not cause the waste of tin cream simultaneously. Or in another embodiment, the bottoms of the two adjacent through grooves between the two adjacent brushing units are communicated, so that the printing efficiency of the solder paste is further improved according to practical requirements, and the solder paste on the PCB is distributed more uniformly.
Referring to fig. 6 and 7, according to another aspect of the present invention, a solder paste printing process is provided, which includes the following steps:
covering the solder paste brushing mold on the corresponding position on the surface of the PCB 5, and covering the chip 6 on the PCB 5 by the cover body 2 to shield the chip 6 on the PCB 5; the corresponding position is that the opening 21 on the cover body 2 of the die is opposite to the position of the chip 6, and the chip 6 and the chip lead 7 are covered and buckled downwards, so that the chip 6 and the chip lead 7 are accommodated in the cover body 2 and isolated from the outside, and meanwhile, the bottom ends of the side wall 11 of the die and the bottom ends of the side wall parts 23 of the cover body 2 are in contact with the PCB 5, and solder paste is prevented from flowing out of the die or polluting the chip.
Brushing solder paste on the solder paste brushing mold; specifically, by printing solder paste on the upper surface of the solder paste printing mold, i.e., the top surface of the side wall 11 and the top surface of the shielding portion 22, the solder paste is printed downward from the through groove 3 between the side wall 11 and the side wall 23 onto the PCB board 5, and the solder paste is confined within the area defined by the lower end of the through groove 3.
And then removing the tin paste brushing mold, and demolding and forming the tin paste. Further, after the solder paste mold is removed, solder paste is formed on the PCB 5 and positions of the chip 6 and the chip leads 7 are defined, and then the package can is fixedly combined with the PCB 5 by the solder paste printed on the PCB 5, thereby completing the packaging process of the chip and the chip leads.
Obviously, the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention, and it is obvious for those skilled in the art to make other variations or changes based on the above descriptions, and all the embodiments cannot be exhausted here, and all the obvious variations or changes that belong to the technical solutions of the present invention are still in the protection scope of the present invention.
Claims (9)
1. A solder paste brushing mold, comprising:
the painting unit comprises a frame body which is surrounded by a side wall to form a containing cavity; and
the cover body is positioned in the containing cavity and the bottom of the cover body comprises an opening;
the cover body comprises a shielding part fixedly connected with the side wall of the frame body and a side wall part extending downwards from the edge of the shielding part;
the cover body is configured to cover and buckle the chip on the PCB;
a through groove which penetrates through the upper surface and the lower surface of the die and is used for tin paste to flow in is arranged between the side wall part of the cover body and the side wall of the frame body, and a lower port of the through groove is configured to be used for tin paste to be printed on a PCB.
2. The mold of claim 1, wherein the through-slots are in a continuous annular configuration around a perimeter of the sidewall portion of the cover.
3. The mold according to claim 1, wherein the mold comprises a plurality of brushing units arranged in an array, and an edge sidewall is shared between two adjacent brushing units.
4. The mold of claim 1, wherein the side wall portion of the cover is fixedly connected to the side wall of the frame body by a connecting bridge.
5. The mold of claim 4 wherein said connecting bridge segment is located at a top edge of an outer surface of said sidewall portion.
6. The mold of claim 4, wherein the frame, the cover, and the connecting bridge section are of an integrally formed construction.
7. The mold of claim 1, wherein the bottom ends of the side wall portions are located at the same level as the bottom ends of the side walls of the frame body.
8. The mold of claim 1, wherein the mold is made of metal.
9. The mold according to claim 1, wherein the width of the through groove between the side wall portion of the cover and the side wall of the frame body is 0.15mm to 0.25 mm; the distance between the bottom surface of the shielding part and the PCB is 1mm to 2 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922402352.0U CN212046381U (en) | 2019-12-27 | 2019-12-27 | Tin paste brushing mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922402352.0U CN212046381U (en) | 2019-12-27 | 2019-12-27 | Tin paste brushing mold |
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| Publication Number | Publication Date |
|---|---|
| CN212046381U true CN212046381U (en) | 2020-12-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201922402352.0U Active CN212046381U (en) | 2019-12-27 | 2019-12-27 | Tin paste brushing mold |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110978751A (en) * | 2019-12-27 | 2020-04-10 | 青岛歌尔微电子研究院有限公司 | Tin paste brushing mold and tin paste printing process |
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2019
- 2019-12-27 CN CN201922402352.0U patent/CN212046381U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110978751A (en) * | 2019-12-27 | 2020-04-10 | 青岛歌尔微电子研究院有限公司 | Tin paste brushing mold and tin paste printing process |
| WO2021129399A1 (en) * | 2019-12-27 | 2021-07-01 | 青岛歌尔微电子研究院有限公司 | Solder paste application mold and solder paste printing process |
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