CN212649959U - Display driver board for displaying technology serial interface signal output - Google Patents
Display driver board for displaying technology serial interface signal output Download PDFInfo
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- CN212649959U CN212649959U CN202021160615.8U CN202021160615U CN212649959U CN 212649959 U CN212649959 U CN 212649959U CN 202021160615 U CN202021160615 U CN 202021160615U CN 212649959 U CN212649959 U CN 212649959U
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- heat dissipation
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Abstract
The utility model discloses a display driver board of display technology serial interface signal output belongs to display driver board technical field, including the drive plate main part, the surface of drive plate main part is located the upper end of treater and is provided with treater heat radiation structure, the surface of mount evenly is provided with the louvre, the centre of mount is provided with the semiconductor refrigeration piece, the lower extreme of semiconductor refrigeration piece is provided with the conducting strip, the utility model discloses a conducting strip carries out heat conduction to the treater work production heat of drive plate main part, and the semiconductor refrigeration piece refrigeration makes the conducting strip cool down, makes the conducting strip cool down to the treater, and the treater high efficiency is dispelled the heat, improves treater work efficiency; the utility model discloses to electric capacity and cylindrical components and parts, with cartridge cooling module nestification in the surface, through VC liquid cooling heat dissipation section of thick bamboo heat absorption, heat radiation fins distributes to VC liquid cooling heat dissipation section of thick bamboo absorptive heat, improves cylindrical components and parts's radiating efficiency, improves components and parts life.
Description
Technical Field
The utility model belongs to the technical field of the display drive board, concretely relates to display drive board of display technology serial interface signal output.
Background
The driving board scheme mainly refers to a driving board card applied to a product related to liquid crystal display, and comprises integrated circuit boards used in the fields of computers, televisions, advertising machines, projectors, monitoring displays, industrial control displays, medical equipment displays, ship-borne vehicle-borne display equipment and the like.
The prior art has the following problems: the display drive board of current MIPI DSI signal output has the treater radiating effect poor when using, and high temperature environment reduces the processing performance, influences the result of use, does not have the heat dissipation to cylindrical devices such as electric capacity simultaneously, and high temperature easily leads to burning out, has the potential safety hazard.
SUMMERY OF THE UTILITY MODEL
To solve the problems set forth in the background art described above. The utility model provides a display driver board of display technology serial interface signal output has simple structure, and the treater radiating efficiency is high, the convenient characteristics of cylindrical components and parts heat dissipation.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a display driver board that shows technical serial interface signal output, includes the drive plate main part, the upper end that the surface of drive plate main part is located the treater is provided with treater heat radiation structure, treater heat radiation structure includes louvre, mount, semiconductor refrigeration piece and conducting strip, wherein, the surface of mount evenly is provided with the louvre, the centre of mount is provided with the semiconductor refrigeration piece, the lower extreme of semiconductor refrigeration piece is provided with the conducting strip.
Preferably, the fixing frame and the driving plate main body are fixed through fastening screws, and the heat conducting fins are fixed with the fixing frame in a clamping mode.
Preferably, the refrigeration end of the fixing frame is tightly attached to the surface of the heat conducting fin.
Preferably, fixing holes are formed in the periphery of the surface of the driving plate main body.
Preferably, the upper end surface of drive plate main part is provided with cartridge cooling subassembly, cartridge cooling subassembly includes VC liquid cooling heat dissipation section of thick bamboo, heat radiation fins and rubber base, wherein, rubber base's upper end is provided with VC liquid cooling heat dissipation section of thick bamboo, the surface of VC liquid cooling heat dissipation section of thick bamboo evenly is provided with heat radiation fins all around.
Preferably, the VC liquid cooling heat dissipation cylinder is welded and fixed with the heat dissipation fins, and the VC liquid cooling heat dissipation cylinder is connected with the rubber base in a clamping mode.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses a conducting strip carries out heat conduction to the treater work production heat of drive plate main part, and the refrigeration of semiconductor refrigeration piece makes the conducting strip cool down for the conducting strip cools down to the treater, and the treater high efficiency heat dissipation improves treater work efficiency;
2. the utility model discloses to electric capacity and cylindrical components and parts, with cartridge cooling module nestification in the surface, carry out the heat absorption through VC liquid cooling heat dissipation section of thick bamboo, heat radiation fins distributes to the absorptive heat of VC liquid cooling heat dissipation section of thick bamboo, improves cylindrical components and parts's radiating efficiency, improves components and parts's life.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the heat dissipation structure of the processor of the present invention;
FIG. 3 is a schematic structural view of the cylindrical heat sink assembly of the present invention;
in the figure: 1. a processor heat dissipation structure; 11. heat dissipation holes; 12. a fixed mount; 13. a semiconductor refrigeration sheet; 14. a heat conductive sheet; 2. a drive plate main body; 3. a cylindrical heat dissipation assembly; 31. the VC liquid cooling heat dissipation cylinder; 32. Heat dissipation fins; 33. a rubber base; 4. and (7) fixing holes.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides the following technical solutions: the utility model provides a display driver board that shows technical serial interface signal output, includes drive plate main part 2, and the upper end that the surface of drive plate main part 2 lies in the treater is provided with treater heat radiation structure 1, and treater heat radiation structure 1 includes louvre 11, mount 12, semiconductor refrigeration piece 13 and conducting strip 14, and wherein, the surface of mount 12 evenly is provided with louvre 11, and the centre of mount 12 is provided with semiconductor refrigeration piece 13, and the lower extreme of semiconductor refrigeration piece 13 is provided with conducting strip 14.
Specifically, the fixing frame 12 is fixed with the driving plate main body 2 by fastening screws, the heat-conducting fins 14 are fixed with the fixing frame 12 by clamping,
through adopting above-mentioned technical scheme, conveniently carry out fixed mounting.
Specifically, the refrigeration end of the fixing frame 12 is tightly attached to the surface of the heat conducting fin 14,
through adopting above-mentioned technical scheme, make things convenient for the refrigeration to cool down conducting strip 14.
Specifically, the periphery of the surface of the driving plate main body 2 is provided with a fixing hole 4,
through adopting above-mentioned technical scheme, make things convenient for the fixed of drive plate main part 2.
Specifically, the upper end surface of the driving board main body 2 is provided with a cylinder-mounted heat dissipation component 3, the cylinder-mounted heat dissipation component 3 comprises a VC liquid-cooled heat dissipation cylinder 31, heat dissipation fins 32 and a rubber base 33, wherein the upper end of the rubber base 33 is provided with the VC liquid-cooled heat dissipation cylinder 31, the periphery of the outer surface of the VC liquid-cooled heat dissipation cylinder 31 is uniformly provided with the heat dissipation fins 32,
through adopting above-mentioned technical scheme, the convenient heat dissipation to cylindrical components and parts.
Specifically, the VC liquid-cooled heat dissipating cylinder 31 is welded and fixed to the heat dissipating fins 32, the VC liquid-cooled heat dissipating cylinder 31 is engaged with the rubber base 33,
through adopting above-mentioned technical scheme, improve cartridge cooling module 3's structural stability.
The semiconductor refrigerating plate 13 of the utility model is the prior art, and the model of the semiconductor refrigerating plate is TEC 1-12703.
The utility model discloses a theory of operation and use flow: the utility model discloses during the use, install the display drive board in suitable position, the treater work of drive plate main part 2 produces the heat, carry out heat conduction through conducting strip 14, semiconductor refrigeration piece 13 refrigerates and makes the cooling of conducting strip 14, make conducting strip 14 cool down to the treater, the high-efficient heat dissipation of treater, improve treater work efficiency, to electric capacity and cylindrical components and parts, with 3 nestings of cartridge cooling subassembly in the surface, absorb heat through VC liquid cooling heat dissipation section of thick bamboo 31, heat radiation fins 32 distributes to the absorptive heat of VC liquid cooling heat dissipation section of thick bamboo 31, the radiating efficiency of cylindrical components and parts is improved, the life of components and parts is prolonged.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a show display driver board of display technology serial interface signal output, includes drive plate main part (2), its characterized in that: the surface of drive plate main part (2) is located the upper end of treater and is provided with treater heat radiation structure (1), treater heat radiation structure (1) includes louvre (11), mount (12), semiconductor refrigeration piece (13) and conducting strip (14), wherein, the surface of mount (12) evenly is provided with louvre (11), the centre of mount (12) is provided with semiconductor refrigeration piece (13), the lower extreme of semiconductor refrigeration piece (13) is provided with conducting strip (14).
2. A display driver board for a display technology serial interface signal output according to claim 1, wherein: the fixing frame (12) and the driving plate main body (2) are fixed through fastening screws, and the heat conducting fins (14) are clamped and fixed with the fixing frame (12).
3. A display driver board for a display technology serial interface signal output according to claim 1, wherein: the refrigeration end of the fixed frame (12) is tightly attached to the surface of the heat conducting fin (14).
4. A display driver board for a display technology serial interface signal output according to claim 1, wherein: and fixing holes (4) are formed in the periphery of the surface of the driving plate main body (2).
5. A display driver board for a display technology serial interface signal output according to claim 1, wherein: the upper end surface of drive plate main part (2) is provided with cartridge cooling subassembly (3), cartridge cooling subassembly (3) include VC liquid cooling heat dissipation section of thick bamboo (31), heat radiation fins (32) and rubber base (33), wherein, the upper end of rubber base (33) is provided with VC liquid cooling heat dissipation section of thick bamboo (31), the surface of VC liquid cooling heat dissipation section of thick bamboo (31) evenly is provided with heat radiation fins (32) all around.
6. The display driver board for display technology serial interface signal output according to claim 5, wherein: the VC liquid cooling heat dissipation cylinder (31) is fixedly welded with the heat dissipation fins (32), and the VC liquid cooling heat dissipation cylinder (31) is connected with the rubber base (33) in a clamping mode.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202021160615.8U CN212649959U (en) | 2020-06-21 | 2020-06-21 | Display driver board for displaying technology serial interface signal output |
Applications Claiming Priority (1)
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CN202021160615.8U CN212649959U (en) | 2020-06-21 | 2020-06-21 | Display driver board for displaying technology serial interface signal output |
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CN212649959U true CN212649959U (en) | 2021-03-02 |
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