CN211352946U - FPC circuit board - Google Patents

FPC circuit board Download PDF

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Publication number
CN211352946U
CN211352946U CN202020305779.9U CN202020305779U CN211352946U CN 211352946 U CN211352946 U CN 211352946U CN 202020305779 U CN202020305779 U CN 202020305779U CN 211352946 U CN211352946 U CN 211352946U
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China
Prior art keywords
assembly
circuit board
dustproof
heat dissipation
piece
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Application number
CN202020305779.9U
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Chinese (zh)
Inventor
夏玉海
蔡亚潮
陈明勤
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Xiamen Zhongsheng Precise Co ltd
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Xiamen Zhongsheng Precise Co ltd
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Priority to CN202020305779.9U priority Critical patent/CN211352946U/en
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Abstract

The utility model relates to a durable type circuit board technical field, and a FPC circuit board is disclosed, including the circuit board main part, the both sides of circuit board main part all splice the assembly with the piece, the assembly guide way has been seted up to the assembly with the inside of piece, the inside upper surface injection moulding of circuit board main part has fastening screw stand, the assembly has dustproof heat dissipation backplate structure with the top sliding connection of piece, dustproof heat dissipation backplate structure includes dustproof top cap, extend assembly wing backplate, the positioning hole, the cooperation clamping frame, radiator fan and the leading-in end that charges, the both ends stamping forming of dustproof top cap has the assembly wing backplate of extension, a plurality of positioning hole have been seted up to the inside of dustproof top cap, the top and the equal joint in bottom of positioning hole have the cooperation clamping frame. The utility model discloses an increase the dustproof heat dissipation backplate of loading and unloading of being convenient for on the circuit board for the device can reduce the ageing that dust contact circuit and components and parts brought, and can help main components and parts to carry out the cooling of dispelling the heat fast.

Description

FPC circuit board
Technical Field
The utility model relates to a durable type circuit board technical field especially relates to a FPC circuit board.
Background
FPC is also known as flexible circuit board, it is with the quality light, thin, can freely bend excellent characteristics such as folding and be prepared for favour, it has high reliability to be made as one kind of substrate with mylar or polyimide, the flexible printed circuit of superexcellent song, through on the frivolous plastic piece of flexible, the design of embedding circuit, the component of avoiding the installation receives the dust influence, often need carry out dustproof processing, but the dustproof processing of current device is neither convenient for load and unload, again can lead to the unable quick heat dissipation of processing element under the encapsulated situation, the utility model discloses a new solution is proposed to above problem.
SUMMERY OF THE UTILITY MODEL
The purpose of the utility model is to solve the shortcoming that exists among the prior art, if: the dustproof treatment of the existing device is not convenient for assembly and disassembly, and can cause the treatment element to be incapable of quickly dissipating heat in a closed state.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a FPC circuit board, includes circuit board main part, the both sides of circuit board main part all are glued the assembly and add the piece, the assembly guide way has been seted up to the inside of piece is added in the assembly, the inside upper surface injection moulding of circuit board main part has fastening screw stand, the top sliding connection that the assembly adds the piece has dustproof heat dissipation backplate structure.
Preferably, dustproof heat dissipation backplate structure includes dustproof top cap, extends assembly wing backplate, positioning and assembling hole, cooperation clamping frame, radiator fan and the leading-in end that charges, the both ends stamping forming of dustproof top cap has the extension assembly wing backplate, a plurality of positioning and assembling holes have been seted up to the inside of dustproof top cap, the top and the equal joint in bottom of positioning and assembling hole have cooperation clamping frame, the inside of cooperation clamping frame has radiator fan through the fix with screw, one side of cooperation clamping frame has the charging end through the fix with screw.
Preferably, the bottom end of the extension assembling wing guard plate is stamped with a sliding T-shaped block, and the sliding T-shaped block is in clearance fit with the inside of the assembling guide groove.
Preferably, one end of the dustproof heat dissipation guard plate structure is located right above the fastening thread stand column and is provided with a thread through hole, the diameter of the thread through hole is completely the same as the inner diameter of the fastening thread stand column, the size of the inner thread is the same, and the thread through hole is connected with the fastening thread stand column through a screw.
Preferably, the cooling fan comprises flabellum, power motor and assembly plate, the power motor has been welded on the top of assembly plate, the output of power motor is equipped with the flabellum.
Preferably, the surface of the circuit board main body is connected with a processing unit CPU in a welding manner, and the mounting position of the heat radiation fan is perpendicular to the CPU.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model realizes the rapid assembly between the dustproof heat dissipation protective plate structure and the circuit board main body through the clearance fit between the assembly guide groove arranged in the assembly adding block additionally arranged on the two sides and the sliding T-shaped block at the bottom end of the extension assembly wing protective plate, and the dustproof heat-dissipation protective plate structure can quickly finish assembly and positioning through the positioning connection between the threaded through hole and the fastening threaded upright post, and the top end of the circuit board main body is protected from dust by utilizing the covering design of the dustproof top cover and the extended assembly wing protective plate, after the charging input end is connected with a power supply, the fan blades are driven by the power motor to enable the cooling fan to work, because the cooling fan is perpendicular to the CPU of the processing element and can quickly help the CPU to carry out wind power cooling, the device can reduce the aging caused by dust contacting with circuits and components and can help the main components to carry out quick cooling under the condition of realizing quick assembly.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is an exploded view of the overall structure of the present invention;
fig. 3 is a schematic view of the connection structure of the dustproof heat dissipation guard plate structure of the present invention.
In the figure: 1. a circuit board main body; 2. assembling an additional block; 3. fastening the threaded upright column; 4. assembling a guide groove; 5. a dust-proof top cover; 6. extending and assembling the wing protection plate; 7. positioning assembly holes; 8. matching and clamping the frame; 9. a heat radiation fan; 10. charging an input terminal; 11. dustproof heat dissipation backplate structure.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Referring to fig. 1-3, the FPC circuit board comprises a circuit board main body 1, wherein assembly adding blocks 2 are respectively glued to two sides of the circuit board main body 1, an assembly guide groove 4 is formed in each assembly adding block 2, a fastening threaded upright column 3 is formed on the upper surface in the circuit board main body 1 in an injection molding mode, and the top end of each assembly adding block 2 is connected with a dustproof heat dissipation protection plate structure 11 in a sliding mode;
the dustproof heat-dissipation protective plate structure 11 comprises a dustproof top cover 5, an extension assembly wing protective plate 6, positioning and assembling holes 7, a matching clamping frame 8, a heat-dissipation fan 9 and a charging leading-in end 10, the extension assembly wing protective plate 6 is formed at two ends of the dustproof top cover 5 in a stamping mode, a plurality of positioning and assembling holes 7 are formed in the dustproof top cover 5, the matching clamping frame 8 is clamped at the top end and the bottom end of each positioning and assembling hole 7, the heat-dissipation fan 9 is fixed in the matching clamping frame 8 through screws, the heat-dissipation fan 9 comprises fan blades, a power motor and assembling pieces, the power motor is welded at the top end of each assembling piece, the fan blades are assembled at the output end of the power motor, a processing piece CPU is welded and connected to the surface of the circuit board main body 1, the mounting position of the heat-dissipation fan 9 is perpendicular to the CPU, the charging leading-, and helps the processing element to dissipate heat;
the equal stamping forming in bottom of extending assembly wing backplate 6 has slip T type piece, slip T type piece is clearance fit with the inside of assembly guide way 4, be convenient for realize sliding connection's rapid Assembly, dustproof heat dissipation backplate structure 11's one end is located fastening screw stand 3 directly over, threaded through hole has been seted up, threaded through hole diameter is the same with fastening screw stand 3's inner diameter completely, and inside screw thread size is the same, pass through screw connection between threaded through hole and the fastening screw stand 3, be convenient for dustproof heat dissipation backplate structure 11 and the location installation between circuit board main part 1.
The working principle is as follows:
in the utility model, when the user uses the device, the clearance fit between the assembly guide groove 4 arranged in the assembly adding block 2 added at two sides and the sliding T-shaped block at the bottom end of the extension assembly wing guard plate 6 is used for realizing the rapid assembly between the dustproof heat radiation guard plate structure 11 and the circuit board main body 1, and the positioning connection between the screw thread through hole and the fastening screw thread upright post 3 is used for leading the dustproof heat radiation guard plate structure 11 to rapidly complete the assembly positioning, the covering design of the dustproof top cover 5 and the extension assembly wing guard plate 6 is used for protecting the top end of the circuit board main body 1 from being influenced by dust, after the charging leading-in end 10 is connected with power, the fan blade is driven by the power motor to lead the heat radiation fan 9 to work, because the heat radiation fan 9 is vertical to the CPU processing element to rapidly help the wind power to radiate heat, the device is under the realization of rapid, reduce the ageing that dust contact circuit and components and parts brought, and can help main components and parts to carry out quick heat dissipation cooling.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Claims (6)

1. The utility model provides a FPC circuit board, includes circuit board main part (1), its characterized in that, the both sides of circuit board main part (1) all splice and have the assembly to add piece (2), assembly guide way (4) have been seted up to the inside of assembly with piece (2), the inside upper surface injection moulding of circuit board main part (1) has fastening screw stand (3), the top sliding connection that the assembly adds piece (2) has dustproof heat dissipation backplate structure (11).
2. The FPC circuit board of claim 1, wherein the dustproof heat dissipation protection plate structure (11) comprises a dustproof top cover (5), an extension assembly wing protection plate (6), positioning assembly holes (7), a matching clamping frame (8), a heat dissipation fan (9) and a charging lead-in end (10), the extension assembly wing protection plate (6) is punched and formed at two ends of the dustproof top cover (5), the dustproof top cover (5) is provided with a plurality of positioning assembly holes (7), the top end and the bottom end of each positioning assembly hole (7) are respectively clamped with the matching clamping frame (8), the heat dissipation fan (9) is fixed inside the matching clamping frame (8) through screws, and the charging lead-in end (10) is fixed on one side of the matching clamping frame (8) through screws.
3. The FPC board according to claim 2, wherein the bottom ends of the extended assembly wing protection plates (6) are stamped with sliding T-shaped blocks, and the sliding T-shaped blocks are in clearance fit with the inside of the assembly guide grooves (4).
4. The FPC board according to claim 2, wherein one end of the dust-proof heat dissipation protective plate structure (11) is located right above the fastening threaded column (3) and is provided with a threaded through hole, the diameter of the threaded through hole is identical to the inner diameter of the fastening threaded column (3), the size of the internal thread is identical, and the threaded through hole is connected with the fastening threaded column (3) through a screw.
5. The FPC board according to claim 2, wherein the heat dissipation fan (9) comprises fan blades, a power motor and a mounting plate, the power motor is welded to the top end of the mounting plate, and the fan blades are mounted at the output end of the power motor.
6. The FPC board according to claim 2, wherein a processing unit CPU is soldered to the surface of the circuit board main body (1), and the heat dissipation fan (9) is mounted at a position perpendicular to the CPU.
CN202020305779.9U 2020-03-12 2020-03-12 FPC circuit board Active CN211352946U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020305779.9U CN211352946U (en) 2020-03-12 2020-03-12 FPC circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020305779.9U CN211352946U (en) 2020-03-12 2020-03-12 FPC circuit board

Publications (1)

Publication Number Publication Date
CN211352946U true CN211352946U (en) 2020-08-25

Family

ID=72092117

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202020305779.9U Active CN211352946U (en) 2020-03-12 2020-03-12 FPC circuit board

Country Status (1)

Country Link
CN (1) CN211352946U (en)

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