CN211297011U - 一种低成本且便于使用的插脚式灯珠 - Google Patents
一种低成本且便于使用的插脚式灯珠 Download PDFInfo
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- 238000001746 injection moulding Methods 0.000 claims abstract description 42
- 239000011324 bead Substances 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 3
- 239000012778 molding material Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 abstract 1
- 239000011049 pearl Substances 0.000 description 38
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 238000000465 moulding Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
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- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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Abstract
本实用新型涉及LED灯相关技术领域,且公开了一种低成本且便于使用的插脚式灯珠,包括注塑件,所述注塑件上固定穿插有正极五金件和负极五金件,所述正极五金件和负极五金件的底部一端相平齐,所述正极五金件的顶部一端高于负极五金件的顶部一端,所述正极五金件和负极五金件的顶部一端均为字形,所述正极五金件的顶部一端与负极五金件的顶部一端之间连接有灯珠。该低成本且便于使用的插脚式灯珠,正极五金件和负极五金件与灯珠相互焊接之后,即可达到将灯珠进行导电线路的连接,然后在利用注塑机将注塑件注塑成型,操作简单方便,从而有效的降低设备加工的成本,便于操作人员的加工使用。
Description
技术领域
本实用新型涉及LED灯相关技术领域,具体为一种低成本且便于使用的插脚式灯珠。
背景技术
LED灯的使用早已走进千家万户及各个行业设备,但现有的LED灯的端头一般是通过焊接的方式与灯座相互固定连接,这种连接方式在LED灯损坏之后不能对灯座进行拆卸,降低了灯座的使用效率,增加了LED灯的使用成本,因此出现插脚式LED灯珠,利用与灯座相互插接的方式相互电性连接,但现有的插脚式灯珠在进行制作时制作过程较为繁琐,增加了LED灯灯珠的制作成本,不方便灯珠的加工使用,因此发明人设计了一种低成本且便于使用的插脚式灯珠,来降低加工成本。
实用新型内容
解决了现有的插脚式灯珠加工过程繁琐造成加工成本较高的问题。
一种低成本且便于使用的插脚式灯珠,包括注塑件,所述注塑件上固定穿插有正极五金件和负极五金件,所述正极五金件和负极五金件的底部一端相平齐,所述正极五金件的顶部一端高于负极五金件的顶部一端,所述正极五金件和负极五金件的顶部一端均为7字形,所述正极五金件的顶部一端与负极五金件的顶部一端之间连接有灯珠。
优选的,所述正极五金件和负极五金件均采用导电金属片制成,所述正极五金件和负极五金件为相互平行设置,保障正极五金件和负极五金件与灯座之间插接的稳定配合性能。
优选的,所述灯珠为细长立柱形,灯珠的顶部一端和底部一端均固定连接有导电端头,所述灯珠通过顶部和底部的导电端头分别与正极五金件和负极五金件的顶部一端相互焊接,通过焊接的方式达到将灯珠与正极五金件和负极五金件之间的快速稳定连接。
优选的,所述注塑件采用注塑机注塑成型,所述注塑件为绝缘注塑材料制成,所述注塑件的注塑形状为长方体注塑形状,在灯珠通过顶部和底部的导电端头分别与正极五金件和负极五金件的顶部相互焊接之后,通过注塑机将注塑件与正极五金件和负极五金件之间注塑连接。
优选的,所述灯珠与正极五金件和负极五金件均为相互平行设置。
优选的,所述灯珠采用LED灯灯珠,所述灯珠的数量为一个或两个。
与现有技术相比:
该低成本且便于使用的插脚式灯珠,通过设置正极五金件、负极五金件和灯珠相互配合,在灯珠进行组装加工时,将正极五金件的顶部端头和负极五金件的顶部端头分别与灯珠的导电端头相互焊接,即可达到将灯珠进行导电线路的连接,同时灯珠形状大小较小,且在正极五金件和负极五金件与灯珠相互焊接之后,然后在利用注塑机将注塑件注塑成型,操作简单方便,从而有效的降低设备加工的成本,便于操作人员的加工使用。
附图说明
图1为本实用新型结构示意图;
图2为本实用新型灯珠与负极五金件侧视连接示意图;
图3为本实用新型正极五金件示意图;
图4为本实用新型实施例示意图。
图中:1注塑件、2正极五金件、3负极五金件、4灯珠。
具体实施方式
如图1-4所示,本实用新型提供一种技术方案:一种低成本且便于使用的插脚式灯珠,包括注塑件1,注塑件1采用注塑机注塑成型,注塑件1为绝缘注塑材料制成,注塑件1的注塑形状为长方体注塑形状,注塑件1上固定穿插有正极五金件2和负极五金件3,正极五金件2和负极五金件3均采用导电金属片制成,正极五金件2和负极五金件3为相互平行设置,保障正极五金件2和负极五金件3与灯座之间插接的稳定配合性能,正极五金件2和负极五金件3的底部一端相平齐,正极五金件2的顶部一端高于负极五金件3的顶部一端,正极五金件2和负极五金件3的顶部一端均为7字形,正极五金件2的顶部一端与负极五金件3的顶部一端之间连接有灯珠4,灯珠4采用LED灯灯珠,灯珠4的数量为一个或两个,灯珠4为细长立柱形,灯珠4的顶部一端和底部一端均固定连接有导电端头,灯珠4通过顶部和底部的导电端头分别和正极五金件2和负极五金件3的顶部一端相互焊接,通过焊接的方式达到将灯珠4与正极五金件2和负极五金件3之间的快速稳定连接,灯珠4与正极五金件2和负极五金件3均为相互平行设置,在灯珠4通过顶部和底部的导电端头分别与正极五金件2和负极五金件3的顶部相互焊接之后,通过注塑机将注塑件1与正极五金件2和负极五金件3之间注塑连接。
实施例一:
如图1所示,灯珠4的数量为一个。
实施例二:
如图4所示,灯珠4的数量为两个,两个灯珠4分别与正极五金件2的顶部一端和负极五金件3的顶部一端相互连接,两个灯珠4与一个灯珠4相比较光照更亮。
在设备使用时,将正极五金件2的顶部端头和负极五金件3的顶部端头分别与灯珠4的导电端头相互焊接,即可达到将灯珠4进行导电线路的连接,后在利用注塑机将注塑件1注塑成型,操作简单方便,从而有效的降低设备加工的成本,便于操作人员的加工使用。
Claims (6)
1.一种低成本且便于使用的插脚式灯珠,包括注塑件(1),其特征在于:所述注塑件(1)上固定穿插有正极五金件(2)和负极五金件(3),所述正极五金件(2)和负极五金件(3)的底部一端相平齐,所述正极五金件(2)的顶部一端高于负极五金件(3)的顶部一端,所述正极五金件(2)和负极五金件(3)的顶部一端均为7字形,所述正极五金件(2)的顶部一端与负极五金件(3)的顶部一端之间连接有灯珠(4)。
2.根据权利要求1所述的一种低成本且便于使用的插脚式灯珠,其特征在于:所述正极五金件(2)和负极五金件(3)均采用导电金属片制成,所述正极五金件(2)和负极五金件(3)为相互平行设置。
3.根据权利要求1所述的一种低成本且便于使用的插脚式灯珠,其特征在于:所述灯珠(4)为细长立柱形,灯珠(4)的顶部一端和底部一端均固定连接有导电端头,所述灯珠(4)通过顶部和底部的导电端头分别和正极五金件(2)和负极五金件(3)的顶部一端相互焊接。
4.根据权利要求1所述的一种低成本且便于使用的插脚式灯珠,其特征在于:所述注塑件(1)采用注塑机注塑成型,所述注塑件(1)为绝缘注塑材料制成,所述注塑件(1)的注塑形状为长方体注塑形状。
5.根据权利要求1所述的一种低成本且便于使用的插脚式灯珠,其特征在于:所述灯珠(4)与正极五金件(2)和负极五金件(3)均为相互平行设置。
6.根据权利要求1所述的一种低成本且便于使用的插脚式灯珠,其特征在于:所述灯珠(4)可采用LED灯灯珠,所述灯珠(4)的数量为一个或两个。
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CN201920904755.2U CN211297011U (zh) | 2019-06-15 | 2019-06-15 | 一种低成本且便于使用的插脚式灯珠 |
US16/713,022 US11177424B2 (en) | 2019-06-15 | 2019-12-13 | Dual in-line package LED device |
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CN112503406A (zh) * | 2020-11-05 | 2021-03-16 | 深圳市乐事达灯饰有限公司 | 一种插脚式led灯头及其制造方法 |
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JPH0783082B2 (ja) * | 1989-05-18 | 1995-09-06 | 株式会社東芝 | 半導体装置 |
EP2913856A4 (en) * | 2012-10-25 | 2016-01-06 | Panasonic Ip Man Co Ltd | LIGHT EMITTING DEVICE, ITS MANUFACTURING METHOD, AND BODY HAVING A LIGHT EMITTING DEVICE MOUNTED THEREON |
US9541241B2 (en) * | 2013-10-03 | 2017-01-10 | Cree, Inc. | LED lamp |
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CN112503406A (zh) * | 2020-11-05 | 2021-03-16 | 深圳市乐事达灯饰有限公司 | 一种插脚式led灯头及其制造方法 |
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